CN111234781A - Heat-conducting and heat-storing phase change plate and preparation method thereof - Google Patents
Heat-conducting and heat-storing phase change plate and preparation method thereof Download PDFInfo
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Abstract
The invention relates to the technical field of heat dissipation, and provides a heat-conducting heat-storage phase change plate and a preparation method thereof, wherein the heat-conducting heat-storage phase change plate comprises a phase change plate shell and a phase change composite material, a closed cavity is defined by the phase change plate shell, the phase change composite material is filled in the cavity, the phase change plate shell is made of a heat-conducting material, and the phase change composite material comprises the following raw material components in parts by weight: 600 parts of phase change material, 250 parts of heat conducting filler, 0-80 parts of base material, 0-15 parts of coupling agent and 0-3 parts of heat stabilizer. The heat-conducting heat-storage phase change plate has the advantages of high phase change latent heat, large heat conductivity coefficient, good durability, no toxicity or corrosion to electronic components, easy cleaning and repair, good interface compatibility, low manufacturing cost, simple formula and convenient use.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a heat conduction and storage phase change plate and a preparation method thereof.
Background
With the rapid development of electronic integration technology, electronic devices are developing toward miniaturization and light weight, and the integration level of systems is higher and higher. On the other hand, in the application of high-power components in electronic equipment, the heat power consumption is increased sharply, and the generated heat is not sufficiently dissipated, so that the working performance and the service life of the product are directly influenced, and statistics shows that more than about 40% of reliability (service life) faults of electronic products are caused by temperature rise. With the advent of the 5G era, the heat dissipation task of electronic products becomes more severe, and how to effectively solve the heat dissipation problem has become a bottleneck in the further development of electronic technology.
Phase change materials are materials which give consideration to both phase change heat storage and high heat conduction. When the temperature reaches the phase-change softening point, the phase-change material is softened from a solid state or has a certain fluidity state, and a larger amount of energy is absorbed and released in the phase-change process, the energy is called phase-change latent heat, and the process is an isothermal or approximately isothermal process. Therefore, when the phase change material is applied to a thermal power consumption device in an electronic product, instantaneous thermal shock of the phase change material can be effectively resisted, namely overtemperature protection is provided for the electronic component through phase change heat storage, and the probability that the temperature rise of the electronic component exceeds the standard is reduced. The phase change heat conduction material has another important characteristic of having a heat conduction function, and in the formula of the phase change material, the heat conduction coefficient can be greatly improved by adding the heat conduction filler, so that heat generated by a heat power consumption device is effectively and quickly conducted out.
The phase-change material has large phase-change latent heat, high heat conductivity coefficient and good heat transfer and fluidity, but still has some defects at the application end:
(1) the durability of the phase-change material is that physical and chemical properties are easy to be degraded in the phase-change circulation process, thereby affecting the heat storage and heat conduction performance of the phase-change material. Some common heat-conducting phase-change materials in the market are easy to be dried and cracked in the process of using for a medium-long time;
(2) the pollution problem of the phase-change material to electronic components, because the phase-change material has certain flowability, the phase-change material is easy to leak from a matrix and immerse into gaps of the device, so that the device is polluted;
(3) the electronic components using the phase-change material are relatively difficult to repair, the phase-change material is fully filled in the surface and gaps of the wetted component, the wetted component is difficult to clean in the repair process, the electronic component is easy to damage, and the repair cost is greatly increased;
(4) the interface compatibility problem of the phase-change material and the electronic component is solved, the formula of the phase-change material relates to materials with multiple components, the difference of the expansion coefficients of the materials and the component is easy to cause the generation of internal stress, and meanwhile, the materials with various components have the risk of chemical reaction with the surface of the component, thereby greatly influencing the performance of the electronic component.
Disclosure of Invention
Based on the above, the embodiment of the invention provides a heat-conducting and heat-storing phase change plate which has the advantages of high phase change latent heat, large heat conductivity coefficient, good durability, no toxicity or corrosion to electronic components, easy cleaning and repair, good interface compatibility, low manufacturing cost, simple formula and convenient use.
