JP4654546B2 - Notebook computer - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a notebook personal computer that prevents heat generated by a CPU or the like on a printed circuit board inside the personal computer from being transmitted to the bottom surface of the personal computer or the surface of a keyboard, and causing discomfort due to heat.
[0002]
[Prior art]
In recent years, when heat generated inside a laptop computer is transferred to the surface of the computer and the surface temperature rises, the heat at the portion where the PC user's body contacts the surface of the computer makes the user uncomfortable. That is a problem.
[0003]
As an example, the heat source inside the personal computer is mainly the CPU on the printed circuit board, each chip, the power supply, etc. However, since the surface temperature of the CPU reaches over 100 ° C. in particular, it is locally on the bottom of the personal computer close to the CPU. In some cases, the temperature of the personal computer may become high, and the heat of the bottom surface of the personal computer when the personal computer is operated on the user's lap or the heat of the surface of the keyboard or the palm touches the user may be uncomfortable.
[0004]
Under these circumstances, as a recent technology, a technology that efficiently cools a heating element such as a CPU without increasing the dimension in the height direction, a heat generating part inside the personal computer is surrounded by a heat insulating material, and a heat pipe encloses the inside of the personal computer. The technology which suppresses the temperature rise of the case surface of the personal computer by transmitting / dissipating the heat is proposed.
[0005]
For example, as disclosed in Japanese Patent Application Laid-Open No. 2000-277964, the heat generated from a heating element such as a CPU is transferred to a location different from the location of the heating element by a heat transfer means such as a heat pipe and a heat sink. Has proposed a notebook computer that cools quickly by forced heat dissipation.
[0006]
Also, for example, as disclosed in Japanese Patent Application Laid-Open No. 11-202978, a heat insulating material that cuts off between the heat generating portion inside the device and the bottom surface of the personal computer, a heat sink provided on the back surface of the display portion, and generated inside the device The heat pipe that transmits the heat to the heat radiating plate and the ventilation holes provided at the top and bottom of the display case prevent the heat generated in the device from being transmitted to the bottom of the computer, etc. Notebook personal computers to be transported have been proposed.
[0007]
[Problems to be solved by the invention]
However, in the case of Japanese Patent Laid-Open No. 2000-277964, it is possible to prevent the abnormal temperature rise of the CPU itself by promoting the heat dissipation of the CPU while keeping the notebook personal computer thin. The generation of radiant heat is inevitable, and it is impossible to prevent the occurrence of local high-temperature areas on the bottom of the PC and keyboard.
[0008]
Furthermore, in the case of JP-A-11-202978, if the heat insulating performance of the heat insulating material is low, the effect of suppressing the amount of heat transmitted to the personal computer surface is small, and in order to obtain the effect, it is necessary to increase the thickness of the heat insulating material, In recent years, it has become difficult to reduce the thickness desired for notebook computers.
[0009]
In addition, the printed board and keyboard, HDD, ground aluminum plate, and the case of the main body are surrounded by a heat insulating material, heat is easily trapped, and heat from the CPU and other heat-generating components on the printed board is dissipated. Since most of them rely on heat transfer from the heat pipe to the heat sink, it is necessary to increase the performance of the heat pipe and heat sink.
[0010]
The object of the present invention is to install a high-performance vacuum insulation material that cuts off heat transfer between the heat generating part inside the notebook computer and the surface of the computer so that the insulation efficiency is improved in a limited size. Prevents local temperature rise on the PC surface over a long period of time and suppresses temperature rise on the entire PC surface, preventing users from feeling discomfort due to heat even when used for a long time There is.
