CN105992510B - Shield piece - Google Patents
Shield piece Download PDFInfo
- Publication number
- CN105992510B CN105992510B CN201510094782.4A CN201510094782A CN105992510B CN 105992510 B CN105992510 B CN 105992510B CN 201510094782 A CN201510094782 A CN 201510094782A CN 105992510 B CN105992510 B CN 105992510B
- Authority
- CN
- China
- Prior art keywords
- groove
- electrically
- backing plate
- shielding piece
- conductive backing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of shielding pieces.The shielding piece of embodiment according to the present invention includes: the electrically-conductive backing plate for being configured for shielding EMI, the groove being formed on electrically-conductive backing plate, and the heat sink material of formation in a groove.
Description
Technical field
The present invention relates to shieldings piece (shield sheet).
Background technique
Because the heat generated in electronic device causes the failure of electronic device and electronic circuit, need for blocking
The EMI of EMI and the heat generated by electronic device shields piece.
The research and development of conventional shielding piece are concentrated mainly in EMI shielding so that heat sinking function is insufficient.In order to increase heat dissipation effect
Rate, different types of cooling fin are added to shielding piece.But this solution make shield piece thicken.
Additionally, there are another solutions that the material that will shield piece is mixed with conductive radiator filler, and caused by it
Vortex increases heat.
The prior art of the invention discloses in Korean Patent Publication No.10-2013-0108921
(ELECTROMAGNETIC WAVE SHIELD SHEET；In disclosure on October 7th, 2013).
Summary of the invention
One aspect according to an illustrative embodiment of the invention provides a kind of shielding piece, which includes being formed
Heat sink material in the groove of electrically-conductive backing plate.Shielding piece includes electrically-conductive backing plate, groove and heat sink material, and can be into one
Step includes radiating component, which is coupled to the side (side, side) of electrically-conductive backing plate.
Protruding portion can be formed on the side of electrically-conductive backing plate, and radiating component is formed on the upper surface of protruding portion.It is more
A protruding portion can be formed around the side of electrically-conductive backing plate.
Radiating component can be contacted with the heat sink material in groove, and radiating component may include beryllium oxide (BeO2), nitrogen
At least one of change aluminium (AlN), silicon carbide (SiC) and aluminium oxide.
Groove may include multiple first grooves and multiple second grooves.First groove and the second groove can form grid.It is recessed
The area of section of slot can reduce along towards the direction of the bottom of electrically-conductive backing plate.The depth of groove can be in the thickness of electrically-conductive backing plate
In 10% to 20% range of degree.
Heat sink material can be formed in a groove by filling cream (paste, slurry), or by being transferred in groove
It is formed.Heat sink material may include beryllium oxide (BeO2), aluminium nitride (AlN), at least one of silicon carbide (SiC) and aluminium oxide.
Detailed description of the invention
Fig. 1 is the top view for shielding the illustrative embodiments of piece；
Fig. 2 shows the electrically-conductive backing plates of shielding piece；
Fig. 3 shows the groove of shielding on piece；
Fig. 4 is the sectional view of the A-A ' interception in Fig. 1；
Fig. 5 is the top view for shielding the another exemplary embodiment of piece；
Fig. 6 shows the electrically-conductive backing plate of the shielding piece according to another embodiment；
Fig. 7 is the top view for shielding the another exemplary embodiment of piece；
Fig. 8 shows the electrically-conductive backing plate and groove of the shielding piece according to another exemplary embodiment；
Fig. 9 shows the heat sink material according to another exemplary embodiment；
Figure 10 shows the radiating component according to another exemplary embodiment；And
Figure 11 is the sectional view along B-B ' interception.
Specific embodiment
Hereinafter, shielding piece according to the present invention will be described with reference to the drawings.It is any when the present invention is described with reference to the drawings
Identical or corresponding element will be assigned identical reference label, and will not provide it extra description.
It can be used the term such as " first " and " second " that should not still limit to said elements when describing each element
In above-mentioned term.Above-mentioned term is only used for distinguishing an element with another.
When an element is described as " coupling " to another element, this not merely refers to the object between the two elements
Reason, direct contact, but also should include following possibility, that is, another element between the two elements, and this two
Each of a element is contacted with the another element.
Fig. 1 is the top view for shielding the illustrative embodiments of piece, and Fig. 2 shows the electrically-conductive backing plate of shielding piece, Fig. 3 shows screen
The groove of on piece is covered, and Fig. 4 is the sectional view of the A-A ' interception in Fig. 1.
Referring to figs. 1 to Fig. 4, shielding piece 100 includes electrically-conductive backing plate 110, groove 120 and heat sink material 130.
Electrically-conductive backing plate 110 is configurable for shielding EMI (electromagnetic interference) and is the conductive sheet with high conductivity.Example
Such as, electrically-conductive backing plate 110 can be sheet metal or the composite sheet made of metal and soft magnetic materials.Electrically-conductive backing plate 110 can be with shape
Shape as the plate with the thickness in the range of 0.1mm to 0.3mm.
In the case where shielding piece 100 is applied to wireless charger, electrically-conductive backing plate 110 is placed on connecing in wireless charger
Make it possible to effectively receive the EMI generated by transmitter on take-up circle and prevents the rest part exposure in addition to receiving coil
In EMI radiation.
Groove 120 is formed on the top surface of electrically-conductive backing plate 110, and is applied to the feelings of wireless charger in shielding piece 100
Under condition, groove is located on the opposite side of receiving coil.Groove 120 can be formed by, for example, machine drilling, laser drill etc..
The depth of groove 120 can be in the range of the 10% to 20% of the thickness of electrically-conductive backing plate 110.If groove 120
Depth be more than 20% electrically-conductive backing plate 110 thickness, the shield effectiveness of electrically-conductive backing plate 110 reduces, and if groove 120
Depth is less than the 10% of the thickness of electrically-conductive backing plate 110, then the heat dissipation effect of the heat sink material 130 in groove 120 reduces.
Groove 120 may include multiple first grooves 121 and multiple second grooves 122.
Multiple first grooves 121 are extended in a first direction and are arranged side by side.For example, the first groove 121 erects in Fig. 3
It is straight to extend.
Multiple second grooves 122 extend and are arranged side by side in a second direction.First groove 121 and the second groove 122
Grid can be formed.Second horizontal extension in Fig. 3 of groove 122.Multiple first grooves 121 are evenly-spaced, and multiple
Two grooves 122 are also evenly-spaced.
The area of section of groove 120 can be reduced along the direction of the bottom towards electrically-conductive backing plate 110.For example, groove can be with
It is taper and there is inverted triangle in longitudinal cross-section.In this embodiment, it will be described below heat dissipation material
Material 130 can also have shape identical with groove 120 that the thermal conductivity in the transverse direction of electrically-conductive backing plate 110 will be become larger than
Thermal conductivity in up and down direction.
The heat sink material 130 being formed in groove 120 can be conductive material or can be not leading with high heat conductance
Electric material.The example of conductive material for heat sink material 130 can be metal.Electrically non-conductive material for heat sink material 130
It can be, for example, beryllium oxide (BeO2), aluminium nitride (AlN), at least one of silicon carbide (SiC) and aluminium oxide.
The thermal conductivity of beryllium oxide is 260W/mK, and the thermal conductivity of aluminium nitride is 320W/mK, and the thermal conductivity of silicon carbide is 270W/
MK, and the thermal conductivity of aluminium nitride is 24WmK-35W/mK.
Heat sink material 130 is completely filled up in groove 120, and as shown in figure 4, the upper surface of electrically-conductive backing plate 110 and
Heat sink material 130 can be plane.
Heat sink material 130 can be formed by the way that thermal grease to be filled into groove 120.It is, having beryllium oxide
(BeO2), aluminium nitride (AlN), at least one of silicon carbide (SiC) and aluminium oxide thermal grease be filled into groove 120, and
And after the adhesive volatilization in cream, heat sink material 130 is retained in groove 120.
Also, heat sink material 130 can be formed by being transferred in groove 120.It is, the carrier such as film is moved
It moves on the upper surface of electrically-conductive backing plate 110 so that the heat sink material being located on carrier 130 to be transferred in groove 120.
In addition to process as described above, heat sink material 130 can be formed in a wide variety of ways in groove 120.
Heat sink material 130 and conduction can be passed through by the heat that the heater of the receiving coil in such as wireless charger generates
Substrate 110 is dissipated to outside.Especially since heat sink material 130, maximizes heat dissipation effect.
Shielding piece 100 may further include radiating component 140.Radiating component 140 has high heat conductance and can be with coupling
It is connected to the side of electrically-conductive backing plate 110.
Radiating component 140 can be metal or have high heat conductance nonmetallic materials.In the latter case, radiate structure
Part 140 can be by beryllium oxide (BeO2), aluminium nitride (AlN), at least one of silicon carbide (SiC) and aluminium oxide formed.But
It is, it should be understood that do not need to form the radiating component 140 with material identical with the material of heat sink material 130.
Protruding portion 111 can be formed on the side of electrically-conductive backing plate 110, and radiating component 140 can be formed in protruding portion
On 111 upper surface.Multiple protruding portion 111 can be formed as zigzag fashion along the side of electrically-conductive backing plate 110.Radiating component 140
It can be filled into containing groove 112, or transplant or be attached on the upper surface of protruding portion 111.It in the former case, can be with
It is formed simultaneously containing groove 112 and groove 120.
Radiating component 140 can be formed as contacting with the heat sink material 130 in groove 120.In this case, conductive base
The protruding portion 111 of plate 110 can be formed in the end of groove 120.Therefore, heat can pass through heat sink material 130 and heat dissipation structure
Part 140 dissipates.In particular, the area for heat dissipation is become much larger due to radiating component 140 so that radiating efficiency increases.
Fig. 5 is the top view for shielding the another embodiment of piece, and Fig. 6 shows the shielding according to another embodiment
The electrically-conductive backing plate of piece.
Referring to figure 5 and figure 6, the side of the protruding portion 111 of electrically-conductive backing plate 110 can be uneven (uneven, concave-convex).
The height on uneven side can be identical as the height of protruding portion 111.
The shape of radiating component 140 can be formed as corresponding with the shape of protruding portion 111 and uneven side.Also
It is that radiating component 140 can be formed on the upper surface on protruding portion 111 and uneven side.In this embodiment, it accommodates
Groove can be formed on protruding portion 111 and uneven side, and radiating component 140 can be formed in containing groove.
Area for heat dissipation is become much larger due to uneven side, to increase heat dissipation effect.
Fig. 7 is the top view for shielding the another exemplary embodiment of piece, and Fig. 8 is shown according to another exemplary embodiment
Shielding piece electrically-conductive backing plate and groove, Fig. 9 shows the heat sink material according to another exemplary embodiment, and Figure 10 shows basis
The radiating component of another exemplary embodiment, and Figure 11 is the sectional view along B-B ' interception.
Referring to Fig. 5 to Fig. 9, the shielding piece according to another exemplary embodiment includes electrically-conductive backing plate 210,220 and of groove
Heat sink material 230, and may further include radiating component 240.
Electrically-conductive backing plate 210, groove 220 and heat sink material 230 be with it is those of described above identical.It is, conductive
Substrate 210 is configurable for masking EMI.Groove 220 is formed on the upper surface of electrically-conductive backing plate 210, and as shown in figure 8,
It may include the first groove 221 and the second groove 222.The heat sink material 230 being formed in groove 220 can be conductive material or can
To be the electrically non-conductive material with high heat conductance.
In this exemplary embodiment, protruding portion is not formed on electrically-conductive backing plate 210, and radiating component 240 is straight
Connect the side for being coupled to electrically-conductive backing plate 210.It is, as shown in figure 9, the thickness of radiating component 240 and the thickness of electrically-conductive backing plate 210
It is identical.
The side that radiating component 240 can be coupled to electrically-conductive backing plate 210 becomes zigzag fashion, and therefore, for heat dissipation
Region becomes much larger and radiating efficiency also becomes much larger.In this embodiment, radiating component 240 can be coupled to groove
220 end.
As described above, shielding piece according to the present invention, can provide a kind of shielding with high EMI shielding and radiating efficiency
Piece, so when this shielding piece is applied to wireless charger, it can be by the heat that is generated in the wireless charger that effectively dissipates
Amount is to prevent charge efficiency from reducing.
Although only certain exemplary embodiments of this invention is described above, for common skill of the art
For art personnel it should be understood that without departing substantially from technical concept and range of the invention, there are of the invention each
Kind changes and modification, and technical concept of the invention and range should be defined by the following claims.It should also be understood that except above-mentioned
A large amount of other embodiments other than embodiment are also included in claim of the invention.
Claims (15)
1. a kind of shielding piece, comprising:
Electrically-conductive backing plate is configurable for shielding electromagnetic interference；
Groove, is formed on the electrically-conductive backing plate and not through the electrically-conductive backing plate, and the groove extends to the conduction
The side of substrate；
Heat sink material is formed in the groove；And
Radiating component, the radiating component are coupled on the side of the electrically-conductive backing plate, and the side surface of the radiating component is exposed to
It is external.
