CN201499421U - Shielding structure - Google Patents
Shielding structure Download PDFInfo
- Publication number
- CN201499421U CN201499421U CN2009201738031U CN200920173803U CN201499421U CN 201499421 U CN201499421 U CN 201499421U CN 2009201738031 U CN2009201738031 U CN 2009201738031U CN 200920173803 U CN200920173803 U CN 200920173803U CN 201499421 U CN201499421 U CN 201499421U
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- China
- Prior art keywords
- radiator
- spare part
- shielding construction
- pad
- electronics spare
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A shielding structure is arranged in an electronic device. The shielding structure comprises a first spacer and a second spacer that are made from insulating materials, wherein one side surface of the first spacer is attached to the radiator of the electronic device, and the second spacer is arranged on the other side surface of the first spacer. The second spacer is provided with an opening for receiving the electronic components of a circuit board and isolating electromagnetic waves generated by the electronic components.
Description
Technical field
The utility model is relevant for a kind of shielding construction, particularly a kind of shielding construction that has heat conduction and electromagnetic wave shielding function concurrently.
Background technology
Along with the fast development of electronic industry, make employed central processing unit in the Computing system (central processing unit, CPU) or the speed of service and the operational capability of other electronic building bricks such as little process chip constantly improve.When the Computing system is in the running status of full load; the heat energy that these electronic building bricks produced also increases thereupon; if this heat energy fails to distribute from electronic building brick timely; then can cause the paralysis crisis of Computing system; therefore, the heat dissipation problem that how to solve electronic building brick just becomes an important topic.
Industry is for the processing mode of electronic building brick heat dissipation problem at present, one radiator normally is installed on the heating face of electronic building brick, in air arround by radiator the heat energy that electronic building brick was produced being dissipated into, electronic building brick can be maintained in the normal operating temperature range.The radiating mode of this use radiator, generally be that the position corresponding to electronic building brick applies one deck thermal grease on radiator, a side that then radiator is coated with thermal grease is covered on the heating face of electronic building brick, utilize then a fixture with radiator pressure holding closely on electronic building brick, avoid radiator slippage or get loose on electronic building brick, so that effectively electronic building brick is dispelled the heat.
In this mode of electronic building brick being dispelled the heat by radiator, since electronic building brick when running except meeting produces a large amount of heat energy, also be accompanied by simultaneously electromagnetic generation, after the absorption of this electromagnetic wave via radiator, can be radiated to other electronic building brick of inside computer system again by radiator, and then cause the instability of computer system.Because the use of thermal grease only is to promote the heat conduction efficiency between radiator and the electronic building brick, and fail to provide simultaneously and isolate and/or lead and let out electromagnetic usefulness, therefore on the existing mode that electronic building brick is dispelled the heat, exist computer system to be subjected to electromagnetic interference (Electro MagneticInterference easily, EMI) problem, and then influence the overall operation usefulness of computer system.
The utility model content
In view of above problem, the utility model provides a kind of shielding construction, so as to improving existing radiator and the use of thermal grease in electronic installation, only can reduce the operational temperature of electronic building brick, but the problem of the electromagnetic interference of can't the insulating electron spare part being produced.
To achieve these goals, the utility model discloses a kind of shielding construction, be installed in the electronic installation, this electronic installation has a circuit board and a radiator, and this circuit board has at least one electronics spare part, this radiator is arranged on this electronics spare part, it is characterized in that, this shielding construction includes:
One heat exchange sheet has one first relative side and one second side, and this heat exchange sheet fits in this radiator with this first side; And
One electromagnetic wave shielding sheet is arranged on this second side of this heat exchange sheet, and this electromagnetic wave shielding sheet has an opening, and this electronics spare part is positioned at this opening, so as to isolating the electromagnetic wave that this electronics spare part is produced;
Wherein, this heat exchange sheet and this electromagnetic wave shielding sheet are an insulating material spare.
Above-mentioned shielding construction is characterized in that, this opening connects this electromagnetic wave shielding sheet.
Above-mentioned shielding construction is characterized in that, non-through this electromagnetic wave shielding sheet of this opening.
Above-mentioned shielding construction is characterized in that, this insulating material spare is graphite piece or ceramic member.
To achieve these goals, the utility model also discloses a kind of shielding construction, be installed in the electronic installation, this electronic installation has a circuit board and a radiator, and this circuit board has at least one electronics spare part, this radiator is arranged on this electronics spare part, it is characterized in that, this shielding construction includes:
One body, this body are an insulating material spare, and this body has one first relative side and one second side, and this body fits in this radiator with this first side; And
One opening is arranged on this second side of this body, and this electronics spare part is positioned at this opening, so as to isolating the electromagnetic wave that this electronics spare part is produced.
