CN106358418A - Radiating device with damping property - Google Patents
Radiating device with damping property Download PDFInfo
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- CN106358418A CN106358418A CN201510411558.3A CN201510411558A CN106358418A CN 106358418 A CN106358418 A CN 106358418A CN 201510411558 A CN201510411558 A CN 201510411558A CN 106358418 A CN106358418 A CN 106358418A
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- heat
- graphite cake
- damping property
- ceramic wafer
- top surface
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Abstract
The invention provides a radiating device with a damping property. The radiating device with the damping property is suitably configured in power generating equipment and capable of radiating without a fan. The radiating device with the damping property comprises a ceramic plate, a graphite plate and a radiating fin device, wherein the top surface of the ceramic plate fits a heat source, the top surface of the graphite plate fits the ceramic plate, and the radiating fin device fits the graphite plate. The radiating device with the damping property has the advantages that the ceramic plate is quick in absorption and release of heat and capable of absorbing the heat generated by the heat source quickly; the graphite plate is quick in heat conduction and capable of conducting the heat in the ceramic plate into the radiating fin device quickly, and fins are used for dissipating the heat into air; a heat conduction buffer area is formed between the heat source and the radiating fin device through combination of the ceramic plate and the graphite plate, and accordingly the radiating device has the heat conduction damping property.
Description
Technical field
The present invention relates to a kind of heat abstractor on conduction of heat with buffer damping effect, it is used for the radiating aspect of high power electronic element, can discharge rapidly produced hyperpyrexia during electronic component work done, make this electronic component be able to maintain that normal operation.
Background technology
Heat abstractor is all set in many electrical equipment, heat produced by high power electronic element in circuit is discharged, it is to avoid cause the breaking-up of electronic component because temperature is too high.For example: be provided with heat abstractor in many computer products, heat produced by cpu is discharged.
Existing heat abstractor is mostly to have radiating fin to conduct heat, recycles fan assembly to carry out air cooling operation to radiating fin.Heat abstractor in the streets also has the heat taking away high power electronic element using the coolant in cooling tube, but needs to carry out air cooling operation with fan to cooling tube.Operate without the air cooling that fan is provided, this radiating fin has little time to dissipate with the heat of this cooling tube, and this electronic component will be made to damage because of overheated intensification.
Accelerate radiating using fan, can make in the body of dust access instruments.Dust accretions, on circuit, can affect to radiate.Dust also can absorb moisture corrosion electronic circuit, or occasionally short circuit can occur.Therefore in the electrical equipment harsh to environmental requirement, should not be radiated using fan.In other words, improve heat sinking benefit using fan, the service life of apparatus will necessarily be reduced.
In the case of power source is no deceived, using fan for cooling, still there is the necessity of setting.But if in a generating equipment also in the way of arranging fan, electronic component is carried out with work of lowering the temperature, electric power produced by generating equipment can be consumed.So, just reduce the capacity benefit of generating equipment.So, only do not need the heat abstractor of consumption electric power, be only required for generating equipment.
Content of the invention
Main purpose of the present invention is providing a kind of heat abstractor, and the heat of heat generating source can rapidly be suctioned out by it, and rapidly dissipates in the air, so that this heat generating source is provided with the protective effect of cooling really.
Still a further object of the present invention is providing a kind of heat abstractor, and the heat energy drawn can quickly be discharged by it, and without using fan for cooling, for a kind of heat abstractor that need not provide electric power.
In order to reach the above object, the present invention provides a kind of heat abstractor with damping property it is characterised in that it comprises:
One ceramic wafer, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast；The top surface of this ceramic wafer is fitted with a heat generating source, and can draw this heat produced by heat generating source；
One graphite cake, it is a plate face, and has excellent heat conductivity；The top surface of this graphite cake is fitted with the bottom surface of this ceramic wafer, and can be quickly by the heat derives in this ceramic wafer；And,
One heat radiation fin device, it is fitted with the bottom surface of this graphite cake；This graphite cake can rapidly conduct contained heat energy in this ceramic wafer to this heat radiation fin device, and dissipates in the air by each fin of this heat radiation fin device.
