CN206423039U - Heat dissipation type cell phone mainboard - Google Patents
Heat dissipation type cell phone mainboard Download PDFInfo
- Publication number
- CN206423039U CN206423039U CN201720065447.6U CN201720065447U CN206423039U CN 206423039 U CN206423039 U CN 206423039U CN 201720065447 U CN201720065447 U CN 201720065447U CN 206423039 U CN206423039 U CN 206423039U
- Authority
- CN
- China
- Prior art keywords
- mainboard
- shaped
- heat dissipation
- type cell
- cell phone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 17
- 239000013013 elastic material Substances 0.000 claims abstract description 9
- 238000005452 bending Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000010954 inorganic particle Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000006261 foam material Substances 0.000 claims 1
- 239000006260 foam Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Telephone Set Structure (AREA)
Abstract
The utility model discloses a kind of heat dissipation type cell phone mainboard, including L-shaped mainboard, the L-shaped mainboard short side is arranged at the top of mobile phone, the long side of the long edge mobile phone of L-shaped mainboard is set, distribution is set and is provided with thermally conductive sheet on the inside of mobile module, the L-shaped mainboard on the L-shaped mainboard, and the side of the thermally conductive sheet is fixedly connected with the L-shaped mainboard, opposite side bending forms heat conduction inclined tab, and elastic material is filled between the heat conduction inclined tab and the L-shaped mainboard.Using heat dissipation type cell phone mainboard of the present utility model, the heat that mobile module is produced can be distributed in whole mobile phone space, effectively carry out mobile phone radiating.
Description
Technical field
The utility model is related to mobile phone manufacture field, more particularly to a kind of heat dissipation type cell phone mainboard.
Background technology
With the development of the society, the development of science and technology, requirement of the people to the function, performance each side of various mobile terminals
More and more higher, while requiring that the speed of service is more and more faster, also requires that hardware device volume is less and less, and following
The problem of some are inevitable is generated, such as radiate difficult problem.
Mobile phone heat is main by battery, processor module, power management module, charge management module, RF modules and shooting
Head module is produced.
In intelligent machine development at this stage, typically generally using disconnected plate design, this kind of design is although motherboard space ratio
It is more upright, be easy to PCB main board to design, but because between above-mentioned module inevitably too close to thermal source can not be released well
Put, and the heat-dissipating space of complete machine can not be effectively utilized.
Utility model content
To solve above technical problem, the utility model provides a kind of heat dissipation type cell phone mainboard, and L-shaped mainboard runs through complete machine knot
Structure, effectively can disperse thermal source, and PCB main board is a good heat conduction carrier, and then can make full use of the radiating of complete machine
Space, radiates highly effective to complete machine.
Technical scheme is as follows：
A kind of heat dissipation type cell phone mainboard, its key is：Including L-shaped mainboard, the L-shaped mainboard short side is arranged on mobile phone top
Portion, the long side of the long edge mobile phone of L-shaped mainboard is set, and distribution sets mobile module on the L-shaped mainboard, the L-shaped mainboard
Inner side is provided with thermally conductive sheet, and the side of the thermally conductive sheet is fixedly connected with the L-shaped mainboard, and opposite side bending forms heat conduction inclined tab,
Elastic material is filled between the heat conduction inclined tab and the L-shaped mainboard.
Using said structure, L-shaped mainboard runs through complete machine structure, effectively can disperseed thermal source, and PCB main board is one good
Good heat conduction carrier, and then the heat-dissipating space of complete machine can be made full use of, complete machine is radiated highly effective.And heat conduction inclined tab is in electricity
Pond can be in close contact after installing with battery, and the heat that preferably can be produced battery is oriented to L-shaped mainboard, so that heat be distributed to
Whole mobile phone.And elastic material then can restore heat conduction inclined tab after battery taking-up, heat conduction when making to install battery next time
Inclined tab can also be close to battery.
Further, in mobile phone processor module, RF modules, power management module and charge management module according to
On the free end to the direction of L-shaped mainboard short side on the long side of L-shaped mainboard, the long side for being sequentially arranged at the L-shaped mainboard, mobile phone
Camera module in module is arranged on the L-shaped mainboard short side.