In a first aspect, an embodiment of the present invention provides a heat conduction and storage phase change plate, including a phase change plate shell and a phase change composite material, where the phase change plate shell encloses a closed cavity, the phase change composite material is filled in the cavity, the phase change plate shell is made of a heat conduction material, and the phase change composite material includes the following raw material components in parts by weight:
furthermore, the heat conduction and storage phase change plate further comprises at least one adhesive layer, and the adhesive layer is arranged on the outer surface of the phase change plate shell. The arrangement of the adhesive layer can enable the heat-conducting and heat-storing phase change plate to be convenient to install and use, and the heat-conducting and heat-storing phase change plate can be directly attached to a heat power consumption device in an electronic product, and instantaneous thermal shock can be effectively resisted by utilizing the heat-conducting and heat-storing functions of the heat-conducting and heat-storing phase change plate, so that overtemperature protection is provided for electronic components, and the probability that the temperature rise of the electronic components exceeds the; when repairing, directly take away heat conduction heat accumulation phase change board can, need not to consider the problem that traditional phase change material is difficult to clear away at the in-process of repairing, greatly reduced the cost of repairing.
In a preferred embodiment, an adhesive layer is disposed on one surface of the phase change plate housing, and a radiation heat dissipation layer is disposed on the other surface of the phase change plate housing.
Further, the phase change plate shell is selected from one of copper material, aluminum material, titanium material or stainless steel, but is not limited thereto.
Preferably, the phase change material is at least one of paraffin, stearic acid, butyl stearate, trimethylolethane, polyethylene glycol, or a crystalline hydrated salt.
Preferably, the heat conductive filler is at least one of graphite, graphene, carbon nanotubes, carbon fibers, copper powder, aluminum oxide, aluminum nitride, silicon nitride, boron nitride, silicon carbide, magnesium oxide or silicon oxide.
Preferably, the matrix material is at least one of a thermoplastic or a thermoplastic rubber, such as at least one of optionally but not limited to silicone rubber, epoxy, silicone, natural rubber, neoprene, styrene butadiene rubber, or nitrile butadiene rubber; the coupling agent is selected from at least one of silane coupling agent, titanate and aluminate coupling agent; the heat stabilizer is at least one of lead stearate, calcium stearate, di-n-butyltin dilaurate, dibutyltin maleate monoester or dialkyltin dodecanethiolate.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a heat conduction and storage phase change plate, including the following steps:
s1: preparing a phase change plate shell, so that the phase change plate shell encloses a containing cavity, and reserving an opening on the phase change plate shell;
s2: adding a coupling agent into the heat-conducting filler, and uniformly mixing;
s3: putting the base material and the phase-change material into a kneader together according to the weight part ratio, adding the heat stabilizer and the heat-conducting filler treated by the coupling agent after uniformly mixing, continuously mixing, and finally vacuumizing to remove bubbles to obtain molten fluid;
s4: adding a molten fluid into the phase change plate shell through a reserved opening, filling 80-100% of the containing cavity, and then vacuumizing the unfilled containing cavity; and sealing the opening to obtain the heat conduction and heat storage phase change plate.
Preferably, the base material and the phase change material in S3 are heated and kneaded in a kneader at a temperature of 60-250 ℃ for 10-90min, and the heat conductive filler treated by the heat stabilizer and the coupling agent is added and then mixed for 10-90 min.
Further, after the step S4 closes the opening, the method further includes the steps of: carrying out single-sided or double-sided back gluing on the outer surface of the phase change plate shell to form at least one adhesive layer; when the surface of the phase change plate shell is subjected to single-side gum application, the other surface is applied with radiation heat dissipation coating to form a radiation heat dissipation layer.
In the formula of the traditional phase-change material, a matrix material with a certain weight part is required to be added to serve as a carrier of the phase-change composite material, and a plurality of necessary modification aids such as a heat stabilizer, a dispersing agent, a flame retardant, an antioxidant, a reinforcing agent, a plasticizer, a coupling agent, an anti-aging agent, an antifoaming agent, a curing agent and the like are required to be added to improve the comprehensive performance of the phase-change material, so that the ratio of the weight part of the phase-change material to the weight part of the phase-change composite material is greatly reduced, the phase-change enthalpy value is reduced, the formula cost is increased, the process.
According to the technical scheme of the embodiment of the invention, as the phase change composite material is sealed in the phase change plate shell, the phase change composite material has the following beneficial effects:
(1) the problem of leakage loss after the phase-change composite material reaches a phase-change softening point is not required to be considered, so that other auxiliary agents are few, the content of the phase-change material can be designed to be higher in proportion, larger phase-change latent heat is obtained, the heat storage performance is improved, meanwhile, a three-dimensional heat conduction network structure is constructed by adding a heat conduction filler, the heat conduction coefficient is effectively improved, and the heat transfer performance is enhanced;
(2) in the repeated phase change circulation process, the phase change composite material in the phase change plate shell is always in a relatively stable environment, does not exchange substances with the outside and does not precipitate small molecules, so that the condition that the conventional heat conduction phase change material is easy to dry and crack in the middle and long-term use process is avoided, and the problem of poor durability of the phase change composite material is effectively solved; meanwhile, the scheme also solves the problems that the phase-change material is easy to leak from the matrix after being softened and is immersed into the gap of the device, so that the device is polluted;
(3) the phase-change composite material is not in direct contact with the electronic components, so that the electronic components are easier to clean and repair, and the problem of interface compatibility of the electronic components and the electronic components is thoroughly avoided;
(4) the formula design of the phase-change composite material can be greatly simplified, auxiliary agents such as a reinforcing agent, a toughening agent, an anti-aging agent, a flame retardant or an antioxidant are not required to be added, the weight percentage of the components of the phase-change material can be greatly increased, the phase-change enthalpy retention rate (the ratio of the phase-change enthalpy of the phase-change composite material to the phase-change enthalpy of a pure phase-change material) is more than 90%, particularly in the preferable formula only adding the phase-change material and the heat-conducting filler, the phase-change enthalpy retention rate is more than 98%, the phase-change latent heat of the far-exceeding conventional phase-change composite material is obtained, the formula cost is reduced, and;
(5) tests show that the heat conduction and heat storage phase change plate disclosed by the embodiment of the invention still keeps stable heat conduction and heat storage functions after 5000 times of heat absorption and heat release circulation, and the performance value attenuation rate is extremely low, so that the heat conduction and heat storage phase change plate can be repeatedly used, and the comprehensive cost is lower;
(6) the heat conduction and heat storage phase change plate is particularly suitable for scenes that the single-point temperature rise of electronic components is too high and the heat dissipation space is insufficient, provides overtemperature protection for the electronic components, effectively and quickly conducts heat generated by a heat consumption device, and is beneficial to simplification and lightening of a heat dissipation structure of an electronic product.
Drawings
Fig. 1 is a schematic view of a heat conductive and heat storage phase change plate structure of embodiment 1;
FIG. 2 is a schematic diagram of the structure of the heat-conducting and heat-storing phase change plate of examples 2 to 4 and comparative examples 1 to 2;
FIG. 3 is a schematic view of a structure of a heat conductive and heat accumulating phase change plate of embodiment 5;
fig. 4 is a schematic view of the structure of the heat-conductive and heat-storage phase change plate of embodiment 6.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the following description. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example 1
The heat conduction and heat storage phase change plate of the embodiment is shown in fig. 1 and comprises a phase change plate shell 1 and a phase change composite material 2, wherein the phase change plate shell 1 encloses a closed containing cavity, the phase change composite material 2 is filled in the containing cavity, the phase change plate shell 1 is made of a copper material, and the phase change composite material 2 is composed of the following raw materials in parts by weight: 500 parts of phase change material refined paraffin, and 30 parts of heat conducting filler, namely alumina and graphene in weight ratio: 1 in total, 100 parts.
Example 2
The heat conduction and heat storage phase change plate of the embodiment is shown in fig. 2 and comprises a phase change plate shell 1 and a phase change composite material 2, wherein the phase change plate shell 1 encloses a closed containing cavity, the phase change composite material 2 is filled in the containing cavity, one surface of the phase change plate shell 1 is provided with an adhesive layer 3, the phase change plate shell 1 is made of a copper material, and the phase change composite material is composed of the following raw materials in parts by weight: 600 parts of phase change material refined paraffin, and 30 parts of heat conducting filler aluminum oxide, graphene and carbon nano tube by weight: 1: 1 in total, 100 parts.
Example 3
The heat conduction and heat storage phase change plate of the embodiment is shown in fig. 2 and comprises a phase change plate shell 1 and a phase change composite material 2, wherein the phase change plate shell 1 encloses a closed containing cavity, the phase change composite material 2 is filled in the containing cavity, one surface of the phase change plate shell 1 is provided with an adhesive layer 3, the phase change plate shell material is a copper material, and the phase change composite material is composed of the following raw materials in parts by weight: 60 parts of matrix material silicone rubber, 400 parts of phase change material refined paraffin, and 30 parts of heat conducting filler, namely alumina and graphene in weight ratio: 1, 8 parts of silane coupling agent and 2 parts of thermal stabilizer calcium stearate.
Example 4
The heat conduction and heat storage phase change plate of the embodiment is shown in fig. 2 and comprises a phase change plate shell 1 and a phase change composite material 2, wherein the phase change plate shell 1 encloses a closed containing cavity, the phase change composite material 2 is filled in the containing cavity, one surface of the phase change plate shell 1 is provided with an adhesive layer 3, the phase change plate shell 1 is made of a copper material, and the phase change composite material is composed of the following raw materials in parts by weight: 55 parts of nitrile rubber serving as a base material, 450 parts of refined paraffin serving as a phase change material, and 20 parts of boron nitride and expanded graphite serving as a heat-conducting filler in parts by weight: 160 parts of the mixture of 1, 7 parts of silane coupling agent and 1.5 parts of thermal stabilizer lead stearate.
Example 5
The heat conduction and heat storage phase change plate of the embodiment is shown in fig. 3, and comprises a phase change plate shell 1 and a phase change composite material 2, wherein the phase change plate shell 1 encloses a closed cavity, the phase change composite material 2 is filled in the closed cavity, two adhesive layers are arranged on the surface of the phase change plate shell 1, the two adhesive layers are respectively an adhesive layer 3 and an adhesive layer 4, the phase change plate shell 1 is made of a copper material, and the phase change composite material is composed of the following raw materials in parts by weight: 50 parts of matrix material chloroprene rubber, 400 parts of phase change material refined paraffin, silicon carbide as heat-conducting filler, carbon nano tube and graphene according to the weight ratio of 20: 1: 1, 9 parts of silane coupling agent and 2.5 parts of thermal stabilizer calcium stearate.
Example 6
The heat conduction and storage phase change plate of the embodiment, as shown in fig. 4, includes a phase change plate casing 1 and a phase change composite material 2, the phase change plate casing 1 encloses a closed cavity, the phase change composite material 2 is filled in the cavity, which occupies 80% of the cavity volume, one surface of the phase change plate casing 1 is provided with an adhesive layer 3, and the other surface is provided with a radiation heat dissipation layer 5. The phase change plate shell material is stainless steel, and the phase change composite material is composed of the following raw materials in parts by weight: 80 parts of matrix material epoxy resin, 300 parts of phase change material polyethylene glycol, silicon carbide as a heat conducting filler, and 5 parts of carbon nano tube and graphene in weight ratio: 1: 1, 15 parts of silane coupling agent and 3 parts of calcium stearate serving as a thermal stabilizer.
Example 7
The preparation method of the heat-conducting and heat-storing phase change plate in embodiment 1 comprises the following steps:
s1: preparing a copper-based phase change plate shell by a punch forming process, enclosing the phase change plate shell into a containing cavity, sealing and welding the rest edges after reserving one edge as an opening, repeatedly cleaning the shell by acetone, ethanol and deionized water, and drying the shell;
s2: mixing alumina and graphene according to a weight ratio of 30: 1, adding 100 parts of the mixture into absolute ethyl alcohol, wet-grinding for 60min, and drying in a vacuum oven at 60 ℃ for 30 min;
s3: putting 500 parts of refined paraffin and 100 parts of heat-conducting filler into a kneader, heating and kneading at 100 ℃ for 60min, then cooling to room temperature and kneading for 30min, and finally vacuumizing to remove bubbles to obtain molten fluid;
s4: and adding the molten fluid obtained in the step S3 into the copper phase change plate shell in the step S1 through a reserved opening, filling the whole shell, and then closing the opening to obtain the heat conduction and heat storage phase change plate.
Example 8
The preparation method of the heat-conducting and heat-storing phase change plate of embodiment 2 includes the following steps:
s1: preparing a copper-based phase change plate shell by a punch forming process, enclosing the phase change plate shell into a containing cavity, sealing and welding the rest edges after reserving one edge as an opening, repeatedly cleaning the shell by acetone, ethanol and deionized water, and drying the shell;
s2: mixing alumina, graphene and carbon nanotubes according to a weight ratio of 30: 1: 1, adding 100 parts of the mixture into absolute ethyl alcohol, wet-grinding for 60min, and drying in a vacuum oven at 60 ℃ for 30 min;
s3: placing 600 parts of refined paraffin and 100 parts of heat-conducting filler into a kneading machine, heating and kneading for 60min at the temperature of 100 ℃, then cooling to room temperature and kneading for 30min, and finally vacuumizing to remove bubbles to obtain molten fluid;
s4: and adding the molten fluid obtained in the step S3 into the copper phase change plate shell in the step S1 through a reserved opening, filling the whole shell, closing the opening, and carrying out single-side gum application on the outer surface of the phase change plate shell to form an adhesive layer 3 to obtain the heat conduction and storage phase change plate.
Example 9
The preparation method of the heat-conducting and heat-storing phase change plate of embodiment 3 includes the following steps:
s1: preparing a copper-based phase change plate shell by a punch forming process, enclosing the phase change plate shell into a containing cavity, sealing and welding the rest edges after reserving one edge as an opening, repeatedly cleaning the shell by acetone, ethanol and deionized water, and drying the shell;
s2: mixing alumina and graphene according to a weight ratio of 30: 1, adding 150 parts of the raw materials into absolute ethyl alcohol, wet-grinding for 60min, and drying in a vacuum oven at 60 ℃ for 30 min; subsequently, 8 parts of silane coupling agent is added into 150 parts of heat conducting filler and uniformly mixed;
s3: putting 60 parts of silicone rubber and 400 parts of refined paraffin into a kneader, heating and kneading for 60min at the temperature of 100 ℃, adding 2 parts of calcium stearate and 150 parts of heat-conducting filler treated by a coupling agent after uniformly mixing, continuously mixing for 60min, and finally vacuumizing to remove bubbles to obtain molten fluid;
s4: and adding the molten fluid obtained in the step S3 into the copper phase change plate shell in the step S1 through a reserved opening, filling the whole shell, closing the opening, and carrying out single-side gum application on the outer surface of the phase change plate shell to form an adhesive layer 3 to obtain the heat conduction and storage phase change plate 3.
Example 10
The preparation method of the heat-conducting and heat-storing phase change plate of embodiment 4 includes the following steps:
s1: preparing a copper-based phase change plate shell by a punch forming process, enclosing the phase change plate shell into a containing cavity, sealing and welding the rest edges after reserving one edge as an opening, repeatedly cleaning the shell by acetone, ethanol and deionized water, and drying the shell;
s2: mixing boron nitride and expanded graphite according to a weight ratio of 20: adding 160 parts of the heat-conducting filler mixture of 1 into absolute ethyl alcohol, wet-grinding for 60min, and drying in a vacuum oven at 60 ℃ for 40 min; then adding 7 parts of silane coupling agent into the heat-conducting filler, and uniformly mixing;
s3: putting 55 parts of nitrile rubber and 450 parts of refined paraffin into a kneader, heating and kneading for 60min at the temperature of 110 ℃, adding 1.5 parts of lead stearate and 160 parts of heat-conducting filler treated by a coupling agent after uniformly mixing, continuously mixing for 60min, and finally vacuumizing to remove bubbles to obtain molten fluid;
s4: and adding the molten fluid obtained in the step S3 into the copper phase change plate shell in the step S1 through a reserved opening, filling the whole shell, closing the opening, and carrying out single-side gum application on the outer surface of the phase change plate shell to form an adhesive layer 3 to obtain the heat conduction and storage phase change plate.
Example 11
The preparation method of the heat-conducting and heat-storing phase change plate of embodiment 5 includes the following steps:
s1: preparing a copper-based phase change plate shell by a punch forming process, enclosing the phase change plate shell into a containing cavity, sealing and welding the rest edges after reserving one edge as an opening, repeatedly cleaning the shell by acetone, ethanol and deionized water, and drying the shell;
s2: silicon carbide, carbon nano tubes and graphene are mixed according to the weight ratio of 20: 1: adding 180 parts of the heat-conducting filler mixture of 1 into absolute ethyl alcohol, wet-grinding for 60min, and drying in a vacuum oven at 60 ℃ for 30 min; then adding 9 parts of silane coupling agent into the heat-conducting filler, and uniformly mixing;
s3: putting 50 parts of chloroprene rubber and 400 parts of refined paraffin into a kneader, heating and kneading for 60min at the temperature of 120 ℃, adding 2.5 parts of calcium stearate and 180 parts of heat-conducting filler treated by a coupling agent after uniformly mixing, continuously mixing for 60min, and finally vacuumizing to remove bubbles to obtain molten fluid;
s4: and adding the molten fluid obtained in the step S3 into the copper phase change plate shell in the step S1 through a reserved opening, after the whole shell is filled with the molten fluid, closing the opening, and carrying out double-sided back gluing on the outer surface of the phase change plate shell to form an adhesive layer 3 and an adhesive layer 4 so as to obtain the heat conduction and heat storage phase change plate.
Example 12
The preparation method of the heat-conducting and heat-storing phase change plate of embodiment 6 includes the following steps:
s1: preparing a copper-based phase change plate shell by a punch forming process, enclosing the phase change plate shell into a containing cavity, sealing and welding the rest edges after reserving one edge as an opening, repeatedly cleaning the shell by acetone, ethanol and deionized water, and drying the shell;
s2: silicon carbide, carbon nano tubes and graphene are mixed according to the weight ratio of 5: 1: 1, adding 250 parts of the heat-conducting filler mixture into anhydrous ethanol, wet-grinding for 60min, and drying in a vacuum oven at 60 ℃ for 30 min; then adding 15 parts of silane coupling agent into the heat-conducting filler, and uniformly mixing;
s3: putting 80 parts of epoxy resin and 300 parts of polyethylene glycol into a kneader, heating and kneading for 60min at the temperature of 120 ℃, adding 3 parts of calcium stearate and 250 parts of heat-conducting filler treated by a coupling agent after uniformly mixing, continuously mixing for 60min, and finally vacuumizing to remove bubbles to obtain molten fluid;
s4: and adding the molten fluid obtained in the step S3 into the copper phase change plate shell in the step S1 through a reserved opening, filling 80% of the volume of the whole shell, vacuumizing the phase change plate shell, closing the opening, carrying out gum application on one surface of the outer surface of the phase change plate shell to form an adhesive layer 3, and coating a radiation heat dissipation material on the other surface of the phase change plate shell to form a radiation heat dissipation layer 5 to obtain the heat conduction and storage phase change plate.
Comparative example 1
The heat conduction and heat storage phase change plate of the comparative example comprises a phase change plate shell 1 and a phase change composite material 2, wherein the phase change plate shell 1 encloses a closed containing cavity, the phase change composite material 2 is filled in the containing cavity, one surface of the phase change plate shell 1 is provided with an adhesive layer 3, the phase change plate shell is made of copper materials, and the phase change composite material is 600 parts of pure phase change material refined paraffin.
The preparation method of the heat conduction and heat storage phase change plate comprises the following steps:
s1: preparing a copper-based phase change plate shell by a punch forming process, enclosing the phase change plate shell into a containing cavity, sealing and welding the rest edges after reserving one edge as an opening, repeatedly cleaning the shell by acetone, ethanol and deionized water, and drying the shell;
s2: heating 600 parts of refined paraffin to be molten;
s3: and adding the molten fluid obtained in the step S2 into the copper phase change plate shell in the step S1 through a reserved opening, filling the whole shell, closing the opening, and carrying out single-side gum application on the outer surface of the phase change plate shell to form an adhesive layer 3 to obtain the heat conduction and storage phase change plate.
Comparative example 2
The heat conduction and heat storage phase change plate of the comparative example is shown in fig. 2 and comprises a phase change plate shell 1 and a phase change composite material 2, wherein the phase change plate shell 1 encloses a closed containing cavity, the phase change composite material 2 is filled in the containing cavity, one surface of the phase change plate shell 1 is provided with an adhesive layer 3, the phase change plate shell is made of a copper material, and the phase change composite material is composed of the following raw materials in parts by weight: 400 parts of matrix material silicone rubber, 100 parts of phase change material refined paraffin, and 30 parts of heat conducting filler, namely alumina and graphene in weight ratio: 1, 8 parts of silane coupling agent and 2 parts of thermal stabilizer calcium stearate.
The preparation method of the heat conduction and heat storage phase change plate comprises the following steps:
s1: preparing a copper-based phase change plate shell by a punch forming process, enclosing the phase change plate shell into a containing cavity, sealing and welding the rest edges after reserving one edge as an opening, repeatedly cleaning the shell by acetone, ethanol and deionized water, and drying the shell;
s2: mixing alumina and graphene according to a weight ratio of 30: 1, adding 150 parts of the raw materials into absolute ethyl alcohol, wet-grinding for 60min, and drying in a vacuum oven at 60 ℃ for 40 min; then adding 8 parts of silane coupling agent into the heat-conducting filler, and uniformly mixing;
s3: placing 400 parts of silicone rubber and 100 parts of refined paraffin into a kneader, heating and kneading for 60min at the temperature of 100 ℃, adding 2 parts of calcium stearate and 150 parts of heat-conducting filler treated by a coupling agent after uniformly mixing, continuously mixing for 60min, and finally vacuumizing to remove bubbles to obtain molten fluid;
s4: and adding the molten fluid obtained in the step S3 into the copper phase change plate shell in the step S1 through a reserved opening, filling the whole shell, carrying out single-side gum application on the outer surface of the phase change plate shell to form an adhesive layer 3, and closing the opening to obtain the heat conduction and heat storage phase change plate.
Example 13
The performance test was performed on the newly prepared heat-conductive and heat-storage phase change plates of examples 1 to 6 and the heat-conductive and heat-storage phase change plates of comparative examples 1 to 2, and the performance test was performed on the heat-conductive and heat-storage phase change plates after the heat absorption and heat release cycles of 5000 times, respectively, and the test results are as follows:
TABLE 1 Performance test data for examples 1-6 and comparative examples 1-2 as prepared and after 5000 cycles of endothermic and exothermic cycles
As can be seen from table 1, the performance test data of the heat-conducting and heat-storing phase change plates of examples 1 to 6 and the heat-conducting and heat-storing phase change plates of comparative examples 1 to 2 are not changed much when the plates are just prepared and after 5000 times of heat absorption and heat release cycles; the heat conductivity coefficient of the heat conduction and storage phase change plates in the embodiments 1-6 is far higher than that of the comparative example 1 (the composite phase change material only contains pure phase change material); the phase change enthalpy retention rate of the heat-conducting and heat-storing phase change plates in the embodiments 1 to 6 is far higher than that of the comparative example 2 (the composite phase change material contains a large amount of matrix material by weight percentage). Therefore, the heat-conducting and heat-accumulating phase change plate has high phase change latent heat, large heat conductivity coefficient, stable performance and excellent durability; by simplifying the formula of the phase-change composite material, the weight percentage of the components of the phase-change material can be greatly increased, so that the retention rate of phase-change enthalpy is more than 90%, and the phase-change latent heat of a far-exceeding conventional phase-change composite material is obtained.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. A heat conduction and heat storage phase change plate is characterized in that: the phase change plate comprises a phase change plate shell and a phase change composite material, wherein a closed containing cavity is defined by the phase change plate shell, the phase change composite material is filled in the containing cavity, the phase change plate shell is made of a heat conducting material, and the phase change composite material comprises the following raw material components in parts by weight:
2. a heat conducting and storing phase change plate according to claim 1, wherein: the phase change plate is characterized by further comprising at least one adhesive layer, wherein the adhesive layer is arranged on the outer surface of the phase change plate shell.
3. A heat conducting and storing phase change plate according to claim 2, wherein: an adhesive layer is arranged on one surface of the phase change plate shell, and a radiation heat dissipation layer is arranged on the other surface of the phase change plate shell.
4. A heat conducting and storing phase change plate according to claim 1, wherein: the phase change plate shell is made of one of copper materials, aluminum materials, titanium materials or stainless steel.
5. A heat conducting and storing phase change plate according to claim 1, wherein: the phase-change material is at least one of paraffin, stearic acid, butyl stearate, trimethylolethane, polyethylene glycol or crystalline hydrated salt.
6. A heat conducting and storing phase change plate according to claim 1, wherein: the heat conducting filler is at least one of graphite, graphene, carbon nano tubes, carbon fibers, copper powder, aluminum oxide, aluminum nitride, silicon nitride, boron nitride, silicon carbide, magnesium oxide or silicon oxide.
7. A heat conducting and storing phase change plate according to claim 1, wherein: the base material is at least one of thermoplastic plastics or thermoplastic rubber; the coupling agent is selected from at least one of silane coupling agent, titanate and aluminate coupling agent; the heat stabilizer is at least one of lead stearate, calcium stearate, di-n-butyltin dilaurate, dibutyltin maleate monoester or dialkyltin dodecanethiolate.
8. A preparation method of the heat conduction and storage phase change plate as claimed in any one of claims 1 to 7, characterized by comprising the following steps:
s1: preparing a phase change plate shell, so that the phase change plate shell encloses a containing cavity, and reserving an opening on the phase change plate shell;
s2: adding a coupling agent into the heat-conducting filler, and uniformly mixing;
s3: putting the base material and the phase-change material into a kneader together according to the weight part ratio, adding the heat stabilizer and the heat-conducting filler treated by the coupling agent after uniformly mixing, continuously mixing, and finally vacuumizing to remove bubbles to obtain molten fluid;
s4: adding a molten fluid into the phase change plate shell through a reserved opening, filling 80-100% of the containing cavity, and then vacuumizing the unfilled containing cavity; and sealing the opening to obtain the heat conduction and heat storage phase change plate.
9. The method of preparing a heat conductive and heat accumulating phase change sheet according to claim 8, wherein the matrix material and the phase change material are heated and kneaded in a kneader at a temperature of 60 to 250 ℃ for 10 to 90min, and the heat conductive filler treated with the heat stabilizer and the coupling agent is added and then mixed for 10 to 90 min.
10. The method for preparing a heat-conducting and heat-storing phase change plate according to claim 8, wherein after the step of S4 closing the opening, the method further comprises the following steps: carrying out single-sided or double-sided back gluing on the outer surface of the phase change plate shell to form at least one adhesive layer; when the surface of the phase change plate shell is subjected to single-side gum application, the other surface is applied with radiation heat dissipation coating to form a radiation heat dissipation layer.
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