CN107249284B - A kind of mobile terminal - Google Patents
A kind of mobile terminal Download PDFInfo
- Publication number
- CN107249284B CN107249284B CN201710566621.XA CN201710566621A CN107249284B CN 107249284 B CN107249284 B CN 107249284B CN 201710566621 A CN201710566621 A CN 201710566621A CN 107249284 B CN107249284 B CN 107249284B
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- mobile terminal
- metal layer
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
Abstract
The invention discloses a kind of mobile terminals, including display module, center, pcb board and the rear shell being cascading；Heat source part is provided between the center and the pcb board；The heat accumulation component for absorbing and storing the heat that the heat source part generates is provided between the display module and the center；The soaking radiation assembly that the heat for generating the heat source part is radiated to the rear shell is provided between the pcb board and the rear shell.Absorb and store heat by the heat accumulation component so that the temperature of mobile terminal will not suddenly change, the temperature rise for improving user experiences and guarantees that the hardware performance of mobile terminal is normal；By the soaking radiation assembly, so that uniformly being scattered after heat transfer to the soaking radiation assembly and being radiated to the rear shell, the radiating efficiency of mobile terminal is improved, so that the surface temperature of the mobile terminal be effectively reduced.
Description
Technical field
The present invention relates to field of electronic devices, and in particular to a kind of mobile terminal.
Background technique
With the development of electronic technology, the gradually steering of the mobile terminals such as mobile phone, tablet computer is lightening, mobile terminal
The distance between hardware is smaller and smaller, causes heat-dissipating space also smaller and smaller, influences the radiating efficiency of mobile terminal.It is mobile simultaneously
The hardware of terminal constantly upgrades, performed by calculation processing it is also more many and diverse, the radiating efficiency of mobile terminal will directly affect
The performance of its hardware, to influence user to the experience sense of mobile terminal.
In order to improve the heat dissipation problem of mobile terminal, currently, graphite flake, thermally conductive gel, heat conductive silica gel are widely used in
In the design of mobile terminal.For example, graphite flake and foam are pasted among LCM and metal center, in euthermic chip and metal center
Between fill thermally conductive gel or heat conductive silica gel.Although existing heat sink conception can improve to a certain degree dissipating for mobile terminal
The thermal efficiency, but the radiating requirements of the mobile terminal increasingly developed are not able to satisfy, therefore, how to further increase mobile terminal
Radiating efficiency be current those skilled in the art technical problem urgently to be resolved.
Summary of the invention
Existing heat sink conception only considered the heat accumulation under the conditions of the thermally conductive variable working condition without consideration of mobile terminal, and lead
The thermal efficiency is not high, results in heat in the short time and rapidly gathers in the inside of mobile terminal, on the one hand, so that the table of mobile terminal
Face temperature increases suddenly, to influence the temperature rise experience of user；On the other hand, so that the temperature of euthermic chip sharply increases, hold
The easily frequency reducing strategy of triggering system, influences the hardware performance of mobile terminal.Secondly, although graphite flake or copper foil have good lead
Thermal energy power can scatter the even heat that euthermic chip generates, and still, the radianting capacity of graphite flake or copper foil is poor, so that
Cannot effectively heat be radiate by being transmitted to graphite flake or copper foil, so that the surface temperature of mobile terminal increases.
The object of the present invention is to provide a kind of mobile terminals with absorb heat heat accumulation and thermal radiation function, so that mobile
The temperature of terminal will not suddenly change, guarantee that the hardware performance of mobile terminal is normal, while reducing the surface temperature of mobile terminal.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of mobile terminal, aobvious including what is be cascading
Show module, center, pcb board and rear shell；Heat source part is provided between the center and the pcb board；The display module and
The heat accumulation component for absorbing and storing the heat that the heat source part generates is provided between the center；The pcb board and institute
It states and is provided with the soaking radiation assembly that the heat for generating the heat source part is radiated to the rear shell between rear shell.
Preferably, the mobile terminal further includes the first heat-conductive assembly and the second heat-conductive assembly, first heat-conductive assembly
It is arranged on the surface of the heat source part, and between the heat source part and the center；The second heat-conductive assembly filling
In gap between the pcb board and the heat source part.
Preferably, the heat accumulation component includes the first metal layer, heat-absorbing paint layer, second metal layer and thermally conductive package
Layer；The first metal layer and the second metal layer are separately positioned on the upper and lower surface of the heat-absorbing paint layer；It is described thermally conductive
Wrapping layer wraps up the first metal layer, the heat-absorbing paint layer and the second metal layer；Wherein described first
Metal layer is located at the side of the display module；The second metal layer is located at the side of the center.
Preferably, the thermally conductive wrapping layer includes the first pet layer and the second pet layer；First pet layer is arranged in institute
It states on the first metal layer；Second pet layer is arranged in the second metal layer；The edge of first pet layer with it is described
The edge of second pet layer bonds so that the thermally conductive wrapping layer wrap up the first metal layer, the heat-absorbing paint layer and
The second metal layer.
Preferably, the second metal layer includes two layers of layers of copper being stacked or the layers of copper being stacked and aluminium layer.
Preferably, the colloid for the heat accumulation component to be bonded to the center is additionally provided on the thermally conductive wrapping layer
Layer.
Preferably, shielding part is provided between the pcb board and the soaking radiation assembly.
Preferably, the soaking radiation assembly includes being cascading from the pcb board to the direction of the rear shell
Metal layer, graphene layer and heat radiation layer.
Preferably, the soaking radiation assembly further includes setting on the metal layer for bonding with the shielding part
Colloid layer.
Preferably, the soaking radiation assembly further includes release film layer, and the release film layer is arranged on the colloid layer.
Compared with prior art, a kind of beneficial effect of mobile terminal provided in an embodiment of the present invention is: the movement
Terminal includes the display module being cascading, center, pcb board and rear shell；It is arranged between the center and the pcb board
There is heat source part；The heat for absorbing and storing the heat source part generation is provided between the display module and the center
Heat accumulation component；Heat for generating the heat source part is provided between the pcb board and the rear shell to the rear shell spoke
The soaking radiation assembly penetrated.Heat is absorbed and stored by the heat accumulation component, it is whole in movement that heat in the short time can be reduced
The risk that the inside at end is rapidly gathered so that the temperature of mobile terminal will not suddenly change, improve user temperature rise experience simultaneously
Guarantee that the hardware performance of mobile terminal is normal；The soaking radiation assembly has stronger thermal radiation capability, and the heat source part produces
Raw heat transfer is to the soaking radiation assembly and is uniformly scattered, while the soaking radiation assembly can effectively will be warm
It measures and is radiated to the rear shell, the radiating efficiency of mobile terminal is improved, so that the surface temperature of the mobile terminal be effectively reduced.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of mobile terminal provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of heat accumulation component provided in an embodiment of the present invention；
Fig. 3 is the schematic diagram of soaking radiation assembly provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, it is a kind of schematic diagram of mobile terminal, the mobile terminal provided by one embodiment of the invention
Including display module 1, center 2, pcb board 3 and the rear shell 4 being cascading；Heat source is provided between center 2 and pcb board 3
Part 5；The heat accumulation component 6 of the heat for absorbing and storing the generation of heat source part 5 is provided between display module 1 and center 2.Heat accumulation
Component 6 has the function of heat absorption, thermally conductive, soaking, thermal diffusion, heat accumulation, and thermal equilibrium temperature can be effectively reduced, delay thermal balance fast
Degree, to reduce the temperature of the mobile terminal.
Further, it is provided with what the heat for generating heat source part 5 was radiated to rear shell 4 between pcb board 3 and rear shell 4
Soaking radiation assembly 7.Heat radiation component 7 has good capacity of heat transmission and surface thermal radiation capability, can be effectively by heat
It uniformly scatters and radiates to rear shell 4, so that the surface temperature of the mobile terminal be effectively reduced.
Wherein, display module 1 includes the TP (Touch Panel, touch screen) and LCM (Liquid being stacked
Crystal Module, LCD MODULE), the LCM is arranged between the TP and center 2.
In an alternative embodiment, shielding part 8 is provided between pcb board 3 and soaking radiation assembly 7.
In an alternative embodiment, the mobile terminal further includes the first heat-conductive assembly 9 and the second heat-conductive assembly 10；
First heat-conductive assembly 9 is arranged on the surface of heat source part 5, and between heat source part 5 and center 2；Second heat-conductive assembly 10 is filled out
It fills in the gap between pcb board 3 and heat source part 5.By the first heat-conductive assembly 9 and the second heat-conductive assembly 10, so that heat source part 5
Package surface and bottom can radiate simultaneously, can more efficiently reduce the temperature and mobile terminal of heat source part 5
Surface temperature optimizes the temperature rise of the touch screen side, avoids the earpiece area temperature positioned at the touch screen side excessively high, thus shadow
Ring user's communication experience.
Wherein, the first heat-conductive assembly 9 is filled into the heat source part by needle-based dispensing or injecting type mode for dispensing glue
Surface.Second heat-conductive assembly 10 is filled into bottom and the pcb board of heat source part 5 by needle-based dispensing or injecting type mode for dispensing glue
In 3 gap, solder ball can be reduced by filling the second heat-conductive assembly 10 in the bottom of heat source part 5 and the gap of pcb board 3
Between the air gap bring thermal resistance, the heat that heat source part 5 is distributed effectively conducts to pcb board 3, and laterally expands
It scatters and, while one layer of flawless Underfill layer can be formed, the thermal expansion due to heat source part 5 and pcb board 3 can be effectively reduced
Coefficient mismatch or external force caused by impact, reduce pcb board 3 deformation occurs risk, 5 knot of heat source part can also be effectively reduced
Temperature inhibits influence of the high temperature frequency reducing to the performance of mobile terminal hardware.The use of first heat-conductive assembly 9 and the second heat-conductive assembly 10
Temperature is between -40 DEG C to 120 DEG C.
In an alternative embodiment, the first heat-conductive assembly 9 and the second heat-conductive assembly 10 by binder and are led respectively
Hot filler is prepared.Preferably, the binder uses epoxy resin, and the heat-conducting filler uses nano-scale copper powder.
The epoxy resin has the viscosity such as middle and high, and in the case where mobile terminal fever, is also able to maintain that higher viscosity.The
One heat-conductive assembly 9 and the second heat-conductive assembly 10 all have excellent heating conduction and insulation performance.Preferably, the first heat-conductive assembly
9 and second the thermal coefficient of heat-conductive assembly 10 be not less than 1W/mK.
Referring to Fig. 2, it is the schematic diagram of the heat accumulation component in Fig. 1, the heat accumulation component includes the first metal layer 61, inhales
Hot dope layer 62, second metal layer 63 and thermally conductive wrapping layer 64；The first metal layer 61 is separately positioned on second metal layer 63
The upper and lower surface of heat-absorbing paint layer 62；Thermally conductive wrapping layer 64 is by the first metal layer 61, heat-absorbing paint layer 62 and second metal layer
63 wrap up；Wherein 61 layers of the first metal side positioned at the display module；Second metal layer 63 is located at the center
Side.Preferably, the thickness range of the heat accumulation component is 0.2mm to 0.4mm.
In an alternative embodiment, thermally conductive wrapping layer 64 includes the first PET (Polyethylene
Terephthalate, polyethylene terephthalate) layer 64a and the second pet layer 64b；First pet layer 64a setting is the
On one metal layer 61；Second pet layer 64b is arranged in second metal layer 63；The edge and the second pet layer of first pet layer 64a
The edge of 64b bonds, so that thermally conductive wrapping layer 64 wraps up the first metal layer 61, heat-absorbing paint layer 62 and second metal layer
63.Preferably, the thickness of the first pet layer 64a and the second pet layer 64b are 0.01mm.Wherein, the first pet layer 64a and second
Pet layer 64b have lower gas, vapor permeability and excellent high- and low-temperature resistance performance, can barrier gas and water, oil and
Own mechanical performance is kept while peculiar smell under the conditions of high and low temperature.Pass through the envelope of the first pet layer 64a and the second pet layer 64b
Side processing prevents heat-absorbing paint layer 62 from revealing so that heat-absorbing paint layer 62 is sealed.Wherein, the first metal layer 61 and
Two metal layers 63 play a supporting role to heat-absorbing paint layer 62, further by thermally conductive wrapping layer 64 wrap up the first metal layer 61,
Heat-absorbing paint layer 62 and second metal layer 63, which are formed, has the figurate heat accumulation component, avoids due to heat-absorbing paint layer
62 form is uncertain to cause the shape of the heat accumulation component to change, to be unfavorable for the heat accumulation component in mobile terminal
In application.
In an alternative embodiment, the first metal layer 61 and second metal layer 63 are all made of layers of copper.
In an alternative embodiment, second metal layer 63 includes two layers of layers of copper being stacked or is stacked
Layers of copper and aluminium layer.Second 64b layers of metal is located at close to the side of the center, by two layers of setting of layers of copper or is stacked
Layers of copper and aluminium layer, more efficiently by heat absorption that the heat source part is transmitted to the center and heat-absorbing paint can be oriented to
Layer 62.
Preferably, the layers of copper uses C1100 red copper, and thickness range is 0.025mm to 0.1mm；The aluminium layer uses
A1050 aluminium, thickness range are 0.025mm to 0.1mm.
In an alternative embodiment, it is additionally provided on thermally conductive wrapping layer 64 for the heat accumulation component to be bonded to institute
State the colloid layer 65 of center.Specifically, the side of colloid layer 65 is pasted on the second pet layer 64b, and the other side is pasted onto described
On frame.Preferably, colloid layer 65 with a thickness of 0.005mm.
