TW201706767A - Thermal dissipation buffer conduction composite molding structure of mobile electronic device comprising a compound membrane composed of a buffer layer, a heat insulation film and a conduction heat dissipation film - Google Patents
Thermal dissipation buffer conduction composite molding structure of mobile electronic device comprising a compound membrane composed of a buffer layer, a heat insulation film and a conduction heat dissipation film Download PDFInfo
- Publication number
- TW201706767A TW201706767A TW104126372A TW104126372A TW201706767A TW 201706767 A TW201706767 A TW 201706767A TW 104126372 A TW104126372 A TW 104126372A TW 104126372 A TW104126372 A TW 104126372A TW 201706767 A TW201706767 A TW 201706767A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- film
- electronic device
- conductive
- mobile electronic
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 47
- 239000002131 composite material Substances 0.000 title claims abstract description 43
- 238000009413 insulation Methods 0.000 title claims abstract description 14
- 238000000465 moulding Methods 0.000 title claims abstract description 14
- 239000012528 membrane Substances 0.000 title abstract 5
- 150000001875 compounds Chemical class 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000004973 liquid crystal related substance Substances 0.000 claims description 21
- 239000011148 porous material Substances 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 abstract description 9
- 238000004904 shortening Methods 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明係有關一種行動電子裝置之散熱緩衝導電複合成型結構，尤指一種結合散熱、緩衝、導電、隔熱四個功能於一體之複合成型結構。The invention relates to a heat dissipating buffer conductive composite forming structure of a mobile electronic device, in particular to a composite forming structure combining four functions of heat dissipation, buffering, electric conduction and heat insulation.
按，智慧手機、平板電腦等行動電子裝置，其已經由雙核心、四核心、八核心…演變成愈來愈高的運算時脈的處理晶片；且行動電子裝置之發展係以短小輕薄為設計趨勢，因此為能達到高運算效能與短小輕薄之雙重要求，行動電子裝置之散熱效率益加重要。According to mobile electronic devices such as smart phones and tablet PCs, which have evolved from dual-core, quad-core, and eight-core... to increasingly higher processing clock processing chips; and the development of mobile electronic devices is designed to be short and light. Trends, so in order to achieve high computing efficiency and short and light requirements, the heat dissipation efficiency of mobile electronic devices is important.
次按，目前行動電子裝置之散熱方式，主要是利用簡單的開孔、導熱、熱對流等方式，但該些散熱方式以無法負荷現今高效能晶片所產生之熱能，因此會有積熱的問題，熱能無法均勻散佈，導致降低行動電子裝置內部的散熱效率。Sub-press, the current heat dissipation method of mobile electronic devices mainly uses simple opening, heat conduction, heat convection, etc., but these heat dissipation methods can not load the heat energy generated by high-performance wafers today, so there is a problem of heat accumulation. The thermal energy cannot be evenly distributed, resulting in lowering the heat dissipation efficiency inside the mobile electronic device.
又按，通常電子設備的芯片在工作時是主要熱源，散熱不僅是為了降低芯片自身溫度以保證其能在要求的溫度範圍內正常工作，同時還要兼顧散熱時不能造成殼體局部過熱，給消費者造成不良使用體驗。In addition, usually, the chip of the electronic device is the main heat source during operation, and the heat dissipation is not only to lower the temperature of the chip itself to ensure that it can work normally within the required temperature range, but also to prevent partial overheating of the casing when the heat is dissipated. Consumers experience a bad experience.
是以，台灣新型M第496156號專利，揭露一種行動電子裝置散熱結構，其包括一前殼支架11、液晶顯示模組12及一後蓋16及一導熱元件15，該液晶顯示模組12一側設有一基板14，該基板14上設置有至少一電子元件141，該後蓋16具有一容置空間161，該液晶顯示模組12一側貼設一中框13，該基板14系嵌設於該中框13上，該導熱元件15係設置於所述電子元件141與後蓋16之間，該導熱元件15一側對應接觸所述電子元件141，另一側對應接觸所述後蓋16；藉以幫助該電子元件121之熱能均勻散佈不產生積熱。惟查，其作為散熱之導熱元件15係與後蓋16分別製造後，再將導熱元件15黏合在後蓋16內緣面，因此其散熱效率或電子屏蔽功能仍有不足之處，此外其未揭露保護該液晶顯示模組12的緩衝結構，因此尚有改善空間。The invention discloses a heat dissipation structure of a mobile electronic device, which comprises a front housing bracket 11, a liquid crystal display module 12, a rear cover 16 and a heat conducting component 15, and the liquid crystal display module 12 A substrate 14 is disposed on the side of the substrate 14 , and the substrate 14 is provided with at least one electronic component 141 . The back cover 16 has a receiving space 161 , and a middle frame 13 is attached to the liquid crystal display module 12 . The heat conducting component 15 is disposed between the electronic component 141 and the back cover 16 on the middle frame 13 . The heat conductive component 15 corresponds to the electronic component 141 and the other side corresponds to the back cover 16 . The thermal energy of the electronic component 121 is evenly distributed without generating heat. However, it is found that the heat-dissipating heat-dissipating component 15 and the rear cover 16 are separately fabricated, and then the heat-conductive component 15 is bonded to the inner edge of the back cover 16, so that the heat dissipation efficiency or the electronic shielding function is still insufficient, and The buffer structure for protecting the liquid crystal display module 12 is disclosed, so that there is still room for improvement.
此外，在目前的手機設計中，爲了保護LCD在使用中受到衝擊力不被損壞，同時解決LCD使用中發熱過多影響性能，傳統設計是在LCD下方貼裝泡棉用來緩衝衝擊力，貼裝導電膜用來散熱，惟，這樣需要設置一個專門的組裝工站，組裝成本較高，增加Z軸方向厚度。In addition, in the current mobile phone design, in order to protect the LCD from being damaged during use, and to solve the problem of excessive heat generation in the LCD, the conventional design is to put foam under the LCD to buffer the impact force, and mount it. The conductive film is used for heat dissipation. However, it is necessary to provide a special assembly station, which has a high assembly cost and increases the thickness in the Z-axis direction.
是以，解決傳統行動電子裝置之上述問題點，為本發明之主要課題。Therefore, solving the above problems of the conventional mobile electronic device is a main subject of the present invention.
緣是，本發明之主要目的，係在提供一種行動電子裝置之散熱緩衝導電複合成型結構，其結合散熱、緩衝、導電、隔熱四個功用於一體，並將一體嵌固定在前殼支架，具有節約組裝人力，縮短組裝時間，降低組裝成本，提高組裝良率，降低Z軸方向厚度之功效增進。The main purpose of the present invention is to provide a heat-dissipating and buffering conductive composite structure of a mobile electronic device, which combines four functions of heat dissipation, buffering, conducting, and heat-insulation, and is integrally embedded and fixed on the front shell bracket. It has the advantages of saving assembly manpower, shortening assembly time, reducing assembly cost, improving assembly yield, and reducing thickness in the Z-axis direction.
本發明又一目的，是在提供一種行動電子裝置之散熱緩衝導電複合成型結構，其結合散熱、緩衝、導電三個功用於一體，具有可以保持行動電子裝置的可靠性，又能節約成本。Another object of the present invention is to provide a heat dissipating buffer conductive composite forming structure of a mobile electronic device, which combines three functions of heat dissipation, buffering and conducting, and has the capability of maintaining the reliability of the mobile electronic device and saving cost.
為達上述目的，本發明所採用之技術手段包含: 一透明基板； 一液晶顯示模組，係設在該透明基板之下方；一中殼支架，係設在該液晶顯示模組的下方；一電路板，係設在該中殼支架的下方，其上至少設有一電子芯片；電池，係設在該中殼支架的下方；以及 一後蓋，係相對結合在該中殼支架的底緣，其具有一容置空間，用以收納前述之構件；In order to achieve the above object, the technical means adopted by the present invention comprises: a transparent substrate; a liquid crystal display module disposed under the transparent substrate; and a middle case bracket disposed under the liquid crystal display module; a circuit board disposed under the middle case bracket, at least one electronic chip is disposed thereon; a battery is disposed under the middle case bracket; and a back cover is oppositely coupled to the bottom edge of the middle case bracket The utility model has an accommodating space for accommodating the aforementioned components;
其特徵在於：一複合膜片，係由一緩衝層、一隔熱膜及一導電散熱膜由上而下疊合所構成，該複合膜片與該中殼支架一體模注成型(insert molding)，形成該複合膜片嵌固定在該中殼支架上，且下層之該導電散熱膜的表面至少裸露出一導電散熱面在該中殼支架之表面處。The composite film is composed of a buffer layer, a heat insulating film and a conductive heat dissipating film, and the composite film is integrally molded with the middle shell bracket (insert molding). Forming the composite film embedded on the middle shell bracket, and the surface of the lower conductive film of the lower layer exposes at least a conductive heat dissipating surface at the surface of the middle shell bracket.
依據前揭特徵，一可行實施例中，該複合膜片位於該中殼支架與該液晶顯示模組之間，形成該複合膜片嵌固定在該中殼支架之上表面，且該中殼支架之表面預定處設有一開孔，該開孔裸露出該導電散熱膜之導電散熱面，以供散熱，同時該緩衝層供該液晶顯示模組緩衝及該中殼支架與該電子芯片之間最後一道阻熱層之用。According to the foregoing feature, in a possible embodiment, the composite film is located between the middle shell bracket and the liquid crystal display module, and the composite film is embedded and fixed on the upper surface of the middle shell bracket, and the middle shell bracket The surface of the surface is provided with an opening, the conductive heat dissipation surface of the conductive heat dissipation film is exposed for heat dissipation, and the buffer layer is buffered by the liquid crystal display module and the last between the middle case support and the electronic chip A heat barrier layer.
