CN113453517B

CN113453517B - Heat dissipation device and electronic equipment

Info

Publication number: CN113453517B
Application number: CN202110788757.1A
Authority: CN
Inventors: 刘秒
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-07-13
Filing date: 2021-07-13
Publication date: 2022-11-22
Anticipated expiration: 2041-07-13
Also published as: CN113453517A

Abstract

The application discloses heat abstractor and electronic equipment, foretell heat abstractor includes: the device comprises a shell, a heat insulation layer and a liquid conveying piece; the heat insulation layer is arranged in the shell and divides the shell into a first cavity and a second cavity, and the heat insulation layer is provided with a through hole; the first chamber is filled with compressed gas, the second chamber is filled with liquid medium, and the second chamber is used for being in contact with a heat source; the liquid conveying piece is arranged around the inner wall of the shell, is communicated with the first cavity and the second cavity, and is used for conveying liquid water converted from water vapor in the first cavity into the second cavity.

Description

Heat dissipation device and electronic equipment

Technical Field

The application belongs to the technical field of electronics, and in particular relates to a heat dissipation device and electronic equipment.

Background

At present, electronic equipment, especially mobile phones, are increasingly widely used, and with the increase of functions of electronic equipment such as mobile phones, the number of high-power elements inside the electronic equipment is correspondingly increased, and a large amount of heat is generated by the high-power elements in the operation process.

The graphite film is mostly adopted to dissipate heat of the existing scheme for electronic equipment, when the electronic equipment runs a large program, the power consumption of a central processing unit is high, a large amount of heat is generated, the efficiency of the heat transferred to the graphite film from the central processing unit is low, a large amount of heat cannot be timely dissipated, and the use performance of the electronic equipment is affected.

Disclosure of Invention

The present application aims to provide a heat dissipation device, which can solve the problem of poor heat dissipation efficiency of the existing heat dissipation device.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a heat dissipation apparatus, including: the device comprises a shell, a heat insulation layer and a liquid conveying piece;

the heat insulation layer is arranged in the shell and divides the shell into a first cavity and a second cavity, and the heat insulation layer is provided with a through hole;

the first chamber is filled with compressed gas, the second chamber is filled with liquid medium, and the second chamber is used for being in contact with a heat source;

the liquid conveying piece is arranged around the inner wall of the shell, is communicated with the first cavity and the second cavity, and is used for conveying liquid water converted from water vapor in the first cavity into the second cavity.

According to the heat dissipation device provided by the embodiment of the application, the heat dissipation device further comprises a gas compression device, and the gas compression device is communicated with the first cavity and used for compressing gas in the first cavity.

According to the heat dissipation device provided by the embodiment of the application, the heat dissipation device further comprises a pressure detection component, wherein the pressure detection component is arranged in the first cavity and used for obtaining the pressure value of the first cavity, and the gas compression device compresses the gas in the first cavity under the condition that the pressure value is smaller than the target pressure value.

According to the heat dissipation device provided by the embodiment of the application, the liquid conveying piece is a capillary tube, the liquid conveying piece is sequentially attached to the inner wall of the first cavity and the inner wall of the second cavity, and the liquid conveying piece is connected end to form a closed loop.

According to the heat dissipation device provided by the embodiment of the application, the inner wall of the second chamber, which is in contact with the liquid conveying member, is provided with a hydrophilic layer.

According to an embodiment of the present application, the liquid medium includes ethanol.

According to the heat dissipation device provided by the embodiment of the application, the shell is provided with the heat dissipation layer at the position corresponding to the first cavity.

In a second aspect, an embodiment of the present application provides an electronic device, including: functional device, circuit board and the above-mentioned heat dissipating double-fuselage;

the functional device is arranged on the circuit board, and corresponds to the second cavity under the condition that the shell is abutted against the functional device.

According to an electronic device provided by the embodiment of the application, the housing is provided with a groove corresponding to the second cavity, and the functional device is located in the groove under the condition that the housing covers the functional device.

According to an electronic apparatus provided by an embodiment of the present application, a heat transfer layer is provided between the functional device and the casing.