Using said structure, high thermal source and low heat in these modules can be made separately to be distributed, can be effectively by thermal source point
Dissipate, in such as module on cell phone mainboard, produce heat at most be processor module, and mobile phone bottom is provided that phonetic incepting
Module, speech reception module is that the heat produced is few, so the bottom that processor module is installed into L-shaped mainboard can make processing
Device module is easy to processor module to radiate away from the high module of other generation heats.
Further, between the charge management module and power management module, power management module and processor die
The gap more than 10 millimeters is left between block and between processor module and RF modules.
Using said structure, 10 millimeters of interval between modules is above is optimal distance, under this distance, can subtract
Influence of the heat that small modules are produced to radiating each other, more efficiently radiates.
Further, the charge management module, power management module, RF modules and processor module and the L
The distance more than 5 millimeters is left between the edge of shape mainboard.
Using said structure, modules are then avoided that the heat that modules are distributed apart from more than 5 millimeters of mainboard edge
Have influence on other components of mobile phone, such as battery.
Further, the thermally conductive sheet is elastic copper sheet, and the side of the elastic copper sheet is oliquely downward bent to form institute
State heat conduction inclined tab.
Using said structure, copper is one of best metal of several thermal conductivity, and price is relative to other several metals,
Copper is less expensive, therefore reduces cost.And copper has good deformability, heat conduction inclined tab is able to take multiple extruding, increase
Plus service life.
Further, the outer surface of the elastic copper sheet is covered with insulating barrier.
Using said structure, it is avoided that copper sheet is turned on battery or mainboard, makes mainboard or battery short circuit, cause
It is dangerous.
Further, the insulating barrier constitutes for composite, and the composite is by nano inorganic particle and macromolecule
Elastomeric material is constituted.
Using said structure, composite not only insulate, and with good deformability, is able to take repeatedly extruding
Deformation, increases service life.
Further, the elastic material is made up of insulation perforated foams, and insulate perforated foams high temperature resistant.
Using said structure, insulation perforated foams have good elasticity, install after battery, can make thermally conductive sheet and electricity
Pond is in close contact, and is easy to thermally conductive sheet to absorb the heat that battery is produced, and the perforated foams that insulate can not only avoid mobile phone master
Plate sends short circuit, moreover it is possible to heat conduction, the heat of mainboard and the heat of battery is distributed to the whole space of mobile phone, is conducive to mobile phone to dissipate
Heat.
Beneficial effect：Using heat dissipation type cell phone mainboard of the present utility model, the heat that mobile module is produced can be distributed to
In whole mobile phone space, mobile phone radiating is effectively carried out.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the phantom of mainboard when not installing battery；
The phantom of mainboard when Fig. 3 is installs battery.
Embodiment
With reference to embodiment and accompanying drawing, the utility model is described in further detail.
As Figure 1-3, a kind of heat dissipation type cell phone mainboard, including L-shaped mainboard 1, the short side of L-shaped mainboard 1 is arranged on mobile phone
Top, the long side of the long edge mobile phone of L-shaped mainboard 1 is set.Processor module 8, RF modules 9, power management module 7 in mobile phone
And charge management module 6 according to the free end on the long side of the L-shaped mainboard 1 to the direction of the short side of L-shaped mainboard 1, be sequentially arranged at
On the long side of the L-shaped mainboard 1, the camera module 10 in mobile module is arranged on the short side of L-shaped mainboard 1.
Between the charge management module 6 and power management module 7, between power management module 7 and processor module 8 with
And gap more than 10 millimeters is left between processor module 8 and RF modules 9.And apart from the milli of edge 5 of the L-shaped mainboard
It is more than rice.
The inner side of the L-shaped mainboard 1 is provided with thermally conductive sheet 3, the thermally conductive sheet 3 be elastic copper sheet, its outer surface covered with by
The insulating barrier 11 that nano inorganic particle is constituted with macromolecular material
The side of the thermally conductive sheet 3 is fixedly connected with the L-shaped mainboard 1, opposite side downward bending formation heat conduction inclined tab 4, institute
State between heat conduction inclined tab 4 and the L-shaped mainboard 1 filled with the elastic material 5 being made up of insulation perforated foams.
Battery 2 loads after mobile phone, and its side wall is closely abutted with heat conduction inclined tab 4, and the heat that battery 2 is distributed is through the He of thermally conductive sheet 3
In the whole space of the transmission mobile phone of elastic material 5, the heat that mobile module is produced also is driven hand through thermally conductive sheet 3 and elastic material 5
In the whole space of machine, mobile phone radiating is effectively carried out.
Finally it should be noted that foregoing description is only preferred embodiment of the present utility model, the common skill of this area
Art personnel on the premise of without prejudice to the utility model objective and claim, can make under enlightenment of the present utility model
Represented as multiple types, such conversion is each fallen within protection domain of the present utility model.
Claims (8)
1. a kind of heat dissipation type cell phone mainboard, it is characterised in that：Including L-shaped mainboard (1), L-shaped mainboard (1) short side is arranged on mobile phone
Top, the long side of the long edge mobile phone of L-shaped mainboard (1) is set, and distribution sets mobile module, the L on the L-shaped mainboard (1)
Thermally conductive sheet (3) is provided with the inside of shape mainboard (1), the side of the thermally conductive sheet (3) is fixedly connected with the L-shaped mainboard (1), another
Side bending forms heat conduction inclined tab (4), and elastic material (5) is filled between the heat conduction inclined tab (4) and the L-shaped mainboard (1).
2. heat dissipation type cell phone mainboard according to claim 1, it is characterised in that：Processor module (8) in mobile phone, RF modules
(9), the free end of power management module (7) and charge management module (6) along the long side of the L-shaped mainboard (1) is to L-shaped mainboard
(1) on the direction of short side, the long side for being sequentially arranged at the L-shaped mainboard (1), the camera module (10) in mobile module is installed
On L-shaped mainboard (1) short side.
3. heat dissipation type cell phone mainboard according to claim 2, it is characterised in that：The charge management module (6) and power supply pipe
Manage between module (7), between power management module (7) and processor module (8) and processor module (8) and RF modules (9)
Between leave gap more than 10 millimeters.
4. the heat dissipation type cell phone mainboard according to Claims 2 or 3, it is characterised in that：The charge management module (6), power supply
Left between the edge of management module (7), RF modules (9) and processor module (8) and the L-shaped mainboard (1) more than 5 millimeters
Distance.
5. heat dissipation type cell phone mainboard according to claim 1, it is characterised in that：The thermally conductive sheet (3) is elastic copper sheet, described
The side of elastic copper sheet is oliquely downward bent to form the heat conduction inclined tab (4).
6. heat dissipation type cell phone mainboard according to claim 5, it is characterised in that：The outer surface of the elastic copper sheet is covered with exhausted
Edge layer (11).
7. heat dissipation type cell phone mainboard according to claim 6, it is characterised in that：The insulating barrier (11) is composite group
Into the composite is made up of nano inorganic particle and macromolecular material.
8. heat dissipation type cell phone mainboard according to claim 1, it is characterised in that：The elastic material (5) is by the porous bubble that insulate
Foam material is constituted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720065447.6U CN206423039U (en) | 2017-01-19 | 2017-01-19 | Heat dissipation type cell phone mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720065447.6U CN206423039U (en) | 2017-01-19 | 2017-01-19 | Heat dissipation type cell phone mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206423039U true CN206423039U (en) | 2017-08-18 |
Family
ID=59572071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720065447.6U Expired - Fee Related CN206423039U (en) | 2017-01-19 | 2017-01-19 | Heat dissipation type cell phone mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206423039U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108924322A (en) * | 2018-09-21 | 2018-11-30 | 熊齐虎 | Filter glass mobile phone |
-
2017
- 2017-01-19 CN CN201720065447.6U patent/CN206423039U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108924322A (en) * | 2018-09-21 | 2018-11-30 | 熊齐虎 | Filter glass mobile phone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170818 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |