CN206212529U - The thermal dispersant coatings structure of portable electronic devices - Google Patents
The thermal dispersant coatings structure of portable electronic devices Download PDFInfo
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- CN206212529U CN206212529U CN201621143955.3U CN201621143955U CN206212529U CN 206212529 U CN206212529 U CN 206212529U CN 201621143955 U CN201621143955 U CN 201621143955U CN 206212529 U CN206212529 U CN 206212529U
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- thermal dispersant
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Abstract
A kind of thermal dispersant coatings structure of portable electronic devices, including one be applied to portable electronic devices fore shell and rear shell, and fore shell it is corresponding with rear shell phase combination one component, it is characterised in that：Fore shell is coated with a heat conducting coating, shell is provided with a thermal dispersant coatings afterwards, so that the heat that electronic building brick thermal source is distributed, heat conducting coating through fore shell is diffused, uniformly dispersing is in whole cavity, heat exchange is carried out by the thermal dispersant coatings of rear shell and the external world again, so that fore shell is correspondingly formed a cooling system with rear shell phase.Whereby, relative to have DIE Temperature clearly to reduce, it is hot or when machine problem not result in body, and electronic equipment performance can be given full play to relatively, allows consumer to have more preferable man-machine experience.
Description
Technical field
The utility model is the thermal dispersant coatings structure about a kind of portable electronic devices, and espespecially a kind of transmission fore shell is led
Hot coating is diffused, and uniformly dispersing is in whole cavity, then thermal dispersant coatings by rear shell and the external world carry out heat exchange.
Background technology
, after via long-time use, are then locally there is superheating phenomenon in presently commercially available portable electronic devices, and this shows
As not only causing the reduction of electronic equipment performance, body is hot or when machine problem.
Secondary person, because the appearance and modeling requirement thickness of current portable electronic devices is excessively thin, space to be preserved is not to biography
Thermal convection current (obtaining convection current using fan) in system heat transfer method, so just only remaining heat transfer and heat radiation two ways can
It is employed, presently commercially available portable electronic devices are to utilize to be attached near heating sources mostly, such as high heat conduction such as graphite flake, Copper Foil
To reach radiating and cooling purpose, from commercially available Meizu, millet from the point of view of the brand large-screen mobile phone such as Huawei, has no significantly radiating drop to material
Temp effect, local temperature still remain high, the phenomenon not only cause electronic equipment performance reduction, body it is hot or when machine problem very
To making consumer's sense of touch temperature too high or even scalding user, consumer in more complaint.
As shown in figure 1, presently commercially available portable electronic devices 10 are generally after one, and shell 11 combines a fore shell 12, and in this
A circuit board 13 and a battery 14 are provided between shell 11 and the fore shell 12 afterwards, there are a core parts 14 on the circuit board 13, and
A display module 16 and a contact panel 17 are provided with the fore shell 12；However, portable electronic devices are after a long time use, by
In the heat that the electronic building brick thermal source (such as core parts 14, battery 15) is distributed, such as (such as high-performance of core parts 14
CPU produced used heat in) running, it is impossible to passed by effective manner, causes part superheating phenomenon occur, this phenomenon
It is not only that consumer brings the too high bad use feeling of sense of touch temperature, or even receives the arithmetic speed of portable electronic devices
It is to limitation or even excessively slow when the phenomenon of machine also happens occasionally.
Look into again, presently commercially available portable electronic devices are to attach the heat conduction materials high such as graphite flake 20 or Copper Foil in rear shell 11 mostly
Material, it is intended to the heat for being distributed the electronic building brick thermal source (such as core parts 14, battery 15), such as (example of core parts 14
Such as high-performance CPU) produced used heat in operation exhales by rear shell 11, to reach the purpose of radiating；But in fact, because
In view of heat-conduction even temperature concept, used heat cannot uniformly dispersing on the casing of portable electronic devices, therefore without significantly radiating
Local temperature arround effect, such as core parts 14 still remains high, and causes body hot or when machine problem, can only passively with
The efficiency of software reduction core parts 14, brings consumer and causes bad experience.
Therefore the present inventor conceives a kind of thermal dispersant coatings structure of portable electronic devices in view of problem points are above taken off, it is
The utility model problem to be solved.
