1264272 九、發明說明： 【發明所屬之技術領域】 特別是有關於一種適 本發明是有關於一種電池模組 用於電子裝置之電池模組。 【先前技術】 電池的工作溫度和電池的充電放電效率有密切的相 關，過高溫和過低溫會使電池充電放電不足，影響到電池 的電容量’長期下來，不僅電池的使用效率會變^，電地 的使用壽命也會變短。 一般常用於電子裝置的電池多為鋰離子電池，鋰離子 電池的較佳工作溫度範圍在攝氏50到60度，高於一般的 室溫。 、又 ㈣在習知的技術中，電子裝置的電池一般係為一塑膠材 質所包覆，而其工作溫度主要是受室溫的影響。雖然部分 電路板上的高溫元件產生的熱仍有可能影響電池所處環境 的溫度，但此種傳導熱途徑並不穩定，且其傳導熱效率易 受同存於系統中的其他傳導熱的途徑干擾。 因此，電池一般皆處於較室溫略高的溫度（低於較佳 工作溫度範圍）下工作，而非處於較佳工作溫度，攝氏 到60度之間工作。在此溫度下，電池的充電放電無法處於 最適化的條件下，這將影響電池的效率及壽命。 、 【發明内容】 因此本發明的目的就是在提供一種適用於電子裴 夏的 5 1264272 電池模組，此電池模組具有一適當且穩定的傳熱裝置，使 電路板上高溫元件的熱可以傳導到電池模組之上，以使電 池可以在高於室溫的較佳工作温度範圍下運作。 根據本發明之上述目的，提出一種適用於電子裝置的 電池模組，至少包含一電池及導熱裝置。導熱裝置可將高 /HZL元件產生的熱傳導到電池上，可以使電池模組的溫度上 升，而達到電池之較佳工作温度範圍。電池模組更可以包 含散熱裝置，當電池模組的溫度高於較佳工作溫度範圍， 散熱裝置即會將電池上多餘的熱散出。 依照本發明一較佳實施例，電池模組可設置於一高溫 兀件之上，高溫元件將熱直接傳導致電池模組。高溫元件 可以為晶片、塗佈散熱膠之晶片或具有散熱片之晶片。 依…、本t明另一較佳實施例，高溫元件和電池模組可 設置於可攜裝置中不同的位置，利用一個以上的導熱裝 置例如導熱片、導熱管等等作為橋樑，將熱迅速的由高 溫元件傳到電池模組。 在本發明實施例中所揭露的電池模組更可選擇性的包 括政熱機構，當電池模組的溫度可能或已經超過電池之 車乂佳工作溫度範圍時，散熱模組開始作用，以使電池模組 可處於一較佳工作溫度範圍之内。 根據上述，在本發明中，將電路板上高溫元件的散執 途控和電池模組的熱傳導途徑整合—起，使高溫元件和電 池权組間熱傳導更為敎及有效率，而使位於電池模組内 之電池能處在恆定的較佳溫度環境下。 6 1264272 【實施方式】 本發明主要是提供一種適用於電子裝置的電池模組。 電池模組中的導熱裝置可將高溫元件產生的熱傳導到電池 杈組上，使電池模組内之電池能在高於室溫的較佳工作溫 度下運作。另外，電子裝置的電池模組還可以選擇性的2 括散熱裝置，此散熱裝置可將電池上多餘的熱散出。導熱 裝置和散熱裝置兩者的組合可提供電池所需的熱量，使電 池在恆定的較佳工作溫度下運作。 睛參照第1圖和第2圖，其繪示依照本發明一實施例 的圖。 如第1圖所示，圖中的電路板11()包含市面常見的電 子裝置如手機、筆記型電腦、數位相機及個人數位助理器 的電路板110。高溫元件120指的是電路板110上容易產生 高熱的元件，電路板11〇上的高溫元件12〇可例如說中央 處理器、晶片、塗佈散熱膠之晶片或具有散熱片之晶片。 在本實施例中，在高溫元件120為一具有散熱片（未繪示 於圖上）之中央處理器。 一電池模組160位於高溫元件120之上，電池模組16〇 包括一導熱殼體140及位於導熱殼體14〇内之電池15〇。導 熱殼體140會吸收高溫元件120所產生的熱量而使電池模 組160的溫度上升。一般而言高溫元件12〇的溫度約在攝 氏60度至80度之間，因此，藉由導熱殼體14〇的傳導， 可使電池模組160及電池150處於一較佳工作溫度範圍之 内。 如第1圖所示，電池模組160更可因應需要而增設一 1264272 散熱裝置170,散熱裝置170可以為散熱片、散熱管、散熱 風扇或是目灿白用的散熱機構。通常，導熱殼體14〇除了 傳導熱量外，亦可以將電池模組16〇的熱量逸散。但是， 當來自高溫元件120的熱量過多時，散熱裝置17〇即可發 揮作用，將過多的熱量逸散。此時，用於監測中央處理器 溫度的溫度監控裝置亦可用來監控電池模組16〇的溫度以 決定散熱裝置170的動作。 導熱殼體140所示用的材質通常為具有高導熱性的材 質、，一般為金屬，如鐵、銅合金、鋁合金和鎂合金。導熱 设體140可提供電池15〇 —個穩定的工作溫度環境。導熱 设體140與咼溫元件12〇兩者介面間更可包括一導熱介質 ^30’其目的是用來填補介面間的空隙提昇導熱效率。導熱 介質130包含散熱膏、導熱橡膠以及石墨片。 位於導熱殼體14〇内的電池150例如可為用於手機、 筆記型電腦、數位相機及個人數位助理器的鋰離子電池。 一般而言，鐘離子電池的較佳工作溫度約為攝氏5〇度到約 攝氏60度之間。 在本實施例中，在導熱殼體140上之散熱裝置17〇可 以疋與導熱殼體140 —體成形，或是加設於導熱殼體"ο 之上。若散熱裝置170係增設於導熱殼體140之上時，兩 者間可具有一導熱介質（未繪示於圖上）以提昇介面間的 導熱效率。導熱介質包含散熱膏、導熱橡膠以及石墨片。 在本實施例中，當散熱裝置170包括散熱風扇時，可 搭配電路板11〇上的溫控積體電路19〇，可以調節風扇的開 啟和關閉或轉速快慢。 8 1264272 導熱殼2圖所示，散熱裝置17°和 月"於不同位置，可用至少一個導熱管18〇 幫助兩者間熱的傳遞，此導埶 〒…吕180 一端和導熱殼體140 相接，另-端和散熱裝4 17"目接，可將熱迅速的由導熱 嫒體140傳到散熱裝置ι7〇。 請參照第3圖、第4圖和第5圖，其繪示依照本發明 另一實施例的圖。 此實施例中各元件的配置和前一實施例類似，主要不 同點在於在別-實施例中’電池模組和高溫元件距離非 常接近1適當的接觸傳熱途徑就可以將熱由高溫元件導 到電池上。在此實施例中，電池模組和高溫元件位於不同 位置兩者間有一段距離，熱的傳導不易，故用導熱裝置， 例如導熱官來提昇兩者間的導熱效率，同時導熱管也可以 扮演兩者間聯繫的橋樑。 如第3圖所示，圖中的電路板21〇包含市面常見的電 子裝置例如手機、筆記型電腦、數位相機及個人數位助理 器的電路板210。高溫元件22〇指的是電路板21〇上容易產 生咼熱的元件，電路板210上的高溫元件22〇例如可包含 中央處理器、晶片、塗佈散熱膠之晶片或具有散熱片之晶 片。在本實施例中，在高溫元件22〇為一具有散熱片（未 繪示於圖上）之中央處理器。 一電池模組260和高溫元件220間隔一個空間，電池 模組260包括一導熱殼體24〇、位於導熱殼體24〇内之電池 250及導熱管230。導熱管230連結於高溫元件220及導熱 殼體240之間。導熱管230可將高溫元件220所釋放的熱 1264272 量傳導致而使電池模組260的溫度上升。一般而言高溫元 件210的溫度約在攝氏60度至80度之間，因此，藉由導 熱殼體240的傳導，可使電池模組260及電池250處於一 較佳工作溫度範圍之内。 電池模組260和咼溫元件220位於不同位置，在高溫 元件220與導熱殼體240間有至少一個第一導熱管23〇在 兩者間進行熱傳遞’此第一導熱管230 一端和高溫元件22〇1264272 IX. Description of the Invention: [Technical Field of the Invention] In particular, the present invention relates to a battery module for a battery module for an electronic device. [Prior Art] The operating temperature of the battery is closely related to the charging and discharging efficiency of the battery. Excessive high temperature and low temperature may cause insufficient charging and discharging of the battery, which affects the battery's capacity. In the long run, not only the efficiency of the battery will change, The service life of the electric field will also be shorter. The batteries commonly used in electronic devices are mostly lithium-ion batteries. The preferred operating temperature range of lithium-ion batteries is 50 to 60 degrees Celsius, which is higher than the normal room temperature. (4) In the conventional technology, the battery of the electronic device is generally covered by a plastic material, and its operating temperature is mainly affected by the room temperature. Although the heat generated by the high temperature components on some of the boards may still affect the temperature of the environment in which the battery is located, this conduction heat path is not stable and its conduction thermal efficiency is susceptible to interference with other conducted heat paths in the system. . As a result, batteries are typically operated at slightly higher temperatures (less than the preferred operating temperature range) at room temperature, rather than at a preferred operating temperature, between 60 degrees Celsius. At this temperature, the battery's charge and discharge cannot be under optimal conditions, which will affect the efficiency and life of the battery. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a 5 1264272 battery module suitable for use in an electronic summer, the battery module having a suitable and stable heat transfer device for conducting heat of high temperature components on the circuit board. Above the battery module, so that the battery can operate at a better operating temperature range above room temperature. According to the above object of the present invention, a battery module suitable for an electronic device is provided, comprising at least one battery and a heat conducting device. The heat transfer device conducts the heat generated by the high/HZL element to the battery, which can raise the temperature of the battery module to reach the preferred operating temperature range of the battery. The battery module can also include a heat sink. When the temperature of the battery module is higher than the preferred operating temperature range, the heat sink will dissipate excess heat from the battery. According to a preferred embodiment of the present invention, the battery module can be disposed on a high temperature component, and the high temperature component directly transmits heat to the battery module. The high temperature component can be a wafer, a wafer coated with a thermal paste, or a wafer having a heat sink. According to another preferred embodiment of the present invention, the high temperature component and the battery module can be disposed at different positions in the portable device, and the heat is quickly utilized by using more than one heat conducting device such as a heat conducting sheet, a heat pipe, or the like as a bridge. Passed by the high temperature component to the battery module. The battery module disclosed in the embodiment of the present invention can further selectively include a thermal heating mechanism. When the temperature of the battery module may exceed or exceed the operating temperature range of the battery, the heat dissipation module starts to function. The battery module can be within a preferred operating temperature range. According to the above, in the present invention, the transparent control of the high-temperature components on the circuit board and the heat conduction path of the battery module are integrated, so that the heat conduction between the high-temperature component and the battery weight group is more efficient and efficient, and the battery is located in the battery. The battery in the module can be in a constant temperature environment. 6 1264272 [Embodiment] The present invention mainly provides a battery module suitable for an electronic device. The heat transfer device in the battery module conducts heat generated by the high temperature component to the battery pack so that the battery in the battery module can operate at a better operating temperature above room temperature. In addition, the battery module of the electronic device can also selectively include a heat sink, which can dissipate excess heat from the battery. The combination of both the heat transfer device and the heat sink provides the heat required by the battery to operate the battery at a constant, preferred operating temperature. Referring to Figures 1 and 2, there is shown a diagram in accordance with an embodiment of the present invention. As shown in Fig. 1, the circuit board 11() in the figure includes a circuit board 110 of a commercially available electronic device such as a mobile phone, a notebook computer, a digital camera, and a personal digital assistant. The high temperature component 120 refers to a component on the circuit board 110 that is susceptible to high heat, and the high temperature component 12 on the circuit board 11 can be, for example, a central processor, a wafer, a wafer coated with a thermal paste, or a wafer having a heat sink. In the present embodiment, the high temperature component 120 is a central processor having a heat sink (not shown). A battery module 160 is disposed above the high temperature component 120. The battery module 16A includes a heat conducting housing 140 and a battery 15 位于 located in the heat conducting housing 14A. The heat conducting casing 140 absorbs the heat generated by the high temperature element 120 to raise the temperature of the battery module 160. Generally, the temperature of the high temperature component 12 is between about 60 degrees Celsius and 80 degrees Celsius. Therefore, the battery module 160 and the battery 150 can be placed within a preferred operating temperature range by conduction of the heat conducting housing 14? . As shown in FIG. 1 , the battery module 160 can further add a 1264272 heat sink 170 as needed. The heat sink 170 can be a heat sink, a heat sink, a heat sink fan, or a heat sink for the white light. In general, the thermally conductive housing 14 dissipates heat from the battery module 16 in addition to conducting heat. However, when there is too much heat from the high temperature element 120, the heat sink 17 acts to dissipate excess heat. At this time, the temperature monitoring device for monitoring the temperature of the central processing unit can also be used to monitor the temperature of the battery module 16 to determine the action of the heat sink 170. The material used for the thermally conductive housing 140 is typically a material having high thermal conductivity, typically a metal such as iron, a copper alloy, an aluminum alloy, and a magnesium alloy. The thermally conductive housing 140 provides a battery environment that is stable to the operating temperature. The heat conducting medium 140 and the temperature sensing element 12 may further comprise a heat conducting medium ^30' for filling the gap between the interfaces to improve the heat conduction efficiency. The thermally conductive medium 130 contains a thermal grease, a thermally conductive rubber, and a graphite sheet. The battery 150 located within the thermally conductive housing 14A can be, for example, a lithium ion battery for use in cell phones, notebook computers, digital cameras, and personal digital assistants. In general, a preferred operating temperature for a plasma battery is between about 5 degrees Celsius and about 60 degrees Celsius. In this embodiment, the heat sink 17 on the heat conducting housing 140 may be formed integrally with the heat conducting housing 140 or may be added to the heat conducting housing. If the heat sink 170 is added to the heat conducting housing 140, a heat conducting medium (not shown) may be provided between the two to improve the heat transfer efficiency between the interfaces. The heat transfer medium contains a thermal grease, a thermal conductive rubber, and a graphite sheet. In the present embodiment, when the heat sink 170 includes a heat dissipating fan, the temperature control integrated circuit 19〇 on the circuit board 11 can be used to adjust the opening and closing of the fan or the speed of the fan. 8 1264272 The heat-conducting case 2 shows that the heat-dissipating device 17° and the moon are at different positions, and at least one heat-conducting pipe 18〇 can be used to help the heat transfer between the two. Connected, the other end and the heat sink 4 17 " eye connection, the heat can be quickly transferred from the heat transfer body 140 to the heat sink ι7 〇. Referring to Figures 3, 4 and 5, there is shown a diagram in accordance with another embodiment of the present invention. The configuration of each component in this embodiment is similar to that of the previous embodiment. The main difference is that in the other embodiment, the battery module and the high temperature component are very close to each other. The appropriate contact heat transfer path can guide the heat from the high temperature component. Go to the battery. In this embodiment, the battery module and the high temperature component are located at different positions, and the heat conduction is not easy. Therefore, a heat conducting device, such as a heat conducting member, is used to improve the heat conduction efficiency between the two, and the heat pipe can also play The bridge between the two. As shown in Fig. 3, the circuit board 21 of the figure includes a circuit board 210 of a commercially available electronic device such as a mobile phone, a notebook computer, a digital camera, and a personal digital assistant. The high temperature component 22 refers to a component on the circuit board 21 that is susceptible to heat, and the high temperature component 22 on the circuit board 210 can include, for example, a central processing unit, a wafer, a wafer coated with a thermal paste, or a wafer having a heat sink. In the present embodiment, the high temperature component 22 is a central processor having a heat sink (not shown). A battery module 260 and a high temperature component 220 are spaced apart from each other. The battery module 260 includes a heat conducting housing 24, a battery 250 located in the heat conducting housing 24, and a heat pipe 230. The heat pipe 230 is coupled between the high temperature element 220 and the heat conducting casing 240. The heat pipe 230 can transfer the heat 1264272 released by the high temperature component 220 to cause the temperature of the battery module 260 to rise. Generally, the temperature of the high temperature component 210 is between about 60 degrees Celsius and 80 degrees Celsius. Therefore, the battery module 260 and the battery 250 can be placed within a preferred operating temperature range by conduction of the heat conducting housing 240. The battery module 260 and the temperature-sensing element 220 are located at different positions, and at least one first heat-conducting tube 23 is thermally transferred between the high-temperature element 220 and the heat-conducting housing 240. The first heat-conducting tube 230 has one end and the high-temperature element. 22〇
相接，另一端和導熱殼體240 _，可將熱迅速的由高溫 元件220傳到導熱殼體240。 如第3圖所示’電池模組26〇更可因應需要而增設一 散熱裝置270,散熱裝置270可以為散熱片、散熱管、散熱 風扇或是目前習用的散熱機構。通常，導熱殼體除了 傳導熱量外，亦可以將電池模M 26〇的熱量逸散。但是， 當來自高溫元件22G的熱量過多時’散熱裝置27()即可發 揮作用’將過多的熱量逸散。此時，用於監測中央處理器 溫度的溫度監控裝置亦可用來監控電池模組26g的溫度以 決定散熱裝置270的動作。 又 導…、威體240所示用的材質通常為具有高導熱性的材 質’-般為金屬，如鐵、銅合金、鋁合金和鎂合金埶 殼體240可提供電池25〇 一個穩定的工作溫度環境。’、、、 位於導熱殼體240内的電池25〇例如可為用於手機、 k型電腦、數位相機及個人數位助理器的鐘離子電池。 一般而言，鋰離子電池的較佳工作 / 攝氏60度之間。 ^為攝氏50度到約 本實施例中 ’在導熱殼體240上之散熱裝置 270可以 1264272 是與導熱殼體240 —體成形，或是加設於導熱殼體24〇之 上。若散熱裝置270係增設於導熱殼體240之上時，兩者 間可具有一導熱介質（未繪示於圖上）以提昇介面間的導 熱效率。導熱介質包含散熱膏、導熱橡膠以及石墨片。 在本實施例中，當散熱裝置270包括散熱風扇時，可 搭配電路板210上的溫控積體電路29〇,可以調節風扇的開 啟和關閉或轉速快慢。 在某些特殊情況下，如第4圖所示，散熱裝置27〇和 • 導熱殼體240可能於不同位置，可用至少一個第二導熱管 280幫助兩者間熱的傳遞，此第二導熱管28〇 一端和導熱殼 體240相接，另一端和散熱裝置270相接，可將熱迅速的 由導熱殼體240傳到散熱裝置27〇。 此外，第1圖、第2圖、第3圖和第4圖中的導熱殼 體的外形，亦可以變形為如第5 g，第5圖是以第4圖的 實施例示範導熱殼體240的另一外形。此外形的導熱殼體 240除了具有導熱的功能外，還可以作為—種支樓結構。此 • 外’若此導熱殼體的材質為鐵的話，此導熱殼體對電 路板還具有良好的電磁波屏蔽的功能。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 =範圍内’當可作各種之更動與潤飾，因此本發明之保 - 濩範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 «本發明之上述和其他目的、特徵、優點與實施例 11 1264272 能更明顯易懂，所附圖式之詳細說明如下： 第1圖和第2圖，其繪示依照本發明一實施例的示意 圖。 第3圖、第4圖和第5圖，其繪示依照本發明另一實 施例的示意圖。 【主要元件符號說明】 210:電路板 220·•高溫元件 230 :第一導熱管 240 :導熱殼體 250 :電池 260 :電池模組 270 :散熱裝置 280 :第二導熱管 290 :溫控積體電路In conjunction with the other end and the thermally conductive housing 240 _, heat can be quickly transferred from the high temperature component 220 to the thermally conductive housing 240. As shown in Fig. 3, the battery module 26 can be further provided with a heat sink 270 as needed. The heat sink 270 can be a heat sink, a heat sink, a heat sink or a conventional heat sink. In general, the heat conducting housing dissipates heat from the battery module M 26 in addition to conducting heat. However, when the amount of heat from the high temperature element 22G is excessive, the heat sink 27() acts to dissipate excess heat. At this time, the temperature monitoring device for monitoring the temperature of the central processor can also be used to monitor the temperature of the battery module 26g to determine the action of the heat sink 270. Also, the material used for the body 240 is usually a material with high thermal conductivity, which is a metal, such as iron, copper alloy, aluminum alloy and magnesium alloy. The housing 240 can provide a stable battery. Working temperature environment. The battery 25 located in the heat conducting housing 240 can be, for example, a clock ion battery for a mobile phone, a k-type computer, a digital camera, and a personal digital assistant. In general, lithium ion batteries work better between / 60 degrees Celsius. ^ is 50 degrees Celsius to about 10,000. The heat sink 270 on the heat conducting housing 240 may be formed integrally with the heat conducting housing 240 or may be applied to the heat conducting housing 24A. If the heat sink 270 is added to the heat conducting housing 240, a heat conducting medium (not shown) may be provided therebetween to improve the heat transfer efficiency between the interfaces. The heat transfer medium contains a thermal grease, a thermal conductive rubber, and a graphite sheet. In the present embodiment, when the heat sink 270 includes a heat dissipating fan, the temperature control integrated circuit 29 on the circuit board 210 can be used to adjust the opening and closing of the fan or the speed of the fan. In some special cases, as shown in FIG. 4, the heat sink 27 and the heat conducting housing 240 may be in different positions, and at least one second heat pipe 280 may be used to assist the heat transfer between the two. One end of the 28-inch end is connected to the heat-conducting casing 240, and the other end is connected to the heat-dissipating device 270, so that heat can be quickly transferred from the heat-conducting casing 240 to the heat-dissipating device 27A. In addition, the outer shape of the heat conducting case in FIGS. 1 , 2 , 3 , and 4 may also be modified as in the 5th g, and the fifth drawing is an example of the heat conducting case 240 in the embodiment of FIG. 4 . Another shape. In addition to the function of heat conduction, the heat-conductive housing 240 can also serve as a branch structure. If the material of the heat-conducting case is iron, the heat-conducting case also has a good electromagnetic wave shielding function for the circuit board. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and any person skilled in the art can make various changes and refinements without departing from the scope of the invention. The scope of the invention - the scope of the invention is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention can be more clearly understood. The detailed description of the drawings is as follows: Figs. 1 and 2 are shown in accordance with the drawings. A schematic diagram of an embodiment of the invention. 3, 4 and 5 are schematic views showing another embodiment of the present invention. [Description of main component symbols] 210: Circuit board 220·• High temperature component 230: First heat pipe 240: Heat conducting case 250: Battery 260: Battery module 270: Heat sink 280: Second heat pipe 290: Temperature controlled integrated body Circuit
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