CN216930648U - Heat exchanger device and cabinet - Google Patents

Abstract

The utility model provides a heat exchanger device and rack relates to the heat transfer field, especially relates to refrigeration heat exchanger technical field. The specific implementation scheme is as follows: the heat exchanger device comprises: a finned heat exchanger; the jet type heat exchanger is connected with the fin type heat exchanger in series; and the cooling liquid flows to the jet type heat exchanger from the fin type heat exchanger. The cooling liquid flows to the jet type heat exchanger from the fin type heat exchanger, so that the stepped utilization of the cooling capacity of the cooling liquid is realized, and the energy consumption is reduced.

Description

Heat exchanger device and cabinet

Technical Field

The present disclosure relates to the field of heat exchange technology, and more particularly, to the field of refrigeration heat exchangers.

Background

Along with the development of electronic components towards high performance and miniaturization, the integration level and the energy consumption of the electronic components are continuously improved, so that the heat flux density of the electronic components is rapidly increased, and then local hot spots are generated, which is not beneficial to the safe and stable operation of the system.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a high efficiency and energy saving heat exchanger apparatus and cabinet.

According to an aspect of the present disclosure, there is provided a heat exchanger device comprising a fin heat exchanger; the jet flow type heat exchanger is connected with the fin type heat exchanger in series; and the cooling liquid flows to the jet flow type heat exchanger from the fin type heat exchanger.

According to another aspect of the present disclosure, there is provided a cabinet provided with a plurality of layers of cells; and in the heat exchanger device, the fin type heat exchanger and the jet type heat exchanger are arranged on each layer of unit cell.

It should be understood that the statements in this section do not necessarily identify key or critical features of the embodiments of the present disclosure, nor do they limit the scope of the present disclosure. Other features of the present disclosure will become apparent from the following description.

Drawings

The drawings are included to provide a better understanding of the present solution and are not to be construed as limiting the present disclosure. Wherein:

FIG. 1 is a schematic view of a heat exchanger apparatus according to a first embodiment of the present disclosure;

FIG. 2 is a cross-sectional view of a fluidic heat exchanger according to a first embodiment of the present disclosure;

FIG. 3 is a schematic view of an array of nozzles according to a first embodiment of the present disclosure;

FIG. 4 is a schematic view of a heat exchanger apparatus according to a second embodiment of the present disclosure;

FIG. 5 is a schematic flow diagram of a cooling fluid according to a second embodiment of the present disclosure;

fig. 6 is a schematic diagram of a cabinet according to a second embodiment of the present disclosure.

Detailed Description

Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings, in which various details of the embodiments of the disclosure are included to assist understanding, and which are to be considered as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

When the equipment dissipates heat, a heat exchanger is usually used for assisting in dissipating heat. The cooling liquid in the heat exchanger exchanges heat with electronic components in the equipment to take away the heat of the electronic components, so that the electronic components can reliably run in an adaptive temperature range.

In addition to the limited ability of heat dissipation to address local hot spots, the heat exchanger in the related art also needs to be configured with a train-to-train air conditioner separately for the overall temperature of the internal environment of the device. However, since a plurality of vertically arranged air conditioners or horizontally arranged air conditioners are separately disposed inside the apparatus, the air conditioners not only occupy a large space but also increase the manufacturing cost of the entire heat exchanger.

In view of the above-mentioned problems, there is a need for a heat exchanger that can effectively solve the cooling problem of local high-temperature hot spots in equipment, and further can improve the heat exchange capability. Moreover, it is desirable that the heat exchanger be space efficient and have a reduced manufacturing cost.

The present disclosure provides a heat exchanger apparatus 100, as shown in fig. 1, the heat exchanger apparatus 100 including: a finned heat exchanger 10, a jet heat exchanger 20, and a coolant. Wherein, the flow heat exchanger 20 is connected with the finned heat exchanger 10 in series. The cooling fluid flows from the finned heat exchanger 10 to the jet heat exchanger 20.

The finned heat exchanger 10 can exchange heat with heat in a low heat flow density environment in an air-cooling heat exchange manner. The jet heat exchanger 20 can exchange heat with the heat of the electronic component 300 with high heat flow density, and can solve the problem of cooling local high-temperature hot spots.

