CN200997744Y - Heat-transfer soaker - Google Patents

Abstract

The heat-conducting and heat-spreading device of the present utility model at least includes: a reflective layer and a graphite heat-conducting heat-spreading layer, and the graphite heat-conducting heat-spreading layer is arranged on the lower surface of the reflective layer, and when the heat source is placed on the upper surface of the reflective layer, it generates heat Part of the heat energy emitted by the source is reflected and dissipated by the reflective layer, and part of the heat energy is transmitted through the reflective layer to the heat-conducting heat-spreading layer of graphite. With the effect of rapid heat conduction and heat-spreading of graphite itself, the heat energy can be evenly distributed to the entire plate surface of the heat-conducting device , increase the thermal energy diffusion area, and then obtain a better heat dissipation effect.

Description

Heat conduction heat equalization device

technical field

The utility model relates to a heat-conducting and heat-spreading device, aiming to provide a heat-conducting and heat-spreading device that is simple in structure and capable of rapid heat conduction and heat dissipation.

Background technique

Some electronic device components, such as the central processing unit in the computer, the north bridge chip, etc., will generate a lot of heat due to the impedance consumption of electric energy during the transmission or processing of electrical signals. If the heat is not dissipated effectively, it will affect the performance of the electronic device. Performance, loss of service life, what's more, it will be damaged and unusable. Therefore, if an electronic device has the above-mentioned components that generate a large amount of heat energy, the heat dissipation problem must be considered during design to ensure the operating performance of the device and extend the life of the device. At present, there are many heat dissipation methods used in various fields and devices. According to the requirements and the objective conditions of the devices, different heat dissipation methods can be used in the design to achieve the purpose of heat dissipation.

Generally, to protect electronic devices, protect users, or for aesthetic purposes, electronic components are often placed in a casing, such as computers, televisions, walkmans, etc., and most components are covered in plastic casings. A common heat dissipation method for an electronic device (such as a computer) with such a structure is to install a heat dissipation device on the heating component of the electronic device, such as a fan, cooling fins, etc., so that the heat energy is first transferred from the heating component to the air in the housing. A number of heat dissipation holes are set on the shell to allow heat to dissipate to the outside of the shell through heat convection. In order to increase the efficiency of heat convection, a fan can be added to allow the fan to generate forced convection to accelerate the removal of heat in the shell. .

Heat dissipation fins, heat dissipation openings, fans, etc. are all heat dissipation methods, and they are used together according to different needs. The heat dissipation method of the heat dissipation holes is usually combined with other devices to increase heat convection efficiency, such as the above-mentioned fan. However, using a fan consumes power and also takes up space, which is not suitable for some electronic devices (such as thumb drives, wireless network cards, etc.). However, if only the heat dissipation holes are simply used, the heat dissipation efficiency is not good.

Utility model content

The purpose of this utility model is to provide a heat-conducting and heat-spreading device with a simple structure, which can quickly conduct heat and dissipate heat. The heat energy is quickly exported.

In order to achieve the above purpose, the heat conduction and heat equalization device of the present utility model at least includes: a reflective layer, the upper surface of which is provided with at least one heat source, and the lower surface thereof is provided with a graphite heat conduction heat equalization layer; a graphite heat conduction heat equalization layer, set on the lower surface of the reflective layer.

Wherein, the reflective layer is a metal layer.

The reflective layer is an aluminum layer.

The reflective layer and the graphite heat-conducting heat-spreading layer are mutually pasted and positioned with an adhesive.

The adhesive is thermally conductive adhesive.

The adhesive is hot melt.

The adhesive is pressure-sensitive adhesive.

The beneficial effects of the utility model are: when the heat source is placed on the upper surface of the reflective layer, part of the heat energy emitted by the heat source is reflected by the reflective layer and released, and part of the heat energy passes through the reflective layer and is transferred to the graphite heat-conducting layer. Due to the rapid heat conduction and uniform heat effect of graphite itself, the heat energy can be evenly distributed to the entire plate surface of the heat conduction device, increasing the heat energy diffusion area, thereby obtaining better heat dissipation effect.