In the embodiment of the application, the second chamber is in contact with the heat source, the liquid medium in the second chamber is heated and converted into vapor, the vapor enters the first chamber along the through hole on the heat insulation layer, the vapor is condensed into liquid water under the action of compressed gas in the first chamber, the liquid conveying piece conveys the liquid water in the first chamber into the second chamber, the heat of the heat source is continuously absorbed through the processes of cyclic heating vaporization and pressurized condensation, the heat of the heat source is transferred into the second chamber and finally diffused into the air along the cavity wall of the first chamber, and the heat dissipation efficiency is high.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;

fig. 2 is a second schematic structural diagram of a heat dissipation device according to an embodiment of the present application;

reference numerals are as follows:

1: a first chamber; 2: a thermal insulation layer;

3: a second chamber; 4: a pneumatic valve;

5: a compressor; 6: a heat dissipation layer;

7: a capillary tube; 8: a hydrophilic layer;

9: a circuit board; 10: a functional device;

11: a heat transfer layer.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The mobile phone heat dissipation mode in the prior art mainly comprises three modes of natural heat dissipation, graphene heat dissipation and heat pipe heat dissipation.

The natural heat dissipation is that components or circuit boards dissipate heat to the surrounding air through self heat transfer, and with the development of the 5G technology and the use of a large number of high-power heating elements, the heat generated by the components is transferred to the circuit boards in a large amount, and the heat dissipation effect is poor because the components or the circuit boards directly dissipate heat.

Graphite heat conduction sticker dispels the heat through setting up graphite heat conduction sticker in that the cell-phone is inside, and CPU is kept away from to graphite heat conduction sticker, and the heat is very low from CPU's efficiency of reaching graphite heat conduction sticker, leads to a large amount of heats and can not in time spill, causes the cell-phone to go up the heat easily and gathers, and the part is generated heat obviously.

The heat pipe is used for heat dissipation, a heat pipe is arranged in the mobile phone, liquid is arranged in the heat pipe, and the liquid absorbs heat and evaporates when the mobile phone generates heat, then is slowly conducted to the other section to continuously flow back and repeat the whole heat absorption and heat release process to cool the mobile phone. The heat pipe occupies the space of the mobile phone, and when all the liquid is boiled and vaporized, the heat transfer energy is reduced.

In order to solve the above problems, the heat dissipating device of the present application is described below with reference to fig. 1 and 2.

As shown in fig. 1, the heat dissipation device according to the embodiment of the present application includes: the casing, insulating layer 2 and liquid transport.

The thermal insulation layer 2 is arranged in the shell, the shell is divided into a first chamber 1 and a second chamber 3 by the thermal insulation layer 2, and the thermal insulation layer 2 is provided with a through hole.

The first chamber 1 is filled with compressed gas, the second chamber 3 is filled with liquid medium, and the second chamber 3 is used for being in contact with a heat source;

the liquid conveying member is arranged around the inner wall of the shell, is communicated with the first cavity 1 and the second cavity 3, and is used for conveying liquid water converted from water vapor in the first cavity 1 to the second cavity 3.

Specifically, the shape of the housing may be square, circular, annular, etc., the shape of the housing is not particularly limited, and the material of the housing may be metal. The heat insulation layer 2 is connected with the inner wall of the shell, a plurality of through holes penetrating through the two opposite surfaces are formed in the heat insulation layer 2, the size of each through hole is suitable for steam to pass through, and the number of the through holes is not particularly limited.

The thermal insulation layer 2 divides the housing into two chambers, referred to as a first chamber 1 and a second chamber 3, respectively, the first chamber 1 is filled with a compressed gas, which may be an inert gas. The second chamber 3 is filled with a liquid medium, the liquid medium is a volatile liquid, for example, the liquid medium may be water, and the second chamber 3 and the heat source may be fixedly connected by a bonding method, a welding method, a screwing method, or the like according to specific use conditions.

The liquid transport element may extend through the insulating layer 2 or a gap for arranging the liquid transport element may be provided at the edge of the insulating layer 2. Liquid transport element the first chamber 1 communicates with the second chamber 3 and the liquid transport element may have a certain driving force for transporting liquid water converted from water vapor in the first chamber 1 into the second chamber 3.

The following is a detailed description of the operation of the heat sink.

The outer wall of second chamber 3 contacts with the heat source, and it has volatile liquid to fill in the second chamber 3, and the temperature rise turns into vapor after volatile liquid is heated, and volatile liquid absorbs the heat of heat source at the in-process that is heated the vaporization.

The water vapor enters the first chamber 1 along the through holes on the heat insulation layer 2, the first chamber 1 is filled with compressed gas, the compressed gas enables the first chamber 1 to be in a high pressure state, the water vapor is condensed into liquid water under the action of the compressed gas, the water vapor releases heat in the process of converting the water vapor into the liquid water, and the heat is diffused into surrounding air along the cavity wall of the first chamber 1.

The shell is divided into two chambers by the heat insulating layer 2, so that heat of the second chamber 3 can be prevented from entering the first chamber 1, the first chamber 1 is prevented from being too high in temperature, and the first chamber 1 is not beneficial to converting water vapor into liquid water due to the fact that the first chamber 1 is too high in temperature.

The volume of the first chamber 1 may be larger than the volume of the second chamber 3, so that the heat released by the water vapor during the conversion into liquid water has sufficient space to dissipate the heat, so that the heat can be sufficiently diffused into the surrounding air along the wall of the first chamber 1.

The liquid conveying piece conveys the liquid water subjected to pressure condensation of the water vapor into the second chamber 3, the liquid water continuously absorbs the heat of the heat source through the circulation of the processes of heated vaporization and pressure condensation, the heat of the heat source is transferred into the second chamber 3 and finally diffused into the air along the wall of the first chamber 1, and therefore high-efficiency heat dissipation of the heat source is achieved, the temperature of the heat source is reduced, and the using performance of the heat source is ensured.

In this application embodiment, the liquid medium in the second cavity 3 is heated and turns into vapor, vapor gets into first cavity 1 along the through-hole on the insulating layer 2, vapor condenses to liquid water under the effect of compressed gas in first cavity 1, liquid transport piece carries the liquid water in with first cavity 1 to the second cavity 3 in, liquid water is heated the vaporization through the circulation, the process of pressurized condensation, constantly absorb the heat of heat source, spread the heat transfer of heat source to the second cavity 3 in and finally along the chamber wall of first cavity 1 to the air, heat abstractor simple structure, and the radiating efficiency is high.

In an alternative embodiment, the heat sink further comprises a gas compression device in communication with the first chamber 1 for compressing the gas in the first chamber 1.

Specifically, the gas compression device comprises a gas pressure valve 4 and a compressor 5, wherein the gas pressure valve 4 is communicated with the cavity wall of the first cavity 1, the compressor 5 is communicated with the gas pressure valve 4, and the compressor 5 is communicated with the first cavity 1 through the gas pressure valve 4.

The water vapour entering the first chamber 1 needs to be condensed into liquid water by the compressed gas, and the water vapour releases heat during the conversion into liquid water, and the heat is diffused from the chamber wall of the first chamber 1 into the surrounding air. The compressor 5 compresses the gas in the first chamber 1, so that the pressure of the first chamber 1 is always in a pressure state required by the conversion of water vapor into liquid water, the stability of the circulation process of heated vaporization and pressurized condensation of the liquid medium is ensured, and the heat radiation performance of the heat radiation device is further improved.

In the embodiment of the application, the gas in the first chamber 1 is compressed by the gas compression device, so that the pressure in the first chamber 1 is always in a pressure state required by the conversion of water vapor into liquid water, the stability of the circulation process of heating vaporization and pressure condensation of a liquid medium is ensured, and the heat radiation performance of the heat radiation device is further improved.

In an optional embodiment, the heat dissipation device further includes a pressure detection component, the pressure detection component is disposed in the first chamber 1 and is configured to obtain a pressure value of the first chamber 1, and the gas compression device compresses the gas in the first chamber 1 when the pressure value is smaller than a target pressure value.

Specifically, the pressure detection component may be a pressure sensor, the pressure sensor is disposed in the first chamber 1, and is configured to detect a pressure value of the first chamber 1, define a pressure value required for converting water vapor into liquid water as a target pressure value, and when the pressure value is smaller than the target pressure value, the compressor 5 is started, so that the pressure value in the first chamber 1 is equal to or greater than the target pressure value, thereby making the pressure in the first chamber 1 in a pressure state required for converting water vapor into liquid water, ensuring stability of a cyclic process in which a liquid medium is heated, vaporized and condensed under pressure, and further improving stability of heat dissipation performance of the heat dissipation device.

In the process that the compressor 5 compresses the gas in the first chamber 1, if the pressure value detected by the pressure sensor is greater than the rated pressure value, the compressor 5 is closed, the compression of the gas in the first chamber 1 is stopped, the rated pressure value is greater than the target pressure value, the rated pressure value is set according to the specific use environment, and the rated pressure value is not specifically limited.

In an optional embodiment, the pressure sensor and the compressor 5 may be in communication connection with a controller, the pressure sensor detects a pressure value of the first chamber 1, the controller compares the pressure value with a target pressure value, the controller sends a start signal to the compressor 5 when the pressure value is smaller than the target pressure value, the compressor 5 starts to compress gas in the first chamber 1, so that the pressure value in the first chamber 1 is equal to or greater than the target pressure value, and thus the pressure in the first chamber 1 is in a pressure state required for converting water vapor into liquid water; when the pressure value is larger than the rated pressure value, the controller sends a closing signal to the compressor 5, and the compressor 5 is closed to stop compressing the gas in the first chamber 1.

In the embodiment of the present application, the pressure detecting component is disposed in the first chamber 1 and configured to detect a pressure value of the first chamber 1, and when the pressure value is smaller than a target pressure value, the compressor 5 is started to compress the gas in the first chamber 1; under the condition that the pressure value is greater than the rated pressure value, the compressor 5 is closed, the gas in the first chamber 1 is stopped being compressed, the pressure in the first chamber 1 is always in the pressure state required by the steam to be converted into the liquid water, the stability of the circulation process of the liquid medium which is heated, vaporized and condensed under pressure is ensured, and the stability of the heat dissipation performance of the heat dissipation device is further improved.

In an alternative embodiment, the liquid transport member is a capillary tube 7, and the liquid transport member sequentially fits the inner wall of the first chamber 1 and the inner wall of the second chamber 3, and is connected end to form a closed loop.

That is, part of the liquid transport member is located in the first chamber 1 and the remaining part of the liquid transport member is located in the second chamber 3.

As shown in fig. 2, specifically, the liquid conveying element is a capillary 7, the piping shape of the capillary 7 is set according to the shape of the cavity walls of the first cavity 1 and the second cavity 3, the capillary 7 is connected end to form a closed loop, a part of the pipe section of the capillary 7 is located in the first cavity 1, and another part of the pipe section of the capillary 7 is located in the second cavity 3. A plurality of capillaries 7 can be arranged at intervals in the housing.

The outer wall of second cavity 3 contacts with the heat source, liquid medium turns into vapor after being heated in the second cavity 3, vapor gets into first cavity 1 along the through-hole on the insulating layer 2, first cavity 1 is filled with compressed gas, vapor condenses to liquid water under compressed gas's effect, liquid water in first cavity 1 along capillary 7's pipe wall infiltration capillary 7 inside, later flow back to second cavity 3 along capillary 7 under the drive of capillary force, capillary 7 makes the process that liquid water flows back to second cavity 3 swift more, and capillary 7 simple structure.

The liquid water flowing back to the second chamber 3 circulates the heated vaporization and pressurized condensation process, continuously absorbs the heat of the heat source, transfers the heat of the heat source into the second chamber 3 and finally diffuses into the air along the chamber wall of the first chamber 1, so that the high-efficiency heat dissipation of the heat source is realized, and the heat dissipation efficiency is improved.

