CN106358418A - Heat sink with damping properties - Google Patents

Abstract

The invention provides a heat dissipation device with damping property, which can achieve the purpose of heat dissipation without matching with a fan and is suitable for being configured in power generation equipment. The heat dissipating double-fuselage includes: a ceramic plate, a graphite plate, and a heat sink fin device. The top surface of the ceramic plate is attached to a heat generating source. The ceramic plate has the advantages of quick heat absorption and quick heat release, and can quickly absorb the heat generated by the heat generation source. The top surface of the graphite plate is attached to the ceramic plate. The graphite plate has fast heat conduction and can lead out the heat contained in the ceramic plate fast. The heat dissipation fin device is attached to the graphite plate. The graphite plate has fast heat conduction, can quickly conduct the heat in the ceramic plate to the heat dissipation fin device, and dissipates the heat in the air by the fins. The combination of the ceramic plate and graphite plate provides a buffer zone for thermal conduction between the heat generating source and the fin means, thereby providing a damping property for thermal conduction.

Description

Heat sink with damping properties

technical field

The invention relates to a heat dissipation device with a buffering and damping function in heat conduction, which is used in the heat dissipation of high-power electronic components, and can quickly discharge the high heat generated when the electronic components perform work, so that the electronic components can maintain normal operation.

Background technique

Heat dissipation devices are installed in many electrical appliances to discharge the heat generated by high-power electronic components in the circuit and avoid damage to electronic components due to excessive temperature. For example: many computer products are provided with cooling devices to discharge the heat generated by the CPU.

Most of the existing heat dissipation devices have heat dissipation fins to conduct heat, and then use the fan device to perform air cooling operation on the heat dissipation fins. The cooling devices in the market also use the cooling liquid in the cooling pipe to take away the heat of the high-power electronic components, but it is still necessary to use a fan to perform air cooling on the cooling pipe. If there is no air-cooling operation provided by the fan, the heat of the heat dissipation fins and the cooling pipe cannot be dissipated in time, and the electronic components will be damaged due to overheating.

Using a fan to accelerate heat dissipation will cause dust to enter the body of the device. Dust accumulates on the circuit, which affects heat dissipation. Dust can also absorb moisture and corrode electronic circuits, or occasionally short circuits may occur. Therefore, in electrical equipment with strict environmental requirements, it is not suitable to use fans to dissipate heat. In other words, using a fan to improve cooling efficiency will inevitably reduce the service life of the device.

When the power source is safe, it is necessary to use a fan to cool down. However, if a fan is also installed in a power generation device to cool down the electronic components, the power generated by the power generation device will be consumed. In this way, the production efficiency of the power generation equipment is reduced. Therefore, only cooling devices that do not consume electricity are needed for power generation equipment.

Contents of the invention

The main purpose of the present invention is to provide a heat dissipation device, which can quickly absorb the heat from the heat generating source and quickly dissipate it in the air, so as to provide protection for the heat generating source from cooling down.

Another object of the present invention is to provide a heat dissipation device that can quickly discharge absorbed heat energy without using a fan to cool down, and is a heat dissipation device that does not need to provide power.

In order to achieve the above object, the present invention provides a heat dissipation device with damping properties, which is characterized in that it comprises:

A ceramic plate, which is a plate surface, and has the characteristics of fast heat absorption and heat release; the top surface of the ceramic plate is bonded to a heat generating source, and can absorb the heat generated by the heat generating source;

A graphite plate, which is a plate surface, and has excellent thermal conductivity; the top surface of the graphite plate is attached to the bottom surface of the ceramic plate, so that the heat in the ceramic plate can be quickly exported; and,

A heat dissipation fin device, which is attached to the bottom surface of the graphite plate; the graphite plate can quickly conduct the heat energy contained in the ceramic plate to the heat dissipation fin device, and rely on the fins of the heat dissipation fin device The flakes dissipate in the air.

The heat dissipation device with damping properties, wherein: the bottom surface of the ceramic plate is not larger than the top surface of the graphite plate, and the bottom surface of the ceramic plate is completely attached to the top surface of the graphite plate.

The heat dissipation device with damping properties, wherein: the heat generating source is a high-power electronic component.

The heat dissipation device with damping properties, wherein: the heat generation source is a high-power, high-frequency electronic switch.

The heat dissipation device with damping properties, wherein: the heat generating source is a high-power, high-frequency power automatic switching switch.

In order to achieve the above object, the present invention also provides a heat dissipation device with damping properties, which is characterized in that it comprises:

A graphite plate, which is a plate surface, and has excellent thermal conductivity; the top surface of the graphite plate is bonded to a heat generating source, so that the heat generated by the heat generating source can be quickly exported;

A ceramic plate, which is a plate surface, and has the characteristics of fast heat absorption and rapid heat release; the top surface of the ceramic plate is attached to the bottom surface of the graphite plate, and can quickly absorb the heat conducted by the graphite plate; and ,

A heat dissipation fin device, which is attached to the bottom surface of the ceramic plate; the heat energy contained in the ceramic plate will be quickly conducted into the heat dissipation fin device, and dissipated in the air by virtue of the fins of the heat dissipation fin device middle.

