JP2002319652A5 - - Google Patents
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- Publication number
- JP2002319652A5 JP2002319652A5 JP2002083503A JP2002083503A JP2002319652A5 JP 2002319652 A5 JP2002319652 A5 JP 2002319652A5 JP 2002083503 A JP2002083503 A JP 2002083503A JP 2002083503 A JP2002083503 A JP 2002083503A JP 2002319652 A5 JP2002319652 A5 JP 2002319652A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002083503A JP4104887B2 (en) | 2002-03-25 | 2002-03-25 | Internal structure of electrical and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002083503A JP4104887B2 (en) | 2002-03-25 | 2002-03-25 | Internal structure of electrical and electronic equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10275300A Division JP2000106495A (en) | 1998-09-29 | 1998-09-29 | Inner structure of electric/electronic apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002319652A JP2002319652A (en) | 2002-10-31 |
| JP2002319652A5 true JP2002319652A5 (en) | 2005-11-10 |
| JP4104887B2 JP4104887B2 (en) | 2008-06-18 |
Family
ID=19193390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002083503A Expired - Fee Related JP4104887B2 (en) | 2002-03-25 | 2002-03-25 | Internal structure of electrical and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4104887B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7188484B2 (en) * | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
| JP4841566B2 (en) * | 2008-01-07 | 2011-12-21 | 三菱電機株式会社 | Inverter |
| JP5643648B2 (en) * | 2008-09-22 | 2014-12-17 | パナソニック株式会社 | Portable electronic devices |
| WO2013074415A1 (en) * | 2011-11-15 | 2013-05-23 | Henkel Corporation | Electronic devices assembled with thermally insulating layers |
| JP2013220652A (en) * | 2012-04-19 | 2013-10-28 | Three M Innovative Properties Co | Heat-shielding sheet |
| JP5906140B2 (en) | 2012-06-22 | 2016-04-20 | 日東電工株式会社 | Radiation heat conduction suppression sheet |
| TWI657132B (en) | 2013-12-19 | 2019-04-21 | 德商漢高智慧財產控股公司 | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith |
| TWM489869U (en) * | 2014-07-16 | 2014-11-11 | Force Applied Material Tech Company | Heat insulation adhesive structure and substrate having the same |
| JP6304772B2 (en) | 2015-10-26 | 2018-04-04 | Ｎｅｃプラットフォームズ株式会社 | Electronic component, server, cover member, and support member |
| CN105555107B (en) * | 2016-02-29 | 2018-06-29 | 联想(北京)有限公司 | Fan-free cooling system and electronic equipment |
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2002
- 2002-03-25 JP JP2002083503A patent/JP4104887B2/en not_active Expired - Fee Related