又一可行實施例中，該複合膜片位於該中殼支架與該該液晶顯示模之間，且該中殼支架之表面為無開孔結構，形成該複合膜片嵌固定在該中殼支架之下表面。In another possible embodiment, the composite film is located between the middle shell bracket and the liquid crystal display mold, and the surface of the middle shell bracket is an open-cell structure, and the composite film is formed and fixed on the middle shell bracket. Under the surface.
依據前揭特徵，該中殼支架係為一塑膠件所構成，同時向上固定該液晶顯示模組，向下固定該電路板；該電路板上以表面黏著技術(SMT)設有一屏蔽罩(shielding can)，該屏蔽罩(shielding can)之罩面接觸該導電散熱膜之導電散熱面；該電路板之電子芯片上設有一絕緣散熱片，用以提供該電子芯片散熱，同時阻隔該屏蔽罩與該電子芯片接觸，起到絕緣作用；且該電子芯片接觸該絕緣散熱片，用以將該電子芯片的熱量沿垂直方向向上傳遞，將該電子芯片產出的熱量傳遞出去，使該屏蔽罩傳來的熱量沿橫向水平散佈出去，並以該隔熱膜阻止該導電散熱膜向外輻射熱量。According to the foregoing feature, the middle shell bracket is formed by a plastic component, and the liquid crystal display module is fixed upwardly, and the circuit board is fixed downward; the circuit board is provided with a shield cover by surface adhesion technology (SMT). The cover of the shield can contact the conductive heat dissipation surface of the conductive heat dissipation film; the electronic chip of the circuit board is provided with an insulating heat sink for providing heat dissipation of the electronic chip while blocking the shield and The electronic chip contacts the insulating film; and the electronic chip contacts the insulating heat sink to transfer the heat of the electronic chip upward in a vertical direction, and the heat generated by the electronic chip is transmitted, so that the shielding cover is transmitted. The heat is distributed horizontally horizontally, and the heat-insulating film prevents the conductive heat-dissipating film from radiating heat outward.
依據前揭特徵，該絕緣散熱片可由添加硅膠的氧化鋁所構成；該導電散熱膜為銅箔、鋁箔或石墨片其中之一所構成；該緩衝層為泡棉層、橡膠層或彈性薄膜層其中之一所構成；該隔熱膜可以是一有微孔結構的平面薄膜或在此平面薄膜基礎上加工有複數氣孔、孔洞結構的打孔薄膜。According to the foregoing feature, the insulating heat sink may be composed of alumina added with silica gel; the conductive heat dissipating film is composed of one of copper foil, aluminum foil or graphite sheet; the buffer layer is a foam layer, a rubber layer or an elastic film. One of the layers is formed; the thermal insulation film may be a planar film having a microporous structure or a perforated film having a plurality of pores and pore structures formed on the surface of the planar film.
藉助上揭技術手段，本發明將傳統的單射蓋體改為模注一體成型，亦即其先將該緩衝層、隔熱膜及導電散熱膜之三層組成複合膜片，放在模具中與該中殼支架一體成型，據以減少一個組裝工站，節約組裝人力，縮短組裝時間，降低組裝成本，降低Z軸方向厚度；並且可減少因組裝不良帶來的膜片浪費，提高組裝良率之功效增進。且其結合散熱、緩衝、導電、隔熱四個功用於一體，具有可以保持行動電子裝置的可靠性，又能節約成本之功效。By means of the above-mentioned technical means, the invention replaces the traditional single-shot cover body into a mold-integrated molding, that is, the three layers of the buffer layer, the heat-insulating film and the conductive heat-dissipating film are first formed into a composite film, and placed in the mold. It is integrally formed with the middle shell bracket, thereby reducing an assembly station, saving assembly manpower, shortening assembly time, reducing assembly cost, and reducing thickness in the Z-axis direction; and reducing diaphragm waste caused by poor assembly and improving assembly. The efficiency of the rate is improved. And it combines four functions of heat dissipation, buffering, conduction and heat insulation, and has the effect of maintaining the reliability of the mobile electronic device and saving cost.
首先，請參閱圖2～圖4所示，本發明所揭露之行動電子裝置之散熱緩衝導電複合成型結構，其第一可行實施例包含:一透明基板20，其外周緣上可設有一非透明之印刷區21，但不限定於此；一液晶顯示模組30，係設在該透明基板20之下方；一中殼支架22，係設在該液晶顯示模組30的下方；一電路板40，係設在該中殼支架22的下方，其上至少設有一電子芯片41； 一電池50，係設在該中殼支架22的下方；以及 一後蓋60，係通過該中殼支架22a相對結合在該透明基板20底緣，其具有一容置空間61，用以收納前述之構件；惟，上揭構件係屬先前技術(Prior Art)，非本發明之專利標的，容不贅述。First, referring to FIG. 2 to FIG. 4, the heat dissipation buffer conductive composite molding structure of the mobile electronic device disclosed in the present invention, the first feasible embodiment includes: a transparent substrate 20, and a non-transparent layer can be disposed on the outer periphery thereof. The printing area 21 is not limited thereto; a liquid crystal display module 30 is disposed under the transparent substrate 20; a middle case holder 22 is disposed under the liquid crystal display module 30; and a circuit board 40 Provided below the middle casing bracket 22, at least one electronic chip 41 is disposed thereon; a battery 50 is disposed below the middle casing bracket 22; and a rear cover 60 is opposite to the middle casing bracket 22a In the bottom edge of the transparent substrate 20, it has an accommodating space 61 for accommodating the aforementioned components. However, the above-mentioned components are prior art (Prior Art), and the patents of the present invention are not described herein.
