CN204906945U - Heat abstractor with damping nature - Google Patents
Heat abstractor with damping nature Download PDFInfo
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- CN204906945U CN204906945U CN201520508103.9U CN201520508103U CN204906945U CN 204906945 U CN204906945 U CN 204906945U CN 201520508103 U CN201520508103 U CN 201520508103U CN 204906945 U CN204906945 U CN 204906945U
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- heat
- graphite cake
- ceramic wafer
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Abstract
The utility model provides a heat abstractor with damping nature, its fan that need not to arrange can reach radiating purpose, is fit for the configuration and uses in power generating equipment. This heat abstractor contains: a ceramic plate, a graphite cake, an and heat radiation fins device. The top surface and the heat production source laminating of ceramic plate. This ceramic plate heat absorption is fast, exothermic fast, can absorb this heat fast and produce the produced heat in source. Top surface and this ceramic plate laminating of this graphite cake. This graphite cake heat conduction is fast, can derive the heat that contains in quick this ceramic plate. This heat radiation fins device and this graphite cake laminating. The heat conduction of this graphite cake is fast, can conduct the heat in this ceramic plate fast to this heat radiation fins device in to by each fin with heat dissipation in the air. The combination of this ceramic plate and graphite cake forms a heat conducting buffer zone, and has heat conducting damping nature between this heat source that produces and this heat radiation fins device.
Description
Technical field
The utility model relates to a kind of heat abstractor on heat transfer with buffer damping effect, and it is for the heat radiation aspect of high power electronic element, the high heat produced can be discharged rapidly, enable this electronic component maintain normal operation during electronic component work done.
Background technology
In much electrical equipment, all heat abstractor is set, discharges with the heat that high power electronic element in circuit is produced, avoid Yin Wendu too high and cause the breaking-up of electronic component.Such as: in many computer products, be provided with heat abstractor, discharge with the heat that CPU is produced.
Existing heat abstractor is mostly have radiating fin to carry out heat by conduction, and recycling fan assembly carries out air cooling operation to radiating fin.Heat abstractor in the streets also has and utilizes the cooling fluid in cooling water pipe to take away the heat of high power electronic element, but needs to carry out air cooling operation with fan to cooling water pipe.If the air cooling operation not having fan to provide, the heat of this radiating fin and this cooling water pipe has little time to dissipate, and this electronic component will be made to damage because of overheated intensification.
Use fan to accelerate heat radiation, can make in the body of dust access instruments.Dust accretions, on circuit, can affect heat radiation.Dust also can absorb moisture corrosion electronic circuit, or the short circuit of even meeting circuit for generating.Therefore in the electric equipment harsh to environmental requirement, should not fan be used dispel the heat.In other words, use fan to improve heat sinking benefit, the useful life of apparatus will inevitably be reduced.
At power source without when deceiving, use fan for cooling, still have the necessity of setting.If but also to arrange the mode of fan in a generating equipment, carry out cooling work to electronic component, the electric power that generating equipment produces can be consumed.So, the production capacity benefit of generating equipment is just reduced.So, only have the heat abstractor not needing power consumption, be only required for generating equipment.
Utility model content
The utility model main purpose is providing a kind of heat abstractor, and heat can be produced the heat sucking-off in source by rapidly, and rapidly dissipation in air, to produce to this heat the protective effect that source provides really cooling.
A utility model again object is providing a kind of heat abstractor, and drawn heat energy can be discharged by fast, and without the need to using fan for cooling, for a kind of without the need to providing the heat abstractor of electric power.
In order to reach the above object, the utility model provides a kind of heat abstractor with damping property, and it is characterized in that, it comprises:
One ceramic wafer, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast; Fitting in the end face of this ceramic wafer and the heat source that produces, and can draw this heat and produce the heat that produces of source;
One graphite cake, it is a plate face, and has excellent heat conductivity; Fitting in the bottom surface of the end face of this graphite cake and this ceramic wafer, and can be derived by the heat in this ceramic wafer fast; And,
One heat radiation fin device, the bottom surface laminating of itself and this graphite cake; Heat energy contained in this ceramic wafer can conduct in this heat radiation fin device by this graphite cake rapidly, and relies on each fin dissipation of this heat radiation fin device in air.
