TWM548416U - Flexible uniform temperature plate - Google Patents
Flexible uniform temperature plate Download PDFInfo
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- TWM548416U TWM548416U TW104220964U TW104220964U TWM548416U TW M548416 U TWM548416 U TW M548416U TW 104220964 U TW104220964 U TW 104220964U TW 104220964 U TW104220964 U TW 104220964U TW M548416 U TWM548416 U TW M548416U
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Abstract
Description
本實用新型涉及一種柔性均溫板。 The utility model relates to a flexible temperature equalizing plate.
電子裝置於使用過程中，由於電子元件之運行，會產生大量之熱量。若這些熱量未能及時傳導出去而累積於所述電子元件之內部，將會導致所述電子元件之溫度升高並影響其效能，甚至損壞所述電子元件。因此，業界一直致力於研發各種散熱元件以解決電子元件之散熱問題，其中，均溫板係很常見之一種散熱元件。 During the use of the electronic device, a large amount of heat is generated due to the operation of the electronic component. If the heat is not conducted in time to accumulate inside the electronic component, it will cause the temperature of the electronic component to rise and affect its performance, even damaging the electronic component. Therefore, the industry has been working on the development of various heat dissipating components to solve the heat dissipation problem of electronic components. Among them, the uniform temperature plate is a common heat dissipating component.
常用之均溫板主要由殼體、工作流體、毛細組織以及支撐結構構成。殼體內部形成有中空容腔，中空容腔填充有工作流體。工作流體吸收電子元件散發之熱量後變成蒸汽，遇冷後回復成液態而可循環使用，通過工作流體發生相變進行熱量之傳遞，達到散熱之功效。 The commonly used uniform temperature plate is mainly composed of a casing, a working fluid, a capillary structure and a support structure. A hollow cavity is formed inside the casing, and the hollow cavity is filled with a working fluid. The working fluid absorbs the heat emitted by the electronic component and turns into steam. When it is cooled, it returns to a liquid state and can be recycled. The phase change of the working fluid is used to transfer heat to achieve the effect of heat dissipation.
然而，常用之均溫板通常為矩形板體，並且由於本身為腔體材料而無法彎折，而電子裝置中通常具有多個分散之發熱元件，所述多個發熱元件還可能位於不同之平面中，想要同時覆設多個分散之發熱元件，就必須設置多個均溫板，從而增加了製造難度和製造成本。 However, the commonly used uniform temperature plate is usually a rectangular plate body, and cannot be bent because it is itself a cavity material, and the electronic device usually has a plurality of dispersed heating elements, and the plurality of heating elements may also be located in different planes. In order to cover a plurality of dispersed heating elements at the same time, it is necessary to provide a plurality of temperature equalizing plates, thereby increasing manufacturing difficulty and manufacturing cost.
有鑑於此，本實用新型提供了一種可彎折並具有多個吸熱區域之柔性均溫板。 In view of this, the present invention provides a flexible temperature equalizing plate that can be bent and has a plurality of heat absorbing regions.
一種柔性均溫板，其包括複數均溫部，所述柔性均溫板還包括連接複數均溫部之柔性結構，所述複數均溫部間隔設置於所述柔性結構上，所述複數均溫部之間之所述柔性結構構成可撓部。 A flexible temperature equalizing plate comprising a plurality of temperature equalizing portions, the flexible temperature equalizing plate further comprising a flexible structure connecting the plurality of temperature equalizing portions, wherein the plurality of temperature equalizing portions are spaced apart from the flexible structure, the plurality of equalizing temperatures The flexible structure between the portions constitutes a flexible portion.
相較於現有技術，本實用新型之柔性均溫板不僅具備現有均溫板高效吸收熱量之功能，而且利用柔性材料之特性，使均溫板具備可彎折之功能，從而實現一片均溫板即可解決智慧手機、家電產品以及機械手臂等具有多個發 熱源之電子裝置之散熱問題。因此，本實用新型之柔性均溫板簡化了制程，並且降低了製造成本。此外，本實用新型之柔性均溫板可以還根據需求定制形狀和尺寸，適用範圍較廣。 Compared with the prior art, the flexible temperature equalizing plate of the utility model not only has the function of efficiently absorbing heat by the existing uniform temperature plate, but also utilizes the characteristics of the flexible material, so that the temperature equalizing plate has the function of bending, thereby realizing a uniform temperature plate. It can solve multiple problems such as smart phones, home appliances, and robotic arms. The heat dissipation problem of the electronic device of the heat source. Therefore, the flexible temperature equalizing plate of the present invention simplifies the process and reduces the manufacturing cost. In addition, the flexible temperature equalizing plate of the present invention can also be customized in shape and size according to requirements, and has a wide application range.