本發明之主要特徵在於：一複合膜片70，係為一緩衝層71、一隔熱膜72及一導電散熱膜73由上而下疊合所構成，該複合膜片70與該中殼支架22一體模注成型(insert molding)，形成該複合膜片70嵌固定在該中殼支架22上，且該導電散熱膜73之表面至少裸露出一導電散熱面731在該中殼支架22之表面預定處。本實施例中，該中殼支架22為一體成型且具有一內框面222之單一型的中殼支架22a。The main feature of the present invention is that a composite film 70 is composed of a buffer layer 71, a heat insulating film 72 and a conductive heat dissipating film 73 which are stacked from top to bottom. The composite film 70 and the middle shell bracket are formed. 22 integrally insert molding, the composite film 70 is embedded and fixed on the middle shell bracket 22, and at least a conductive heat dissipating surface 731 is exposed on the surface of the inner shell bracket 22 on the surface of the conductive heat dissipating film 73. Reservations. In this embodiment, the middle casing bracket 22 is a single-shaped middle casing bracket 22a integrally formed and having an inner frame surface 222.
圖4係本發明第一可行實施例之剖視圖，該透明基板20係設在該中殼支架22a之內框面222上，該複合膜片70位於該中殼支架22a與該液晶顯示模組30之間，形成該複合膜片70嵌固定在該中殼支架22a之上表面，且該中殼支架22a之表面預定處設有一開孔221，該開孔221裸露出該導電散熱膜73之導電散熱面731，用以供散熱，同時該緩衝層71供該液晶顯示模組30緩衝及該中殼支架22a與該電子芯片41之間最後一道阻熱層。4 is a cross-sectional view of a first embodiment of the present invention. The transparent substrate 20 is disposed on the inner frame 222 of the middle case holder 22a. The composite film 70 is located on the middle case holder 22a and the liquid crystal display module 30. The composite film sheet 70 is formed and fixed on the upper surface of the middle shell holder 22a, and the surface of the middle shell holder 22a is provided with an opening 221 for exposing the conductive surface of the conductive heat dissipation film 73. The heat dissipating surface 731 is used for heat dissipation, and the buffer layer 71 is used for buffering the liquid crystal display module 30 and the last heat blocking layer between the middle case holder 22a and the electronic chip 41.
圖5〜圖8係本發明第二可行實施例，其相同於第一可行實施例之構造以相同圖號表示，其差異僅在於: 該中殼支架22b係包括在其周緣結合一獨立成型之框體23所構成。亦即在第一可行實施例中，該中殼支架22a為一體成型且同時具有框體功能之內框面222，而本實施例中，該框體23為獨立成型再套固在該中殼支架22b支外周邊223上所構成之中殼支架22，如圖7所示。5 to 8 are second feasible embodiments of the present invention, and the configurations identical to those of the first possible embodiment are denoted by the same reference numerals, and the difference is only that: the middle case bracket 22b includes a separate molding formed at the periphery thereof. The frame 23 is constructed. That is, in the first possible embodiment, the middle case bracket 22a is an inner frame surface 222 which is integrally formed and has a frame function. In the embodiment, the frame body 23 is separately formed and then sleeved in the middle case. The inner casing bracket 22 is formed on the outer periphery 223 of the bracket 22b as shown in FIG.
請參閱圖9~圖11所示，其係揭露本發明第三可行實施例，其相同於第一可行實施例的結構以相同圖號表示，其差異僅在於: 該複合膜片70位於該中殼支架22與該該電路板40之間，本實施例中，該中殼支架22為表面無開孔結構之中殼支架22形成該複合膜片70嵌固定在該中殼支架22c之下表面。Referring to FIG. 9 to FIG. 11 , a third possible embodiment of the present invention is disclosed. The structure of the same as the first possible embodiment is represented by the same figure, and the difference is only: the composite diaphragm 70 is located therein. Between the case holder 22 and the circuit board 40, in the embodiment, the middle case holder 22 is a surface-free opening structure, and the case holder 22 is formed to be fixedly mounted on the lower surface of the middle case holder 22c. .