[0011]
[Means for Solving the Problems]
The notebook personal computer of the present invention includes a printed circuit board, a CPU on the printed circuit board, a heat dissipation device that eliminates heat dissipation from the CPU , and a vacuum heat insulating material having a size larger than the planar area of the CPU. The outer material of the material is composed of two types of laminated films, one of the outer materials is a laminated film having an aluminum foil layer, the other of the outer materials is a laminated film having an aluminum vapor deposition layer, and the vacuum The heat-sealed portion of the outer periphery of the outer cover material of the heat insulating material was folded to the side of the laminated film having the aluminum foil layer, and the laminated film surface having the aluminum deposited layer was attached in close contact with the inside of the bottom of the personal computer or the back of the keyboard It is a notebook computer, a vacuum insulation material that covers the core material with low solid thermal conductivity with a jacket material with high gas barrier properties and evacuates the inside, close to the CPU. Prevents radiant heat from the CPU to the affected area. In addition, by attaching the vacuum insulation to the bottom of the computer or the back of the keyboard, heat transfer due to the air present between the vacuum insulation and the vacuum insulation with excellent insulation performance is installed. Therefore, heat transfer from the inside of the personal computer to the surface of the personal computer can be greatly reduced with a thinner thickness than when a general-purpose heat insulating material of normal pressure is attached.
[0013]
Further, in the notebook type personal computer of the present invention, the jacket material of the vacuum heat insulating material is composed of two kinds of laminated films, one of the jacket materials is a laminated film having an aluminum foil layer, and the other is a laminated film having an aluminum vapor deposition layer. Fold the heat-welded part of the outer periphery of the vacuum insulation material to the side of the laminated film with the aluminum foil layer, and make the laminated film surface with the aluminum vapor deposition layer adhere to the inside of the bottom of the computer or the back of the keyboard. Since the heat-welded part of the outer periphery of the vacuum insulation material is bent and attached, the ratio of the area of the core part, which is the effective heat insulation part, to the space to be insulated is increased. The heat insulation efficiency with the bottom of the personal computer and the back of the keyboard is improved, and the bottom surface temperature reduction effect for a certain area can be increased.
[0014]
In addition, since the heat-welded part of the outer periphery of the vacuum insulation material is bent to the side having the aluminum foil layer and attached to the personal computer, the influence of heat leakage caused by the heat conduction of the aluminum foil layer is reduced on both sides. It can be reduced to the same level as when an aluminum vapor deposition layer is used. Furthermore, since it has an aluminum foil layer having a high gas barrier property on one side of the vacuum heat insulating material, it is excellent in long-term reliability compared with a vacuum heat insulating material having an aluminum vapor deposition layer on both sides.
[0015]
In the notebook type personal computer of the present invention, the heat radiating device that excludes heat from the CPU is composed of at least one of a heat radiating plate, a heat sink, a heat pipe, a thermo module, and a fan.
[0016]
Furthermore, the core material of the vacuum heat insulating material is selected as a base material of fumed silica excellent in heat insulating performance, and contains at least 1% by weight or more of powdery carbon to uniformly disperse, thereby achieving excellent heat insulating performance and long-term performance. A reliable high-performance vacuum heat insulating material can be provided.
[0017]
If the average primary particle size of the fumed silica of the core material of the vacuum heat insulating material is 50 nm or less, the voids between the powders are fine and fumed silica with a lower gas thermal conductivity is obtained, and more excellent heat insulating performance is achieved. It is possible to provide a high performance vacuum heat insulating material.
[0018]
Furthermore, by changing the powdered carbon dispersed in the core of the vacuum heat insulating material to a powdered carbon black having a specific surface area of less than 100 m ² / g, the gas generated over time from the powdered carbon black improves the heat insulating performance. Therefore, it is possible to provide a high performance vacuum heat insulating material with little deterioration of heat insulating performance over time.
[0019]
In addition, if the powdery carbon black having a specific surface area of 100 m ² / g or more and less than 300 m ² / g is used, the addition amount is set to 1% by weight or more and 30% by weight or less. It is possible to provide a high-performance vacuum heat insulating material that is suppressed to such an extent that the gas generated in the air does not interfere with the improvement of the heat insulating performance, and that hardly deteriorates over time.