The described heat abstractor with damping property, wherein: the bottom surface of this ceramic plate is not more than the top surface of this graphite cake, and fitted with the top surface of this graphite cake completely in this ceramic plate bottom surface.
The described heat abstractor with damping property, wherein: this heat generating source is high-power electronic component.
The described heat abstractor with damping property, wherein: this heat generating source is high power, high-frequency electrical switch.
The described heat abstractor with damping property, wherein: this heat generating source is high power, high-frequency automatic power switch.
In order to reach the above object, the present invention also provides a kind of heat abstractor with damping property it is characterised in that it comprises:
One graphite cake, it is a plate face, and has excellent heat conductivity；The top surface of this graphite cake is fitted with a heat generating source, and can be rapidly by this heat derives produced by heat generating source；
One ceramic plate, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast；The top surface of this ceramic wafer is fitted with the bottom surface of this graphite cake, and can quickly draw the heat that this graphite cake is conducted；And,
One heat radiation fin device, it is fitted with the bottom surface of this ceramic wafer；In this ceramic wafer, contained heat energy can rapidly conduct to this heat radiation fin device, and dissipates in the air by each fin of this heat radiation fin device.
The described heat abstractor with damping property, wherein: the bottom surface of this graphite cake is not more than the top surface of this ceramic wafer, and fitted with the top surface of this ceramic wafer completely in this graphite cake bottom surface.
The described heat abstractor with damping property, wherein: this heat generating source is high-power electronic component.
The described heat abstractor with damping property, wherein: this heat generating source is high power, high-frequency electrical switch.
The described heat abstractor with damping property, wherein: this heat generating source is high power, high-frequency automatic power switch.
By the characteristic that heat absorption is fast, heat release is fast of described ceramic wafer, promptly heat produced by described heat generating source is taken out, to reduce the temperature of described heat generating source.By the fast characteristic of described graphite heat conducting, promptly the heat of described ceramic wafer is conducted to described heat radiation fin device, and dissipate in atmosphere.
Brief description
Fig. 1 is the structure chart of the embodiment of the present invention；
Fig. 2 is the structure chart of another embodiment of the present invention.
Description of reference numerals: 10- heat abstractor；11- ceramic wafer；12- graphite cake；13- heat radiation fin device；131- fin；20- heat generating source；30- heat abstractor；31- graphite cake；32- ceramic wafer；33- heat radiation fin device；331- fin.
Specific embodiment
Refer to Fig. 1.Disclosed heat abstractor 10, it comprises: a ceramic wafer 11, a graphite cake 12 and a heat radiation fin device 13.Described ceramic wafer 11 is a plate face, and its top surface is fitted with a heat generating source 20, and can rapidly draw this heat produced by heat generating source 20.This heat generating source 20 is the high power electronic element in circuit, for example: electric crystal amasss body, altofrequency electrical switch, high-frequency power automatic transfer switch.This ceramic wafer 11 has the material behavior that heat absorption is fast, heat release (inhaling cold) is fast.Therefore, this heat produced by heat generating source 20 can rapidly be absorbed by this ceramic wafer 11, and quickly reduces the temperature of this heat generating source 20.
Described graphite cake 12 is a plate face, and its top surface is fitted with the bottom surface of this ceramic wafer 11, and can draw contained heat in this ceramic wafer 11.This graphite cake has the fast material behavior of conduction of heat.So, the heat conductivity of this graphite cake 12 can be relied on, the heat in this ceramic wafer 11 is quickly derived.
Described heat radiation fin device 13 is fitted with the bottom surface of this graphite cake 12.By the fast characteristic of the conduction of heat of this graphite cake 12, contained heat in this ceramic wafer 11 promptly can be conducted to this heat radiation fin device 13, and each fin 131 by this heat radiation fin device 13, heat is dissipated in the air.
Foregoing ceramic plate is combined with graphite cake, forms the buffer zone of a conduction of heat, and have the damping property of conduction of heat between this heat generating source and this heat radiation fin device.Buffer damping by this ceramic wafer and graphite cake, make the barrier being formed on heat between this heat generating source (thermal source) and this heat radiation fin device (source of heat release) so that the remaining heat of this heat radiation fin device does not interfere with the radiating of this heat generating source, cooling.
The bottom surface of this ceramic wafer 11 is not more than the top surface of this graphite cake 12, and is fitted with the top surface of this graphite cake 12 completely in this ceramic wafer 11 bottom surface.So, be conducive to this graphite cake 12 comprehensively by the heat derives in this ceramic wafer 11.
Described ceramic wafer 11 has splendid heat absorptivity, can quickly absorb this heat produced by heat generating source 20, and reduce the temperature of this heat generating source 20, make this heat generating source 20 be able to maintain that normal operation.Heat in this ceramic wafer 11 can rapidly be siphoned away by this graphite cake 12, so that the thermal content in ceramic wafer 11 is reduced, and can draw the heat energy of this heat generating source 20 again.Heat in this graphite cake 12 can rapidly conduct to this heat radiation fin device 13, and makes this graphite cake 12 fast cooling.By this fast endothermic to this heat generating source 20 for the ceramic wafer 11, and the quick conductive of this graphite cake 12, and heat energy is quickly conducted to this heat radiation fin device 13, then dissipate in the air.That is, this heat produced by heat generating source 20 only can unidirectional through this ceramic wafer 11, graphite cake 12, the quick conduction of heat radiation fin device 13 and dissipate in the air.
Fig. 2 show the structure chart of another embodiment of the present invention.Heat abstractor 30 shown in this embodiment comprises: a graphite cake 31, a ceramic wafer 32 and a heat radiation fin device 33.This graphite cake 31 is a plate face, and its top surface is fitted with a heat generating source 20, and can be by this heat derives produced by heat generating source 20.This ceramic plate 32 is a plate face, and its top surface is fitted with the bottom surface of this graphite cake 31, and can quickly draw the heat that this graphite cake 31 is conducted.This heat radiation fin device 33 is fitted with the bottom surface of this ceramic wafer 32.This ceramic wafer 32 meeting Fast exothermic, the heat energy contained by inside is rapidly conducted to this heat radiation fin device 33, and dissipates in the air by each fin 331 of this heat radiation fin device 33.Using the embodiment shown in Fig. 2, this heat generating source 20 must have good being electrically insulated property, to avoid because graphite cake 31 has electric conductivity leaking electricity.
The bottom surface of this graphite cake 31 is not more than the top surface of this ceramic wafer 32, and is fitted with the top surface of this ceramic wafer 32 completely in this graphite cake 31 bottom surface.So, this ceramic wafer 32 can comprehensively draw the heat that this graphite cake 31 is conducted.
The heat abstractor 10,30 of the present invention need not configure radiator fan, it is ensured that the quick dissipation of heat is in atmosphere, can avoid in dust access instruments because of fan meanwhile.For the TRT treasuring electric power, any independent of the electricity consumption producing electric energy, be all considered waste.Radiator fan provisioned in traditional heat-dissipating device is it is simply that a kind of device of waste electric power.Therefore, the heat abstractor 10,30 of the present invention, for generating equipment, is one kind more preferably heat dissipation design.
To sum up institute is old, heat abstractor 10,30 provided by the present invention, for a kind of device that just can reach proper heat reduction without using radiator fan, by this ceramic wafer 11,32 heat absorption is fast, heat release is fast, and the heat conductivity of this graphite cake 12,31 is good, and make heat quickly leave this heat generating source 20, to maintain the normal operation of this heat generating source 20.
Described above it is merely exemplary for the purpose of the present invention; and nonrestrictive, those of ordinary skill in the art understand, in the case of the spirit and scope being limited without departing from claim; can many modifications may be made, change or equivalent, but fall within protection scope of the present invention.
Claims (10)
1. a kind of heat abstractor with damping property is it is characterised in that it comprises:
One ceramic wafer, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast；The top surface of this ceramic wafer
Fit with a heat generating source, and this heat produced by heat generating source can be drawn；
One graphite cake, it is a plate face, and has excellent heat conductivity；The top surface of this graphite cake and this pottery
The bottom surface laminating of porcelain plate, and can be quickly by the heat derives in this ceramic wafer；And,
One heat radiation fin device, it is fitted with the bottom surface of this graphite cake；This graphite cake can be by this ceramic wafer
Contained heat energy rapidly conducts to this heat radiation fin device, and each fin by this heat radiation fin device
Dissipate in the air.
2. the heat abstractor with damping property according to claim 1 is it is characterised in that this ceramic plate
Bottom surface be not more than the top surface of this graphite cake, and fitted with the top surface of this graphite cake completely in this ceramic plate bottom surface.
3. the heat abstractor with damping property according to claim 1 is it is characterised in that this heat produces
Source of students is high-power electronic component.
4. the heat abstractor with damping property according to claim 1 is it is characterised in that this heat produces
Source of students is high power, high-frequency electrical switch.
5. the heat abstractor with damping property according to claim 1 is it is characterised in that this heat produces
Source of students is high power, high-frequency automatic power switch.
6. a kind of heat abstractor with damping property is it is characterised in that it comprises:
One graphite cake, it is a plate face, and has excellent heat conductivity；The top surface of this graphite cake and a heat
Volume production source of students is fitted, and can be rapidly by this heat derives produced by heat generating source；
One ceramic plate, it is a plate face, and has the characteristic that heat absorption is fast, heat release is fast；The top surface of this ceramic wafer
Fit with the bottom surface of this graphite cake, and can quickly draw the heat that this graphite cake is conducted；And,
One heat radiation fin device, it is fitted with the bottom surface of this ceramic wafer；Contained heat energy in this ceramic wafer can be fast
Conduct fastly to this heat radiation fin device, and dissipate in the air by each fin of this heat radiation fin device.
7. the heat abstractor with damping property according to claim 6 is it is characterised in that this graphite cake
Bottom surface be not more than the top surface of this ceramic wafer, and fitted with the top surface of this ceramic wafer completely in this graphite cake bottom surface.
8. the heat abstractor with damping property according to claim 6 is it is characterised in that this heat produces
Source of students is high-power electronic component.
9. the heat abstractor with damping property according to claim 6 is it is characterised in that this heat produces
Source of students is high power, high-frequency electrical switch.
10. the heat abstractor with damping property according to claim 6 is it is characterised in that this heat
Generating source is high power, high-frequency automatic power switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510411558.3A CN106358418A (en) | 2015-07-14 | 2015-07-14 | Radiating device with damping property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510411558.3A CN106358418A (en) | 2015-07-14 | 2015-07-14 | Radiating device with damping property |
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| Publication Number | Publication Date |
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| CN106358418A true CN106358418A (en) | 2017-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510411558.3A Pending CN106358418A (en) | 2015-07-14 | 2015-07-14 | Radiating device with damping property |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101652020A (en) * | 2009-09-04 | 2010-02-17 | 大连九久光电科技有限公司 | High heat radiating circuit substrate and manufacturing method thereof |
| CN201499421U (en) * | 2009-08-27 | 2010-06-02 | 英业达股份有限公司 | Shielding structure |
| CN104750206A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device and manufacturing method of heat radiation structure |
| CN204906945U (en) * | 2015-07-14 | 2015-12-23 | 徐夫子 | Heat abstractor with damping nature |
-
2015
- 2015-07-14 CN CN201510411558.3A patent/CN106358418A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201499421U (en) * | 2009-08-27 | 2010-06-02 | 英业达股份有限公司 | Shielding structure |
| CN101652020A (en) * | 2009-09-04 | 2010-02-17 | 大连九久光电科技有限公司 | High heat radiating circuit substrate and manufacturing method thereof |
| CN104750206A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device and manufacturing method of heat radiation structure |
| CN204906945U (en) * | 2015-07-14 | 2015-12-23 | 徐夫子 | Heat abstractor with damping nature |
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Application publication date: 20170125 |