圖12~圖15所示，其係揭露本發明第四可行實施例，其相同於第三可行實施例的結構以相同圖號表示，其差異僅在於: 該中殼支架22d係包括在其周緣結合一獨立成型之框體23所構成，該框體23為獨立成型再套固在該中殼支架22d之外周邊223上，如圖14所示。12 to 15 show a fourth possible embodiment of the present invention, and the same structure as the third possible embodiment is denoted by the same figure, and the difference is only that: the middle case bracket 22d is included in the periphery thereof. In combination with a separately formed frame 23, the frame 23 is independently molded and then sleeved on the outer periphery 223 of the middle casing bracket 22d, as shown in FIG.
上揭實施例中，該中殼支架22係可為一塑膠件所構成，同時向上固定該液晶顯示模組30，向下固定該電路板40；該電路板40上以表面黏著技術(SMT)設有一屏蔽罩(shielding can)80，該屏蔽罩(shielding can)80之罩面81接觸該導電散熱膜73之導電散熱面731；該電路板40上設有一絕緣散熱片90，用以提供該電子芯片41散熱，同時阻隔該屏蔽罩80與該電子芯片41接觸，起到絕緣作用；且該電子芯片41接觸該絕緣散熱片90，用以將該電子芯片41的熱量沿垂直方向向上傳遞，將該電子芯片41產出的熱量傳遞出去，使該屏蔽罩80傳來的熱量沿橫向水平散佈出去，並以該隔熱膜72阻止該導電散熱膜73向外輻射熱量，本實施例中，該絕緣散熱片90可由添加硅膠的氧化鋁所構成，但不限定於此。In the above embodiment, the middle case bracket 22 can be composed of a plastic component, and the liquid crystal display module 30 is fixed upwardly, and the circuit board 40 is fixed downward; the surface of the circuit board 40 is surface-adhesive (SMT) A shield can 80 is provided. The cover 81 of the shield can contact the conductive heat dissipation surface 731 of the conductive heat dissipation film 73. The circuit board 40 is provided with an insulating heat sink 90 for providing the shield. The electronic chip 41 dissipates heat while blocking the shield cover 80 from contacting the electronic chip 41 to provide insulation. The electronic chip 41 contacts the insulating heat sink 90 for transmitting the heat of the electronic chip 41 upward in a vertical direction. The heat generated by the electronic chip 41 is transmitted, and the heat transmitted from the shield cover 80 is horizontally dispersed, and the heat-dissipating film 72 is prevented from radiating heat to the outside. In this embodiment, The insulating fins 90 may be made of alumina to which silica gel is added, but are not limited thereto.
承上，該導電散熱膜73用以橫向傳遞熱量，達到均勻散熱，本實施例中，該導電散熱膜73該導電散熱膜為銅箔、鋁箔或石墨片其中之一所構成，但不限定於此。The conductive heat dissipating film 73 is configured to transmit heat in a lateral direction to achieve uniform heat dissipation. In the embodiment, the conductive heat dissipating film 73 is formed by one of copper foil, aluminum foil or graphite sheet, but is not limited thereto. this.
此外，在該導電散熱膜73的上方覆蓋設有一層隔熱膜72，用以阻止該導電散熱膜73向外輻射熱量，以防使用者手感過熱，本實施例中，該隔熱膜72是用PET材質添加空心玻璃珠發泡而成的具有微孔結構的隔熱薄膜，或利用其他材質或工藝加工而成且具有隔熱功能的薄膜，其既可以是平面的也可以是在此平面薄膜的基礎上經過打孔加工而具有複數個氣孔，孔洞結構721的薄膜，其阻熱原理主要是利用其內部微孔中的空氣層以及後添加的孔洞中的空氣層來凝聚空氣，利用空氣導熱係數大的特性形成熱阻層，該熱阻層可影響熱量傳送方向，使熱量能均勻散佈並控制在熱阻層內以阻止熱量進一步向殼體外擴散，但不限定於此。In addition, a heat insulating film 72 is disposed on the conductive heat dissipating film 73 to prevent the conductive heat dissipating film 73 from radiating heat outward to prevent the user from overheating. In this embodiment, the heat insulating film 72 is A heat-insulating film having a microporous structure obtained by foaming hollow glass beads with PET material, or a film processed by other materials or processes and having heat insulating function, which may be flat or flat. On the basis of the film, a film having a plurality of pores and a hole structure 721 is mainly used to condense air by using an air layer in the inner micropores and an air layer in the post-added holes, using air. The characteristic of high thermal conductivity forms a thermal resistance layer, which can affect the heat transfer direction, so that the heat can be uniformly dispersed and controlled in the thermal resistance layer to prevent heat from further diffusing outside the casing, but is not limited thereto.
再者，在該隔熱膜72的外側設有一層緩衝層71（材料可以為橡膠、泡棉等彈性緩衝材料），用以保護該液晶顯示模組30，達到緩衝及防止熱量傳遞到殼體外之功效，本實施例中，該緩衝層721為泡棉層、橡膠層或彈性薄膜層其中之一所構成，但不限定於此。Further, a buffer layer 71 (the material may be an elastic buffer material such as rubber or foam) is disposed on the outer side of the heat insulating film 72 to protect the liquid crystal display module 30 to buffer and prevent heat from being transmitted to the outside of the casing. In this embodiment, the buffer layer 721 is composed of one of a foam layer, a rubber layer or an elastic film layer, but is not limited thereto.
請同時再參閱圖8及圖15所示之放大圖，該複合膜片70嵌固定在該中殼支架20作為縱向傳熱和電磁屏蔽介質，改善該中殼支架20導熱不良的問題，且將該電子芯片41發出的熱量繼續沿縱向傳遞出去，進而將從該電子芯片41傳來的熱量通過該絕緣散熱片90和該屏蔽罩80縱向傳送到該複合膜片70之導電散熱膜73，然後通過該導電散熱膜73橫向平行散佈開來，達到均勻散熱；再者在該隔熱膜72，其既可以是平面的也可以是在此平面薄膜的基礎上經過打孔加工而具有複數個氣孔，孔洞結構721的薄膜，其作用可以阻止熱量繼續向殼體外擴散，以免給使用者造成過熱的不良使用體驗，並以該緩衝層71，提供緩衝作用兼具隔熱，保護該液晶顯示模組30；藉此，本發明具有結合散熱、緩衝、導電、隔熱四個功用於一體，既可以保持行動電子裝置的可靠性，又能節約成本之功效。Please refer to the enlarged view shown in FIG. 8 and FIG. 15 at the same time. The composite diaphragm 70 is fixedly fixed to the middle casing bracket 20 as a longitudinal heat transfer and electromagnetic shielding medium, thereby improving the problem of poor heat conduction of the middle casing bracket 20, and The heat generated by the electronic chip 41 continues to be transmitted in the longitudinal direction, and the heat transferred from the electronic chip 41 is longitudinally transmitted to the conductive heat dissipation film 73 of the composite film 70 through the insulating heat sink 90 and the shield cover 80, and then The conductive heat dissipating film 73 is laterally and parallelly dispersed to achieve uniform heat dissipation. Further, in the heat insulating film 72, it may be planar or may be perforated on the basis of the flat film to have a plurality of air holes. The film of the hole structure 721 can prevent the heat from continuing to spread out to the outside of the casing, so as not to cause a bad user experience of overheating, and the buffer layer 71 provides a buffering function and heat insulation to protect the liquid crystal display module. 30; thereby, the invention has the functions of combining heat dissipation, buffering, conducting, and heat insulation, thereby maintaining the reliability of the mobile electronic device and saving cost.
藉助上揭技術手段，本發明以該中殼支架22係將傳統的單射蓋體改為模注一體成型，亦即其先將該緩衝層71、隔熱膜72及導電散熱膜73之三層組成複合膜片70，放在模具中與該中殼支架22一體成型，據以減少一個組裝工站，節約組裝人力，縮短組裝時間，降低組裝成本，降低Z軸方向厚度；並且可減少因組裝不良（膜片偏位或者變形，需要撕掉重新組裝）帶來的膜片浪費，提高組裝良率。By means of the above-mentioned technical means, the present invention adopts the middle shell bracket 22 to change the conventional single-shot cover body into a mold-integrated molding, that is, the buffer layer 71, the heat-insulating film 72 and the conductive heat-dissipating film 73 are firstly formed. The composite film 70 is formed in a mold and integrated with the middle shell bracket 22, thereby reducing an assembly station, saving assembly manpower, shortening assembly time, reducing assembly cost, and reducing thickness in the Z-axis direction; The assembly is poor (the diaphragm is displaced or deformed, and it needs to be removed and reassembled) to waste the diaphragm and improve the assembly yield.
綜上所述，本發明所揭示之技術手段，確具「新穎性」、「進步性」及「可供產業利用」等發明專利要件，祈請 鈞局惠賜專利，以勵發明，無任德感。In summary, the technical means disclosed in the present invention have the invention patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patent to encourage the invention. German sense.
惟，上述所揭露之圖式、說明，僅為本發明之較佳實施例，大凡熟悉此項技藝人士，依本案精神範疇所作之修飾或等效變化，仍應包括在本案申請專利範圍內。The drawings and the descriptions of the present invention are merely preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application.