After the fin type heat exchanger 10 and the jet type heat exchanger 20 are connected in series, all heat in the whole equipment is radiated through cooling liquid, additional inter-row air conditioner auxiliary radiation is not needed to be configured, the occupied space of the whole heat exchanger device 100 is saved, and the investment cost is reduced.

The cooling fluid flows from the finned heat exchanger 10 to the jet heat exchanger 20. The cooling liquid exchanges heat with heat in the low heat flow density environment through the fin type heat exchanger 10, the cooling liquid passing through the fin type heat exchanger 10 takes away the heat in the low heat flow density environment, and the temperature of the cooling liquid rises and reaches a first temperature.

Then, the cooling liquid flows through the jet heat exchanger 20, and the first temperature of the cooling liquid is lower than the temperature of the electronic component 300 with high heat flux density, so that after the cooling liquid exchanges heat with the electronic component 300 with high heat flux density, the cooling liquid can further absorb heat and take away most of the heat in the electronic component 300, and at this time, the temperature of the cooling liquid rises rapidly and reaches the second temperature.

In summary, the cooling liquid firstly passes through the fin type heat exchanger 10 and then passes through the jet type heat exchanger 20, so that the following effects can be achieved:

a, the cooling liquid flows to the electronic component 300 with high heat flux density from the environment with low heat flux density, so that the step utilization of the cooling capacity of the cooling liquid can be realized, and the energy consumption is reduced.

And B, all heat in the whole equipment is absorbed and radiated through cooling liquid, and additional inter-row air conditioners are not required to be configured for auxiliary radiation, so that the occupied space of the whole heat exchanger device 100 is saved, and the cost is reduced.

It is understood that the effects mentioned in the above related to A \ B \ C in the disclosure are exemplary and not exhaustive, and the disclosure is not limited thereto.

In addition, the fin-type heat exchanger 10 is connected in series with the jet-type heat exchanger 20, and the number and the series connection mode of the fin-type heat exchanger 10 and the jet-type heat exchanger 20 may include the following cases:

it is possible that one fin heat exchanger 10 is connected in series with one jet heat exchanger 20.

Alternatively, one finned heat exchanger 10 may be connected in series with a plurality of parallel ejector heat exchangers 20.

Or, a plurality of fin heat exchangers 10 may be connected in series and then connected in series with one jet heat exchanger 20.

Or, a plurality of fin heat exchangers 10 may be connected in parallel and then connected in series with one jet heat exchanger 20.

Alternatively, a plurality of fin heat exchangers 10 may be connected in parallel and then connected in series with a plurality of parallel jet heat exchangers 20.

In the present disclosure, when the plurality of fin heat exchangers 10 are connected in parallel, the outlet ends of the plurality of fin heat exchangers 10 connected in parallel are converged into one pipeline. The outlet ends of the multiple fin heat exchangers 10 are converged into a pipeline, and the pipeline is communicated with the total inlet end of one or more jet heat exchangers 20 connected in parallel.

It should be noted that the fin heat exchanger 10 and the jet heat exchanger 20 in the above embodiments are only exemplary, and are not intended to limit the disclosure. The number and the serial relation of the fin type heat exchanger 10 and the jet type heat exchanger 20 can be set according to the actual requirements of the equipment, such as the area and the volume of the equipment, the number and the positions of the electronic components 300 with high heat flow density, and the like, and will not be described in detail herein.

In some embodiments, the jet heat exchanger 20 is provided in plurality, and the plurality of jet heat exchangers 20 are connected in parallel.

In the present disclosure, a plurality of electronic components 300 having high heat flux density are provided in the same apparatus, and a plurality of jet heat exchangers 20 are provided. The electronic components 300 with high heat flux density are arranged in the same device, the jet heat exchangers 20 are also arranged in a plurality of numbers, each jet heat exchanger 20 can correspond to one electronic component 300, and therefore heat exchange and heat dissipation can be independently carried out on each electronic component 300, and each electronic component 300 can achieve the expected heat dissipation effect.

In the present disclosure, the jet heat exchanger 20 may be arranged in a dot pattern. The jet-type heat exchanger 20 arranged in a dot shape enables the heat exchange position to be more accurate, and is high in efficiency and low in energy consumption. And the jet flow type heat exchanger 20 arranged in a point shape can reduce the coverage area of the jet flow type heat exchanger 20 and save the cost.