Utility model content
For the heat of the operationally produced main heating source of the chip for solving portable electronic devices causes electronic equipment
The problem that can be reduced, the utility model provides a kind of thermal dispersant coatings structure of portable electronic devices, DIE Temperature is had clearly
Reduce, it is hot or when machine problem not result in body, and electronic equipment performance can be given full play to relatively, allows consumer to have preferably
Man-machine experience；It is different from market and attaches radiating thin film manner, the maximum area of dissipation under product structure complexity is overcome, with system
Make convenient and can avoid producing the effect for cutting waste material.
The utility model solves the technical scheme that its technical problem used：
A kind of thermal dispersant coatings structure of portable electronic devices, including：One be applied to portable electronic devices fore shell and
Shell, and the fore shell afterwards is corresponding with rear shell phase to combine a component, and in the cavity of the rear shell and the fore shell, and the fore shell top
Face is provided with predetermined electronic building brick, it is characterised in that：The fore shell is coated with a heat conducting coating, and the rear shell is provided with a thermal dispersant coatings, with
The heat for being distributed the electronic building brick thermal source, the heat conducting coating through the fore shell is diffused, and uniformly dispersing is in whole cavity
It is interior, then thermal dispersant coatings by the rear shell and the external world carry out heat exchange, so that fore shell is correspondingly formed a cooling system with rear shell phase.
According to feature is preceding taken off, the heat conducting coating is coated with high conductivity material, spraying or electroforming are on the top of the fore shell
The conductive structure layer that face and bottom surface any of which face or two faces are constituted.
According to feature is preceding taken off, the thermal dispersant coatings are coated with high-cooling property material, spraying or electroforming are on the top of the rear shell
The radiator structure layer that face is constituted.
According to feature is preceding taken off, the electronic building brick includes the circuit board and battery that are arranged between the rear shell and the fore shell, should
There are core parts, the electronic building brick also includes being arranged at the display module and contact panel of the fore shell top surface on circuit board.
By technological means is above taken off, the utility model makes the fore shell be correspondingly formed an effective radiating system with the rear shell phase
System, the heat that thermal source produced by solution portable electronic devices is distributed, via heat conduction and thermal dispersant coatings structure, does not result in housing
The problem of hot-spot, the heat for solving the operationally produced main heating source of chip of portable electronic devices is passed through housing and is scalded
Hinder user, allow consumer to have more preferable man-machine experience.
The beneficial effects of the utility model are have DIE Temperature clearly to reduce, and do not result in body hot or when machine is asked
Topic, can give full play to electronic equipment performance relatively, allow consumer to have more preferable man-machine experience；It is different from market and attaches radiating
Thin film manner, overcomes the maximum area of dissipation under product structure complexity, with easy to make and can avoid producing what is cut waste material
Effect.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the decomposition texture schematic diagram of existing portable electronic devices.
Fig. 2 is decomposition texture schematic diagram of the present utility model.
Fig. 3 is structure cut-away view of the present utility model.
Label declaration in figure：
10A portable electronic devices
Shell after 11
12 fore shells
13 circuit boards
14 core parts
15 batteries
16 display modules
17 contact panels
18 cavitys
19 components
30 heat conducting coatings
40 thermal dispersant coatings
Specific embodiment
First, refer to shown in Fig. 2~Fig. 3, the thermal dispersant coatings structure of the utility model portable electronic devices 10A, wrap
Shell 11 combines a fore shell 12 after including one, and the fore shell 11 is corresponding with the rear shell 12 is combined into a component 19, and in the rear shell 11
In the cavity 18 of the fore shell 12, and the top surface of the fore shell 12 is provided with predetermined electronic building brick, in the present embodiment, the electronics group
Part includes the circuit board 13 being arranged between the rear shell 11 and the fore shell 12 and battery 15, has core parts on the circuit board 13
14, the electronic building brick also includes being arranged at the display module 16 and contact panel 17 of the top surface of fore shell 12.