The described heat abstractor with damping property, wherein: the bottom surface of this ceramic wafer is not more than the end face of this graphite cake, and this ceramic wafer bottom surface end face that is complete and this graphite cake is fitted.
The described heat abstractor with damping property, wherein: it is high-power electronic component that this heat produces source.
The described heat abstractor with damping property, wherein: it is high power, high-frequency electronic switch that this heat produces source.
The described heat abstractor with damping property, wherein: it is high power, high-frequency automatic power switch that this heat produces source.
In order to reach the above object, the utility model also provides a kind of heat abstractor with damping property, and it is characterized in that, it comprises:
One graphite cake, it is a plate face, and has excellent heat conductivity; Fitting in the end face of this graphite cake and the heat source that produces, and can be derived by the heat that this heat generation source produces rapidly;
One ceramic wafer, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast; Fitting in the bottom surface of the end face of this ceramic wafer and this graphite cake, and can draw the heat that this graphite cake conducts fast; And,
One heat radiation fin device, the bottom surface laminating of itself and this ceramic wafer; Heat energy contained in this ceramic wafer can conduct in this heat radiation fin device rapidly, and relies on each fin dissipation of this heat radiation fin device in air.
The described heat abstractor with damping property, wherein: the bottom surface of this graphite cake is not more than the end face of this ceramic wafer, and this graphite cake bottom surface end face that is complete and this ceramic wafer is fitted.
The described heat abstractor with damping property, wherein: it is high-power electronic component that this heat produces source.
The described heat abstractor with damping property, wherein: it is high power, high-frequency electronic switch that this heat produces source.
The described heat abstractor with damping property, wherein: it is high power, high-frequency automatic power switch that this heat produces source.
The characteristic that heat absorption by means of described ceramic wafer is fast, heat release is fast, the heat that promptly source that produces produces by described heat takes out, to reduce the temperature that described heat produces source.By means of the characteristic that described graphite heat conducting is fast, promptly by the heat conduction of described ceramic wafer extremely described heat radiation fin device, and dissipation in atmosphere.
Accompanying drawing explanation
Fig. 1 is the structure chart of the utility model embodiment;
Fig. 2 is the structure chart of another embodiment of the utility model.
Description of reference numerals: 10-heat abstractor; 11-ceramic wafer; 12-graphite cake; 13-heat radiation fin device; 131-fin; 20-heat produces source; 30-heat abstractor; 31-graphite cake; 32-ceramic wafer; 33-heat radiation fin device; 331-fin.
Embodiment
Refer to Fig. 1.The heat abstractor 10 that the utility model discloses, it comprises: ceramic wafer 11, graphite cake 12 and a heat radiation fin device 13.Described ceramic wafer 11 is a plate face, and its end face and a heat produce source 20 and fit, and can draw this heat rapidly and produce the heat that produces of source 20.This heat generation source 20 is the high power electronic element in circuit, such as: electric crystal amasss body, high-frequency electronic switch, high-frequency power automatic transfer switch.This ceramic wafer 11 has the material behavior that heat absorption is fast, heat release (inhaling cold) is fast.Therefore, the heat that this heat generation source 20 produces can be absorbed by this ceramic wafer 11 rapidly, and reduces the temperature that this heat produces source 20 fast.
Described graphite cake 12 is a plate face, fits in the bottom surface of its end face and this ceramic wafer 11, and can draw heat contained in this ceramic wafer 11.This graphite cake has the fast material behavior of heat transfer.So, the heat conductivity of this graphite cake 12 can be relied on, the heat in this ceramic wafer 11 is derived fast.
Described heat radiation fin device 13 is fitted with the bottom surface of this graphite cake 12.By means of the characteristic that the heat transfer of this graphite cake 12 is fast, contained heat in this ceramic wafer 11 promptly can be conducted in this heat radiation fin device 13, and rely on each fin 131 of this heat radiation fin device 13, by heat dissipation in air.
The combination of foregoing ceramic plate and graphite cake, produces between source and this heat radiation fin device at this heat and forms a heat conducting buffer zone, and have heat conducting damping property.By means of the buffer damping of this ceramic wafer and graphite cake, make this heat produce between source (thermal source) with this heat radiation fin device (source of heat release) and form barrier on heat, make the remaining heat of this heat radiation fin device can not affect heat radiation, the cooling in this heat generation source.
The bottom surface of this ceramic wafer 11 is not more than the end face of this graphite cake 12, and this ceramic wafer 11 bottom surface end face that is complete and this graphite cake 12 is fitted.So, be conducive to this graphite cake 12 all sidedly the heat in this ceramic wafer 11 to be derived.
Described ceramic wafer 11 has splendid heat absorptivity, the heat that this heat generation source 20 produces can be absorbed fast, and reduce the temperature that this heat produces source 20, make this heat produce source 20 and can maintain normal operation.Heat in this ceramic wafer 11 can siphon away by this graphite cake 12 rapidly, and the thermal content in ceramic wafer 11 is reduced, and can draw the heat energy that this heat produces source 20 again.Heat in this graphite cake 12 can conduct to this heat radiation fin device 13 rapidly, and makes this graphite cake 12 fast cooling.By means of this ceramic wafer 11, this heat is produced to the fast endothermic in source 20, and the quick conductive of this graphite cake 12, and heat energy is conducted to fast this heat radiation fin device 13, then dissipation is in air.Also namely, this heat produce the heat that produces of source 20 only can the unidirectional quick conduction through this ceramic wafer 11, graphite cake 12, heat radiation fin device 13 and dissipation in air.
Figure 2 shows that the structure chart of another embodiment of the utility model.Heat abstractor 30 shown in this embodiment comprises: graphite cake 31, ceramic wafer 32 and a heat radiation fin device 33.This graphite cake 31 is a plate face, and its end face and a heat produce source 20 and fit, and the heat that this heat generation source 20 produces can be derived.This ceramic wafer 32 is a plate face, fits in the bottom surface of its end face and this graphite cake 31, and can draw the heat that this graphite cake 31 conducts fast.This heat radiation fin device 33 is fitted with the bottom surface of this ceramic wafer 32.This ceramic wafer 32 meeting Fast exothermic, conducts to rapidly by the heat energy contained by inside in this heat radiation fin device 33, and relies on each fin 331 dissipation of this heat radiation fin device 33 in air.Use the embodiment shown in Fig. 2, this heat produces source 20 must have good being electrically insulated property, to avoid leaking electricity because of graphite cake 31 tool conductivity.
The bottom surface of this graphite cake 31 is not more than the end face of this ceramic wafer 32, and this graphite cake 31 bottom surface end face that is complete and this ceramic wafer 32 is fitted.So, this ceramic wafer 32 can draw the heat that this graphite cake 31 conducts all sidedly.
Heat abstractor 10,30 of the present utility model, without the need to configuring radiator fan, just can ensure the quick dissipation of heat in atmosphere, meanwhile, can avoid dust because of fan in access instruments.For the Blast Furnace Top Gas Recovery Turbine Unit (TRT) treasuring electric power, any has nothing to do in the electricity consumption producing electric energy, is all considered waste.The radiator fan that traditional heat-dissipating device is equipped with is exactly a kind of device of wastes power.Therefore, heat abstractor 10,30 of the present utility model, for generating equipment, is one more preferably heat dissipation design.
To sum up institute is old, heat abstractor 10,30 provided by the utility model, for a kind of device without the need to using radiator fan just can reach proper heat reduction, heat absorption by means of this ceramic wafer 11,32 is fast, heat release is fast, and the thermal conductivity of this graphite cake 12,31 is good, and make heat leave this heat generation source 20 fast, to maintain the normal operation that this heat produces source 20.
More than illustrate the utility model just illustrative; and nonrestrictive, those of ordinary skill in the art understand, when not departing from the spirit and scope that claim limits; many amendments, change or equivalence can be made, but all will fall within protection range of the present utility model.
Claims (10)
1. have a heat abstractor for damping property, it is characterized in that, it comprises:
One ceramic wafer, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast; Fitting in the end face of this ceramic wafer and the heat source that produces, and can draw this heat and produce the heat that produces of source;
One graphite cake, it is a plate face, and has excellent heat conductivity; Fitting in the bottom surface of the end face of this graphite cake and this ceramic wafer, and can be derived by the heat in this ceramic wafer fast; And,
One heat radiation fin device, the bottom surface laminating of itself and this graphite cake; Heat energy contained in this ceramic wafer can conduct in this heat radiation fin device by this graphite cake rapidly, and relies on each fin dissipation of this heat radiation fin device in air.
2. the heat abstractor with damping property according to claim 1, is characterized in that, the bottom surface of this ceramic wafer is not more than the end face of this graphite cake, and this ceramic wafer bottom surface end face that is complete and this graphite cake is fitted.
3. the heat abstractor with damping property according to claim 1, is characterized in that, it is high-power electronic component that this heat produces source.
4. the heat abstractor with damping property according to claim 1, is characterized in that, it is high power, high-frequency electronic switch that this heat produces source.
5. the heat abstractor with damping property according to claim 1, is characterized in that, it is high power, high-frequency automatic power switch that this heat produces source.
6. have a heat abstractor for damping property, it is characterized in that, it comprises:
One graphite cake, it is a plate face, and has excellent heat conductivity; Fitting in the end face of this graphite cake and the heat source that produces, and can be derived by the heat that this heat generation source produces rapidly;
One ceramic wafer, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast; Fitting in the bottom surface of the end face of this ceramic wafer and this graphite cake, and can draw the heat that this graphite cake conducts fast; And,
One heat radiation fin device, the bottom surface laminating of itself and this ceramic wafer; Heat energy contained in this ceramic wafer can conduct in this heat radiation fin device rapidly, and relies on each fin dissipation of this heat radiation fin device in air.
7. the heat abstractor with damping property according to claim 6, is characterized in that, the bottom surface of this graphite cake is not more than the end face of this ceramic wafer, and this graphite cake bottom surface end face that is complete and this ceramic wafer is fitted.
8. the heat abstractor with damping property according to claim 6, is characterized in that, it is high-power electronic component that this heat produces source.
9. the heat abstractor with damping property according to claim 6, is characterized in that, it is high power, high-frequency electronic switch that this heat produces source.
10. the heat abstractor with damping property according to claim 6, is characterized in that, it is high power, high-frequency automatic power switch that this heat produces source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520508103.9U CN204906945U (en) | 2015-07-14 | 2015-07-14 | Heat abstractor with damping nature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520508103.9U CN204906945U (en) | 2015-07-14 | 2015-07-14 | Heat abstractor with damping nature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204906945U true CN204906945U (en) | 2015-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520508103.9U Expired - Fee Related CN204906945U (en) | 2015-07-14 | 2015-07-14 | Heat abstractor with damping nature |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764310A (en) * | 2016-04-29 | 2016-07-13 | 许继集团有限公司 | Relay protection device and functional plug-in thereof |
| CN106358418A (en) * | 2015-07-14 | 2017-01-25 | 徐夫子 | Radiating device with damping property |
-
2015
- 2015-07-14 CN CN201520508103.9U patent/CN204906945U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358418A (en) * | 2015-07-14 | 2017-01-25 | 徐夫子 | Radiating device with damping property |
| CN105764310A (en) * | 2016-04-29 | 2016-07-13 | 许继集团有限公司 | Relay protection device and functional plug-in thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151223 Termination date: 20200714 |
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| CF01 | Termination of patent right due to non-payment of annual fee |