[0020]
Furthermore, by making these powdery carbons into graphitized carbon powders, the graphitized carbon powders have a structure with high crystallinity by high-temperature firing in advance and do not contain impurities such as organic gases. Moreover, since it does not have a reactive group at the terminal, it is possible to provide a high-performance vacuum heat insulating material that does not generate gas over time and has little deterioration in heat insulating performance.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a notebook personal computer according to the present invention will be described below with reference to the drawings. In addition, about the same structure as the past, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.
[0022]
(Embodiment 1)
1 is a side view of a notebook computer according to Embodiment 1 of the present invention, FIG. 2 is a perspective view of the notebook computer according to Embodiment 1 of the present invention as viewed from above, and FIG. 3 is a plan view of a vacuum heat insulating material. 4 is a cross-sectional view of the vacuum heat insulating material, and FIG. 5 is a detailed view of the main part of the heat welded portion of FIG.
[0023]
Reference numeral 1 denotes a notebook personal computer on which a CPU 3 and other chips are mounted on a printed circuit board 2. Reference numeral 4 denotes a cooling device for the CPU 3, which includes a heat transfer block 5 in contact with the CPU 3, a heat pipe 6 that transfers heat, a heat sink 7 that forcibly releases the transferred heat from the notebook computer 1, and a fan 8. A heat sink 9 diffuses and dissipates the internal heat. Reference numeral 10 denotes a vacuum heat insulating material, which is attached to the inside of the PC bottom surface 11 directly below the CPU 3 and the keyboard back surface 12 directly above the CPU 3 with an adhesive.
[0024]
The vacuum heat insulating material 10 is formed by filling a core material 14 in a jacket 13 having a gas barrier property and thermally welding the outer periphery of the jacket material to form a heat welded portion 15, and the inside is reduced in pressure or vacuum. . The material is wet silica powder as the core material 14, the surface protection layer 13a is covered with a polyethylene terephthalate film, the gas barrier layer 13b is formed of an ethylene vinyl alcohol copolymer resin film with aluminum vapor deposition, and the heat welding layer 13c is covered with the material. High-density polyethylene is used. The internal pressure of the vacuum heat insulating material 10 is 133.3 Pa, and the size is 95 (mm) × 50 (mm) × 2 (mm). The heat conductivity of the vacuum heat insulating material 10 was measured and found to be 0.0080 W / mK.
[0025]
When the surface temperature of the notebook type personal computer 1 configured in this way was measured, it can be reduced by about 4 ° C. at the personal computer bottom surface 11 directly below the CPU 3 than when the vacuum heat insulating material is not installed. The temperature could be reduced by about 3.5 ° C. Furthermore, the entire bottom surface of the personal computer could be reduced by 2 ° C. or more.
[0026]
When a general-purpose atmospheric pressure insulation material of the same thickness is attached in close contact, only a temperature reduction of about 1.5 ° C. is observed on the bottom surface 11 of the PC just below the CPU 3 and about 1 ° C. is observed on the keyboard directly above the CPU 3. Great effect compared to the case where the user did not work, when the user worked on the computer for a long time on the knee, the discomfort caused by the heat from the bottom, or when the user placed his hand on the keyboard while working Can reduce discomfort caused by heat.
[0027]
The position where the vacuum heat insulating material 10 is attached is not limited to the CPU 3 as long as it causes local heat generation, and the bottom surface of the personal computer may be provided with a heat sink 9 or aluminum vapor deposition on the entire surface for heat dissipation or the like. However, the vacuum insulation material 10 may be mounted on these.
[0028]
Here, as the core material of the vacuum heat insulating material, open cells of a polymer material such as polystyrene and polyurethane, inorganic and organic powders, inorganic and organic fiber materials, and the like can be used.
[0029]
In the present invention, agglomerated silica powder, foamed pearlite pulverized powder, diatomaceous earth powder, calcium silicate powder, calcium carbonate powder, inorganic powder such as clay and talc, and inorganic fibers such as glass wool and ceramic fiber, among which secondary agglomerated particles are preferable. An inorganic powder having a diameter of 20 μm or less is desirable.
[0030]
The outer cover material is a surface protective layer, stretched products such as nylon film, polyethylene terephthalate film, polypropylene, gas barrier layer, metal vapor deposition film, inorganic vapor deposition film and metal foil, etc. High-density polyethylene film, ethylene / vinyl alcohol copolymer resin film, polypropylene film, polyacrylonitrile film, unstretched polyethylene terephthalate film, and the like can be used.
[0031]
(Embodiment 2)
FIG. 6 is a cross-sectional view of the vacuum heat insulating material 10a attached to the notebook computer 1 according to the second embodiment of the present invention. The configuration of the notebook personal computer 1 is the same as that of the first embodiment. 16 is a laminated film having an aluminum foil layer on the gas barrier layer 13b of the jacket material 13, 17 is a laminated film having an aluminum deposited layer on the gas barrier layer 13b of the jacket material 13, and the heat-welded portion 15 has an aluminum foil layer. It is bent toward the laminated film 16 side.
[0032]
With the vacuum heat insulating material 10a configured in this way, the laminated film 16 side having the aluminum foil layer is directed to the CPU 3 side that is a high temperature inside the personal computer, and the laminated film 17 having the aluminum vapor deposition layer is placed inside the personal computer bottom surface 11 or Since the notebook type personal computer 1 attached in close contact with the back surface 12 of the keyboard is attached by bending the thermal welding portion 15 at the outer periphery of the outer cover material of the vacuum heat insulating material 10a toward the CPU 3 inside the personal computer, The ratio of the area of the core part which is an effective heat insulation part rises, and the temperature reduction effect can be raised.
[0033]
Moreover, since the heat welding part 15 of the outer periphery of the vacuum insulating material 10a is bent to the laminated film 16 side having the aluminum foil layer and mounted inside the personal computer, heat leakage caused by heat transfer of the aluminum foil layer Can be reduced to the same extent as the vacuum heat insulating material having the laminated film having the aluminum vapor deposition layers on both sides as shown in the first embodiment, and an equivalent temperature reduction effect can be obtained.
[0034]
Furthermore, since it has the laminated | multilayer film 16 which has an aluminum foil layer with high gas barrier property on the single side | surface of the vacuum heat insulating material 10a, compared with the vacuum heat insulating material which has a laminated film which has an aluminum vapor deposition layer on both surfaces, it is about 2 times. It has excellent long-term reliability and can maintain a heat insulating effect for a longer period.
[0035]
(Embodiment 3)
7, 8, and 9 are plan views of the vacuum heat insulating materials 10a, 10b, and 10c attached to the notebook type personal computer 1 according to the third embodiment of the present invention, in which the heat welding portion 15 is a core material. This is a state before the fin portion 18 protruding from the 14 portion is bent. The vacuum heat insulating material 10a is formed by folding the outer cover material 13 into two laminated films and heat-welding the three sides, and the vacuum heat insulating material 10b is formed by forming the outer cover material 13 into a single tubular film. It consists of a pillow type. Although the vacuum heat insulating material 10c is also a cylindrical pillow type, by using the auxiliary film 19 for the heat-welded portion 15a that connects one sheet of the covering material 13, a structure having a higher gas barrier property than the pillow type is provided. Can do. The configuration of the notebook personal computer 1 is the same as that of the first embodiment.
[0036]
These vacuum heat insulating materials 10a, 10b, and 10c are the case where the heat welding part 15 of the outer periphery of the outer cover material is a two-sided or three-sided fin part 18 that protrudes from the core material 14 part, and is a four-side seal type outer covering material. Since there are few compared with 4 sides, the reliability with respect to a gas barrier improves more.
