KR20120076309A

KR20120076309A - A mobile phone cooler

Info

Publication number: KR20120076309A
Application number: KR1020110140006A
Authority: KR
Inventors: 추민우
Original assignee: 추민우
Priority date: 2010-12-29
Filing date: 2011-12-22
Publication date: 2012-07-09

Abstract

The present invention relates to a mobile phone cooling device, and more particularly to a back plate integrated mobile phone cooling device for radiating heat generated inside the mobile phone without forming a separate heat sink.

Description

Mobile phone cooler {A mobile phone cooler}

The present invention relates to a back plate integrated mobile phone cooling device. Recently, as mobile phones are becoming more sophisticated and equipped with a central processing unit, the heat generation inside the phones has also increased rapidly. If the internal heat of the mobile phone increases, the charging capacity decreases due to the characteristics of Li-ION battery that most mobile phones adopt. As the temperature increases, the electrical resistance of the metal increases (ie, the electrical conductivity decreases). The performance of the same electronic components is also greatly reduced, and even the battery may explode if overheated. In other words, heat generation and battery performance are important reasons why specs are designed for the latest phones.

However, when an additional heat sink is additionally installed to radiate heat inside the mobile phone, a problem arises in that the thickness of the mobile phone becomes thick and heavy.

The present invention is to effectively solve the problems of the prior art, such as battery explosion accident, further downsizing the cell phone due to deterioration of the performance of the battery or electronic components and heat dissipation by effectively dissipating heat generated inside the mobile phone without additional heat sink It is a task.

An object of the present invention, the back plate is provided with a heat transfer portion extending into the inside of the mobile phone to be in thermal contact with the substrate inside the mobile phone; And a heat conduction bonding layer applied between the substrate and the heat transfer part.

An object of the present invention, the back plate in thermal contact with the substrate inside the mobile phone; And a heat conduction bonding layer applied between the substrate and the back plate.

The material of the back plate is preferably aluminum.

It is preferable that the material of the heat transfer part is aluminum or copper.

The thermally conductive bonding layer is preferably formed of thermal grease.

According to the back plate integrated mobile phone cooling apparatus of the present invention,

Firstly, there is no need to configure additional heat sinks, which not only saves parts cost but also reduces the weight (light weight) and thickness (slim) of mobile phones.

Second, since the back plate with excellent thermal conductivity is in contact with a large area of air, the heat dissipation effect is excellent, and heat generation from the substrate or battery of the mobile phone is effectively radiated, thereby preventing the explosion of the mobile phone performance or battery overheating. There's no loss in charge capacity, which extends battery life and eliminates the need to spec down your phone.

Third, by using the aluminum back panel, it is beautiful in appearance and has a very strong effect on life.

1 is an exploded view of a mobile phone to which the rear panel integrated mobile phone cooling apparatus according to the first embodiment of the present invention is applied,
2 is a cross-sectional view of the back plate integrated mobile phone cooling apparatus according to the first embodiment of the present invention,
3 is an exploded view of another mobile phone to which the back plate integrated mobile phone cooling device according to the second embodiment of the present invention is applied,
4 is a cross-sectional view of the back plate integrated mobile phone cooling apparatus according to the second embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, it should be noted that the same components or parts in the drawings are indicated by the same reference numerals as much as possible.

In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted to clarify the gist of the present invention.

1 is an exploded view of a mobile phone to which a back plate-integrated mobile phone cooling apparatus according to a first embodiment of the present invention is applied, the front plate 10 of the mobile phone 1; A substrate 20 in which a CPU, a communication chip, RAM, and the like are embedded; The back plate 30 is provided with a heat transfer part 31 extending into the inside of the mobile phone to be in thermal contact with the substrate 20 inside the mobile phone 1 is shown.

2 is a cross-sectional view taken along line A-A 'of the mobile phone 1 of FIG.

1 and 2, the mobile phone battery 50 is located under the substrate 20 and above the back plate 30 inside the mobile phone.

1 and 2, the front plate 10 and the substrate 20 are of the prior art, so detailed description thereof will be omitted.

In the mobile phone cooling apparatus according to the first embodiment of the present invention, the back plate 30 is made of aluminum or copper material having excellent thermal conductivity, and in particular, it is preferable that the back plate 30 is made of aluminum in consideration of aesthetics and living gas.

In the mobile phone cooling apparatus according to the first embodiment of the present invention, the back plate 30 is made of aluminum or copper having excellent thermal conductivity, and thus heat from the battery 50 which is in thermal contact with the back plate on the back plate. It can release effectively.

Furthermore, in the mobile phone cooling apparatus according to the first embodiment of the present invention, the back plate 30 is further provided with a heat transfer portion 31 extending into the inside of the mobile phone to be in thermal contact with the substrate 20 inside the mobile phone (1). do.

The location and size of the heat transfer part 31 may be appropriately designed according to the location and size of a central processing unit (CPU), a communication chip, a RAM, and the like, which are main heating parts embedded in the substrate 20.

In the back plate-integrated mobile phone cooling apparatus according to the first embodiment of the present invention, the substrate 20 and the heat transfer part 31 are brought into close contact with each other between the substrate 20 and the heat transfer part 31 of the mobile phone 1 to reduce heat loss. A thermally conductive bonding layer 40 is applied over the substrate 20 to prevent it and improve thermal conduction.

The thermally conductive bonding layer 40 is a layer for improving the thermal conductivity by minimizing and closely contacting the gaps or bubbles between the substrate 20 and the heat transfer part 31, and is made of a material having excellent bonding strength and thermal conductivity, such as thermal grease. It is preferably formed.

Since thermal grease is known to contain a silicon compound and a metal or liquid metal having high thermal conductivity such as silver, detailed description thereof will be omitted.

3 is an exploded view of another mobile phone to which the rear plate integrated mobile phone cooling apparatus according to the second embodiment of the present invention is applied, the front plate 10 'of the mobile phone 1', the central processing unit (CPU), the communication chip and the RAM (RAM); ) Is a substrate 20 'embedded with a back plate 30' which is in thermal contact with the substrate 20 'inside the mobile phone 1.

4 is a cross-sectional view of the mobile phone 1 'of FIG.

Unlike FIGS. 1 and 2 where the mobile phone battery 50 is located under the substrate 20 and above the back plate 30 inside the mobile phone, in FIGS. 3 and 4, the mobile phone battery 50 ′ is a mobile phone. It is located next to the substrate 20 'and above the back plate 30' inside.

In the mobile phone cooling apparatus according to the second embodiment of the present invention, the back plate 30 'is made of aluminum or copper having excellent thermal conductivity, and in particular, it is preferable that the back plate 30' is made of aluminum in consideration of aesthetics and living gas. .

In the mobile phone cooling apparatus according to the second embodiment of the present invention, the back plate 30 'is made of aluminum or copper having excellent thermal conductivity, and is in thermal contact with the back plate 30' on the back plate 30 '. The heat from the substrate 20 'and the battery 50' can be effectively released.

In the cellular phone cooling apparatus according to the second embodiment of the present invention, the substrate 20 'and the rear plate 30' of the cellular phone 1 'are brought into close contact with the substrate 20' and the rear plate 30 'to lose heat. A thermally conductive bonding layer 40 'is applied over the substrate 20' to prevent corrosion and improve thermal conduction.

The thermally conductive bonding layer 40 'is the same as the thermally conductive bonding layer 40 of the first embodiment.

The present invention enables the back plate 30, 30 'of the mobile phone to perform the function of the heat sink as well as the housing function to effectively solve the heat problem.

At this time, by applying a thermally conductive bonding layer 40, 40 'such as thermal grease between the back plates 30, 30' and the substrates 20, 20 ', the electronics such as the central processing unit embedded in the substrates 20, 20' The heat generated from the components is effectively radiated through the large back plates 30 and 30 ', which are in contact with air through the heat conductive bonding layers 40 and 40'.

In the case of a mobile phone according to the present invention,

First, there is no need to configure additional heat sinks, which not only saves parts cost but also reduces the weight and thickness of the phone.

Second, since the back plate with excellent thermal conductivity can come into contact with a large area of air, the heat dissipation effect is excellent.

Third, heat dissipation inside the phone effectively prevents the battery from degrading due to deterioration or overheating, and reduces the number of charge / discharge cycles.

Fourth, by using the aluminum back panel, it looks beautiful and has a very strong effect on life.

The present invention has been described above by way of example and detailed description, and the accompanying drawings are not limited thereto, and various changes, modifications, and changes may be made without departing from the spirit of the present invention. It will be apparent to those of ordinary skill in the art.

1, 1 ': cell phone 10, 10': front panel
20, 20 ': substrate 30, 30': back panel
31: Heat transfer part of the back plate 40, 40 ': Thermal conductive bonding layer
50, 50 ': battery

Claims

A back plate in thermal contact with the substrate inside the mobile phone; And a heat conduction bonding layer applied on the substrate between the substrate and the back plate.

A back plate having a heat transfer part extending into the mobile phone to be in thermal contact with the substrate inside the mobile phone; And a thermally conductive bonding layer applied between the substrate and the heat transfer part.

The mobile phone cooling device according to claim 1 or 2, wherein the back plate is made of aluminum.

The mobile phone cooling device according to claim 2, wherein the heat transfer part is made of aluminum or copper.

The mobile phone cooling device according to claim 1 or 2, wherein the thermally conductive bonding layer is formed of thermal grease.