Description of drawings

Fig. 1 is the structural representation of heat conduction heat equalizing device in the utility model;

Fig. 2 is a schematic diagram of the use state of the heat conduction and heat equalizing device in the utility model;

FIG. 3 is a perspective view of the structure of the heat conduction and heat equalization device applied to a notebook computer in the present invention.

【Description of figure number】

1 Heat conduction heat equalization device 11 Reflective layer

12 Graphite heat conduction layer 13 Adhesive

2 Heat source 3 Housing

Detailed ways

The heat conduction and heat equalization device of the present utility model, the basic structural composition of the overall heat conduction and heat equalization device 1 is shown in Figure 1, at least including:

A reflective layer 11, the reflective layer 11 can be a metal layer, such as an aluminum layer, its upper surface is provided with at least one heat source 2, and its heat source 2 can be arranged on the reflective layer 11 in a contact or non-contact manner with the reflective layer 11 The surface and its lower surface are provided with a graphite heat-conducting heat-spreading layer 12 .

A graphite heat-conducting and heat-spreading layer 12 is arranged on the lower surface of the reflective layer 11. As shown in the figure, the reflective layer 11 and the graphite heat-conducting and heat-spreading layer 12 are adhered to each other by an adhesive 13 or mechanically pressed. positioning, and the adhesive 13 can be heat-conducting adhesive, hot-melt adhesive, or pressure-sensitive adhesive.

During specific use, part of the heat energy emitted by the heat source 2 is reflected and dissipated by the reflective layer 11, as shown in FIG. The effect of uniform heat enables the heat energy to be evenly distributed to the entire plate surface of the heat conduction device, increasing the area of heat energy diffusion, thereby obtaining a better heat dissipation effect.

As shown in Figure 3, it is another embodiment of the utility model, the heat conduction and heat equalization device 1 can be made into the form of a housing, as shown in the figure, the heat conduction and heat equalization device 1 can be placed as a notebook computer housing 3. When the heat source 2 (electronic component) inside the casing 3 is in operation, the heat energy emitted by its operation is also reflected and dissipated by the reflective layer 11, and part of the heat energy is transferred to the graphite heat conduction uniform through the reflective layer 11. The heat layer 12 can evenly spread the heat energy to the entire plate surface of the heat conduction and heat equalizing device 1 , increasing the heat energy diffusion area, thereby obtaining a better heat dissipation effect.

As mentioned above, the utility model provides a better and feasible heat conduction and heat equalizing device, so an application for a new patent is submitted according to law; however, the above implementation description and drawings are preferred embodiments of the utility model, not based on This limitation of the utility model means that all similar and identical structures, devices, and features of the utility model should belong to the creation purpose of the utility model and the scope of the patent application.

Claims (7)

1, a kind of heat conduction soakage device is characterized in that, includes at least:

One reflector, its upper surface is provided with at least one pyrotoxin, and its lower surface is provided with the equal thermosphere of a graphite heat conducting;

The equal thermosphere of one graphite heat conducting is arranged at the lower surface in this reflector.

2, heat conduction soakage device according to claim 1 is characterized in that this reflector is a metal level.

3, heat conduction soakage device according to claim 1 is characterized in that this reflector is an aluminium lamination.

4, heat conduction soakage device according to claim 1 is characterized in that this reflector and the utilization of graphite heat conducting soaking interlayer are pasted agent and pasted the location mutually.

5, as heat conduction soakage device as described in the claim 4, it is characterized in that this pastes agent is heat-conducting glue.

6, as heat conduction soakage device as described in the claim 4, it is characterized in that this pastes agent is thermosol.

7, as heat conduction soakage device as described in the claim 4, it is characterized in that this pastes agent is pressure-sensing glue.

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