In the embodiment of the present application, the capillary tube 7 enables the liquid water condensed by vapor under pressure in the first chamber 1 to rapidly flow back to the second chamber 3, and the liquid water flowing back to the second chamber 3 is heated, vaporized and condensed under pressure, so as to continuously absorb the heat of the heat source, transfer the heat of the heat source into the second chamber 3 and finally diffuse the heat into the air along the wall of the first chamber 1, thereby improving the heat dissipation efficiency of the heat dissipation device.

In an alternative embodiment the inner wall of the second chamber 3 that is in contact with the liquid transport member is provided with a hydrophilic layer 8.

As shown in fig. 2, specifically, the liquid transport member may be a capillary tube 7, and the hydrophilic layer 8 may be a sponge-like hydrophilic resin which is attached to the inner wall of the second chamber 3 while being in contact with the wall of the capillary tube 7 in the second chamber 3.

The spongy hydrophilic resin has good hydrophilicity, liquid water in the first cavity 1 permeates the capillary 7 along the tube wall of the capillary 7, then flows back to the second cavity 3 along the capillary 7 under the driving of capillary force, the spongy hydrophilic resin is contacted with the tube wall of the capillary 7 in the second cavity 3, the liquid water in the capillary 7 in the second cavity 3 can be prevented from flowing back to the first cavity 1, the liquid water in the first cavity 1 smoothly flows back to the second cavity 3 along the capillary 7, the heated vaporization of the liquid water and the circulating process of pressurized condensation can be smoothly carried out, and the stability of the heat dissipation performance of the heat dissipation device is further improved.

In this application embodiment, spongy hydrophilic resin laminates with the inner wall of second chamber 3 mutually, adsorb near the inner wall of second chamber 3 with liquid medium, the heat of the liquid medium heat source of being convenient for, spongy hydrophilic resin contacts with the pipe wall of capillary 7, can prevent that the inside liquid water of capillary 7 in the second chamber 3 from taking place to fall the perfusion to first chamber 1 in, ensure the vaporization of being heated of liquid water, the cyclic process of pressurized agglomeration can go on smoothly, heat abstractor's stability of heat dispersion has been improved.

In an alternative embodiment, the liquid medium comprises ethanol.

Specifically, the liquid medium in the second chamber 3 may be a mixed liquid of water and ethanol, the water and the ethanol are volatile liquids, the boiling point of the water is 100 ℃, the boiling point of the ethanol is 78 ℃, and a proper amount of ethanol is added into the water, so that the boiling point of the liquid medium can be reduced, and the water can be heated and vaporized at a lower temperature.

The outer wall of the second chamber 3 is in contact with a heat source, mixed liquid of water and ethanol in the second chamber 3 can be converted into water vapor at a lower temperature after being heated, the water vapor enters the first chamber 1 along the through holes on the heat insulation layer 2, the water vapor is condensed into liquid water under the action of compressed gas, the liquid water in the first chamber 1 permeates into the capillary 7 along the tube wall of the capillary 7, and then the liquid water flows back to the second chamber 3 along the capillary 7 under the driving of capillary force.

The liquid water flowing back to the second chamber 3 circulates through the above processes of heating vaporization and pressure condensation, continuously absorbs the heat of the heat source, transfers the heat of the heat source into the second chamber 3 and finally diffuses into the air along the chamber wall of the first chamber 1, so that the heat dissipation of the heat source is accelerated, and the heat dissipation efficiency of the heat dissipation device is improved.

In the embodiment of the application, the liquid medium comprises ethanol, the boiling point of the ethanol is low, the boiling point of the liquid medium can be reduced by adding a proper amount of ethanol into water, the liquid medium in the second chamber 3 can be converted into water vapor at a lower temperature after being heated, and the processes of heating vaporization and pressure condensation of the liquid medium are accelerated, so that the heat dissipation of a heat source is accelerated, and the heat dissipation efficiency of the heat dissipation device is improved.

In an alternative embodiment the housing is provided with a heat sink layer 6 at a location corresponding to the first chamber 1.

Specifically, the heat dissipation layer 6 may be a heat dissipation film having a function of rapidly transferring heat, and the heat dissipation film may be a natural graphite heat dissipation film, an artificial graphite heat dissipation film, or a nanocarbon heat dissipation film, wherein the artificial graphite heat dissipation film and the nanocarbon heat dissipation film have a small thickness, which may satisfy the demand of a light and thin design.

The heat dissipation film is adhered to the outer wall of the first cavity 1, water vapor in the second cavity 3 enters the first cavity 1 along the through hole in the heat insulation layer 2, the water vapor is condensed into liquid water under the action of compressed gas, the water vapor releases heat in the process of converting the water vapor into the liquid water, the heat in the first cavity 1 is diffused into the surrounding air through the cavity wall of the first cavity 1 and the heat dissipation film, therefore, the heat of a heat source sequentially passes through the second cavity 3, the first cavity 1 and the heat dissipation film are diffused into the surrounding air, the heat dissipation film accelerates the heat transfer, and the heat dissipation efficiency of the heat dissipation device is improved.

In this application embodiment, the heat dissipation film is pasted on the outer wall of the first chamber 1, and the heat of the heat source is diffused to the surrounding air through the second chamber 3, the first chamber 1 and the heat dissipation film in sequence, so that the heat dissipation film accelerates the heat transfer, and the heat dissipation efficiency of the heat dissipation device is improved.

The embodiment of the application also provides electronic equipment, which comprises a functional device 10, a circuit board 9 and the heat dissipation device;

the functional device 10 is provided on the circuit board 9, the functional device 10 corresponding to the second chamber 3 with the housing abutting against the functional device 10.

The functional device 10 may be any component capable of generating heat, such as a central processing unit, a power management unit, etc., and the functional device 10 is fixedly connected to the circuit board 9. The housing may be fixed to one surface of the functional device 10 by welding or screwing, and the functional device 10 corresponds to the second chamber 3.

The functional device 10 is in contact with the outer wall of the second chamber 3, heat is generated in the operation process of the functional device 10, mixed liquid of water and ethanol is filled in the second chamber 3, the water and the ethanol are heated and then converted into water vapor, and the water and the ethanol absorb the heat of the functional device 10 in the heating and vaporizing process.

The water vapor enters the first chamber 1 along the through holes on the heat insulation layer 2, the first chamber 1 is filled with compressed gas, the water vapor is condensed into liquid water under the action of the compressed gas, the water vapor releases heat in the process of converting into the liquid water, and the heat is diffused into the surrounding air through the cavity wall of the first chamber 1 and the heat dissipation film.

Liquid water condensed by vapor compression in the first cavity 1 flows back to the second cavity 3 along the capillary tube 7 under the driving of capillary force, the liquid water circulation that flows back to the second cavity 3 is heated and vaporized, the process of condensation by compression, constantly absorb the heat of the functional device 10, can prevent to influence the performance of the functional device 10 because of the temperature of the functional device 10 is higher, thereby improve the reliability of the functional device 10, and simultaneously, the heat on the functional device 10 is dissipated, the temperature of the functional device 10 is reduced, further, the surface temperature of the electronic equipment is reduced, thereby prevent the user from scalding the hand and other uncomfortable conditions in the process of using the electronic equipment, and further, the use experience of the user is improved.

In this application embodiment, electronic equipment includes functional device 10, circuit board 9 and heat abstractor, functional device 10 is fixed in on the circuit board 9, under the condition of casing with functional device 10 looks butt, functional device 10 contacts with the outer wall of second cavity 3, heat abstractor is heated the vaporization through the circulation, the process of pressurized condensation, constantly absorbs the heat of functional device 10, the reliability of functional device 10 has been improved, electronic equipment's surface temperature has been reduced simultaneously, user's use experience has been promoted.

In an alternative embodiment, the housing is provided with a recess in correspondence of the second chamber 3, in which recess the functional device 10 is located in case the housing covers the functional device 10.