The heat dissipation device with damping properties, wherein: the bottom surface of the graphite plate is not larger than the top surface of the ceramic plate, and the bottom surface of the graphite plate is completely attached to the top surface of the ceramic plate.

The heat dissipation device with damping properties, wherein: the heat generating source is a high-power electronic component.

The heat dissipation device with damping properties, wherein: the heat generation source is a high-power, high-frequency electronic switch.

The heat dissipation device with damping properties, wherein: the heat generating source is a high-power, high-frequency power automatic switching switch.

By virtue of the fast heat absorption and fast heat release characteristics of the ceramic plate, the heat generated by the heat generation source is quickly taken out to reduce the temperature of the heat generation source. By virtue of the fast heat conduction property of the graphite, the heat of the ceramic plate is rapidly conducted to the heat dissipation fin device and dissipated in the air.

Description of drawings

Fig. 1 is a structural diagram of an embodiment of the present invention;

Fig. 2 is a structural diagram of another embodiment of the present invention.

Explanation of reference signs: 10-radiating device; 11-ceramic plate; 12-graphite plate; 13-radiating fin device; 131-fin; 20-heat generation source; 30-radiating device; 31-graphite plate; 32- Ceramic plate; 33-radiating fin device; 331-fin.

detailed description

See Figure 1. The heat dissipation device 10 disclosed in the present invention includes: a ceramic plate 11 , a graphite plate 12 , and a heat dissipation fin device 13 . The ceramic board 11 is a board surface, and its top surface is attached to a heat generating source 20 so as to quickly absorb the heat generated by the heat generating source 20 . The heat generating source 20 is a high-power electronic component in the circuit, for example: a transistor body, a high-frequency electronic switch, and a high-frequency power automatic switching switch. The ceramic plate 11 has material properties of fast heat absorption and heat release (cold absorption). Therefore, the heat generated by the heat generating source 20 is quickly absorbed by the ceramic board 11 , and the temperature of the heat generating source 20 is rapidly reduced.

The graphite plate 12 is a plate surface, and its top surface is attached to the bottom surface of the ceramic plate 11 to absorb the heat contained in the ceramic plate 11 . The graphite plate has material properties of fast heat conduction. Therefore, the heat in the ceramic plate 11 can be rapidly dissipated by virtue of the thermal conductivity of the graphite plate 12 .

The heat dissipation fin device 13 is bonded to the bottom surface of the graphite plate 12 . By virtue of the fast heat conduction characteristics of the graphite plate 12, the heat contained in the ceramic plate 11 can be rapidly transferred to the cooling fin device 13, and by virtue of the fins 131 of the cooling fin device 13, the heat is dissipated. Dissipated in the air.

The above-mentioned combination of the ceramic plate and the graphite plate forms a thermal conduction buffer zone between the heat generating source and the heat dissipation fin device, and has a heat conduction damping property. By virtue of the buffering and damping properties of the ceramic plate and the graphite plate, a thermal barrier is formed between the heat generating source (heat source) and the heat dissipation fin device (heat dissipation source), so that the heat remaining in the heat dissipation fin device does not It will affect the heat dissipation and cooling of the heat generation source.

The bottom surface of the ceramic plate 11 is not larger than the top surface of the graphite plate 12 , and the bottom surface of the ceramic plate 11 is completely attached to the top surface of the graphite plate 12 . In this way, it is beneficial for the graphite plate 12 to completely dissipate the heat in the ceramic plate 11 .

The ceramic plate 11 has excellent heat absorption, and can quickly absorb the heat generated by the heat generating source 20 to reduce the temperature of the heat generating source 20 so that the heat generating source 20 can maintain normal operation. The graphite plate 12 can quickly absorb the heat in the ceramic plate 11 , so that the heat content in the ceramic plate 11 is reduced, and can absorb the heat energy of the heat generating source 20 again. The heat in the graphite plate 12 is quickly transferred to the cooling fin device 13 , so that the temperature of the graphite plate 12 is rapidly cooled. With the rapid heat absorption of the heat generating source 20 by the ceramic plate 11 and the rapid heat conduction of the graphite plate 12, the heat energy is quickly transferred to the heat dissipation fin device 13, and then dissipated in the air. That is to say, the heat generated by the heat generating source 20 can only be dissipated in the air through the rapid conduction of the ceramic plate 11 , the graphite plate 12 , and the cooling fin device 13 in one direction.