100、200‧‧‧柔性均溫板 100,200‧‧‧Flexible temperature plate
10‧‧‧第一均溫部 10‧‧‧First temperature department
12、22‧‧‧金屬基層 12, 22‧‧‧ metal base
122、222‧‧‧收容槽 122, 222‧‧‧ receiving trough
124、224‧‧‧支撐結構 124, 224‧‧‧Support structure
14、24‧‧‧工作液 14, 24‧‧‧ working fluid
16、26‧‧‧黏著層 16, 26‧‧ ‧ adhesive layer
20‧‧‧第二均溫部 20‧‧‧Second temperature department
30、40‧‧‧柔性結構 30, 40‧‧‧ Flexible structure
32‧‧‧柔性金屬層 32‧‧‧Flexible metal layer
34、44‧‧‧柔性基材 34, 44‧‧‧ Flexible substrate
36、46‧‧‧可撓部 36, 46‧‧‧Flexible
362‧‧‧缺口 362‧‧‧ gap
41‧‧‧第一柔性金屬層 41‧‧‧First flexible metal layer
42‧‧‧第二柔性金屬層 42‧‧‧Second flexible metal layer
300‧‧‧第一散熱元件 300‧‧‧First heat dissipating component
400‧‧‧第二散熱元件 400‧‧‧Second heat dissipating component
500‧‧‧導熱膠 500‧‧‧thermal adhesive
圖1是本實用新型第一實施例之柔性均溫板之平面圖。 1 is a plan view of a flexible temperature equalizing plate of a first embodiment of the present invention.
圖2是圖1之柔性均溫板沿II-II線之剖面示意圖。 2 is a schematic cross-sectional view of the flexible temperature equalizing plate of FIG. 1 taken along line II-II.
圖3是圖1之柔性均溫板沿III-III線之剖面示意圖。 3 is a schematic cross-sectional view of the flexible temperature equalizing plate of FIG. 1 taken along line III-III.
圖4是圖1之柔性均溫板用於電子裝置散熱時之剖面示意圖。 4 is a schematic cross-sectional view of the flexible temperature equalizing plate of FIG. 1 for use in dissipating heat from an electronic device.
圖5是圖1之柔性均溫板被彎折90°後用於電子裝置散熱時之剖面示意圖。 FIG. 5 is a schematic cross-sectional view of the flexible temperature equalizing plate of FIG. 1 after being bent by 90° for heat dissipation of the electronic device.
圖6是圖1之柔性均溫板被彎折180°後用於電子裝置散熱時之剖面示意圖。 FIG. 6 is a schematic cross-sectional view showing the flexible temperature equalizing plate of FIG. 1 after being bent by 180° for heat dissipation of the electronic device.
圖7是本實用新型第二實施例之柔性均溫板之剖面示意圖。 Fig. 7 is a schematic cross-sectional view showing a flexible temperature equalizing plate according to a second embodiment of the present invention.
請參閱圖1和圖2，本實用新型第一實施例提供一柔性均溫板100，其包括第一均溫部10、第二均溫部20以及連接第一均溫部10和第二均溫部20之柔性結構30。所述第一均溫部10及第二均溫部20用於給電子裝置中之不同發熱元件散熱(例如，手機中之照相機和CPU)。 Referring to FIG. 1 and FIG. 2 , a first embodiment of the present invention provides a flexible temperature equalizing plate 100 including a first temperature equalizing portion 10 , a second temperature equalizing portion 20 , and a first temperature equalizing portion 10 and a second connecting unit. The flexible structure 30 of the warm portion 20. The first temperature equalizing portion 10 and the second temperature equalizing portion 20 are used to dissipate heat to different heat generating components in the electronic device (for example, a camera and a CPU in a mobile phone).