2. shielding piece according to claim 1, wherein the radiating component is connected to the groove on the electrically-conductive backing plate
End, the electrically-conductive backing plate are sheet metals.
3. shielding piece according to claim 2, wherein protruding portion is formed on the side of the electrically-conductive backing plate, wherein
The radiating component is formed on the protruding portion.
4. shielding piece according to claim 3, wherein multiple protruding portions are formed in the side of the electrically-conductive backing plate
On.
5. shielding piece according to claim 3, wherein the side of the protruding portion is uneven.
6. shielding piece according to claim 2, wherein the radiating component connects with the heat sink material in the groove
Touching.
7. shielding piece according to claim 2, wherein the radiating component includes at least one of the following terms: oxygen
Change beryllium, aluminium nitride, silicon carbide and aluminium oxide.
8. shielding piece according to claim 1, wherein the groove includes extending in a first direction and being arranged side by side
Multiple first grooves.
9. shielding piece according to claim 8, wherein the groove further comprise in a second direction extend and side by side
Multiple second grooves of arrangement.
10. shielding piece according to claim 9, wherein first groove and second groove type are at grid.
11. shielding piece according to claim 1, wherein the area of section of the groove is along towards the electrically-conductive backing plate
Bottom direction reduce.
12. shielding piece according to claim 1, wherein thickness of the depth of the groove in the electrically-conductive backing plate
In the range of 10% to 20%.
13. shielding piece according to claim 1, wherein the heat sink material is by being filled in shape in the groove for cream
At.
14. shielding piece according to claim 1, wherein the heat sink material is formed by being transferred in the groove.
15. shielding piece according to claim 1, wherein the heat sink material includes at least one of the following terms: oxygen
Change beryllium, aluminium nitride, silicon carbide and aluminium oxide.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0117257 | 2014-09-03 | ||
| KR1020140117257A KR101792312B1 (en) | 2014-09-03 | 2014-09-03 | Shield sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105992510A CN105992510A (en) | 2016-10-05 |
| CN105992510B true CN105992510B (en) | 2019-09-13 |
Family
ID=55582945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510094782.4A Active CN105992510B (en) | 2014-09-03 | 2015-03-03 | Shield piece |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101792312B1 (en) |
| CN (1) | CN105992510B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142865A (en) * | 2001-11-06 | 2003-05-16 | Kitagawa Ind Co Ltd | Electromagnetic wave preventive sheet and its manufacturing method |
| KR20070034157A (en) * | 2005-09-23 | 2007-03-28 | 박정현 | Silicone rubber sheet having both electrical conductivity and thermal conductivity at the same time and manufacturing method thereof |
| CN201499421U (en) * | 2009-08-27 | 2010-06-02 | 英业达股份有限公司 | Shielding structure |
| JP2010245407A (en) * | 2009-04-08 | 2010-10-28 | Daido Steel Co Ltd | Electromagnetic wave absorbing heat conductive sheet |
| KR20130108921A (en) * | 2012-03-26 | 2013-10-07 | 조경애 | Electromagnetic wave shield sheet |
-
2014
- 2014-09-03 KR KR1020140117257A patent/KR101792312B1/en active IP Right Grant
-
2015
- 2015-03-03 CN CN201510094782.4A patent/CN105992510B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142865A (en) * | 2001-11-06 | 2003-05-16 | Kitagawa Ind Co Ltd | Electromagnetic wave preventive sheet and its manufacturing method |
| KR20070034157A (en) * | 2005-09-23 | 2007-03-28 | 박정현 | Silicone rubber sheet having both electrical conductivity and thermal conductivity at the same time and manufacturing method thereof |
| JP2010245407A (en) * | 2009-04-08 | 2010-10-28 | Daido Steel Co Ltd | Electromagnetic wave absorbing heat conductive sheet |
| CN201499421U (en) * | 2009-08-27 | 2010-06-02 | 英业达股份有限公司 | Shielding structure |
| KR20130108921A (en) * | 2012-03-26 | 2013-10-07 | 조경애 | Electromagnetic wave shield sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160028304A (en) | 2016-03-11 |
| KR101792312B1 (en) | 2017-11-01 |
| CN105992510A (en) | 2016-10-05 |
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Effective date of registration: 20191012 Address after: Han Guo Jingjidao Patentee after: Company WITS Address before: Han Guo Jingjidao Patentee before: Samsung Electro-Mechanics Co., Ltd. |
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