In an alternative embodiment, colloid layer 65 uses pressure sensitive adhesive or conducting resinl.Wherein the pressure sensitive adhesive has
The characteristic of aggressive tack and permanent adhesive can be pasted onto what the heat accumulation component fastened on the center；The conducting resinl tool
There is certain viscosity, while can play the role of preventing electromagnetic interference.
In an alternative embodiment, the thermal capacity of material used by heat-absorbing paint layer 62 is not less than 300J/K.Into
One step, the thermal coefficient of material used by heat-absorbing paint layer 62 is in 0.1W/mK between 1W/mK.
In an alternative embodiment, heat-absorbing paint layer 62 is using distilled water or by phase changing resin and copper powder mixing system
Heat conductive phase change material made of standby.Preferably, the thickness range of heat-absorbing paint layer 62 is 0.1mm to 0.3mm.The distilled water or
The heat conductive phase change material generates phase transformation after absorbing certain heat, heat storage is got up by phase transition process, so that heat
It transmits after being transmitted to the heat accumulation component not directly to the display module, but is got up by the heat accumulation component storage, thus
So that the surface temperature of mobile terminal will not increase suddenly, simultaneously as the temperature of the heat source part will not be increased sharply, thus
The frequency reducing strategy of system will not be triggered, and then does not interfere with the hardware performance of mobile terminal.
Referring to Fig. 3, it is the schematic diagram of soaking radiation assembly in Fig. 1, the soaking radiation assembly includes from the PCB
Metal layer 71, graphene layer 72 and the heat radiation layer 73 that the direction of plate to the rear shell is cascading.Due to graphene
For single layer atomic structure, so that the capacity of heat transmission with super strength of graphene layer 72, the thermal coefficient of graphene layer 72 are greater than or wait
In 5000W/mK.Preferably, metal layer 71 uses layers of copper, and the thickness of metal layer 71 is set as 0.05mm.Graphene layer 72 passes through
Chemical vapour deposition technique is formed in 71 surface of metal layer, and metal layer 71 plays a supporting role to graphene layer 72, while can be
Radiating efficiency is further increased on the basis of the heat dissipation of graphene layer 72.It can be effectively by heat by metal layer 71 and graphene layer 72
It uniformly spreads out and is transmitted to heat radiation layer 73, heat is radiate by heat radiation layer 73 to the rear shell.
In an alternative embodiment, the soaking radiation assembly further include be arranged on the metal layer 71 for
The colloid layer 74 that shielding part 7 bonds.Preferably, colloid layer 74 is made using double-sided adhesive, and the thickness of colloid layer 74 is set as
0.025mm。
In an alternative embodiment, the soaking radiation assembly further includes release film layer 75, and release film layer 75 is arranged
On the colloid layer 74.Release film layer 75 plays a protective role to colloid layer 74, and the pollutants such as dust is avoided to be adsorbed onto colloid
74 surface of layer, influence the bonding effect of colloid layer 74.
In an alternative embodiment, the thickness of the soaking radiation assembly is arranged in 0.15mm between 0.25mm.
In an alternative embodiment, heat radiation layer 73 is nanometer carbon coating.Preferably, the thickness of the nanometer carbon coating
Degree is set as 0.025mm.The nanometer carbon coating has stronger radianting capacity, can be to the heat for being transmitted to heat radiation layer 73
It is effectively radiated to the rear shell, avoids the accumulation of heat, radiating efficiency is improved, to reduce the surface temperature of mobile terminal.
In an alternative embodiment, the heat emissivity coefficient of heat radiation layer 73 is not less than 0.95.
Further, the mobile terminal can be mobile phone, tablet computer, notebook etc..The heat source part is heat generating core
Piece.
Compared with prior art, a kind of beneficial effect of mobile terminal provided in an embodiment of the present invention is: the movement
Terminal includes the display module being cascading, center, pcb board and rear shell；It is arranged between the center and the pcb board
There is heat source part；The heat for absorbing and storing the heat source part generation is provided between the display module and the center
Heat accumulation component；Heat for generating the heat source part is provided between the pcb board and the rear shell to the rear shell spoke
The soaking radiation assembly penetrated.Heat is absorbed and stored by the heat accumulation component, it is whole in movement that heat in the short time can be reduced
The risk that the inside at end is rapidly gathered so that the temperature of mobile terminal will not suddenly change, improve user temperature rise experience simultaneously
Guarantee that the hardware performance of mobile terminal is normal；The soaking radiation assembly has stronger thermal radiation capability, and the heat source part produces
Raw heat transfer is to the soaking radiation assembly and is uniformly scattered, while the soaking radiation assembly can effectively will be warm
It measures and is radiated to the rear shell, the radiating efficiency of mobile terminal is improved, so that the surface temperature of the mobile terminal be effectively reduced.