Above-mentioned shielding construction is characterized in that, this insulating material spare is graphite piece or ceramic member.
To achieve these goals, the utility model also discloses a kind of shielding construction, be installed in the electronic installation, this electronic installation has a circuit board and a radiator, and this circuit board has at least one electronics spare part, this radiator is arranged on this electronics spare part, it is characterized in that, this shielding construction includes:
One first pad has one first relative side and one second side, and this first pad fits in this radiator with this first side; And
One second pad is arranged on this second side of this first pad, and this second pad has an opening, and this electronics spare part is positioned at this opening, so as to isolating the electromagnetic wave that this electronics spare part is produced;
Wherein, this first pad and this second pad are an identical insulating material spare.
Above-mentioned shielding construction is characterized in that, this opening connects this second pad.
Above-mentioned shielding construction is characterized in that, non-through this second pad of this opening.
Above-mentioned shielding construction is characterized in that, this insulating material spare is graphite piece or ceramic member.
Effect of the present utility model is, disclosed shielding construction is to be arranged between the radiator and electronics spare part of electronic installation, when the electronics spare part comes into operation, the thermal energy conduction that can the electronics spare part be produced by the fin of shielding construction is to radiator, so as to reducing the operational temperature of electronics spare part, and by shielding construction coats and the insulating electron spare part is produced electromagnetic wave, can avoid this electromagnetic wave to overflow and be dissipated to other interior zone of electronic installation, or shielding comes from the electromagnetic interference that other electronic building brick produces.But by the characteristic of heat conductivity that shielding construction had and isolating electromagnetic, can effectively reduce or block the electromagnetic interference phenomenon that being arranged in the electronic installation, make electronic installation have stable operational effectiveness.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.
Description of drawings
Fig. 1 is for being provided with the schematic perspective view of circuit board and radiator in the electronic installation of the utility model first embodiment;
Fig. 2 is that the shielding construction of the utility model first embodiment is arranged at the perspective exploded view between circuit board and the radiator;
Fig. 3 is that the shielding construction of the utility model first embodiment is arranged at the side-looking decomposing schematic representation between circuit board and the radiator;
Fig. 4 connects the generalized section of second pad for the opening of second pad of the utility model first embodiment;
Fig. 5 is the generalized section of non-through second pad of opening of second pad of the utility model first embodiment;
Fig. 6 is that the shielding construction of the utility model first embodiment is arranged at the combination schematic diagram between circuit board and the radiator;
Fig. 7 is the perspective exploded view of the utility model second embodiment;
Fig. 8 is the side-looking decomposing schematic representation of the utility model second embodiment; And
Fig. 9 is the side-looking combination schematic diagram of the utility model second embodiment.
Wherein, Reference numeral
10 shielding constructions
11 first pads
111 first sides
112 second sides
12 second pads
121 openings
13 bodies
131 first sides
132 second sides
14 openings
20 electronic installations
21 circuit boards
211 electronics spare parts
212 location holes
213 crystal grain
22 radiators
221 radiating fins
222 fixed legs
223 holders
23 screws
Embodiment
Below in conjunction with accompanying drawing structural principle of the present utility model and operation principle are done concrete description:
See also Fig. 1 to Fig. 3, the disclosed shielding construction 10 of the utility model first embodiment is to be installed in the electronic installations 20 such as main frame or server, the heat energy that is produced when the running so as to the electronics spare parts 211 in the conduction electron device 20, to reduce the operational temperature of electronics spare part 211, simultaneously cover the electromagnetic wave that electronics spare part 211 is dispersed by shielding construction 10, can avoid this electromagnetic wave that other electronic building brick (not shown) in the electronic installation 20 is produced electromagnetic interference, to keep the overall operation usefulness of electronic installation 20.
Have a circuit board 21 and a radiator 22 in the electronic installation 20, circuit board 21 is attached in the electronic installation 20 with a plurality of screws 23, electrically be arranged to a few electronics spare part 211 on the circuit board 21, and, offer two location holes 212 respectively in position adjacent to electronics spare part 211 both sides.This electronics spare part 211 be a memory chip (memory chip), central processing unit (central processing unit, CPU) or chipset (chip set) can produce the electronic building brick of a large amount of heat energy when equaling to operate.Be to be that chipset is as illustrating in the present embodiment with electronics spare part 211.And on a side of these electronics spare part 211 relative radiators 22, has a chip (Die) 213.
To shown in Figure 4, shielding construction 10 comprises that the composition material of one first pad 11 and one second pad, 12, the first pads 11 and second pad 12 is to be selected from insulating material such as graphite or pottery, but does not exceed with above-mentioned insulating material as Fig. 2.And the material of first pad 11 and second pad 12 can be selected different insulating material for use, and one of them is a graphite as both, and another is a pottery; Or select identical insulating material for use, be all graphite or be all ceramic material as both and form.In the present embodiment, be to be that the heat exchange sheet formed of graphite material and second pad 12 are the electromagnetic wave shielding sheet formed of graphite material as illustrating with first pad 11, but not as limit.
As Fig. 3, Fig. 4 and shown in Figure 6, being provided with of shielding construction 10, be earlier shielding construction 10 to be positioned on the electronics spare part 211, make the chip 213 of electronics spare part 211 be positioned at the opening 121 of second pad 12, chip 213 is coated in the shielding construction 10 by formed accommodation space between first pad 11 and second pad 12.Then with corresponding respectively two location holes 212 that wear oversampling circuit plate 21 of two fixed legs 222 of radiator 22, the side that radiator 22 is equipped with fixed leg 222 is fitted on first side 111 of first pad 11, and in circuit board 21 with respect to the opposite side of radiator 22 fixed leg 222 with holder 223 clip radiators 22, to limit the ability that fixed leg 222 moves along location hole 212 radial direction in location hole 212, radiator 22 is fixedly arranged on the circuit board 21, and fits in closely on first side 111 of first pad 11.
Therefore, when electronics spare part 211 comes into operation, the heat energy that is produced by chip 213 will be passed on the radiator 22 via first pad, 11 heat conduction of shielding construction 10 or the mode of thermal radiation, and by the radiating fin 221 of radiator 22 and the heat exchange action of ambient air, the operational temperature of electronics spare part 211 is reduced, and be maintained in the temperature range that can operate, can avoid electronics spare part 211 to cause operational effectiveness situation low or that cause electronics spare part 211 to burn to take place because temperature is too high.
Simultaneously, when 211 runnings of electronics spare part, the electromagnetic wave that is exhaled by chip 213, can be subjected to shielding construction 10 second pad 12 absorption and/or stop, and be terminated in the shielding construction 10, can avoid other electronic building brick (not shown) in the electronic installation to be subjected to this electromagnetic interference, or be denial in outside the shielding construction 10 by the electromagnetic interference that shielding construction 10 will come from other electronic building brick, therefore make the operational effectiveness of electronics spare part 211 and electronic installation (not shown) and stability obtain to promote.
See also Fig. 7 to Fig. 9, be decomposition and the combination schematic diagram of the utility model second embodiment.Disclosed second embodiment of the utility model and first embodiment are structurally roughly the same, below only just between the two difference be illustrated.The disclosed shielding construction 10 of the utility model second embodiment includes a body 13 and an opening 14.Body 13 is made up of insulating material such as graphite or potteries, and body 13 has one first side 131 and one second side 132, and opening 14 is opened on second side 132.
When shielding construction 10 is positioned on the electronics spare part 211, shielding construction 10 is that second side 132 with body 13 is covered on electronics spare part 211, and, make chip 213 be subjected to the coating of body 13 and be hedged off from the outer world (as shown in Figure 9) with the chip 213 of opening 14 sheathed electronics spare parts 211.Then with corresponding respectively two location holes 212 that wear oversampling circuit plate 21 of two fixed legs 222 of radiator 22, make a side that radiator 22 is equipped with fixed leg 222 fit in first side 131 of body 13, then again in circuit board 21 with respect to the opposite side of radiator 22 fixed leg 222 with holder 223 clip radiators 22, radiator 22 is fixedly arranged on the circuit board 21, and fits in first side 131 of body 13 closely.
Therefore, when electronics spare part 211 comes into operation, the heat energy that is produced by chip 213 will be passed on the radiator 22 via the mode of body 13 with heat conduction or thermal radiation, and by the radiating fin 221 of radiator 22 and the heat exchange action of ambient air, electronics spare part 211 is maintained in the temperature range that can operate, and because chip 213 is subjected to the complete coating of body 13, make and stem from the electromagnetic wave that chip 213 is exhaled, absorbed by body 13 and/or stop, and be terminated in the shielding construction 10, can avoid other electronic building brick (not shown) in the electronic installation to be subjected to this electromagnetic interference, or be denial in outside the shielding construction 10 by the electromagnetic interference that body 13 will come from other electronic building brick, therefore promote the operational effectiveness and the stability of electronics spare part 211 and electronic installation.