柔性結構30包括一柔性金屬層32和貼覆於所述柔性金屬層32表面之柔性基材34。於本實施方式中，柔性金屬層32為軟性銅箔基材，其厚度可以為12μm~35μm。柔性基材34之材料可以係聚醯亞胺、聚對苯二甲酸乙二醇酯或者聚萘二甲酸乙二醇酯。柔性基材34之厚度可以為12μm~50μm。 The flexible structure 30 includes a flexible metal layer 32 and a flexible substrate 34 that is applied to the surface of the flexible metal layer 32. In the present embodiment, the flexible metal layer 32 is a soft copper foil substrate and may have a thickness of 12 μm to 35 μm. The material of the flexible substrate 34 may be polyimine, polyethylene terephthalate or polyethylene naphthalate. The flexible substrate 34 may have a thickness of 12 μm to 50 μm.
請參閱圖3，第一均溫部10包括一金屬基層12以及設置於所述金屬基層12中之工作液14。金屬基層12內通過蝕刻方式形成複數收容槽122，相鄰之收容槽122之間形成支撐結構124。柔性結構30之柔性金屬層32通過黏著層16貼合於金屬基層12之上表面，從而使柔性金屬層32與金屬基層12之收容槽122共同形成複數收容腔，工作液14填充於收容腔中。於本實施方式中，工作液14為固液型相變材料。 Referring to FIG. 3 , the first temperature equalizing portion 10 includes a metal base layer 12 and a working fluid 14 disposed in the metal base layer 12 . A plurality of receiving grooves 122 are formed in the metal base layer 12 by etching, and a supporting structure 124 is formed between the adjacent receiving grooves 122. The flexible metal layer 32 of the flexible structure 30 is adhered to the upper surface of the metal base layer 12 through the adhesive layer 16, so that the flexible metal layer 32 and the receiving groove 122 of the metal base layer 12 form a plurality of receiving cavities, and the working fluid 14 is filled in the receiving cavity. . In the present embodiment, the working fluid 14 is a solid-liquid phase change material.
第二均溫部20之結構與第一均溫部10之結構相同，於此不再贅述。 The structure of the second temperature equalizing portion 20 is the same as that of the first temperature equalizing portion 10, and details are not described herein again.
柔性結構30連接第一均溫部10和第二均溫部20，其中柔性金屬層32貼覆於第一均溫部10和第二均溫部20之上表面。第一均溫部10和第二均溫部20之間之柔性金屬層32和柔性基材34構成可撓部36，為了便於彎折，所述可撓部36之柔性金屬層32由表面朝向柔性基材34形成一缺口362。 The flexible structure 30 connects the first temperature equalizing portion 10 and the second temperature equalizing portion 20, wherein the flexible metal layer 32 is attached to the upper surfaces of the first temperature equalizing portion 10 and the second temperature equalizing portion 20. The flexible metal layer 32 and the flexible substrate 34 between the first temperature equalizing portion 10 and the second temperature equalizing portion 20 constitute a flexible portion 36. The flexible metal layer 32 of the flexible portion 36 is oriented from the surface for the purpose of bending. The flexible substrate 34 forms a gap 362.
本實用新型之柔性均溫板100可用於為電子裝置中多個分散設置之散熱元件進行散熱。柔性基材34具有可撓性，可撓部36處之柔性金屬層32之厚度較薄，不僅易彎折還能節約空間，可撓部36之柔性金屬層32還可以於第一均溫部10和第二均溫部20之間進行熱量傳導，以提高均溫板之傳熱效果。因此，本實用新型之柔性均溫板100不僅適用於多個發熱元件位於同一平面之電子裝置，還適用於多個發熱元件位於不同平面之電子裝置。 The flexible temperature equalizing plate 100 of the present invention can be used for dissipating heat from a plurality of dispersed heat dissipating components in an electronic device. The flexible substrate 34 has flexibility, and the flexible metal layer 32 at the flexible portion 36 has a thin thickness, which is not only easy to bend but also saves space. The flexible metal layer 32 of the flexible portion 36 can also be in the first temperature equalization portion. The heat conduction between the 10 and the second temperature equalizing portion 20 is performed to improve the heat transfer effect of the temperature equalizing plate. Therefore, the flexible temperature equalizing plate 100 of the present invention is applicable not only to electronic devices in which a plurality of heat generating elements are located on the same plane, but also to electronic devices in which a plurality of heat generating elements are located in different planes.
