CN206136564U - Graphite covers copper thermal film based on addition process - Google Patents
Graphite covers copper thermal film based on addition process Download PDFInfo
- Publication number
- CN206136564U CN206136564U CN201621141603.4U CN201621141603U CN206136564U CN 206136564 U CN206136564 U CN 206136564U CN 201621141603 U CN201621141603 U CN 201621141603U CN 206136564 U CN206136564 U CN 206136564U
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- thickness
- graphite
- copper
- ink
- graphite flake
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract
The utility model provides a graphite covers copper thermal film based on addition process, includes the graphite flake, the both sides of graphite flake all have a catalysis printing ink layer, and the outside on two catalysis printing ink layers all has a copper plate, is the thickness of graphite flake 5 50um, is the thickness on catalysis printing ink layer 2 5um, is the thickness of copper plate 2 35um. The utility model discloses simple structure, it is convenient to make, and copper and graphite flake contact have increased the heat conductivility to adopt the addition process to realize that the graphite flake covers copper, reduced the thickness of product, saved material cost, can adapt to the development trend of electronic product " frivolous short and small " now.
Description
Technical field
The utility model is related to heat conduction technical field, more particularly to a kind of graphite based on addition process covers copper heat dissipation film.
Background technology
In recent years, with the fast development of electronic apparatus technology, with high-capacity LED communication apparatus and personal electric product
Gradually tend to miniaturization, high power, high heating direction to develop, so as to the stability that affects equipment to run and speed, battery capacity
Also because heat is limited, service life of equipment is reduced；Especially for chip, with the increase of its speed of service, its caloric value is in
Geometry level increases.The radiating of early stage uses active radiating, such as fan, is eliminated because volume is larger；Present master
Want method to be conducted heat on the metal heat sink of outside using heat-conducting glue and thermal grease conduction, but be because the thermal conductivity of heat-conducting glue
Than relatively low (being less than 5W/mK), and metal heat sink is distant apart from heat generating spot, so heat sinking function can not be realized well.Cause
How this effectively distributes the heat of chip, has become an electronic radiation field key problem urgently to be resolved hurrily.
Chinese patent CN201310630175.6 provides a kind of copper-clad plate with heat sinking function and preparation method, and in
State's patent CN20120402243.4 provides a kind of graphite composite heat-conducting glued membrane and graphite composition metal base copper-clad plate.It is above-mentioned to cover
Copper coin has good capacity of heat transmission and electrical property, but it is higher as the thickness of heat conducting base material, it is difficult to adapt to electricity now
The development trend of sub- product " compact ".
Utility model content
Based on this, for above-mentioned technical problem, there is provided a kind of graphite based on addition process covers copper heat dissipation film.
To solve above-mentioned technical problem, the utility model is adopted the following technical scheme that：
A kind of graphite based on addition process covers copper heat dissipation film, including graphite flake, and the both sides of the graphite flake are respectively provided with catalysis
Ink layer, is respectively provided with copper plate on the outside of two catalyzed oil layer of ink, the thickness of the graphite flake is 5-50um, the catalytic ink
The thickness of layer is 2-5um, and the thickness of the copper plate is 2-35um.
There is through hole on the graphite flake, catalyzed oil layer of ink and copper plate.
This programme further relates to a kind of graphite based on addition process and covers copper heat dissipation film, including graphite flake, and the one of the graphite flake
Side has catalyzed oil layer of ink, and opposite side is fixed with copper foil layer by glue-line, and the outside of the catalyzed oil layer of ink has copper plate, institute
The thickness for stating graphite flake is 5-50um, and the thickness of the catalyzed oil layer of ink is 2-5um, and the thickness of the copper plate is 2-35um,
The thickness of the copper foil layer is 7-50um, and the thickness of the glue-line is 2-15um.
There is through hole on the graphite flake, catalyzed oil layer of ink, glue-line and copper plate.
The utility model simple structure, easily manufactured, copper is contacted with graphite flake, increased heat conductivility, and employing adds
Realize that graphite flake covers copper into method, reduce the thickness of product, save material cost, adapt to electronic product now " frivolous short
It is little " development trend.
Description of the drawings
With reference to the accompanying drawings and detailed description the utility model is described in detail：
Fig. 1 is that a kind of graphite based on addition process of the present utility model covers copper heat dissipation film structure in one embodiment and shows
It is intended to；
Fig. 2 is that a kind of graphite based on addition process of the present utility model covers copper heat dissipation film preferred side in one embodiment
The structural representation of case；
Fig. 3 is that a kind of graphite based on addition process of the present utility model covers copper heat dissipation film structure in another embodiment
Schematic diagram；
Fig. 4 is that a kind of graphite based on addition process of the present utility model covers copper heat dissipation film in another embodiment preferred
The structural representation of scheme.
Specific embodiment
In one embodiment, as shown in figure 1, a kind of graphite based on addition process covers copper heat dissipation film, including graphite flake
110, the both sides of graphite flake 110 are respectively provided with catalyzed oil layer of ink 120, and the outside of two catalyzed oil layer of ink 120 is respectively provided with copper plate
130, the thickness of graphite flake 110 is 5-50um, and the thickness of catalyzed oil layer of ink 120 is 2-5um, and the thickness of copper plate 130 is 2-
35um。
Preferably, as shown in Fig. 2 having through hole A, graphite on graphite flake 110, catalyzed oil layer of ink 120 and copper plate 130
The cohesive force of itself is very low, easily layering, and it is that the layers of copper of levels is connected that hole purpose is increased on graphite, graphite is had more
Good cohesive force, reliability is higher.
In one embodiment, as shown in figure 3, a kind of graphite based on addition process covers copper heat dissipation film, including graphite flake
110, the side of graphite flake 110 has catalyzed oil layer of ink 120, and opposite side is fixed with copper foil layer 140, catalyzed oil by glue-line 130
The outside of layer of ink 120 has copper plate 150, and the thickness of graphite flake 110 is 5-50um, and the thickness of catalyzed oil layer of ink 120 is 2-
5um, the thickness of copper plate 150 is 2-35um, and the thickness of copper foil layer 140 is 7-50um, and the thickness of glue-line 130 is 2-15um.
Preferably, in another embodiment, as shown in figure 4, graphite flake 110, catalyzed oil layer of ink 120, glue-line 130 and plating
There is through hole A, the cohesive force of graphite itself is very low, easily layering in layers of copper 150, it is by levels that hole purpose is increased on graphite
Layers of copper be connected, make graphite have more preferable cohesive force, reliability is higher.
But, those of ordinary skill in the art is it should be appreciated that the embodiment of the above is intended merely to explanation originally
Utility model, and be not used as be to restriction of the present utility model, if in spirit of the present utility model, to
Change, the modification of the upper embodiment all will fall in Claims scope of the present utility model.
Claims (4)
1. a kind of graphite based on addition process covers copper heat dissipation film, it is characterised in that including graphite flake, the both sides of the graphite flake are equal
With catalyzed oil layer of ink, copper plate is respectively provided with the outside of two catalyzed oil layer of ink, the thickness of the graphite flake is 5-50um, described
The thickness of catalyzed oil layer of ink is 2-5um, and the thickness of the copper plate is 2-35um.
2. a kind of graphite based on addition process according to claim 1 covers copper heat dissipation film, it is characterised in that the graphite
There is through hole on piece, catalyzed oil layer of ink and copper plate.
3. a kind of graphite based on addition process covers copper heat dissipation film, it is characterised in that including graphite flake, and the side of the graphite flake has
There is catalyzed oil layer of ink, opposite side is fixed with copper foil layer by glue-line, and the outside of the catalyzed oil layer of ink has copper plate, the stone
The thickness of ink sheet is 5-50um, and the thickness of the catalyzed oil layer of ink is 2-5um, and the thickness of the copper plate is 2-35um, described
The thickness of copper foil layer is 7-50um, and the thickness of the glue-line is 2-15um.
4. a kind of graphite based on addition process according to claim 3 covers copper heat dissipation film, it is characterised in that the graphite
There is through hole on piece, catalyzed oil layer of ink, glue-line and copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621141603.4U CN206136564U (en) | 2016-10-20 | 2016-10-20 | Graphite covers copper thermal film based on addition process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621141603.4U CN206136564U (en) | 2016-10-20 | 2016-10-20 | Graphite covers copper thermal film based on addition process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206136564U true CN206136564U (en) | 2017-04-26 |
Family
ID=58574809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621141603.4U Expired - Fee Related CN206136564U (en) | 2016-10-20 | 2016-10-20 | Graphite covers copper thermal film based on addition process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206136564U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107969091A (en) * | 2016-10-20 | 2018-04-27 | 上海光线新材料科技有限公司 | Graphite based on addition process covers copper heat dissipation film and preparation method thereof |
-
2016
- 2016-10-20 CN CN201621141603.4U patent/CN206136564U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107969091A (en) * | 2016-10-20 | 2018-04-27 | 上海光线新材料科技有限公司 | Graphite based on addition process covers copper heat dissipation film and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170426 Termination date: 20171020 |