CN109413932A - Radiator structure and preparation method thereof - Google Patents
Radiator structure and preparation method thereof Download PDFInfo
- Publication number
- CN109413932A CN109413932A CN201710714035.5A CN201710714035A CN109413932A CN 109413932 A CN109413932 A CN 109413932A CN 201710714035 A CN201710714035 A CN 201710714035A CN 109413932 A CN109413932 A CN 109413932A
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- China
- Prior art keywords
- thermally conductive
- composite material
- heat accumulation
- radiator structure
- conductive heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
A kind of radiator structure, it includes metal shell, the metal shell is formed with cavity and opening, the radiator structure further includes thermally conductive heat accumulation composite material and sealing, the thermally conductive heat accumulation composite material filling is in this cavity, the sealing is arranged in the opening, for sealing the opening, in the cavity by the encapsulation of thermally conductive heat accumulation composite material.Radiator structure of the invention includes thermally conductive heat accumulation composite material, the thermally conductive heat accumulation composite material has high thermal conductivity compared to phase-change material, the thermally conductive heat accumulation composite material also has higher stability and levelability, so that the radiator structure has preferable heat dissipation effect, can be used in electronic equipment radiating to electronic component.In addition, the present invention also provides a kind of production methods of radiator structure.
Description
Technical field
The present invention relates to the production methods of a kind of radiator structure and the radiator structure.
Background technique
In big data era, with the raising of the electronics miniaturizations such as mobile phone, smartwatch, highly integrated degree, electricity
The radiating requirements of sub- equipment are also higher and higher.Currently, graphite flake is mostly used to radiate as radiator structure to electronic equipment, though
Right graphite flake has a high-termal conductivity, but its radiating requirements that can not fully meet electronic equipment.Heat pipe is widely used in electricity
Brain or light emitting diode (LED) heat dissipation, but the thickness of heat pipe is larger, is not suitable for the electronic equipment of miniaturization.Phase-change material
It can be used for the heat dissipation of electronic equipment, and phase-change material can overcome the disadvantages mentioned above of graphite sheet and heat pipe, it is well known that
The thermal conductivity of phase-change material is too low, has seriously affected its application in the electronic device.
Summary of the invention
In view of this, it is necessary to provide a kind of new thermally conductive heat accumulation composite materials of radiator structure, to solve the above problems.
In addition, there is a need to provide a kind of production method of radiator structure.
A kind of radiator structure comprising metal shell, the metal shell are formed with cavity and opening, which also wraps
Thermally conductive heat accumulation composite material and sealing are included, in this cavity, which is arranged at this for the thermally conductive heat accumulation composite material filling
Opening, for sealing the opening, in the cavity by the encapsulation of thermally conductive heat accumulation composite material.
A kind of production method of radiator structure comprising following steps:
Step S1 provides a sheet metal, which has a foldable plane；
Step S2, in the periphery applying conductive glue of the foldable plane of the sheet metal；
Step S3 prints thermally conductive heat accumulation composite wood in the region of the uncoated conducting resinl of the foldable plane of the sheet metal
Material；
Step S4 toasts the above-mentioned conducting resinl for being incorporated into sheet metal foldable plane and thermally conductive heat accumulation composite material；
Step S5 by the sheet metal doubling after baking and is pressed, and is bonded together the conducting resinl correspondence on foldable plane
Sealing is formed, presses together the thermally conductive heat accumulation composite material correspondence on foldable plane, which is converted into chamber
The metal shell of body, thermally conductive heat accumulation composite material by both seals in the cavity.
Radiator structure of the invention includes thermally conductive heat accumulation composite material, which includes phase-change thermal storage material
Material, highly heat-conductive material and auxiliary agent.The thermally conductive heat accumulation composite material has high thermal conductivity compared to phase-change material.The thermally conductive heat accumulation
Composite material also has higher stability and levelability.The thermally conductive heat accumulation composite material also has good impressionability, can be with
Rapid, high volume production, is particularly suitable for electronic product small in size, that thickness is thin.It is made by thermally conductive heat accumulation composite material of the invention
Radiator structure have preferable heat dissipation effect, can be used in electronic equipment radiating to electronic component.
Detailed description of the invention
Fig. 1 is the top view of sheet metal of the present invention.
Fig. 2 is the schematic diagram of the periphery applying conductive glue of the foldable plane of sheet metal shown in Fig. 1.
Fig. 3 is that the thermally conductive heat accumulation of area filling of the uncoated conducting resinl of the foldable plane of sheet metal shown in Fig. 2 is compound
The schematic diagram of material.
Fig. 4 is the perspective view of the radiator structure of better embodiment of the present invention.
Fig. 5 is the schematic cross-section of radiator structure shown in Fig. 4 along the direction V-V.
Fig. 6 is the schematic diagram that radiator structure radiates to battery.
Symbol description
| Radiator structure | 100 |
| Metal shell | 10 |
| Cavity | 11 |
| Opening | 12 |
| Thermally conductive heat accumulation composite material | 20 |
| Sealing | 30 |
| Sheet metal | 110 |
| Foldable plane | 111 |
| Conducting resinl | 120 |
| Battery | 200 |
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by, it is clear that described embodiment is only some embodiments of the invention, rather than whole realities
Apply mode.
Based on the embodiment in the present invention, those of ordinary skill in the art institute without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
All technical and scientific terms used herein with to belong to those skilled in the art of the invention usual
The meaning of understanding is identical.Term as used herein in the specification of the present invention is intended merely to description specific embodiment
Purpose, it is not intended that in limitation the present invention.
Fig. 1~5 are please referred to, better embodiment of the present invention provides a kind of production method of radiator structure 100, packet
Include following steps:
Step S1, referring to Fig. 1, providing a sheet metal 110.The sheet metal 110 has a foldable plane 111.
The sheet metal 110 can be metal foil.The material of the sheet metal 110 is the good gold of heating conductions such as copper
Belong to.
Step S2, further referring to Fig. 2, in the periphery applying conductive glue of the foldable plane 111 of the sheet metal 110
120。
Step S3, further referring to Fig. 3, in the uncoated conducting resinl 120 of the foldable plane 111 of the sheet metal 110
Region print thermally conductive heat accumulation composite material 20.
Preferably, the thickness of the thermally conductive heat accumulation composite material 20 is equal to or slightly less than the thickness of conducting resinl 120.
The thermally conductive heat accumulation composite material includes phase-change heat-storage material, highly heat-conductive material and auxiliary agent.The auxiliary agent is anti-settling agent
And one or both of dispersing agent.
In the thermally conductive heat accumulation composite material, the content of phase-change heat-storage material is 20~80 parts by weight, highly heat-conductive material
Content is 0.5~20 parts by weight, and the content of auxiliary agent is 0.2~10 parts by weight.
The phase-change heat-storage material can be organic phase change material, inorganic phase-changing material or composite phase-change material.This is inorganic
Phase-change material can be crystalline hydrate salt phase-change material, molten salts phase-change material, phase change materials and alloy class phase transformation
One or more of material.The organic phase change material includes but is not limited to paraffin, acetic acid, polyethylene glycol (PEG) and fatty acid
One or more of.
The highly heat-conductive material is carbon nanotube or carbon fiber.
The anti-settling agent includes but is not limited to thicken hydrophobic silica (Japanese fuji SYL350), super-hydrophobicity dioxy
SiClx (Japanese fuji SYL200), hydrophobic silica white micro mist (Japanese fuji SYLOMASK), vapor phase method hydrophobicity two
Silica white micro mist (anti-settling agent R 972), novel organobentonite canescence micro mist (anti-settling agent Benathix), thickening are hydrophobic
One or more of property silica (Japanese fuji SYL310 P), micro- hydrophilic silica (anti-settling agent EH-5).It is described
Anti-settling agent can make thermally conductive heat accumulation composite material have thixotropy, and the viscosity of thermally conductive heat accumulation composite material can be improved.