首先，如圖4所示，本實施例中柔性均溫板100之第一均溫部10和第二均溫部20分別通過導熱膠500貼合於一電子裝置之第一散熱元件300和第二散熱元件400上，由於第一均溫部10和第二均溫部20位於同一平面上，因此，柔性均溫板100不彎折。 First, as shown in FIG. 4, the first temperature equalizing portion 10 and the second temperature equalizing portion 20 of the flexible temperature equalizing plate 100 are respectively attached to the first heat dissipating component 300 of an electronic device through the thermal conductive adhesive 500, and In the two heat dissipating elements 400, since the first temperature equalizing portion 10 and the second temperature equalizing portion 20 are located on the same plane, the flexible temperature equalizing plate 100 is not bent.
其次，如圖5所示，柔性均溫板100之第一均溫部10和第二均溫部20分別通過導熱膠500貼合於一電子裝置之第一散熱元件300和第二散熱元件400上，柔性均溫板100被彎折呈90°角，從而使得第一均溫部10和第二均溫部20相互垂直。 Next, as shown in FIG. 5, the first temperature equalizing portion 10 and the second temperature equalizing portion 20 of the flexible temperature equalizing plate 100 are respectively attached to the first heat dissipating component 300 and the second heat dissipating component 400 of an electronic device through the thermal conductive adhesive 500. Upper, the flexible temperature equalizing plate 100 is bent at an angle of 90° such that the first temperature equalizing portion 10 and the second temperature equalizing portion 20 are perpendicular to each other.
最後，如圖6所示，柔性均溫板100之第一均溫部10和第二均溫部20分別通過導熱膠500貼合於一電子裝置之第一散熱元件300和第二散熱元件400，柔性均溫板100被彎折呈180°，從而使得第一均溫部10和第二均溫部20相互平行。 Finally, as shown in FIG. 6 , the first temperature equalizing portion 10 and the second temperature equalizing portion 20 of the flexible temperature equalizing plate 100 are respectively attached to the first heat dissipating component 300 and the second heat dissipating component 400 of an electronic device through the thermal conductive adhesive 500 . The flexible temperature equalizing plate 100 is bent at 180° such that the first temperature equalizing portion 10 and the second temperature equalizing portion 20 are parallel to each other.
如圖7所示，本實用新型之第二實施例提供之柔性均溫板200之結構與第一實施例中提供之柔性均溫板100之結構大體相同，其區別於於第二實施例提供之柔性均溫板200之柔性結構40包括柔性基材44、間隔設置於柔性基材44上之第一柔性金屬層41以及第二柔性金屬層42。第一均溫部10和第二均溫部20分別設置於第一柔性金屬層41和第二柔性金屬層42表面。第一柔性金屬層41和第二柔性金屬層42之間之柔性基材44構成可撓部46。所述可撓部46不包含柔性金屬層，因此具備更強之可撓性。 As shown in FIG. 7 , the structure of the flexible temperature equalizing plate 200 provided by the second embodiment of the present invention is substantially the same as that of the flexible temperature equalizing plate 100 provided in the first embodiment, which is different from the second embodiment. The flexible structure 40 of the flexible temperature equalization plate 200 includes a flexible substrate 44, a first flexible metal layer 41 spaced apart from the flexible substrate 44, and a second flexible metal layer 42. The first temperature equalizing portion 10 and the second temperature equalizing portion 20 are disposed on the surfaces of the first flexible metal layer 41 and the second flexible metal layer 42, respectively. The flexible substrate 44 between the first flexible metal layer 41 and the second flexible metal layer 42 constitutes a flexible portion 46. The flexible portion 46 does not include a flexible metal layer and thus has greater flexibility.
可以理解，本實用新型提供之柔性均溫板之均溫部之數量、形狀以及尺寸可以根據實際需要調節定制，並不限於本實施例中揭示之數量、形狀以及尺寸。 It can be understood that the number, shape and size of the temperature equalizing portions of the flexible temperature equalizing plate provided by the present invention can be customized according to actual needs, and are not limited to the quantity, shape and size disclosed in the embodiment.
可以理解，本實用新型提供之柔性均溫板之形狀和尺寸也可以根據實際需要調節定制，並不限於本實施例中揭示之形狀和尺寸。 It can be understood that the shape and size of the flexible temperature equalizing plate provided by the present invention can also be customized according to actual needs, and is not limited to the shape and size disclosed in the embodiment.