As shown in fig. 1, in particular, one surface of the second cavity 3 is recessed inwards to form a groove, the groove can be formed by stamping or bending, and the size of the cavity surrounded by the groove walls of the groove is matched with the size of the functional device 10. The functional device 10 is fixed on the circuit board 9, the cavity wall of the second cavity 3 corresponding to the bottom of the groove can be connected to the circuit board 9 through tin soldering, and the functional device 10 is located in the cavity surrounded by the groove walls of the groove.

The functional device 10 generates heat in the operation process, and the heat dissipation device continuously absorbs the heat of the functional device 10 through the processes of cyclic heating vaporization and compression condensation, so that the use performance of the functional device 10 is ensured, the reliability of the functional device 10 is improved, the surface temperature of the electronic equipment is reduced, and the use experience of a user is improved.

The groove of the second chamber 3 and the circuit board 9 form a shielding space, the functional device 10 is located in the shielding space, and the heat dissipation device not only has a good heat dissipation effect on the functional device 10, but also can play a role in shielding radio frequency so as to shield electromagnetic interference signals and the like of other components on the functional device 10.

In this embodiment, one surface of the second cavity 3 is recessed inward to form a groove, the groove of the second cavity 3 and the circuit board 9 form a shielding space, the functional device 10 is located in the shielding space, and the heat dissipation apparatus can play a role in shielding radio frequency in addition to playing a good heat dissipation effect on the functional device 10, so as to shield electromagnetic interference signals and the like of other components on the functional device 10.

In an alternative embodiment, a heat transfer layer 11 is provided between the functional device 10 and the housing.

The heat transfer layer 11 can be made of heat conductive plastic, heat conductive silica gel or heat conductive gel with good heat transfer performance, the heat conductive silica gel is a very soft solid, is similar to sponge, can be directly attached to the upper part of a heat source, is in contact with the heat source for heat conduction, and has good adhesion to most of metal and non-metal materials. The heat-conducting gel is semisolid and is similar to a toothpaste, inherits the advantages of good affinity, high and low temperature resistance, good insulation property and the like of a silica gel material, has strong plasticity, can meet the filling of an uneven interface, and can meet the heat transfer requirements under various applications. The heat-conducting plastic is a plastic composite material compounded by adding heat-conducting metal oxide, graphite fiber or carbon fiber and the like into common plastic, so that the heat-conducting plastic has better heat conductivity.

Specifically, the heat conducting gel may be adhered to the surface of the functional device 10 or the outer wall of the second chamber 3 corresponding to the functional device 10, or the surface of the functional device 10 and the outer wall of the second chamber 3 corresponding to the functional device 10 may be adhered to the heat conducting gel at the same time.

The functional device 10 generates heat in the operation process, and the heat can be more rapidly and uniformly transferred to the second chamber 3 through the heat conducting gel, so that the processes of heating, vaporizing and pressurized condensing of the liquid medium are accelerated, the heat transfer is accelerated, and the heat dissipation efficiency of the heat dissipation device is improved.

In the embodiment of the present application, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like. The embodiment of the present application does not specifically limit the specific type of the electronic device. For convenience of description, the embodiments of the present application take an electronic device as an example of a mobile phone.

For example, the CPU is fixed on the circuit board 9, one surface of the second chamber 3 is recessed inward to form a groove, a cavity wall of the second chamber 3 corresponding to a bottom of the groove may be connected to the circuit board 9 by soldering, the groove of the second chamber 3 and the circuit board 9 form a shielding space, the CPU is located in the shielding space, and the shielding space formed by the groove and the circuit board 9 is filled with a heat-conducting gel.

When a large program is operated, the CPU can generate a large amount of heat, the heat is quickly and uniformly transferred to the second chamber 3 through the heat conducting gel, the mixed liquid of the water and the ethanol in the second chamber 3 is heated and vaporized to be converted into water vapor, and the water and the ethanol absorb the heat in the heating and vaporizing process.

The water vapor enters the first chamber 1 along the through holes on the heat insulation layer 2, the first chamber 1 is filled with compressed gas, the compressed gas enables the first chamber 1 to be in a high pressure state, the water vapor is condensed into liquid water under the action of the compressed gas, the water vapor releases heat in the process of being converted into the liquid water, and the heat is diffused into surrounding air through the chamber wall of the first chamber 1 and the heat dissipation film.

The air pressure valve 4 is communicated with the cavity wall of the first cavity 1, the compressor 5 is communicated with the air pressure valve 4, and the compressor 5 compresses the gas in the first cavity 1. The pressure detection component is arranged in the first chamber 1 and used for detecting the pressure value of the first chamber 1, and when the pressure value is smaller than the target pressure value, the compressor 5 is started to compress the gas in the first chamber 1, so that the pressure in the first chamber 1 is in a pressure state required by the water vapor to be converted into liquid water.

If the pressure value detected by the pressure detection part is greater than the rated pressure value, the compressor 5 is closed, and the compression of the gas in the first chamber 1 is stopped.

The spongy hydrophilic resin is attached to the inner wall of the second chamber 3, and at the same time, the spongy hydrophilic resin is in contact with the wall of the capillary tube 7 in the second chamber 3. Sponge hydrophilic resin laminates with the inner wall of second chamber 3 mutually, adsorb near the inner wall of second chamber 3 with liquid medium, be convenient for liquid medium absorbs CPU's heat, inside liquid water in the first chamber 1 along the pipe wall infiltration capillary 7 of capillary 7, later in the drive of capillary force flows back to second chamber 3 along capillary 7, sponge hydrophilic resin contacts with the pipe wall of capillary 7 in the second chamber 3, can prevent that the inside liquid water of capillary 7 in the second chamber 3 from taking place to fall the perfusion to first chamber 1 in, make liquid water in the first chamber 1 flow back smoothly to in the second chamber 3 along capillary 7.

The liquid hydrologic cycle of backward flow to in the second cavity 3 above-mentioned process that is heated vaporization, pressurized and condenses constantly absorbs CPU's heat, can prevent to influence CPU's performance because of CPU's temperature is higher, and simultaneously, CPU's heat is dispelled the back, and CPU's temperature reduces, has further reduced electronic equipment's surface temperature to prevent that uncomfortable circumstances such as scalding from appearing in user's the in-process using electronic equipment, promoted user's use and experienced.

The groove of the second chamber 3 and the circuit board 9 form a shielding space, the CPU is positioned in the shielding space, and the heat dissipation device not only has a good heat dissipation effect on the CPU, but also can play a role in shielding radio frequency so as to shield interference signals of other components to the CPU, such as electromagnetism and the like.

In the description herein, references to the description of the term "alternative implementations" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipating device, comprising: the device comprises a shell, a heat insulation layer and a liquid conveying piece;

the liquid conveying piece is arranged around the inner wall of the shell, is communicated with the first cavity and the second cavity and is used for conveying liquid water converted from water vapor in the first cavity into the second cavity;

the liquid conveying piece is sequentially attached to the inner wall of the first cavity and the inner wall of the second cavity and is connected end to form a closed loop.

2. The heat sink of claim 1, further comprising a gas compression device in communication with the first chamber for compressing gas within the first chamber.

3. The heat dissipation device of claim 2, further comprising a pressure detection component disposed in the first chamber for obtaining a pressure value of the first chamber, wherein the gas compression device compresses the gas in the first chamber when the pressure value is smaller than a target pressure value.

4. The heat sink of claim 1, wherein the liquid transport member is a capillary tube.

5. The heat dissipating device of claim 4, wherein an inner wall of the second chamber in contact with the liquid transport member is provided with a hydrophilic layer.

6. The heat dissipation device of claim 1, wherein the liquid medium comprises ethanol.

7. The heat dissipating device of claim 1, wherein the housing is provided with a heat dissipating layer at a position corresponding to the first chamber.

8. An electronic device, comprising: a functional device, a circuit board, and the heat dissipating apparatus according to any one of claims 1 to 7;

9. The electronic device according to claim 8, wherein the housing is provided with a recess at a position corresponding to the second chamber, and the functional device is located in the recess with the housing cover provided thereto.

10. The electronic apparatus according to claim 8, wherein a heat transfer layer is provided between the functional device and the casing.