The dispersing agent includes but is not limited to inorganic thickening agent class dispersing agent, cellulose ethers dispersing agent, natural polymer
And its derivative species dispersing agent, synthesis one of high score subclass dispersing agent and misfit type organo-metallic compound class dispersing agent
Or it is several.The inorganic thickening agent class dispersing agent includes but is not limited to fumed silica, sodium bentonite, organic swelling
One or more of soil, diatomite, attapulgite soil, molecular sieve and Silica hydrogel.The cellulose ethers dispersing agent include but
It is not limited to one of methylcellulose, hydroxypropyl methyl cellulose, sodium carboxymethylcellulose and hydroxyethyl cellulose or several
Kind.The natural polymer and its derivative species dispersing agent include but is not limited to starch, gelatin, sodium alginate, casein, Guar
One or more of glue, chitosan, gum arabic, xanthan gum, soybean protein glue and natural rubber.The synthesis high score
Subclass dispersing agent includes but is not limited to polyacrylamide, polyvinyl alcohol, polyvinylpyrrolidone, polyethylene glycol oxide, modified paraffin
Resin, carbomer, polyacrylic acid, Polyacrylate Emulsion, butadiene rubber, butadiene-styrene rubber, polyurethane, modified polyurea,
One or more of low-molecular polyethylene wax, dispersing agent 2155 and dispersing agent 9076.The misfit type organo-metallic compound
Class dispersing agent can be amino alcohol solvay-type titanate esters.The dispersing agent can refine of the thermally conductive heat accumulation composite material
Grain, improves the dispersibility of thermally conductive heat accumulation composite material.
The thermally conductive heat accumulation composite material has high thermal conductivity compared to phase-change material.The dispersing agent and anti-settling agent
Addition, can make the thermally conductive heat accumulation composite material also have higher stability and levelability.
Step S4, to the conducting resinl 120 and thermally conductive heat accumulation composite wood of the above-mentioned foldable plane 111 for being incorporated into sheet metal 110
Material 20 is toasted.
Preferably, the temperature of the baking is 160 DEG C, and the time of baking is 10min.
Step S5 by 110 doubling of sheet metal after baking and presses further referring to Fig. 4~5, makes foldable plane 111
On the correspondence of conducting resinl 120 be bonded together to form sealing 30, make the corresponding pressure of thermally conductive heat accumulation composite material on foldable plane 111
It is combined, which is converted into the metal shell 10 with cavity 11, and thermally conductive heat accumulation composite material 20 is by sealing
30 are sealed in cavity 11, obtain radiator structure 100.
A kind of radiator structure 100, the substantially tabular of radiator structure 100.The radiator structure 100 includes metal shell
10, thermally conductive heat accumulation composite material 20 and sealing 30.The metal shell 10 is formed with cavity 11 and opening 12.The thermally conductive heat accumulation
Composite material 20 is filled in the cavity 11.The sealing 30 is arranged at the opening 12, for the opening 12 to be sealed, with
Thermally conductive heat accumulation composite material 20 is encapsulated in cavity 11.
The metal shell 10 after metal foil doubling by forming.The material of the metal shell 10 is that the heating conductions such as copper are good
Good metal.
The material of the sealing 30 is conducting resinl.Sealing thermally conductive heat accumulation composite material 20 using conducting resinl can be effective
Reduce the electromagnetic interference of radiator structure 100.
The present invention is specifically described below by embodiment.
Embodiment 1
Thermally conductive heat accumulation composite material in the radiator structure 100 of the present embodiment by CTA, carbon nanotube, cetomacrogol 1000,
Dispersing agent 2155 is prepared.
Wherein, the quality of CTA is 44.42g, and the quality of carbon nanotube is 2.94g, and the quality of cetomacrogol 1000 is
50.69, the quality of dispersing agent 2155 is 1.96g.
Dispersed test is carried out to the thermally conductive heat accumulation composite material of the present embodiment.The method of dispersibility test are as follows: pass through
Fineness gauge measures the particle size of thermally conductive heat accumulation composite material, and partial size is smaller, distributed better.Test result is the present embodiment
Thermally conductive heat accumulation composite material particle size less than 15 μm.
Embodiment 2
Thermally conductive heat accumulation composite material in the radiator structure 100 of the present embodiment is by CTA, carbon fiber, cetomacrogol 1000, anti-
Heavy agent EH-5 is prepared.
Wherein, the quality of CTA is 45.3g, and the quality of carbon fiber is 6.00g, and the quality of cetomacrogol 1000 is 46.7g,
The quality of anti-settling agent EH-5 is 2.00g.
Dispersed test is carried out to the thermally conductive heat accumulation composite material of the present embodiment.Test result is the thermally conductive storage of the present embodiment
The particle size of hot composite material is less than 10 μm.
Embodiment 3
Thermally conductive heat accumulation composite material in the radiator structure 100 of the present embodiment by CTA, carbon fiber, cetomacrogol 1000, point
Powder 9076 is prepared.