[0037]
Further, when the fin 18 is bent and attached to the CPU 3 side inside the personal computer, the vacuum heat insulating material can be attached to the thin space inside the personal computer with a small excess thickness due to the bending. It can be installed in a space about 1.5 mm thinner than the vacuum heat insulating material.
[0038]
(Embodiment 4)
FIG. 10 is a cross-sectional view of a vacuum heat insulating material 10e according to Embodiment 4 of the present invention. At least 1 weight of powdered carbon 21 is added to fumed silica 20 as a core material 14 to a jacket material 13 having a laminated film layer. % Or more contained, uniformly dispersed and filled.
[0039]
For such vacuum insulation, fumed silica with excellent heat insulation performance is selected as a base material, and furthermore, high-performance vacuum with long-term reliability and excellent heat insulation performance by uniformly dispersing powdered carbon Insulation can be provided.
[0040]
(Embodiment 5)
FIG. 11 is a cross-sectional view of a vacuum heat insulating material 10f according to the fifth embodiment of the present invention. In the fourth embodiment, a fumed material having an average primary particle diameter of 50 nm or less is applied to the jacket material 13 having a laminated film layer. Silica 20a and powdered carbon 21 are uniformly dispersed and filled.
[0041]
Such a vacuum heat insulating material can make the space | gap between powder fine and can further reduce gas thermal conductivity. When the internal pressure and heat transfer rate of the vacuum heat insulating material 10f according to Embodiment 5 of the present invention were measured in the same manner as in Embodiment 1, it was 0.0050 W / mK at 133.3 Pa.
[0042]
In the notebook type personal computer equipped with the vacuum heat insulating material, the temperature of the bottom surface of the personal computer just under the CPU could be reduced by about 6 ° C. compared to when the vacuum heat insulating material was not installed.
[0043]
(Embodiment 6)
FIG. 12 is a cross-sectional view of a vacuum heat insulating material 10g according to Embodiment 6 of the present invention. In Embodiment 4, fumed with an average primary particle size of 50 nm or less is applied to the jacket material 13 having a laminated film layer. Silica 20a and powdered carbon black 21a having a specific surface area of less than 100 m ² / g as powdered carbon 21 are uniformly dispersed and filled.
[0044]
Since such a vacuum heat insulating material can suppress the gas generated over time from the powdered carbon black to the extent that it does not interfere with the improvement of the heat insulating performance, there is no deterioration of the heat insulating performance over time, and this vacuum heat insulating material is provided. The notebook personal computer can suppress heat transfer to the personal computer surface for a longer period of time.
[0045]
(Embodiment 7)
FIG. 13 is a cross-sectional view of a vacuum heat insulating material 10h according to Embodiment 7 of the present invention. In Embodiment 4, fumed with an average primary particle diameter of 50 nm or less is applied to the jacket material 13 having a laminated film layer. Silica 20a and powdered carbon black 21b having a specific surface area of 100 m ² / g or more and less than 300 m ² / g are uniformly dispersed and filled.
[0046]
Since such a vacuum heat insulating material can suppress the gas generated over time from the powdered carbon black to the extent that it does not interfere with the improvement of the heat insulating performance, there is no deterioration of the heat insulating performance over time, and this vacuum heat insulating material is provided. The notebook personal computer can suppress heat transfer to the personal computer surface for a longer period of time.
[0047]
(Embodiment 8)
FIG. 14 is a cross-sectional view of a vacuum heat insulating material 10i according to an eighth embodiment of the present invention. In the fourth embodiment, a fumed material having an average primary particle diameter of 50 nm or less is applied to the jacket material 13 having a laminated film layer. A graphitized carbon powder 21c as a powdered carbon 21 is uniformly dispersed and filled in silica 20a.
[0048]
In such a vacuum heat insulating material, the graphitized carbon powder contained in the core material of the vacuum heat insulating material has a structure with high crystallinity by high-temperature firing, does not contain impurities such as organic gas, Since there is no generation of gas from the reactive group over time, the heat insulation performance is hardly deteriorated and heat transfer to the personal computer surface can be suppressed for a longer period.
[0049]
【The invention's effect】
As described above, the notebook personal computer of the present invention includes a printed circuit board, a CPU on the printed circuit board, a heat dissipation device that eliminates heat dissipation from the CPU, and a vacuum heat insulating material having a size that is at least larger than the planar area of the CPU. The notebook computer is characterized in that it is attached in close contact with at least one of the inside of the bottom surface of the personal computer just below the CPU and the back surface of the keyboard directly above the CPU, and is close to the CPU. The radiant heat from the CPU to the part is prevented, and furthermore, the heat insulation by the air existing between the vacuum heat insulating material is prevented by attaching the vacuum heat insulating material in close contact with the bottom of the PC or the back of the keyboard. Suppresses heat transfer from the inside of the computer to the surface.
[0050]
The vacuum heat insulating material is composed of a laminated film in which one of the jacket materials has an aluminum foil layer, and the other is a laminated film having an aluminum vapor deposition layer, and the heat-welded portion around the outer jacket material of the vacuum heat insulating material is made of an aluminum foil layer. The area of the core part that is an effective heat insulation part for the space to be insulated is attached by folding the laminated film side having an aluminum vapor deposition layer in close contact with the inside of the bottom surface of the personal computer or the back side of the keyboard. The ratio is increased, the heat insulation efficiency between the inside of the personal computer and the bottom of the personal computer and the back of the keyboard is improved, and the aluminum foil layer having a high gas barrier property is provided on one side of the vacuum heat insulating material, so that the long-term reliability is excellent.
[0052]
Furthermore, the core material of the vacuum heat insulating material is selected as a base material of fumed silica excellent in heat insulating performance, and contains at least 1% by weight or more of powdery carbon to uniformly disperse, thereby achieving excellent heat insulating performance and long-term performance. A reliable high-performance vacuum heat insulating material can be provided.
[0053]
If the average primary particle size of the fumed silica of the core material of the vacuum heat insulating material is 50 nm or less, the voids between the powders are fine and fumed silica with a lower gas thermal conductivity is obtained, and more excellent heat insulating performance is achieved. It is possible to provide a high performance vacuum heat insulating material.
[0054]
Furthermore, by changing the powdered carbon dispersed in the core of the vacuum heat insulating material to a powdered carbon black having a specific surface area of less than 100 m ² / g, the gas generated over time from the powdered carbon black improves the heat insulating performance. Therefore, it is possible to provide a high performance vacuum heat insulating material with little deterioration of heat insulating performance over time.
[0055]
In addition, if the powdery carbon black having a specific surface area of 100 m ² / g or more and less than 300 m ² / g is used, the addition amount is set to 1% by weight or more and 30% by weight or less. It is possible to provide a high-performance vacuum heat insulating material in which the generated gas is suppressed to the extent that it does not interfere with the improvement of the heat insulation performance, and the deterioration of the heat insulation performance over time is small.
[0056]
Furthermore, by converting the powdered carbon into graphitized carbon powder, the graphitized carbon powder has a structure with high crystallinity by high-temperature firing in advance, and does not contain impurities such as organic gas. In addition, since it does not have a reactive group at the terminal, it is possible to provide a high-performance vacuum heat insulating material that does not generate gas over time and has little deterioration in heat insulating performance.
[0057]
From the above, the present invention has a limited size of high-performance vacuum insulation material that blocks heat transfer between the heat generating part inside the personal computer and the surface of the personal computer without hindering the thinning of the notebook personal computer. By wearing it so as to improve the heat insulation efficiency, it is possible to prevent a local temperature rise on the PC surface over a long period of time and suppress the temperature rise of the entire PC surface. This can prevent discomfort caused by heat in the hands.
[Brief description of the drawings]
FIG. 1 is a side view of a notebook computer according to Embodiment 1 of the present invention. FIG. 2 is a perspective view of the notebook computer according to Embodiment 1 of the present invention as viewed from above. FIG. 4 is a cross-sectional view of the vacuum heat insulating material according to Embodiment 1 of the present invention. FIG. 5 is a detailed view of the main part of the heat welded portion of FIG. 4. FIG. FIG. 7 is a plan view of a vacuum heat insulating material according to a third embodiment of the present invention. FIG. 8 is a plan view of a vacuum heat insulating material according to a third embodiment of the present invention. FIG. 10 is a plan view of a vacuum heat insulating material according to Embodiment 3 of the present invention. FIG. 10 is a cross-sectional view of a vacuum heat insulating material according to Embodiment 4 of the present invention. FIG. 12 is a sectional view of a vacuum heat insulating material according to a sixth embodiment of the present invention. FIG. 13 shows a seventh embodiment of the present invention. Sectional view of the vacuum heat insulating material 14 is a cross-sectional view of a vacuum heat insulating material according to an eighth embodiment of the present invention Description of Reference Numerals] that
1 Notebook PC 2 Printed Circuit Board 3 CPU
4 Heat Dissipation Device 5 Heat Transfer Block 6 Heat Pipe 7 Heat Sink 8 Fan 9 Heat Dissipation Plates 10, 10a to 10i Vacuum Heat Insulation Material 11 PC Bottom 12 Keyboard Back Surface 13 Cover Material 13a Surface Protection Layer 13b Gas Barrier Layer 13c Thermal Welding Layer 14 Core Material 15 , 15a Heat welded portion 16 Laminated film 17 having aluminum foil layer Laminated film 18 having aluminum vapor deposition layer 18 Fin portion 19 Auxiliary film 20, 20a Fumed silica 21 Powdered carbon 21a, 21b Powdered carbon black 21c Graphitized carbon powder

Claims (7)

A printed circuit board, and the CPU on the printed circuit board, a heat radiation device for eliminating heat radiation of the CPU, and a vacuum heat insulating material having a planar area than the size of the CPU, the enveloping member of the vacuum heat insulating material It is composed of two kinds of laminated films, one of the jacket materials is a laminated film having an aluminum foil layer, the other of the jacket materials is a laminated film having an aluminum vapor deposition layer, and the jacket of the vacuum heat insulating material A notebook personal computer in which a heat-welded portion at the periphery of the material is folded to the side of the laminated film having the aluminum foil layer, and the laminated film surface having the aluminum vapor deposition layer is attached in close contact with the inside of the bottom of the personal computer or the back of the keyboard .   2. The notebook personal computer according to claim 1, wherein the heat radiating device that excludes heat from the CPU includes at least one of a heat radiating plate, a heat sink, a heat pipe, a thermo module element, and a fan. The notebook personal computer according to claim 1 or 2, wherein the core material of the vacuum heat insulating material is fumed silica containing at least 1% by weight of powdery carbon. The notebook computer according to claim 3 , wherein the fumed silica of the core material of the vacuum heat insulating material has an average primary particle diameter of 50 nm or less. Notebook computer of claim 3 or claim 4 powdered carbon contained in the core material of the vacuum heat insulating material, characterized in that a powdered carbon black is less than a specific surface area of 100 m ² / g. The powdery carbon contained in the core material of the vacuum heat insulating material is a powdery carbon black having a specific surface area of 100 m ² / g or more and less than 300 m ² / g, and the addition amount is 1 wt% or more and 30 wt% or less. notebook computer of claim 3 or claim 4, characterized in that. Powdered carbon contained in the core material of the vacuum heat insulating material, a notebook computer according to claim 3 or claim 4 characterized in that it is a graphitized carbon powder.

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