The disclosed shielding construction of the utility model is to be arranged between the circuit board and radiator of electronic installation, and the electromagnetic wave that the electronics spare part is produced is isolated from the shielding construction by shielding construction, avoiding electromagnetic wave to overflow being dissipated to other zone in the electronic installation, and other electronic building brick is produced electromagnetic interference.Simultaneously, by the conduction of heat that shielding construction had, will come from thermal energy conduction that the running of electronics spare part the time produced to radiator, and by radiator with arround the heat exchange action of air, the operational temperature of electronics spare part is reduced, to keep the operational effectiveness of electronics spare part.
Therefore, the disclosed shielding construction of the utility model except the thermal energy transfer that the electronics spare part can be produced to radiator, and have the electromagnetic interference shielding action of isolating electromagnetic simultaneously.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.
Claims (10)
1. a shielding construction is installed in the electronic installation, and this electronic installation has a circuit board and a radiator, and this circuit board has at least one electronics spare part, and this radiator is arranged on this electronics spare part, it is characterized in that, this shielding construction includes:
One heat exchange sheet has one first relative side and one second side, and this heat exchange sheet fits in this radiator with this first side; And
One electromagnetic wave shielding sheet is arranged on this second side of this heat exchange sheet, and this electromagnetic wave shielding sheet has an opening, and this electronics spare part is positioned at this opening, so as to isolating the electromagnetic wave that this electronics spare part is produced;
Wherein, this heat exchange sheet and this electromagnetic wave shielding sheet are an insulating material spare.
2. shielding construction according to claim 1 is characterized in that this opening connects this electromagnetic wave shielding sheet.
3. shielding construction according to claim 1 is characterized in that, non-through this electromagnetic wave shielding sheet of this opening.
4. shielding construction according to claim 1 is characterized in that, this insulating material spare is graphite piece or ceramic member.
5. a shielding construction is installed in the electronic installation, and this electronic installation has a circuit board and a radiator, and this circuit board has at least one electronics spare part, and this radiator is arranged on this electronics spare part, it is characterized in that, this shielding construction includes:
One body, this body are an insulating material spare, and this body has one first relative side and one second side, and this body fits in this radiator with this first side; And
One opening is arranged on this second side of this body, and this electronics spare part is positioned at this opening, so as to isolating the electromagnetic wave that this electronics spare part is produced.
6. shielding construction according to claim 5 is characterized in that, this insulating material spare is graphite piece or ceramic member.
7. a shielding construction is installed in the electronic installation, and this electronic installation has a circuit board and a radiator, and this circuit board has at least one electronics spare part, and this radiator is arranged on this electronics spare part, it is characterized in that, this shielding construction includes:
One first pad has one first relative side and one second side, and this first pad fits in this radiator with this first side; And
One second pad is arranged on this second side of this first pad, and this second pad has an opening, and this electronics spare part is positioned at this opening, so as to isolating the electromagnetic wave that this electronics spare part is produced;
Wherein, this first pad and this second pad are an identical insulating material spare.
8. shielding construction according to claim 7 is characterized in that, this opening connects this second pad.
9. shielding construction according to claim 8 is characterized in that, non-through this second pad of this opening.
10. shielding construction according to claim 7 is characterized in that, this insulating material spare is graphite piece or ceramic member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201738031U CN201499421U (en) | 2009-08-27 | 2009-08-27 | Shielding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201738031U CN201499421U (en) | 2009-08-27 | 2009-08-27 | Shielding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201499421U true CN201499421U (en) | 2010-06-02 |
Family
ID=42442608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201738031U Expired - Fee Related CN201499421U (en) | 2009-08-27 | 2009-08-27 | Shielding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201499421U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992510A (en) * | 2014-09-03 | 2016-10-05 | 三星电机株式会社 | Shield Sheet |
| CN106358418A (en) * | 2015-07-14 | 2017-01-25 | 徐夫子 | Radiating device with damping property |
| CN107079609A (en) * | 2014-02-24 | 2017-08-18 | 三星电子株式会社 | Hardware shield equipment and the electronic equipment for including hardware shield equipment |
-
2009
- 2009-08-27 CN CN2009201738031U patent/CN201499421U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107079609A (en) * | 2014-02-24 | 2017-08-18 | 三星电子株式会社 | Hardware shield equipment and the electronic equipment for including hardware shield equipment |
| CN107079609B (en) * | 2014-02-24 | 2020-04-07 | 三星电子株式会社 | Hardware shielding device and electronic device comprising same |
| CN105992510A (en) * | 2014-09-03 | 2016-10-05 | 三星电机株式会社 | Shield Sheet |
| CN105992510B (en) * | 2014-09-03 | 2019-09-13 | 三星电机株式会社 | Shield piece |
| CN106358418A (en) * | 2015-07-14 | 2017-01-25 | 徐夫子 | Radiating device with damping property |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100602 Termination date: 20130827 |