Fig. 2 is a structural diagram of another embodiment of the present invention. The heat dissipation device 30 shown in this embodiment includes: a graphite plate 31 , a ceramic plate 32 , and a heat dissipation fin device 33 . The graphite plate 31 is a plate surface, and its top surface is bonded to a heat generating source 20 so as to dissipate the heat generated by the heat generating source 20 . The ceramic plate 32 is a plate surface, and its top surface is attached to the bottom surface of the graphite plate 31 so as to quickly absorb the heat conducted by the graphite plate 31 . The heat dissipation fin device 33 is attached to the bottom surface of the ceramic board 32 . The ceramic plate 32 will dissipate heat quickly, and quickly transfer the heat energy contained inside to the heat dissipation fin device 33 , and dissipate in the air through the fins 331 of the heat dissipation fin device 33 . Using the embodiment shown in FIG. 2 , the heat generating source 20 must have good electrical insulation to avoid electric leakage due to the conductivity of the graphite plate 31 .

The bottom surface of the graphite plate 31 is not larger than the top surface of the ceramic plate 32 , and the bottom surface of the graphite plate 31 is completely attached to the top surface of the ceramic plate 32 . In this way, the ceramic plate 32 can fully absorb the heat conducted by the graphite plate 31 .

The heat dissipation device 10, 30 of the present invention does not need to be equipped with a heat dissipation fan, so that heat can be quickly dissipated in the air, and at the same time, dust can be prevented from entering the device due to the fan. For power generation devices that cherish electric power, any power consumption that is not related to the generation of electric energy is considered a waste. The cooling fan equipped with traditional cooling devices is a device that wastes power. Therefore, the heat dissipation device 10, 30 of the present invention is a more ideal heat dissipation design for power generation equipment.

In summary, the heat dissipation device 10, 30 provided by the present invention is a device that can achieve normal heat dissipation without using a heat dissipation fan. By virtue of the fast heat absorption and heat release of the ceramic plates 11, 32, and the graphite The plates 12 , 31 have good thermal conductivity, so that the heat can quickly leave the heat generating source 20 to maintain the normal operation of the heat generating source 20 .

The above description is only illustrative of the present invention, rather than restrictive. Those of ordinary skill in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined in the claims, but All will fall within the protection scope of the present invention.

Claims (10)

1. a kind of heat abstractor with damping property is it is characterised in that it comprises:

One ceramic wafer, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast；The top surface of this ceramic wafer Fit with a heat generating source, and this heat produced by heat generating source can be drawn；

One graphite cake, it is a plate face, and has excellent heat conductivity；The top surface of this graphite cake and this pottery The bottom surface laminating of porcelain plate, and can be quickly by the heat derives in this ceramic wafer；And,

One heat radiation fin device, it is fitted with the bottom surface of this graphite cake；This graphite cake can be by this ceramic wafer Contained heat energy rapidly conducts to this heat radiation fin device, and each fin by this heat radiation fin device Dissipate in the air.

2. the heat abstractor with damping property according to claim 1 is it is characterised in that this ceramic plate Bottom surface be not more than the top surface of this graphite cake, and fitted with the top surface of this graphite cake completely in this ceramic plate bottom surface.

3. the heat abstractor with damping property according to claim 1 is it is characterised in that this heat produces Source of students is high-power electronic component.

4. the heat abstractor with damping property according to claim 1 is it is characterised in that this heat produces Source of students is high power, high-frequency electrical switch.

5. the heat abstractor with damping property according to claim 1 is it is characterised in that this heat produces Source of students is high power, high-frequency automatic power switch.

6. a kind of heat abstractor with damping property is it is characterised in that it comprises:

One graphite cake, it is a plate face, and has excellent heat conductivity；The top surface of this graphite cake and a heat Volume production source of students is fitted, and can be rapidly by this heat derives produced by heat generating source；

One ceramic plate, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast；The top surface of this ceramic wafer Fit with the bottom surface of this graphite cake, and can quickly draw the heat that this graphite cake is conducted；And,

One heat radiation fin device, it is fitted with the bottom surface of this ceramic wafer；Contained heat energy in this ceramic wafer can be fast Conduct fastly to this heat radiation fin device, and dissipate in the air by each fin of this heat radiation fin device.

7. the heat abstractor with damping property according to claim 6 is it is characterised in that this graphite cake Bottom surface be not more than the top surface of this ceramic wafer, and fitted with the top surface of this ceramic wafer completely in this graphite cake bottom surface.

8. the heat abstractor with damping property according to claim 6 is it is characterised in that this heat produces Source of students is high-power electronic component.

9. the heat abstractor with damping property according to claim 6 is it is characterised in that this heat produces Source of students is high power, high-frequency electrical switch.

10. the heat abstractor with damping property according to claim 6 is it is characterised in that this heat Generating source is high power, high-frequency automatic power switch.