And the utility model is characterized mainly in that：The fore shell 12 is coated with a heat conducting coating 30, and the rear shell 11 is provided with a radiating
Coating 40, so that the heat that the electronic building brick thermal source is distributed, the heat conducting coating 30 through the fore shell 12 is diffused, uniform to dissipate
Cloth carries out heat exchange in whole cavity 18, then by the thermal dispersant coatings 40 of the rear shell 11 and the external world so that the fore shell 12 with should
Shell 11 is corresponding afterwards forms a cooling system.
In the present embodiment, the heat conducting coating 30 is coated with high conductivity material, spraying or electroforming are in the fore shell 12
The conductive structure layer that top surface and bottom surface any of which face or two faces are constituted.The major function of heat conducting coating 30 is heat transfer work(
Can, its possible embodiments of heat-conductive coating one includes but does not limit：With the coating of high-cooling property material, spraying or electroforming before this
The radiator structure layer that the top surface of shell 12 is constituted.The coating of the heat conducting coating 30 is constituted to be included：With bamboo charcoal, carbon pipe, all types of stones
Ink, graphene microchip, Graphene, carbon ball, carbon fiber, boron nitride, aluminium nitride, mica, silica, titanium dioxide, carborundum,
The combination of zinc oxide, germanium oxide etc.；With selected from thinner, ethyl acetate, absolute ethyl alcohol, alcohols, ketone, esters or distilled water or
Heat-conductive coating is formed mixed by the combination of foregoing mixed solvent.
And the thermal dispersant coatings 40 are coated with high-cooling property material, spraying or electroforming are constituted in the top surface of the rear shell 11
Radiator structure layer.The coating of the thermal dispersant coatings 40 is constituted to be included：With bamboo charcoal, carbon pipe, all types of graphite, graphene microchip, stone
Black alkene, carbon ball, carbon fiber, boron nitride, aluminium nitride, mica, silica, titanium dioxide, carborundum, zinc oxide, germanium oxide etc.
Combination；With selected from thinner, ethyl acetate, absolute ethyl alcohol, alcohols, ketone, esters or distilled water or foregoing mixed solvent
Heat radiation coating is formed mixed by combination.
Based on above-mentioned composition, the fore shell 12 is corresponding with the rear shell 11 to form a cooling system, with the heat conduction of the fore shell 12
The uniformly dispersing of coating 30 carries out heat exchange in whole cavity 18, then by the structure of thermal dispersant coatings 40 of rear shell 11 and the external world, relatively
Can have chip core temperature clearly reduces, and it is hot or when machine problem not result in body, electronics can be given full play to relatively and is set
Standby performance, allows consumer to have more preferable man-machine experience.
The utility model has thermal dispersant coatings 40, and order by the top surface of rear shell 11 of portable electronic devices 10A and/or bottom surface
The top surface of fore shell 12 and/or bottom surface have heat conducting coating 30；Therefore, the electronic building brick thermal source (such as core parts 14, battery 15)
Produced used heat in operation, except being exhaled by the thermal dispersant coatings 40 positioned at rear shell 11, can also be using positioned at fore shell 12
The uniformly dispersing of heat conducting coating 30 on the casing of rear shell 11 and the composition of fore shell 12, allow the electronic building brick thermal source (such as core unit
Part 14, battery 15) arround local temperature decline, cause used heat efficiently can outwards be conducted, and have radiating effect show
Effect of work.
Furthermore, the means that the heat conducting coating 30 is made with the thermal dispersant coatings 40 using plating, coating or spraying coating process,
Can all be made for different size or specification portable electronic devices, compared to the hand that prior art attaches graphite flake or Copper Foil
Section, separately has functions that easy to make and can avoid producing cutting waste material.
The above, is only preferred embodiment of the present utility model, not makees any formal to the utility model
Limitation, every any simple modification made to above example according to technical spirit of the present utility model, equivalent variations with
Modification, still falls within the range of technical solutions of the utility model.
In sum, the utility model complies fully with industry development in structure design, using in practicality and cost benefit
Required and disclosed structure is also that, with unprecedented innovative structure, with novelty, creativeness, practicality, meeting has
The regulation of utility model patent important document is closed, therefore lifts application in accordance with the law.