In the embodiment of the present disclosure, the jet heat exchanger 20 is provided with a plurality of and connected in parallel, the fin heat exchanger 10 is provided with one, that is, one fin heat exchanger 10 corresponds to a plurality of and connected in parallel jet heat exchangers 20, and the outlet end of the fin heat exchanger 10 is communicated with the total inlet end of the plurality of jet heat exchangers 20.

The plurality of parallel jet type heat exchangers 20 are arranged, and the total inlet ends of the plurality of parallel jet type heat exchangers 20 are communicated with the total outlet end of the fin type heat exchanger 10, so that the temperature of the cooling liquid entering each jet type heat exchanger 20 is the same, and the problem that the second temperature of the cooling liquid flowing through the jet type heat exchanger 20 is higher than the temperature of the surface of other electronic components 300 which do not exchange heat, and the electronic components 300 are damaged is avoided.

In some embodiments, the fluidic heat exchanger 20 may include a cold plate 21, the cold plate 21 being adapted to engage and cover a surface of the heat generating component. The heating element may be the above-mentioned electronic component 300 with high heat flux density, or may be the electronic component 300 with low heat flux density. In the following embodiments, the heating elements are all explained by taking an electronic component 300 having a high heat flux density as an example.

The cold plate 21 transfers heat generated by the electronic component 300 to the cooling liquid through the plate wall, and then transfers the heat to the external environment through the microchannels or the pipelines by the cooling liquid, and in the whole process, the cooling liquid does not directly contact the electronic component 300 with high heat flux density, and the cooling liquid is indirectly cooled, so that direct impact, soaking and erosion of the cooling liquid on the electronic component 300 are avoided.

The cold plate 21 is attached to the surface of the electronic component 300 with high heat flux density, and covers the surface of the electronic component 300 with high heat flux density, so that the contact area between the cold plate 21 and the electronic component 300 with high heat flux density is increased, the surface of the electronic component 300 with high heat flux density can be subjected to heat exchange and heat dissipation, the uniformity of heat dissipation is ensured, and the thermal stress of the cold plate 21 is reduced.

The cold plate 21 may have a flat structure or a flat structure, may have an arc structure, or may have a sheet structure matching the surface of the electronic component 300. The flaky cold plate 21 can increase the convection area between the cooling liquid and the cold plate 21 as much as possible, accelerate heat exchange and achieve better heat dissipation effect.

The cold plate 21 may be made of a metal material, such as silver, copper, gold, aluminum, titanium, or the like. In addition, the cold plate 21 may also be made of graphene material. The cold plate 21 is a thermally conductive material and is not described in detail herein.

In some embodiments, one or more of a heat conductive silicone grease, a heat conductive silicone, a heat conductive gasket, or a heat conductive tape may be disposed between the cold plate and the surface of the heat generating element.

The heat-conducting silicone grease can be added between the cold plate 21 and the electronic component 300 with high heat flux density, and has high conductivity and excellent heat conductivity, so that the heat conductivity between the electronic component 300 with high heat flux density and the cold plate 21 can be increased under the condition that the surface of the electronic component 300 and the cold plate 21 cannot be completely attached, and the heat exchange rate is improved.

Further, a heat conductive silicone rubber, a heat conductive gasket, a heat conductive tape, or the like may be provided between the cold plate 21 and the electronic component 300 having a high heat flux density, and the heat conductivity between the two may be improved.

In some embodiments, as shown in fig. 2, the fluidic heat exchanger 20 includes a fluidic cavity 22, with a cold plate 21 disposed in the fluidic cavity 22; the fluidic chamber 22 includes an inlet 221 and an outlet 222. The inlet 221 is disposed opposite to the cold plate 21, the direction of the cooling fluid injected from the inlet 221 is perpendicular to the cold plate 21, and the direction of the cooling fluid discharged from the outlet 222 is parallel to the cold plate 21.

Further, the inside of the jet cavity 22 can contain a cooling liquid, the jet cavity 22 includes an inlet 221 and an outlet 222, the cooling liquid can enter the jet cavity 22 from the inlet 221 and flow out of the jet cavity 22 from the outlet 222 to take away heat of the jet cavity 22.

In addition, the jet cavity 22 may surround the cooling liquid and avoid leakage when the cooling liquid exchanges heat, thereby further preventing the cooling liquid from soaking or corroding the electronic component 300. The jet cavity 22 can guide the cooling liquid in a specific direction, so that the retention of the cooling liquid is avoided, the cooling liquid can be recycled, and the cost is saved.