20‧‧‧透明基板
21‧‧‧印刷區
22、22a、22b、22c、22d‧‧‧中殼支架
221‧‧‧開孔
222‧‧‧內框面
223‧‧‧外周邊
30‧‧‧液晶顯示模組
40‧‧‧電路板
41‧‧‧電子芯片
50‧‧‧電池
60‧‧‧後蓋
61‧‧‧容置空間
70‧‧‧複合膜片
71‧‧‧緩衝層
72‧‧‧隔熱膜
721‧‧‧氣孔、孔洞結構
73‧‧‧導電散熱膜
80‧‧‧屏蔽罩
81‧‧‧罩面
90‧‧‧絕緣散熱片20‧‧‧Transparent substrate
21‧‧‧Printing area
22, 22a, 22b, 22c, 22d‧‧‧ middle shell bracket
221‧‧‧Opening
222‧‧‧ inside frame
223‧‧‧outer perimeter
30‧‧‧LCD module
40‧‧‧ boards
41‧‧‧Electronic chip
50‧‧‧Battery
60‧‧‧ Back cover
61‧‧‧ accommodating space
70‧‧‧Composite diaphragm
71‧‧‧buffer layer
72‧‧‧Insulation film
721‧‧‧ stomata and pore structure
73‧‧‧Electrical heat dissipation film
80‧‧‧Shield
81‧‧‧ Cover
90‧‧‧Insulated heat sink
圖1A係習用一種行動電子裝置散熱結構之分解立體圖。 圖1B係習用一種行動電子裝置散熱結構之組合立體圖。 圖1C係習用一種行動電子裝置散熱結構之剖視圖。 圖1D係圖1C中1D所示之放大圖。 圖2係本發明第一可行實施例之分解立體圖。 圖3係本發明第一可行實施例之組合立體圖。 圖4本發明第一可行實施例之剖視圖。 圖5係本發明第二可行實施例之分解立體圖。 圖6係本發明第二可行實施例之組合立體圖。 圖7係本發明第二可行實施例之剖視圖。 圖8係圖7中8所指之放大圖。 圖9係本發明第三可行實施例之分解立體圖。 圖10本發明第三可行實施例之組合立體圖。 圖11係本發明第三可行實施例之剖視圖。 圖12係本發明第四可行實施例之分解立體圖。 圖13係本發明第四可行實施例之組合立體圖。 圖14係本發明第四可行實施例之剖視圖。 圖15係圖14中15所指之放大圖。1A is an exploded perspective view of a heat dissipation structure of a mobile electronic device. FIG. 1B is a perspective view showing a combination of a heat dissipation structure of a mobile electronic device. 1C is a cross-sectional view of a heat dissipation structure of a mobile electronic device. Figure 1D is an enlarged view of 1D in Figure 1C. Figure 2 is an exploded perspective view of a first possible embodiment of the present invention. Figure 3 is a combined perspective view of a first possible embodiment of the present invention. Figure 4 is a cross-sectional view of a first possible embodiment of the present invention. Figure 5 is an exploded perspective view of a second possible embodiment of the present invention. Figure 6 is a combined perspective view of a second possible embodiment of the present invention. Figure 7 is a cross-sectional view showing a second possible embodiment of the present invention. Figure 8 is an enlarged view of 8 in Figure 7. Figure 9 is an exploded perspective view of a third possible embodiment of the present invention. Figure 10 is a perspective view of the combination of a third possible embodiment of the present invention. Figure 11 is a cross-sectional view showing a third possible embodiment of the present invention. Figure 12 is an exploded perspective view of a fourth possible embodiment of the present invention. Figure 13 is a combined perspective view of a fourth possible embodiment of the present invention. Figure 14 is a cross-sectional view showing a fourth possible embodiment of the present invention. Figure 15 is an enlarged view of 15 in Figure 14.
20‧‧‧透明基板 20‧‧‧Transparent substrate
21‧‧‧印刷區 21‧‧‧Printing area
22、22a‧‧‧中殼支架 22, 22a‧‧‧ middle shell bracket
221‧‧‧開孔 221‧‧‧Opening
222‧‧‧內框面 222‧‧‧ inside frame
30‧‧‧液晶顯示模組 30‧‧‧LCD module
40‧‧‧電路板 40‧‧‧ boards
41‧‧‧電子芯片 41‧‧‧Electronic chip
50‧‧‧電池 50‧‧‧Battery
60‧‧‧後蓋 60‧‧‧ Back cover
61‧‧‧容置空間 61‧‧‧ accommodating space
70‧‧‧複合膜片 70‧‧‧Composite diaphragm
71‧‧‧緩衝層 71‧‧‧buffer layer
72‧‧‧隔熱膜 72‧‧‧Insulation film
721‧‧‧氣孔、孔洞結構 721‧‧‧ stomata and pore structure
73‧‧‧導電散熱膜 73‧‧‧Electrical heat dissipation film
731‧‧‧導電散熱面 731‧‧‧Electrical heat dissipation surface
80‧‧‧屏蔽罩 80‧‧‧Shield
81‧‧‧罩面 81‧‧‧ Cover
90‧‧‧絕緣散熱片 90‧‧‧Insulated heat sink
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104126372A TWI672582B (en) | 2015-08-13 | 2015-08-13 | Thermal buffered conductive composite forming structure of mobile electronic device (3) |
| CN201510564601.XA CN106455411A (en) | 2015-08-13 | 2015-09-07 | Heat dissipation buffering conductive composite forming structure of mobile electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104126372A TWI672582B (en) | 2015-08-13 | 2015-08-13 | Thermal buffered conductive composite forming structure of mobile electronic device (3) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201706767A true TW201706767A (en) | 2017-02-16 |
| TWI672582B TWI672582B (en) | 2019-09-21 |
Family
ID=58093930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104126372A TWI672582B (en) | 2015-08-13 | 2015-08-13 | Thermal buffered conductive composite forming structure of mobile electronic device (3) |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106455411A (en) |
| TW (1) | TWI672582B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI710878B (en) * | 2019-03-22 | 2020-11-21 | 友達光電股份有限公司 | Display assembly having shock-absorbing structure |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109362217B (en) * | 2018-09-30 | 2021-10-22 | 联想(北京)有限公司 | Electronic device and electronic device processing method |
| WO2021031114A1 (en) * | 2019-08-20 | 2021-02-25 | 矽统科技股份有限公司 | Heat dissipation patch, eletronic product, method for fabricating heat dissipation patch |
| CN112767838B (en) * | 2021-01-19 | 2022-10-21 | Oppo（重庆）智能科技有限公司 | Flexible display screen and electronic equipment |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110063801A1 (en) * | 2009-09-14 | 2011-03-17 | Lin li-tang | Electronic device with a heat insulating structure |
| TWI507116B (en) * | 2009-11-30 | 2015-11-01 | Radiation element and potable electronic device using same | |
| TWI416208B (en) * | 2010-01-15 | 2013-11-21 | Innolux Corp | Display and assembling method thereof |
| TWI402027B (en) * | 2010-08-20 | 2013-07-11 | Qisda Corp | Electronic device with touch function |
| JP2012160503A (en) * | 2011-01-31 | 2012-08-23 | Kaneka Corp | Composite film, device and method for producing composite film |
| CN103096651B (en) * | 2011-10-31 | 2016-06-08 | 镇江福科鑫电子科技有限公司 | Electronic installation |
| CN202979570U (en) * | 2012-11-26 | 2013-06-05 | 华为终端有限公司 | Shielding case and electronic product thereof |
| US9939858B2 (en) * | 2014-01-21 | 2018-04-10 | Htc Corporation | Electronic device |
| TWM497424U (en) * | 2014-08-22 | 2015-03-11 | Giant Technology Co Ltd | Heat dissipation module structure improvement of electronic device |
| TWM496156U (en) * | 2014-11-19 | 2015-02-21 | Asia Vital Components Co Ltd | Heat dissipating structure of mobile electronic device |
| TWM519268U (en) * | 2015-08-13 | 2016-03-21 | Victory Specific Material Co Ltd M | Heat dissipation buffer conductive composite molding structure of mobile electronic device |
-
2015
- 2015-08-13 TW TW104126372A patent/TWI672582B/en not_active IP Right Cessation
- 2015-09-07 CN CN201510564601.XA patent/CN106455411A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI710878B (en) * | 2019-03-22 | 2020-11-21 | 友達光電股份有限公司 | Display assembly having shock-absorbing structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI672582B (en) | 2019-09-21 |
| CN106455411A (en) | 2017-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWM519269U (en) | Heat dissipation buffer conductive composite molding structure of mobile electronic device | |
| TWM519268U (en) | Heat dissipation buffer conductive composite molding structure of mobile electronic device | |
| TWI672582B (en) | Thermal buffered conductive composite forming structure of mobile electronic device (3) | |
| WO2017067219A1 (en) | Cooling device for mobile terminal, and mobile terminal | |
| US10945331B2 (en) | Mobile display device | |
| US20150201530A1 (en) | Heat Spreading Packaging Apparatus | |
| JP2016201580A (en) | Mobile electronic device case | |
| TW201705851A (en) | Heat radiating, buffering and shielding composite structure of mobile electronic device capable of combining three functions of heat radiating, buffering and shielding together and ensuring the reliability of the mobile electronic device and reducing the cost | |
| WO2017067202A1 (en) | Cooling device for mobile terminal, and mobile terminal | |
| TW201505532A (en) | High heat dissipation circuit board set | |
| TWM548416U (en) | Flexible uniform temperature plate | |
| US20200269543A1 (en) | Thermal insulation structure | |
| TWI669601B (en) | Thermal buffered conductive composite forming structure of mobile electronic device (4) | |
| TWM519359U (en) | Heat dissipation buffer shield composite structure of mobile electronic device | |
| TW201204227A (en) | Heat dissipation apparatus | |
| CN106413335B (en) | Heat dissipation buffering shielding composite structure of mobile electronic device | |
| KR20170080096A (en) | Radiating sheet | |
| TWM515138U (en) | Heat dissipation buffer shield composite structure of mobile electronic device | |
| WO2020052028A1 (en) | Flexible electronic device | |
| KR20130032649A (en) | A case for portable terminal | |
| JP2012146828A (en) | Heat radiation structure and heat radiation member | |
| JP2015026670A (en) | Heat radiator | |
| TWM522552U (en) | Handheld communication apparatus and thin heat sink thereof | |
| CN207304709U (en) | External camera assembly and its cover board, base and shell | |
| JP2017162857A (en) | Heat sink and portable information equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |