JP4104887B2 - Internal structure of electrical and electronic equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an internal structure of an electric / electronic apparatus provided with a heat-generating electronic element.
[0002]
[Background Art and Problems to be Solved by the Invention]
When the hard disk drive (hereinafter referred to as HDD) of a notebook personal computer is continuously operated, the temperature of the HDD may rise to about 50 ° C. when forced cooling is not performed. In this regard, since there is a view that temperature affects the life of the HDD, there is a concern about the failure of the HDD due to overheating. The heat generated by the HDD is transmitted to the housing and released. However, in the notebook personal computer, a part of the housing serves as a palm rest, so the palm rest is also heated. For this reason, when a personal computer is used for a long time, there is also a problem that the user feels discomfort due to heat.
[0003]
In addition, video cameras also generate heat from electronic devices such as CPUs and ICs, so there are concerns about operational stability due to temperature rises. A problem similar to the above occurs in which a person feels discomfort due to heat.
[0004]
Such a problem is not limited to notebook computers and video cameras, and is common to electric and electronic appliances having a heat-generating electronic element containing an electric resistance component, and is particularly prominent in inverse proportion to downsizing of the apparatus. It is becoming.
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to prevent the heat-generating electronic element from being damaged due to heat, and to prevent the inside of the electric / electronic apparatus from causing heat damage to a human body or an object that contacts the electric / electronic apparatus. To provide a structure.
[0005]
[Means for Solving the Problems and Effects of the Invention]
In order to solve the above problems, the present invention is an internal structure of an electric / electronic apparatus provided with a heat-generating electronic element,
A heat insulating member disposed on the inner surface of the casing of the electric and electronic instrument;
A heat conducting member disposed in contact with Oite both between the formed by a flexible material which can be brought into close contact with the heat-generating electronic device and the heat insulating member and the heat-generating electronic device,
A structure in which a refrigerant is sealed inside a metal pipe, and has a portion that passes through the inside of the heat conducting member and a portion that goes out of the heat conducting member, and the heat accumulated in the heat conducting member is A heat pipe that cools the inside of the heat conducting member by transmitting it to the part that has gone out of the heat conducting member;
A heat sink that is provided in a portion of the heat pipe that is exposed to the outside of the heat conducting member, and that dissipates heat transmitted to the portion that has been exposed to the outside of the heat conducting member, thereby cooling the heat pipe . It is characterized by that.
[0006]
In the present invention, the electric / electronic appliance is an appliance in which at least a part of the casing (for example, a handle portion) may be overheated by the heat-generating electronic element, and includes, for example, a notebook computer, a video camera, a mobile phone, and the like. . Further, the exothermic electronic element is an element including an electrical resistance component, and corresponds to, for example, a CPU, an IC, a power transistor, a transformer, a coil, a capacitor, a motor, and the like.
[0007]
When the electric and electronic apparatus of the present invention is continuously used, the heat-generating electronic element generates heat, but this heat is transmitted to the heat conducting member and accumulated therein. That is, the heat generated by the heat-generating electronic element can be released to the heat conducting member. On the other hand, the temperature of the heat conducting member rises due to heat storage, but since the heat insulating member is arranged between the heat conducting member and the housing, the heat insulating member is insulated from the heat conducting member to the heat insulating member of the inner surface of the housing. It effectively prevents heat from being transferred to the place where the is placed. Therefore, the temperature rise of the location where the heat insulation member is arrange | positioned among the housing | casings of an electrical / electronic device is suppressed.
[0008]
As described above, according to the present invention, the heat generated by the heat generating electronic element can be released to the heat conducting member, so that it is possible to prevent the heat generating electronic element from being damaged due to overheating. Moreover, since the temperature rise of the housing | casing of an electrical / electronic device can be suppressed, the effect that it does not cause the damage by a heat | fever with respect to the human body and the object which contact an electrical / electronic device is acquired.
[0009]
In the internal structure of the electric / electronic apparatus according to the present invention, it is preferable that the heat insulating member is disposed on an inner surface of the housing where it is necessary to prevent overheating. The heat insulating member may be arranged on the entire inner surface of the housing, but considering the economy, etc., it is arranged on the inner surface of the housing where it is necessary to prevent overheating (for example, a portion of the housing that contacts the human body). It is preferable to do.
[0010]
Further, the thermally conductive member, Ru is disposed in contact with both between the heat insulating member and the heat-generating electronic device. Thus, the heat conduction member is in contact with the heat-generating electronic elements, as compared with the case of non-contact, the heat-generating electronic device is generated heat can be dissipated efficiently to the heat conducting member.
[0012]
Furthermore, the heat pipe is one in which a refrigerant is sealed inside a heat conduction pipe (a metal pipe such as copper), and the surroundings are cooled using the heat of vaporization of the refrigerant . The heat accumulated in the heat conducting member is cooled very efficiently by the heat pipe passed through the heat conducting member. That is, since the heat pipe cools the inside of the heat conducting member, the heat conducting member can be kept at a low temperature, and the heat generated by the heat-generating electronic element can be released more efficiently.
The heat pipe has a portion that passes through the inside of the heat conducting member and a portion that goes out of the heat conducting member, and a heat sink is provided in the portion that goes out of the heat conducting member. The heat sink cools the heat pipe by dissipating heat transmitted to the portion that has gone out of the heat conducting member.
[0013]
In the internal structure of the electric / electronic apparatus according to the present invention, the heat insulating member is preferably a member having a portion formed of ceramic fiber, glass fiber, or a porous body (for example, a foamed body such as melamine, urethane, or polyimide). . Moreover, it is preferable that the heat conductivity of a heat insulation member is less than 0.1 W / m * K. As the heat insulating member, a ceramic fiber, glass fiber or a porous body (called a base material) may be used as it is, but a base material sandwiched between aluminum foils may be used, In this case, since heat is diffused by the aluminum foil even with respect to local heat, the heat insulating effect is improved.
[0014]
In the internal structure of the electric / electronic apparatus according to the present invention, it is preferable that the heat conductive member has a portion formed of heat conductive silicone. In this case, the heat-conductive silicone is flexible, so it has good adhesion when brought into contact with the exothermic electronic element, and can efficiently release the heat of the exothermic electronic element, as well as vibration countermeasures such as vibration and sound insulation. Is also effective. Examples of the heat conductive silicone include those in which a heat conductive filler (for example, aluminum oxide, boron nitride, aluminum nitride, zinc oxide, silicon carbide, quartz, aluminum hydroxide, etc.) is blended with organopolysiloxane. In addition, when it is necessary to improve physical strength, you may use the heat conductive silicone containing glass fiber instead of the above-mentioned heat conductive silicone or together with this. Moreover, it is preferable that the heat conductivity of a heat conductive member shall be 0.5 W / m * K or more.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Preferred embodiments of the present invention will be described below with reference to the drawings.
In the following description, the first reference example and the second reference example described above exemplify related technology including a part of the configuration requirements of the present invention, and the first embodiment described thereafter is described. And other embodiments correspond to embodiments of the present invention.
[ First Reference Example ]
FIG. 1 is a cross-sectional view of a first reference example . A heat insulating sheet 13 made of polyurethane foam is fixed to the inner surface of a human body contact portion 12 (for example, the front portion of a keyboard corresponding to a palm rest) of a plastic casing 11 of a notebook computer 10 as an electric / electronic apparatus. . The thermal conductivity of polyurethane foam is generally 0.01 to 0.03 W / m · K for both soft and rigid polyurethane foams. A heat conductive sheet 14 made of heat conductive silicone rubber (thermal conductivity 0.8 W / m · K) is fixed to the surface of the heat insulating sheet 13 opposite to the housing, and the heat conductive sheet 14 is The heat-generating electronic element 16 on the printed board 15 is in contact. The heat conductive sheet 14 is formed in a size that can cover at least the surface of the heat-generating electronic element 16 that faces the human body contact portion 12.
[0016]
When the notebook personal computer 10 is continuously used, the heat-generating electronic element 16 generates heat, but this heat is transmitted to the heat conductive sheet 14 and accumulated therein. That is, the heat generated by the heat-generating electronic element 16 is released to the heat conductive sheet 14. On the other hand, although the temperature of the heat conductive sheet 14 increases due to heat storage, since the heat insulating sheet 13 is disposed between the heat conductive sheet 14 and the housing 11, the heat insulating sheet 13 is moved from the heat conductive sheet 14 to the housing. 11 is effectively prevented from being transferred to the place where the heat insulating sheet 13 is arranged, that is, the human body contact place 12. Therefore, the temperature rise of the human body contact portion 12 of the notebook computer 10 is suppressed.
[0017]
In order to assemble such an internal structure, for example, a composite sheet 17 in which a heat insulating sheet 13 and a heat conductive sheet 14 are bonded together is prepared, and the heat insulating sheet 13 side of the composite sheet 17 is connected to the human body contact portion 12 of the housing 11. The heat conductive sheet 14 side of the composite sheet 17 may be brought into contact with the heat generating electronic element 16.
[0018]
As described above, according to the first reference example , the heat generated by the heat-generating electronic element 16 can be released to the heat conductive sheet 14, so that the heat-generating electronic element 16 can be prevented from being damaged due to overheating. Moreover, since the temperature rise of the human body contact body 12 of the notebook computer 10 can be suppressed, the user is not given thermal damage, that is, unpleasant feeling due to heat. Furthermore, since the heat conductive sheet 14 is made of a heat conductive silicone rubber, it not only takes heat of the heat generating electronic element 16 but also plays a role of protecting the heat generating electronic element 16 from vibration.
[0019]
[ Second Reference Example ]
FIG. 2 is a sectional view of a second reference example . The second reference example, except having a heat sink 18 as a heat radiating member to a part or the whole of the outer periphery of the heat conducting sheet 14 of the first reference example has the same configuration as the first embodiment. As described in the first reference example , the heat conductive sheet 14 accumulates heat from the heat-generating electronic element 16, but this heat is efficiently radiated through the heat sink 18 in contact with the outside air. For this reason, the heat conductive sheet 14 can be kept at a relatively low temperature, and the heat generated by the heat-generating electronic element 16 can be efficiently released. Therefore, in the second reference example , the effects of the first reference example can be obtained more remarkably.
[0020]
[ First Embodiment ]
FIG. 3 is a cross-sectional view of the first embodiment . In the first embodiment , a heat pipe 19 as a heat radiating member is passed through the inside of the heat conductive sheet 14 of the first reference example, and a heat sink 20 is provided in a portion of the heat pipe 19 that is outside the heat conductive sheet 14. Other than that, the configuration is the same as that of the first reference example . As described in the first reference example , the heat conductive sheet 14 accumulates heat from the heat-generating electronic element 16, but this heat is cooled very efficiently by the heat pipe 19 passed through the heat conductive sheet 14. The That is, the heat pipe 19 cools the inside of the heat conductive sheet 14. Further, since the heat pipe 19 dissipates heat through the heat sink 20, the heat pipe 19 is also cooled. Therefore, the first embodiment has a high cooling efficiency of the heat conduction sheet 14 is compared with the second reference example, the thermal conductive sheet 14 is kept in a lower temperature than the second reference example, heat-generating electronic device 16 is generated Heat can be released more efficiently. Therefore, in the first embodiment , the effect of the first reference example can be obtained more remarkably.
[0021]
[ Other Embodiments ]
The embodiment of the present invention is not limited to the above-described embodiment, and it goes without saying that various forms can be adopted as long as it belongs to the technical scope of the present invention .
[0022]
For example , in the first and second reference examples and the first embodiment, foamed polyurethane is used as the heat insulating sheet 14, but in addition to this, a glass fiber sheet (for example, a heat insulating sheet MGP type (thermal conductivity of Kitagawa Kogyo Co., Ltd.)). 0.09 W / m · K)) or ceramic fiber sheet (for example, heat insulating sheet CFP type (thermal conductivity 0.078 W / m · K) of Kitagawa Kogyo Co., Ltd.) may be used.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a first reference example .
FIG. 2 is a cross-sectional view of a second reference example .
FIG. 3 is a cross-sectional view of the first embodiment .
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Notebook PC, 11 ... Housing | casing, 12 ... Human body contact location, 13 ... Thermal insulation sheet, 14 ... Heat conduction sheet, 15 ... Printed circuit board, 16 ... Exothermic property Electronic element, 17 ... composite sheet, 18, 20 ... heat sink, 19 ... heat pipe.

Claims (3)

An internal structure of an electric / electronic apparatus provided with a heat-generating electronic element,
A heat insulating member disposed on the inner surface of the casing of the electric and electronic instrument;
A heat conducting member disposed in contact with Oite both between the formed by a flexible material which can be brought into close contact with the heat-generating electronic device and the heat insulating member and the heat-generating electronic device,
A structure in which a refrigerant is sealed inside a metal pipe, and has a portion that passes through the inside of the heat conducting member and a portion that goes out of the heat conducting member, and the heat accumulated in the heat conducting member is A heat pipe that cools the inside of the heat conducting member by transmitting it to the part that has gone out of the heat conducting member;
A heat sink that is provided in a portion of the heat pipe that is exposed to the outside of the heat conducting member, and that dissipates heat transmitted to the portion that has been exposed to the outside of the heat conducting member, thereby cooling the heat pipe . An internal structure of an electric / electronic apparatus characterized by that. The internal structure of the electric / electronic apparatus according to claim 1 , wherein the heat conducting member also functions as a member that protects the heat-generating electronic element from vibration . 3. The internal structure of an electric / electronic apparatus according to claim 2 , wherein the heat conducting member is made of heat conductive silicone or heat conductive silicone containing glass fiber .

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