Claims (4)
1. the thermal dispersant coatings structure of a kind of portable electronic devices, including：One be applied to portable electronic devices fore shell and after
Shell, and the fore shell is corresponding with rear shell phase is combined into a component, and in the cavity of the rear shell and the fore shell, and the fore shell top
Face is provided with predetermined electronic building brick, it is characterised in that：
The fore shell is coated with a heat conducting coating, and the rear shell is provided with a thermal dispersant coatings, so that the heat that the electronic building brick thermal source is distributed,
Heat conducting coating through the fore shell is diffused, and uniformly dispersing is in whole cavity, then thermal dispersant coatings by the rear shell and outer
Boundary carries out heat exchange, so that the fore shell is correspondingly formed a cooling system with the rear shell phase.
2. the thermal dispersant coatings structure of portable electronic devices according to claim 1, it is characterised in that the heat conducting coating
Constituted in the top surface of the fore shell and bottom surface any of which face or two faces with high conductivity material coating, spraying or electroforming
Conductive structure layer.
3. the thermal dispersant coatings structure of portable electronic devices according to claim 1, it is characterised in that the thermal dispersant coatings
With the radiator structure layer that the coating of high-cooling property material, spraying or electroforming are constituted in the top surface of the rear shell.
4. the thermal dispersant coatings structure of portable electronic devices according to any one of claim 1 to 3, it is characterised in that
The electronic building brick includes the circuit board and battery that are arranged between the rear shell and the fore shell, has core unit on the circuit board
Part, the electronic building brick also includes being arranged at the display module and contact panel of the fore shell top surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621143955.3U CN206212529U (en) | 2016-10-21 | 2016-10-21 | The thermal dispersant coatings structure of portable electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621143955.3U CN206212529U (en) | 2016-10-21 | 2016-10-21 | The thermal dispersant coatings structure of portable electronic devices |
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| Publication Number | Publication Date |
|---|---|
| CN206212529U true CN206212529U (en) | 2017-05-31 |
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ID=58757215
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| CN201621143955.3U Active CN206212529U (en) | 2016-10-21 | 2016-10-21 | The thermal dispersant coatings structure of portable electronic devices |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249284A (en) * | 2017-07-12 | 2017-10-13 | 普联技术有限公司 | A kind of mobile terminal |
| CN107249283A (en) * | 2017-07-12 | 2017-10-13 | 普联技术有限公司 | A kind of mobile terminal |
| CN107249285A (en) * | 2017-07-12 | 2017-10-13 | 普联技术有限公司 | A kind of mobile terminal |
| CN107979942A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
| CN109219308A (en) * | 2017-06-29 | 2019-01-15 | 东莞市普威玛精密工业有限公司 | The in-mould injection of portable electronic devices forms thermal dispersant coatings structure |
| CN109275308A (en) * | 2017-07-18 | 2019-01-25 | 东莞市普威玛精密工业有限公司 | The shell of portable electronic devices transfers hot-forming thermal dispersant coatings structure |
| CN109429444A (en) * | 2017-07-13 | 2019-03-05 | 东莞市普威玛精密工业有限公司 | The shell of portable electronic devices transfers thermal dispersant coatings structure |
-
2016
- 2016-10-21 CN CN201621143955.3U patent/CN206212529U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979942A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
| CN109219308A (en) * | 2017-06-29 | 2019-01-15 | 东莞市普威玛精密工业有限公司 | The in-mould injection of portable electronic devices forms thermal dispersant coatings structure |
| CN107249284A (en) * | 2017-07-12 | 2017-10-13 | 普联技术有限公司 | A kind of mobile terminal |
| CN107249283A (en) * | 2017-07-12 | 2017-10-13 | 普联技术有限公司 | A kind of mobile terminal |
| CN107249285A (en) * | 2017-07-12 | 2017-10-13 | 普联技术有限公司 | A kind of mobile terminal |
| CN109429444A (en) * | 2017-07-13 | 2019-03-05 | 东莞市普威玛精密工业有限公司 | The shell of portable electronic devices transfers thermal dispersant coatings structure |
| CN109275308A (en) * | 2017-07-18 | 2019-01-25 | 东莞市普威玛精密工业有限公司 | The shell of portable electronic devices transfers hot-forming thermal dispersant coatings structure |
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