相較於現有技術，本實用新型之柔性均溫板採用柔性結構連接複數個均溫部，並於柔性結構上設置可撓部，不僅能夠高效吸收熱量，而且利用柔性材料之特性，使均溫板可以多角度彎折，適用於具有多個分散設置之發熱元件之電子裝置。從而實現了一片均溫板即可解決智慧手機、家電產品以及機械手臂等具有多個發熱源之電子裝置之散熱問題，簡化了柔性均溫板之制程，降低了製造成本。此外，本實用新型之柔性均溫板可以還根據需求定制形狀和尺寸，適用範圍廣。 Compared with the prior art, the flexible temperature equalizing plate of the present invention adopts a flexible structure to connect a plurality of equal temperature parts, and provides a flexible part on the flexible structure, which not only can efficiently absorb heat, but also utilizes the characteristics of the flexible material to make the temperature uniform. The board can be bent at multiple angles and is suitable for electronic devices having a plurality of discretely disposed heating elements. Thus, a single temperature plate can be realized to solve the heat dissipation problem of the electronic device having multiple heat sources such as smart phones, home appliances and robot arms, simplifying the process of the flexible temperature equalizing plate and reducing the manufacturing cost. In addition, the flexible temperature equalizing plate of the present invention can also be customized in shape and size according to requirements, and has a wide application range.
100‧‧‧柔性均溫板 100‧‧‧Flexible temperature equalization plate
10‧‧‧第一均溫部 10‧‧‧First temperature department
12、22‧‧‧金屬基層 12, 22‧‧‧ metal base
122、222‧‧‧收容槽 122, 222‧‧‧ receiving trough
124、224‧‧‧支撐結構 124, 224‧‧‧Support structure
14、24‧‧‧工作液 14, 24‧‧‧ working fluid
16、26‧‧‧黏著層 16, 26‧‧ ‧ adhesive layer
20‧‧‧第二均溫部 20‧‧‧Second temperature department
30‧‧‧柔性結構 30‧‧‧Flexible structure
32‧‧‧柔性金屬層 32‧‧‧Flexible metal layer
34‧‧‧柔性基材 34‧‧‧Flexible substrate
36‧‧‧可撓部 36‧‧‧Flexible
362‧‧‧缺口 362‧‧‧ gap
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520956238.1U CN205430849U (en) | 2015-11-26 | 2015-11-26 | Flexible even temperature plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM548416U true TWM548416U (en) | 2017-09-01 |
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|---|---|---|---|
| TW104220964U TWM548416U (en) | 2015-11-26 | 2015-12-28 | Flexible uniform temperature plate |
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| CN (1) | CN205430849U (en) |
| TW (1) | TWM548416U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI720865B (en) * | 2020-04-07 | 2021-03-01 | 奇鋐科技股份有限公司 | Heat dissipation connection structure of handheld device |
| TWI763989B (en) * | 2019-04-12 | 2022-05-11 | 雙鴻科技股份有限公司 | Flexible vapor chamber |
| TWI837292B (en) * | 2020-02-03 | 2024-04-01 | 大陸商奇宏電子（深圳）有限公司 | Bendable vapor chamber structure |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413932A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof |
| CN109413930A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of temperature-uniforming plate and the application temperature-uniforming plate |
| JP6886904B2 (en) * | 2017-09-20 | 2021-06-16 | 新光電気工業株式会社 | Loop type heat pipe, manufacturing method of loop type heat pipe, electronic equipment |
| CN107764116A (en) * | 2017-10-16 | 2018-03-06 | 华南理工大学 | Ultrathin flexible soaking plate and its manufacture method |
| CN110418550B (en) * | 2019-06-25 | 2021-06-01 | 华为技术有限公司 | Vapor chamber and folding terminal |
| CN112638123A (en) * | 2020-12-11 | 2021-04-09 | 浙江大学 | Heterogeneous temperature equalizing device |
-
2015
- 2015-11-26 CN CN201520956238.1U patent/CN205430849U/en active Active
- 2015-12-28 TW TW104220964U patent/TWM548416U/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI763989B (en) * | 2019-04-12 | 2022-05-11 | 雙鴻科技股份有限公司 | Flexible vapor chamber |
| TWI837292B (en) * | 2020-02-03 | 2024-04-01 | 大陸商奇宏電子（深圳）有限公司 | Bendable vapor chamber structure |
| TWI720865B (en) * | 2020-04-07 | 2021-03-01 | 奇鋐科技股份有限公司 | Heat dissipation connection structure of handheld device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN205430849U (en) | 2016-08-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |