CN103476223A - Phase change heat dissipation device - Google Patents
Phase change heat dissipation device Download PDFInfo
- Publication number
- CN103476223A CN103476223A CN2012101879394A CN201210187939A CN103476223A CN 103476223 A CN103476223 A CN 103476223A CN 2012101879394 A CN2012101879394 A CN 2012101879394A CN 201210187939 A CN201210187939 A CN 201210187939A CN 103476223 A CN103476223 A CN 103476223A
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- cavity
- phase
- heater element
- change heat
- heat sink
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Abstract
A phase change heat dissipation device is used to carry out heat dissipation on a heating element. The device comprises a cavity and a working medium arranged in the cavity. The working medium is a phase change insulation substance which is in a solid state at a normal temperature. The cavity accommodates the heating element. Compared to the prior art, by using the device of the invention, the cavity of the phase change heat dissipation device accommodates the heating element and the working medium is the phase change insulation substance which is in the solid state at the normal temperature. Therefore, the working medium can be directly contacted with the heating element. During high load operation, the heat generated by the heating element is directly transferred to the working medium so that the working medium is liquefied and transient thermal storage is performed; and a speed of the heat which is conducted from an inner portion of the electronic apparatus to an outer shell is reduced; when the heating element is in a standby state or carries out low-load operation, the working medium is gradually cooled, releases the heat and continuously carries out heat transmission and exchange so that utilization efficiency is high.
Description
Technical field
The present invention relates to a kind of heat abstractor, relate in particular to a kind of heat abstractor that uses the phase change principle to distribute heat that electronic component produces.
Background technology
Electronic technology develops rapidly in recent years, the high frequency of electronic component, high-speed cruising and integrated circuit intensive and microminiaturized, make electronic component continue in the course of the work to produce heat, therefore need to attach at the electronic component place heat abstractor, the heat produced when electronic component is worked is taken away, to guarantee the steady running of electronic component energy.
Traditional radiating mode is the radiator that a metal material is set above heat-generating electronic elements, this radiator has pedestal, the pedestal lower surface contacts with electronic component, its upper surface is provided with some radiating fins, pedestal absorbs the heat that electronic component produces and also passes to radiating fin, by fin by dissipation of heat to surrounding air.But the electronic installation for some intermittent heavy-duty services, the time of its heavy-duty service is shorter, and the time of its standby or underrun is relatively long, therefore, the heat that during this kind of electronic installation heavy-duty service, heater element produces can reach in the air in electronic device shell via radiating fin at short notice, thereby cause the temperature of shell body too high at short notice, while making the staff operate, can produce sense of discomfort; And when standby or underrun, it is less and can't cause the shell body temperature to raise that heater element produces heat, now radiating fin is again less than sufficient utilization.Therefore, need further improve.
Summary of the invention
The present invention aims to provide and a kind ofly avoids electronic installation high load capacity when running shell body excess Temperature and the higher phase-change heat sink of utilization ratio when the electronic installation underload operates.
A kind of phase-change heat sink, in order to heater element heat radiation, it comprises a cavity and is arranged at the working media in described cavity, and described working media is for to present solid-state phase change megohmite insulant at normal temperature, and described cavity is accommodated described heater element.
Compared with prior art, in the present invention, the cavity cover of phase-change heat sink is established and is accommodated described heater element, and the working media in this cavity is for presenting at normal temperatures solid-state phase change material.During heavy-duty service, the heat that heater element produces can first be transferred to this working media, impel this working media liquefaction with the transient state heat accumulation, retarding heat is the speed to external shell by the electronic installation conducted inside, when making the heater element surface maintain in lower scope, avoid the temperature of external electronic device housing to raise too fast; When heater element standby or underrun, the working media release heat of lowering the temperature gradually, working media is proceeded transmission and the exchange of heat, and utilization ratio is higher.
The accompanying drawing explanation
The schematic perspective view of the phase-change heat sink that Fig. 1 is one embodiment of the invention.
The decomposing schematic representation of phase-change heat sink shown in Fig. 2 to Fig. 1.
The generalized section that Fig. 3 is phase-change heat sink shown in Fig. 1.
The main element symbol description
| Phase-change heat sink | 10 |
| |
20 |
| |
11 |
| |
12 |
| |
13 |
| Sidewall upper | 131 |
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14 |
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30 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below with reference to accompanying drawing, phase-change heat sink of the present invention is described in further detail.
Please consult Fig. 1 to Fig. 3 simultaneously, the phase-change heat sink 10 of the present invention's one preferred embodiment, for the heater element 20 in the electronic installation (not shown) is dispelled the heat, it comprises a upper cover 11, a lower cover 12 relative with this upper cover 11 and is arranged at the working media 30 between this upper cover 11 and lower cover 12.
Concrete, this upper cover 11 is tabular substantially with lower cover 12, and these upper cover 11 sizes are slightly larger than lower cover 12 sizes, and described lower cover 12 peripheries extend upward and form sidewall 13, and sidewall 13 upper limbs are bent to form sidewall upper 131 laterally.Conflict this sidewall upper 131 and coordinate the cavity 14 that forms sealing with this lower cover 12 in these upper cover 11 edges.Described upper cover 11, lower cover 12 and sidewall 13 all adopt preferably material of conductibility, as the metals such as aluminium, copper are made.Understandable, described upper cover 11, lower cover 12 can be the plate body of other element (not shown) of the external shell of electronic installation or electronic installation inside.
This working media 30 is arranged in this cavity 14, this working media 30 is for presenting at normal temperatures solid-state megohmite insulant, it can be liquefied as liquid under certain temperature environment, this working media 30 is phase-transition material, between the maximum temperature can bear when the surface temperature of its fusing point when heater element 20 standbies/underrun and heater element 20 heavy-duty service, as crystalline hydrate salt, organic acid or ester class etc.
During work, described heater element 20 forms and is electrically connected by other elements in printed circuit board (PCB) or wire and electronic installation, and these cavity 14 covers are established and accommodated described heater element 20, and in the present embodiment, this heater element 20 is positioned on this lower cover 12.During work, heater element 20 produce heats and by the heat fast transfer to working media 30, near the working media 30 of heater element 20 due to the liquefaction of being heated recently and gradually of distance thermal source, then producing thermal convection makes relatively away from heater element 20, the liquefaction of also being heated gradually of the working media 30 of contiguous cavity 14 inwalls, it is final when all working medium 30 all becomes liquid state, heat just can be passed to the inwall of cavity 14, thereby reach the effect of transient state heat accumulation, retarding heat is the speed to external shell by the electronic installation conducted inside, when the surface of assurance heater element 20 maintains in lower temperature range, avoid the temperature of external electronic device housing to raise too fast, and reduce the sense of discomfort of staff while operating.While making the calorific capacity of heater element 20 be less than external shell to extraneous heat-sinking capability when the running of electronic installation standby or underload, working media 30 release heat of lowering the temperature gradually, carry out transient state heat accumulation next time thereby be cured to gradually solid-state preparing against, recycle to reach.In the process of above-mentioned high load capacity running and standby/underrun, working media 30 is all in the transmission of carrying out heat and exchange, and as heat eliminating medium, the utilization ratio of this working media 30 is higher.Due to the insulating properties of working media 30, it can't affect the operating characteristic of this heater element 20 when impelling heater element 20 surface temperatures evenly to reduce.
Understandable, when heater element 20 is equipped with the circuit board (not shown), described circuit board can be contained in this cavity 14.Above-mentioned upper cover 11, lower cover 12 are not limited to tabular, also can be other shapes, as triangular prism shape etc.The shape of this working media 30 can be carried out corresponding change according to the shape that forms cavity 14, as long as reach, is contained in this cavity 14.
Compared with prior art, in the present invention, the cavity 14 of phase-change heat sink 10 is accommodated described heater element 20, and the working media 30 in this cavity 14 is for presenting at normal temperatures solid-state phase change megohmite insulant.Therefore, this working media 30 can directly contact with heater element 20, during heavy-duty service, the heat that heater element 20 produces can first directly be transferred to this working media 30, impel these working media 30 liquefaction with the transient state heat accumulation, retarding heat is the speed to external shell by the electronic installation conducted inside, when making heater element 20 surfaces maintain in lower scope, avoids the temperature of external electronic device housing to raise too fast; When heater element 20 standbies or underrun, working media 30 release heat of lowering the temperature gradually, working media 30 is proceeded transmission and the exchange of heat, and utilization ratio is higher.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (7)
1. a phase-change heat sink, in order to heater element is dispelled the heat, it comprises a cavity and is arranged at the working media in described cavity, and it is characterized in that: described working media is for to present solid-state phase change megohmite insulant at normal temperature, and described cavity is accommodated described heater element.
2. phase-change heat sink as claimed in claim 1, is characterized in that, described working media is crystalline hydrate salt, organic acid or ester class etc.
3. phase-change heat sink as claimed in claim 1, is characterized in that, described heater element is by printed circuit board (PCB) or wire and extraneous power supply formation electric connection.
4. phase-change heat sink as claimed in claim 3, is characterized in that, described heater element is equipped with a printed circuit board (PCB), and described printed circuit board (PCB) is contained in described cavity.
5. phase-change heat sink as claimed in claim 1, is characterized in that, it comprises a upper cover and a lower cover relative with this upper cover, and described working media is arranged between this upper cover and lower cover.
6. phase-change heat sink as claimed in claim 5, is characterized in that, the bending of described lower cover periphery extends upward the formation sidewall, and described cover rim this sidewall upper of conflicting coordinates this cavity of formation with this lower cover.
7. phase-change heat sink as claimed in claim 5, is characterized in that, described heater element is positioned under this and covers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101879394A CN103476223A (en) | 2012-06-08 | 2012-06-08 | Phase change heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101879394A CN103476223A (en) | 2012-06-08 | 2012-06-08 | Phase change heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103476223A true CN103476223A (en) | 2013-12-25 |
Family
ID=49800869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101879394A Pending CN103476223A (en) | 2012-06-08 | 2012-06-08 | Phase change heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103476223A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764298A (en) * | 2014-12-18 | 2016-07-13 | 宏启胜精密电子(秦皇岛)有限公司 | Heat dissipation structure, manufacturing method therefor, and device employing heat dissipation structure |
| CN111234781A (en) * | 2020-01-19 | 2020-06-05 | 广州视源电子科技股份有限公司 | Heat-conducting and heat-storing phase change plate and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030178730A1 (en) * | 2002-02-08 | 2003-09-25 | Rumer Christopher L. | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN1942085A (en) * | 2005-09-30 | 2007-04-04 | 王坚 | Solid-liquid phase-changeable heat-absorbing protection of electric consumption heating component |
-
2012
- 2012-06-08 CN CN2012101879394A patent/CN103476223A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030178730A1 (en) * | 2002-02-08 | 2003-09-25 | Rumer Christopher L. | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN1942085A (en) * | 2005-09-30 | 2007-04-04 | 王坚 | Solid-liquid phase-changeable heat-absorbing protection of electric consumption heating component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764298A (en) * | 2014-12-18 | 2016-07-13 | 宏启胜精密电子(秦皇岛)有限公司 | Heat dissipation structure, manufacturing method therefor, and device employing heat dissipation structure |
| CN111234781A (en) * | 2020-01-19 | 2020-06-05 | 广州视源电子科技股份有限公司 | Heat-conducting and heat-storing phase change plate and preparation method thereof |
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Application publication date: 20131225 |