Further, in some embodiments, the cold plate 21 may be a separate structure, i.e., a plate-like structure or a sheet-like structure, independent of the exterior of the fluidic cavity 22. At this time, one surface of the cold plate 21 is attached to the outer wall of the jet chamber 22, and the other surface of the cold plate 21 is attached to the surface of the electronic component 300.

The heat of electronic component 300 is transferred to cold plate 21, cold plate 21 transfers the heat to the outer wall of jet cavity 22 again, and the outer wall of jet cavity 22 transfers the heat to the coolant liquid located inside jet cavity 22 again to this heat that realizes electronic component 300 gives off.

Further, one cold plate 21 may correspond to the plurality of jet cavities 22, and when the area of the cavity wall of the jet cavity 22 is smaller than the surface of the electronic component 300 with high heat flow density, the cold plate 21 may be covered on the surface of the electronic component 300, and the plurality of jet cavities 22 may be correspondingly disposed on the other side of the cold plate 21.

Thus, the plurality of jet flow cavities 22 exchange heat with the surface of the electronic component 300 at the same time, so that the heat dissipation of the electronic component 300 with high heat flux density is more uniform, the heat stress is reduced, and the heat dissipation effect is better.

In some embodiments, a corresponding number of fluidic cavities 22 may be configured according to the surface area of the electronic component 300, and it is not necessary to make a specific fluidic cavity 22 for a specific electronic component 300, which is highly adaptable and cost-effective.

In some embodiments, the fluidic chamber 22 may be quickly replaced or disassembled without moving or replacing the cold plate 21, which may be more flexible to use and avoid damage to the surface of the electronic component 300 by replacing or disassembling the fluidic chamber 22.

Further, in other embodiments, the cold plate 21 may be part of the fluid chamber 22, i.e., the cold plate 21 is a chamber wall of the fluid chamber 22. The cavity wall of the jet flow cavity 22, which is used as the cold plate 21, is directly attached to the surface of the electronic component 300 and covers the surface of the electronic component 300, so that the cost of the jet flow type heat exchanger 20 can be saved.

In some embodiments, the jet chamber 22 is made of a metallic material and is integrally formed with the cold plate 21. In this case, the jet cavity 22 may be made of silver, copper, gold, aluminum, titanium, or the like.

The jet flow cavity 22 made of the metal material has better heat conductivity, partial heat absorbed by the cold plate 21 can be quickly transferred to other cavity walls of the jet flow cavity 22, and the cooling liquid sprayed from the inlet 221 can fully exchange heat with the heat on the cavity walls after being splashed.

In addition, when cold plate 21 and efflux cavity 22 integrated into one piece, integrated into one piece's cold plate 21 and efflux cavity 22 make the leakproofness of efflux cavity 22 better, avoid revealing of coolant liquid.

In the embodiment of the present disclosure, the jet cavity 22 is made of copper material, and the pipeline communicated between the fin heat exchanger 10 and the jet heat exchanger 20 may also be made of copper material, and the pipeline and the fin heat exchanger 10 and the pipeline and the jet heat exchanger 20 may be connected by welding, so that the heat exchanger device 100 is firmer by welding, and the risk of liquid leakage is avoided.

Further, the inlet 221 of the jet flow cavity 22 is disposed opposite to the cold plate 21, so that when the cooling liquid is sprayed into the interior of the jet flow cavity 22 from the inlet 221, the spraying direction of the cooling liquid is perpendicular to the cold plate 21.

Because the cooling liquid flowing from the finned heat exchanger 10 to the inlet 221 of the jet flow cavity 22 is in a high-pressure and high-speed state, the cooling liquid impacts the heat exchange surface of the jet flow cavity 22 at a vertical angle, so that the boundary layer between the cooling liquid and the heat exchange surface can be thinner, namely, the convective heat exchange resistance is smaller, and a higher heat transfer coefficient can be obtained.

The heat exchange surface may be a cold plate 21 of the jet chamber 22 or a chamber wall attached to an external cold plate 21. The boundary layer is a thin flow layer with non-negligible viscous force close to the object surface in the high Reynolds number streaming, and is also called as a flow boundary layer and a boundary layer.

In some embodiments, the fluidic cavity 22 is provided with one or more inlets 221; and/or the fluidic chamber 22 is provided with one or more outlets 222.

The fluidic cavity 22 may include one or more inlets 221. When the surface of the electronic component 300 with high heat flux density is large and the number of the inlets 221 of the jet flow cavity 22 is one, the cooling liquid can be uniformly sprayed on the cold plate 21, so that the heat dissipation of the electronic component 300 is more uniform, and the thermal stress of the cold plate 21 of the jet flow cavity 22 is further reduced.

The fluidic chamber 22 can include one or more outlets 222, with the plurality of outlets 222 converging into a single conduit. The plurality of outlets 222 can accelerate the outflow of the cooling liquid in the jet cavity 22, avoid the retention of the cooling liquid in the jet cavity 22, improve the flow rate of the cooling liquid, and improve the heat exchange rate.

The outlet 222 may be a circular tube, a square tube, or an elliptical tube, and is not particularly limited thereto. In the embodiment of the present disclosure, the outlet 222 is a circular tube, and the cavity wall of the fluidic cavity 22 where the outlet 222 is disposed is perpendicular to the cold plate 21, i.e., the direction of the cooling fluid flowing out of the outlet 222 is parallel to the cold plate 21.

It can be seen that the direction of the coolant in the jet chamber 22 at the inlet 221 is perpendicular to the direction of the outlet 222, so that when the coolant in the jet chamber 22 exchanges heat with the cold plate 21, the coolant in the same jet chamber 22 can exchange heat in a jet manner and in a counter-flow manner.

Wherein, when the cooling liquid impacts the cold plate 21, the impact area is a stagnation area, jet type heat exchange is carried out in the stagnation area, and in the stagnation area, the boundary layer is thin, the heat transfer convection resistance is small, and the heat transfer system is high.

After the cooling liquid impacts the cold plate 21, because the area of the cold plate 21 is greater than the area of the stagnation area, the cooling liquid splashes and advects to the periphery outside the stagnation area, the flowing direction of the cooling liquid tends to be parallel to the cold plate 21, and the cooling liquid and the cold plate 21 exchange heat in a convection mode in the area outside the stagnation area of the cold plate 21.

Therefore, the speed of the cooling liquid flowing out from the outlet 222 can be reduced, the cooling liquid can flow out of the jet cavity 22 towards the outlet 222 more stably, repeated sputtering of the cooling liquid in the jet cavity 22 to impact the additional wall of the jet cavity 22 is avoided, impact of the high-speed cooling liquid on the pipeline is also avoided, and the service life is prolonged.

In addition, the temperature of the cooling liquid can be gradually reduced from inside to outside, and the cooling liquid flows out through the outlet 222, so that the heat exchange between the cold plate 21 and the cooling liquid is more uniform, the thermal stress of the cold plate 21 is reduced, and the service life is prolonged.

In some embodiments, a funnel portion 2211 is disposed at the inlet 221, and the funnel portion 2211 is communicated with the outlet end of the fin heat exchanger 10 and is located outside the jet cavity 22; and a circular tube portion 2212 communicating with the funnel portion 2211 and located inside the jet cavity 22.

The funnel portion 2211 is funnel-shaped as the name implies, the funnel portion 2211 is communicated with the outlet end of the fin type heat exchanger 10, the cooling liquid flowing out from the outlet end of the fin type heat exchanger 10 is not in a high-pressure high-flow state, the funnel portion 2211 at the inlet 221 can reduce the resistance of the inlet 221 to the cooling liquid, and the cooling liquid can be sprayed on the cold plate 21 at a speed and a pressure which are capable of keeping or even increasing the original cooling liquid.

Round tube portion 2212, the one end and the funnel portion 2211 of round tube portion 2212 are connected, and in round tube portion 2212's the other end stretched into efflux cavity 22, round tube portion 2212 can make the coolant liquid when directive cold drawing 21, under the circumstances of guaranteeing high-pressure high-speed, can form the stagnation area of maximum area on cold drawing 21 to increase efflux formula heat exchange's area, improve the efficiency of heat exchange.

Further, the funnel portion 2211 is disposed outside the fluidic cavity 22, and the round tube portion 2212 is disposed inside the fluidic cavity 22. The linear distance of the coolant at the inlet 221 may be increased so that the pressure and velocity of the coolant are kept as constant as possible. In addition, the round tube 2212 extends into the jet cavity 22, so that the distance between the round tube 2212 and the cold plate 21 can be reduced, and the cooling liquid ejected from the round tube 2212 is prevented from being dispersed.

In some embodiments, as shown in fig. 3, the round tube portion 2212 is provided with an array of nozzles 2213. The array nozzle 2213 can increase the jet velocity and the jet pressure of the cooling liquid, can increase the heat exchange area of the flow of the cooling liquid, can also ensure the uniformity of heat exchange, and can reduce the local impact of the cooling liquid on the cold plate 21 and reduce the local thermal stress of the cold plate 21.

In some embodiments, a plurality of fin heat exchangers 10 are provided, and the plurality of fin heat exchangers 10 are connected in parallel, and each fin heat exchanger 10 corresponds to one or more ejector heat exchangers 20.

The entire heat exchanger device 100 may include a plurality of parallel branches, and the number and series connection of the fin heat exchanger 10 and the ejector heat exchanger 20 in the same branch include the above-mentioned five cases. When multiple branches are connected in parallel, each branch may include any of the above five conditions in combination with any of the five conditions included in the other branches.

The combined form of the finned heat exchanger 10 and the jet flow type heat exchanger 20 is added, the heat exchanger can be suitable for large-scale equipment such as cabinets of data centers, the combined form is multiple, the application range is wide, the delivery speed is high, the investment cost is low, and the construction and operation cost of the data centers is reduced.

In some embodiments, as shown in fig. 4, the heat exchanger apparatus 100 further comprises a fan 30, the fan 30 being disposed proximate to the finned heat exchanger 10. In some embodiments, the fan 30 is provided in plurality.

The fin heat exchanger 10 is used to absorb heat of a low heat flux density environment, so the fin heat exchanger 10 is not in direct contact with the electronic components 300 in the device, but exchanges heat with the temperature in the environment. By providing one or more fans 30, the flow of air in a low heat flux environment may be accelerated, thereby increasing the efficiency of heat exchange between the air and the fins of the finned heat exchanger 10.

In some embodiments, as shown in fig. 4, the heat exchanger apparatus 100 further comprises an external heat exchanger 40, and the external heat exchanger 40 is connected in series with the fin-type heat exchanger 10 and the ejector heat exchanger 20 to form a closed loop. Both ends of the external heat exchanger 40 are respectively connected with the fin type heat exchanger 10 and the jet type heat exchanger 20.

The outlet end of the finned heat exchanger 10 is communicated with the inlet end of the jet flow type heat exchanger 20, the outlet end of the jet flow type heat exchanger 20 is communicated with the inlet end of the external heat exchanger 40, and the outlet end of the external heat exchanger 40 is communicated with the inlet end of the finned heat exchanger 10.

As shown in fig. 5, the coolant of the fin-type heat exchanger 10 absorbs heat of an environment with low heat flux density, and then the coolant enters the jet cavity 22 of the flow-type heat exchanger 20 and absorbs heat of the electronic component 300 with high heat flux density, the outlets 222 of the plurality of parallel jet cavities 22 are collected together to form the outlet end of the jet-type heat exchanger 20, and flow into the external heat exchanger 40 from the outlet end of the jet-type heat exchanger 20, and all the heat absorbed by the heat exchanger device 100 is transferred to the external environment through the external heat exchanger 40, and then returns to the fin-type heat exchanger 10 through the inlet end of the fin-type heat exchanger 10, thereby completing the closed-loop circulation of the coolant.

In this way, the coolant can be recycled, and the flow rate of the coolant can be increased, thereby increasing the cooling efficiency of the entire heat exchanger apparatus 100.

In some embodiments, the outlet end of the external heat exchanger 40 communicates with one or more finned heat exchangers 10. One or more external heat exchangers 40 may be provided.

In the embodiment of the present disclosure, one external heat exchanger 40 is provided. As can be appreciated from the foregoing, the heat exchanger apparatus 100 may include a plurality of parallel branches, and each branch may include any of the above five conditions in combination with any of the five conditions included in the other branches.

In the present disclosure, no matter how the fin heat exchanger 10 and the ejector heat exchanger 20 are combined, the whole heat exchanger device 100 shares one external heat exchanger 40, the fin heat exchanger 10 has one general inlet end and is communicated with the outlet end of the external heat exchanger 40, and the ejector heat exchanger 20 has one general outlet end and is communicated with the inlet end of the external heat exchanger 40.

Thus, the volume or area of the whole heat exchanger device 100 can be reduced and the space can be saved by sharing one external heat exchanger 40. And the heat absorbed by the whole heat exchanger device 100 is uniformly exchanged with the external environment by the external heat exchanger 40, and the heat exchange efficiency is high.

In some embodiments, the external heat exchanger 40 is a tube heat exchanger or a plate heat exchanger. It should be noted that, the tube heat exchanger or the plate heat exchanger is an example listed in the embodiments of the present disclosure, and other heat exchangers in the related art may also be applied as the external heat exchanger 40 in the heat exchanger device 100, so that the overall adaptability of the heat exchanger device 100 is high.

Based on the same concept, the present disclosure also provides a cabinet, as shown in fig. 6, which includes a cabinet body 101, and the heat exchanger apparatus 100 described above; wherein, the cabinet body 101 is provided with a plurality of layers of unit cells 102, and each layer of unit cell 102 is provided with the fin type heat exchanger 10 and the jet type heat exchanger 20.

The cabinet may be a cabinet for a data center, the cabinet is in a rectangular parallelepiped structure, the cabinet has multiple layers of cells 102, a server, a storage device, a processing device, or the like may be placed in each cell 102, the server, the storage device, or the processing device may include a circuit board, and the circuit board is provided with electronic components 300 with high heat flux density, such as a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), or the like.

A finned heat exchanger 10 and a jet heat exchanger 20 are arranged in each layer of unit cell 102. The finned heat exchanger 10 and the ejector heat exchanger 20 in the multi-layer unit cell 102 correspond to a plurality of parallel branches of the heat exchanger device 100. The number and the serial connection manner of the fin type heat exchanger 10 and the jet type heat exchanger 20 are described in detail above, and are not described again here.

In addition, the fin type heat exchanger 10 and the jet type heat exchanger 20 are arranged in each layer of unit cells 102, so that the equipment such as servers, storage devices or processing devices in each layer of unit cells 102 can be fully cooled, and the equipment can be ensured to normally operate in a proper temperature range.

In the embodiment of the present disclosure, the fin heat exchanger 10 and the jet heat exchanger 20 are disposed inside each unit cell 102, and the external heat exchanger 40 is disposed outside the entire cabinet, so that the heat exchange of the entire heat exchanger device 100 with the external environment can be realized.

In the embodiment of the present disclosure, the finned heat exchanger 10 is disposed at a side close to the air inlet of the cabinet, and under the action of the fan 30, not only the heat exchange between the environment in each layer of the unit cells 102 and the finned heat exchanger 10 is realized, but also the heat exchange between the heat in the environment in each layer of the unit cells 102 and the temperature of the environment outside the cabinet is realized.

In some embodiments, the cabinet further includes a kinematic plate 103 movably disposed within each layer of cells 102; the fin type heat exchanger 10 and the jet type heat exchanger 20 are fixed on the moving plate 103, and are used for adjusting the positions of the fin type heat exchanger 10 and the jet type heat exchanger 20.

The moving plate 103 is disposed inside each layer of the unit cell 102, and the number of the moving plates 103 in each layer of the unit cell 102 may be set to one or more.

The moving plate 103 may be disposed in a position parallel to the upper, lower, left, right, and rear five inner walls of each layer of the unit cells 102. The moving plate 103 may also be bent, i.e., the moving plate 103 is parallel to at least two inner walls of each layer of the unit cells 102.

In this way, the moving plate 103 can drive the fin heat exchanger 10 and the jet heat exchanger 20 to move relative to the storage device, which is convenient for detachment during disassembly or maintenance.

It should be noted that the above is only exemplary, and the shape, number and position of the moving plates 103 may be set according to the position of the electronic component 300 with high heat flux density, such as a cpu or a picture processor, and will not be described in detail herein.

In some embodiments, the heat exchanger apparatus 100 further comprises an external heat exchanger 40, the external heat exchanger 40 is disposed outside the cabinet 101, and an outlet end of the external heat exchanger 40 communicates with an inlet end of the plurality of fin heat exchangers 10.

The finned heat exchanger 10 and the ejector heat exchanger 20 of the multi-layer unit cell 102 finally share one external heat exchanger 40. Thus, the whole cabinet space is small, and the heat exchange efficiency of the heat exchanger device 100 is high.

It is understood that "a plurality" in this disclosure means two or more, and other words are analogous. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. The singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will be further understood that the terms "first," "second," and the like are used to describe various information and that such information should not be limited by these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the terms "first," "second," and the like are fully interchangeable. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "central," "longitudinal," "lateral," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the embodiments of the present disclosure and to simplify the description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, configuration, and operation.

It will be further understood that, unless otherwise specified, "connected" includes direct connections between the two without the presence of other elements, as well as indirect connections between the two with the presence of other elements.

It is further to be understood that while operations are depicted in the drawings in a particular order, this is not to be understood as requiring that such operations be performed in the particular order shown or in serial order, or that all illustrated operations be performed, to achieve desirable results. In certain environments, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is to be limited only by the scope of the appended claims.

The above detailed description should not be construed as limiting the scope of the disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present disclosure should be included in the scope of protection of the present disclosure.

Claims (16)

1. A heat exchanger apparatus comprising:

a finned heat exchanger;

the jet flow type heat exchanger is connected with the fin type heat exchanger in series;

and the cooling liquid flows to the jet flow type heat exchanger from the fin type heat exchanger.

2. The heat exchanger apparatus according to claim 1,

the jet type heat exchanger is provided with a plurality of jet type heat exchangers which are connected in parallel.

3. The heat exchanger apparatus according to claim 1,

the jet heat exchanger comprises a cold plate which is used for being attached to and covering the surface of a heating element.

4. The heat exchanger apparatus according to claim 3,

one or more of heat-conducting silicone grease, heat-conducting silica gel, heat-conducting gaskets and heat-conducting adhesive tapes are arranged between the cold plate and the surface of the heating element.

5. The heat exchanger apparatus according to claim 3,

the jet flow type heat exchanger comprises a jet flow cavity, and the cold plate is arranged in the jet flow cavity;

the jet flow cavity comprises an inlet and an outlet, the inlet and the cold plate are arranged oppositely, the direction of the cooling liquid sprayed into the cold plate from the inlet is perpendicular to the direction of the cold plate, and the direction of the cooling liquid flowing out of the outlet is parallel to the direction of the cold plate.

6. The heat exchanger apparatus according to claim 5,

the jet flow cavity is made of a metal material and is integrally formed with the cold plate.

7. The heat exchanger apparatus according to claim 5,

the jet cavity is provided with one or more inlets; and/or

The fluidic chamber is provided with one or more of the outlets.

8. The heat exchanger apparatus according to claim 5,

the entrance is provided with:

the funnel part is communicated with the outlet end of the fin type heat exchanger and is positioned outside the jet flow cavity;

and the round pipe part is communicated with the funnel part and is positioned in the jet flow cavity.

9. The heat exchanger apparatus according to claim 8,

the round pipe part is provided with an array nozzle.

10. The heat exchanger apparatus according to claim 1,

the fin type heat exchangers are arranged in a plurality of numbers and are connected in parallel, and each fin type heat exchanger corresponds to one or more jet type heat exchangers.

11. The heat exchanger apparatus according to claim 1, further comprising,

one or more fans disposed proximate to the finned heat exchanger.

12. The heat exchanger apparatus of claim 1, further comprising:

the external heat exchanger is connected with the fin type heat exchanger and the jet type heat exchanger in series to form a closed loop;

and the outlet end of the external heat exchanger is communicated with one or more finned heat exchangers.

13. The heat exchanger apparatus according to claim 12,

the external heat exchanger is a tubular heat exchanger or a plate heat exchanger.

14. A cabinet, comprising:

the cabinet body is provided with a plurality of layers of unit grids; and

the heat exchanger device as claimed in any one of claims 1 to 13,

each layer of unit cell is provided with the fin type heat exchanger and the jet type heat exchanger.

15. The cabinet of claim 14, further comprising:

the moving plate is movably arranged in each layer of unit cell;

the fin type heat exchanger and the jet type heat exchanger are fixed on the moving plate and used for adjusting the positions of the fin type heat exchanger and the jet type heat exchanger.

16. The cabinet of claim 14, wherein,

the heat exchanger device further comprises an external heat exchanger, the external heat exchanger is arranged outside the cabinet body, and the outlet end of the external heat exchanger is communicated with the inlet ends of the fin type heat exchangers.

Images