It is the preferred embodiment of the present invention above, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection scope.
Claims (9)
1. a kind of mobile terminal characterized by comprising display module, center, pcb board and the rear shell being cascading；
Heat source part is provided between the center and the pcb board；It is provided between the display module and the center for absorbing
And store the heat accumulation component for the heat that the heat source part generates；It is provided between the pcb board and the rear shell for will be described
The soaking radiation assembly that the heat that heat source part generates is radiated to the rear shell；The mobile terminal further includes the first heat-conductive assembly,
First heat-conductive assembly is arranged on the surface of the heat source part, and between the heat source part and the center；
The heat accumulation component includes the first metal layer, heat-absorbing paint layer, second metal layer and thermally conductive wrapping layer；First gold medal
Belong to layer and the second metal layer is separately positioned on the upper and lower surface of the heat-absorbing paint layer；The thermally conductive wrapping layer is by described
One metal layer, the heat-absorbing paint layer and the second metal layer wrap up；Wherein the first metal layer is located at described
The side of display module；The second metal layer is located at the side of the center.
2. mobile terminal as described in claim 1, which is characterized in that the mobile terminal further includes the second heat-conductive assembly, institute
It states in the gap that the second heat-conductive assembly is filled between the pcb board and the heat source part.
3. mobile terminal as described in claim 1, which is characterized in that the thermally conductive wrapping layer includes the first pet layer and the
Two pet layers；First pet layer is arranged on the first metal layer；Second pet layer is arranged in the second metal layer
On；The edge of the edge of first pet layer and second pet layer bonds, so that described in the thermally conductive wrapping layer package
The first metal layer, the heat-absorbing paint layer and the second metal layer.
4. mobile terminal as described in claim 1, which is characterized in that the second metal layer includes two layers of bronze medal being stacked
Layer or the layers of copper and aluminium layer being stacked.
5. mobile terminal as described in claim 1, which is characterized in that be additionally provided on the thermally conductive wrapping layer for will be described
Heat accumulation component is bonded to the colloid layer of the center.
6. mobile terminal as described in claim 1, which is characterized in that set between the pcb board and the soaking radiation assembly
It is equipped with shielding part.
7. mobile terminal as described in claim 1 or 6, which is characterized in that the soaking radiation assembly includes from the pcb board
Metal layer, graphene layer and the heat radiation layer being cascading to the direction of the rear shell.
8. mobile terminal as described in claim 1, which is characterized in that set between the pcb board and the soaking radiation assembly
It is equipped with shielding part；The soaking radiation assembly includes the metal being cascading from the pcb board to the direction of the rear shell
Layer, graphene layer and heat radiation layer；
The soaking radiation assembly further includes colloid layer of the setting on the metal layer for bonding with the shielding part.
9. mobile terminal as claimed in claim 8, which is characterized in that the soaking radiation assembly further includes release film layer, institute
Release film layer is stated to be arranged on the colloid layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710566621.XA CN107249284B (en) | 2017-07-12 | 2017-07-12 | A kind of mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710566621.XA CN107249284B (en) | 2017-07-12 | 2017-07-12 | A kind of mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107249284A CN107249284A (en) | 2017-10-13 |
| CN107249284B true CN107249284B (en) | 2019-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710566621.XA Expired - Fee Related CN107249284B (en) | 2017-07-12 | 2017-07-12 | A kind of mobile terminal |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107872944B (en) * | 2017-11-29 | 2019-09-06 | 东莞市鸿艺电子有限公司 | A kind of heat storage type temprature control method of mobile device |
| CN108770294A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of radiating subassembly and electronic device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203353019U (en) * | 2013-05-28 | 2013-12-18 | 东莞劲胜精密组件股份有限公司 | Graphene metal cooling fin and electronic product cooling structure |
| CN203968561U (en) * | 2014-06-25 | 2014-11-26 | 乐视致新电子科技（天津）有限公司 | A kind of heat abstractor and electronic equipment |
| WO2017080069A1 (en) * | 2015-11-11 | 2017-05-18 | 海能达通信股份有限公司 | Heat dissipation device of heating device, mobile terminal and heat radiation assembly ofpower amplifier |
| CN206212529U (en) * | 2016-10-21 | 2017-05-31 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
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Granted publication date: 20190712 |