Wherein, the quality of CTA is 45.30g, and the quality of carbon fiber is 6.00g, and the quality of cetomacrogol 1000 is 46.70,
The quality of dispersing agent 9076 is 2.00g.
Dispersed test is carried out to the thermally conductive heat accumulation composite material of the present embodiment.Test result is the thermally conductive storage of the present embodiment
The particle size of hot composite material is less than 10 μm.
Embodiment 4
Thermally conductive heat accumulation composite material in the radiator structure 100 of the present embodiment by CTA, carbon fiber, cetomacrogol 1000, point
Powder 2155 is prepared.
Wherein, the quality of CTA is 44.42g, and the quality of carbon fiber is 5.88g, and the quality of cetomacrogol 1000 is 45.79,
The quality of dispersing agent 2155 is 3.92g.
Dispersed test is carried out to the thermally conductive heat accumulation composite material of the present embodiment.Test result is the thermally conductive storage of the present embodiment
The particle size of hot composite material is less than 7 μm.
Embodiment 5
Thermally conductive heat accumulation composite material in the radiator structure 100 of the present embodiment by CTA, carbon fiber, cetomacrogol 1000, point
Powder 2155 is prepared.
Wherein, the quality of CTA is 44.42g, and the quality of carbon fiber is 2.94g, and the quality of cetomacrogol 1000 is 50.69,
The quality of dispersing agent 2155 is 1.96g.
Dispersed test is carried out to the thermally conductive heat accumulation composite material of the present embodiment.Test result is the thermally conductive storage of the present embodiment
The particle size of hot composite material is less than 7 μm.
Comparative example
What is filled in metal shell 10 in radiator structure in this comparative example is phase-change material cetomacrogol 1000.
Further referring to Fig. 6, by the radiator structure (not shown) of the radiator structure 100 of above-described embodiment 4 and comparative example
It is placed on the surface of the battery 200 to work, is radiated to battery 200, the operating voltage of the battery 200 is 1.92V, work
Making electric current is 0.80A.The temperature of tetra- location points of A, B, C, D of above-mentioned two radiator structure is measured, respectively obtain A,
B, the temperature T of tetra- location points of C, D1、T2、T3、T4.Test result joins following table one.
Table one:
As seen from the above table, when radiating to identical electronic component, by thermally conductive heat accumulation composite material system of the invention
The surface temperature of the radiator structure 100 of work is lower than the temperature on the surface of the radiator structure made by phase-change material polyethylene glycol, can
See that there is better heat dissipation effect by the radiator structure 100 that thermally conductive heat accumulation composite material of the invention makes.
Radiator structure 100 of the invention includes thermally conductive heat accumulation composite material, which stores up comprising phase transformation
Hot material, highly heat-conductive material and auxiliary agent.The thermally conductive heat accumulation composite material has high thermal conductivity compared to phase-change material.This is thermally conductive
Heat accumulation composite material also has higher stability and levelability.The thermally conductive heat accumulation composite material also has good impressionability,
It can be produced with rapid, high volume, be particularly suitable for electronic product small in size, that thickness is thin.By thermally conductive heat accumulation composite material of the invention
The radiator structure 100 of production has preferable heat dissipation effect, can be used in electronic equipment radiating to electronic component.
In addition, it is described above, it is only better embodiment of the invention, not to limit in any form of the invention
System, although the present invention is disclosed above by better embodiment, is not intended to limit the invention, any skill for being familiar with this profession
Art personnel, without departing from the scope of the present invention, be modified when the technology contents using the disclosure above or
The equivalent implementations of equivalent variations are modified to, but without departing from the technical solutions of the present invention, technology according to the present invention
Any simple modification, equivalent change and modification that essence does embodiment of above, still fall within technical solution of the present invention
In range.
Claims (10)
1. a kind of radiator structure comprising metal shell, the metal shell are formed with cavity and opening, it is characterised in that: this is dissipated
Heat structure further includes thermally conductive heat accumulation composite material and sealing, which fills the sealing in this cavity
Portion is arranged in the opening, for sealing the opening, in the cavity by the encapsulation of thermally conductive heat accumulation composite material.
2. radiator structure as described in claim 1, it is characterised in that: the metal shell after metal foil doubling by forming.
3. radiator structure as described in claim 1, it is characterised in that: the material of the sealing is conducting resinl.
4. radiator structure as described in claim 1, it is characterised in that: the thermally conductive heat accumulation composite material includes phase-change thermal storage material
Material, highly heat-conductive material and auxiliary agent, the auxiliary agent are one or both of anti-settling agent and dispersing agent.
5. radiator structure as claimed in claim 4, it is characterised in that: in the thermally conductive heat accumulation composite material, phase-change thermal storage material
The content of material is 20~80 parts by weight, and the content of highly heat-conductive material is 0.5~20 parts by weight, and the content of auxiliary agent is 0.2~10 weight
Measure part.
6. radiator structure as claimed in claim 4, it is characterised in that: the anti-settling agent include thickening hydrophobic silica,
It is super-hydrophobic silica, hydrophobic silica white micro mist, vapor phase method hydrophobic silica white micro mist, novel organic
One or more of bentonite canescence micro mist, thickening hydrophobic silica, micro- hydrophilic silica；The dispersing agent
Including inorganic thickening agent class dispersing agent, cellulose ethers dispersing agent, natural polymer and its derivative species dispersing agent, synthesis high score
One or more of subclass dispersing agent and misfit type organo-metallic compound class dispersing agent.
7. a kind of production method of radiator structure comprising following steps:
Step S1 provides a sheet metal, which has a foldable plane；
Step S2, in the periphery applying conductive glue of the foldable plane of the sheet metal；
Step S3 prints thermally conductive heat accumulation composite material in the region of the uncoated conducting resinl of the foldable plane of the sheet metal；
Step S4 toasts the above-mentioned conducting resinl for being incorporated into sheet metal foldable plane and thermally conductive heat accumulation composite material；
Step S5 by the sheet metal doubling after baking and is pressed, and the conducting resinl correspondence on foldable plane is made to be bonded together to be formed
Sealing presses together the thermally conductive heat accumulation composite material correspondence on foldable plane, which is converted into cavity
Metal shell, thermally conductive heat accumulation composite material by both seals in the cavity.
8. the production method of radiator structure as claimed in claim 7, it is characterised in that: the thermally conductive heat accumulation composite material includes
Phase-change heat-storage material, highly heat-conductive material and auxiliary agent, the auxiliary agent are one or both of anti-settling agent and dispersing agent.
9. the production method of radiator structure as claimed in claim 8, it is characterised in that: in the thermally conductive heat accumulation composite material,
The content of phase-change heat-storage material is 20~80 parts by weight, and the content of highly heat-conductive material is 0.5~20 parts by weight, and the content of auxiliary agent is
0.2~10 parts by weight.
10. the production method of radiator structure as claimed in claim 8, it is characterised in that: the anti-settling agent includes that thickening is hydrophobic
Property silica, super-hydrophobic silica, hydrophobic silica white micro mist, vapor phase method hydrophobic silica white are micro-
One of powder, novel organobentonite canescence micro mist, thickening hydrophobic silica, micro- hydrophilic silica are several
Kind；The dispersing agent includes inorganic thickening agent class dispersing agent, cellulose ethers dispersing agent, natural polymer and its derivative species point
Powder, synthesis one or more of high score subclass dispersing agent and misfit type organo-metallic compound class dispersing agent.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710714035.5A CN109413932A (en) | 2017-08-18 | 2017-08-18 | Radiator structure and preparation method thereof |
| TW106129359A TWI665421B (en) | 2017-08-18 | 2017-08-29 | Heat dissipation structur and method for making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710714035.5A CN109413932A (en) | 2017-08-18 | 2017-08-18 | Radiator structure and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109413932A true CN109413932A (en) | 2019-03-01 |
Family
ID=65463318
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710714035.5A Pending CN109413932A (en) | 2017-08-18 | 2017-08-18 | Radiator structure and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109413932A (en) |
| TW (1) | TWI665421B (en) |
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| CN111234781A (en) * | 2020-01-19 | 2020-06-05 | 广州视源电子科技股份有限公司 | Heat-conducting and heat-storing phase change plate and preparation method thereof |
| CN111836505A (en) * | 2019-04-15 | 2020-10-27 | 辰展股份有限公司 | Thermal phase change heat storage module |
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| US20020033250A1 (en) * | 2000-09-21 | 2002-03-21 | Chia-Chin Chuang | Heat conductive apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI665421B (en) | 2019-07-11 |
| TW201913027A (en) | 2019-04-01 |
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Application publication date: 20190301 |