CN107249284A - A kind of mobile terminal - Google Patents
A kind of mobile terminal Download PDFInfo
- Publication number
- CN107249284A CN107249284A CN201710566621.XA CN201710566621A CN107249284A CN 107249284 A CN107249284 A CN 107249284A CN 201710566621 A CN201710566621 A CN 201710566621A CN 107249284 A CN107249284 A CN 107249284A
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- China
- Prior art keywords
- heat
- layer
- mobile terminal
- metal layer
- thermal source
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses a kind of mobile terminal, including display module, center, pcb board and the rear shell being cascading；Thermal source part is provided between the center and the pcb board；The heat accumulation component for absorbing and storing the heat that the thermal source part is produced is provided between the display module and the center；The soaking radiation assembly to the rear shell radiation for the heat for producing the thermal source part is provided between the pcb board and the rear shell.Absorbed by the heat accumulation component and store heat, with cause mobile terminal temperature will not suddenly change, improve user temperature rise experience and ensure that the hardware performance of mobile terminal is normal；By the soaking radiation assembly, to cause heat transfer to uniformly being scattered after the soaking radiation assembly and being radiated to the rear shell, the radiating efficiency of mobile terminal to be improved, so as to effectively reduce the surface temperature of the mobile terminal.
Description
Technical field
The present invention relates to electronic device field, and in particular to a kind of mobile terminal.
Background technology
With the development of electronic technology, the progressively steering of the mobile terminal such as mobile phone, tablet personal computer is lightening, mobile terminal
The distance between hardware is less and less, causes heat-dissipating space also less and less, influences the radiating efficiency of mobile terminal.It is simultaneously mobile
The hardware of terminal is constantly upgraded, and the calculating processing performed by it is also more numerous and diverse, and the radiating efficiency of mobile terminal will be directly affected
The performance of its hardware, so as to influence user to the experience sense of mobile terminal.
In order to improve the heat dissipation problem of mobile terminal, at present, graphite flake, thermally conductive gel, heat conductive silica gel are widely used in
In the design of mobile terminal.For example, graphite flake and foam are pasted in the middle of LCM and metal center, in euthermic chip and metal center
Between filling thermally conductive gel or heat conductive silica gel.Although existing heat sink conception can improve dissipating for mobile terminal to a certain degree
The thermal efficiency, but the radiating requirements of the mobile terminal increasingly developed can not be met, therefore, how further to improve mobile terminal
Radiating efficiency be current those skilled in the art technical problem urgently to be resolved hurrily.
The content of the invention
Existing heat sink conception only considered the heat conduction of mobile terminal without the heat accumulation under the conditions of consideration variable working condition, and lead
The thermal efficiency is not high, result in heat in the short time and is rapidly gathered in the inside of mobile terminal, on the one hand, so that the table of mobile terminal
Face temperature is raised suddenly, so as to influence the temperature rise of user to experience；On the other hand so that the temperature of euthermic chip is drastically raised, hold
Easily the frequency reducing strategy of triggering system, influences the hardware performance of mobile terminal.Secondly, although graphite flake or copper foil have good lead
Heat energy power, can scatter the even heat that euthermic chip is produced, and still, the radianting capacity of graphite flake or copper foil is poor so that
Being transmitted to graphite flake or copper foil effectively can not radiate heat, so that the surface temperature rise of mobile terminal.
It is an object of the invention to provide a kind of mobile terminal with heat absorption heat accumulation and thermal radiation function, to cause movement
The temperature of terminal will not suddenly change, it is ensured that the hardware performance of mobile terminal is normal, while reducing the surface temperature of mobile terminal.
To solve above technical problem, the embodiment of the present invention provides a kind of mobile terminal, including be cascading it is aobvious
Show module, center, pcb board and rear shell；Thermal source part is provided between the center and the pcb board；The display module and
The heat accumulation component for absorbing and storing the heat that the thermal source part is produced is provided between the center；The pcb board and institute
State the soaking radiation assembly being provided between rear shell for the heat for producing the thermal source part to the rear shell radiation.
Preferably, the mobile terminal also includes the first heat-conductive assembly and the second heat-conductive assembly, first heat-conductive assembly
On the surface for being arranged on the thermal source part, and positioned between the thermal source part and the center；The second heat-conductive assembly filling
In space between the pcb board and the thermal source part.
Preferably, the heat accumulation component includes the first metal layer, heat-absorbing paint layer, second metal layer and heat conduction parcel
Layer；The first metal layer is separately positioned on the upper and lower surface of the heat-absorbing paint layer with the second metal layer；The heat conduction
Integument wraps up the first metal layer, heat-absorbing paint layer and the second metal layer；Wherein described first
Metal level is located at the side of the display module；The second metal layer is located at the side of the center.
Preferably, the heat conduction integument includes the first pet layer and the second pet layer；First pet layer is arranged on institute
State on the first metal layer；Second pet layer is arranged in the second metal layer；The edge of first pet layer with it is described
The edge bonding of second pet layer, with cause the heat conduction integument wrap up the first metal layer, heat-absorbing paint layer and
The second metal layer.
Preferably, the second metal layer includes two layers of layers of copper being stacked or the layers of copper and aluminium lamination that are stacked.
Preferably, the colloid for the heat accumulation component to be bonded to the center is additionally provided with the heat conduction integument
Layer.
Preferably, it is provided with shielding part between the pcb board and the soaking radiation assembly.
Preferably, the soaking radiation assembly includes what is be cascading from the pcb board to the direction of the rear shell
Metal level, graphene layer and heat radiation layer.
Preferably, the soaking radiation assembly, which also includes being arranged on, is used for what is bonded with the shielding part on the metal level
Colloid layer.
Preferably, the soaking radiation assembly also includes release film layer, and the release film layer is arranged on the colloid layer.
Compared with prior art, a kind of beneficial effect of mobile terminal provided in an embodiment of the present invention is：The movement
Terminal includes display module, center, pcb board and the rear shell being cascading；Set between the center and the pcb board
There is thermal source part；It is provided between the display module and the center for absorbing and storing the heat that the thermal source part is produced
Heat accumulation component；It is provided between the pcb board and the rear shell for the heat for producing the thermal source part to the rear shell spoke
The soaking radiation assembly penetrated.Absorbed by the heat accumulation component and store heat, heat in the short time can be reduced whole in movement
The risk that the inside at end is rapidly gathered, with cause mobile terminal temperature will not suddenly change, improve user temperature rise experience simultaneously
Ensure that the hardware performance of mobile terminal is normal；The soaking radiation assembly has stronger thermal radiation capability, the thermal source part production
Raw heat transfer is to the soaking radiation assembly and is uniformly scattered, while the soaking radiation assembly can be effectively by warm
Measure and radiated to the rear shell, the radiating efficiency of mobile terminal is improved, so as to effectively reduce the surface temperature of the mobile terminal.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of mobile terminal provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of heat accumulation component provided in an embodiment of the present invention；
Fig. 3 is the schematic diagram of soaking radiation assembly provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Referring to Fig. 1, a kind of schematic diagram of its mobile terminal that to be one embodiment of the invention provided, the mobile terminal
Including the display module 1 being cascading, center 2, pcb board 3 and rear shell 4；Thermal source is provided between center 2 and pcb board 3
Part 5；The heat accumulation component 6 of the heat for absorbing and storing the generation of thermal source part 5 is provided between display module 1 and center 2.Heat accumulation
Component 6 has heat absorption, heat conduction, soaking, thermal diffusion, the function of heat accumulation, can effectively reduce thermal equilibrium temperature, delay thermal balance speed
Degree, so as to reduce the temperature of the mobile terminal.
Further, it is provided with for the heat that produces thermal source part 5 that shell 4 is radiated backward between pcb board 3 and rear shell 4
Soaking radiation assembly 7.Heat radiation component 7 has good capacity of heat transmission and surface thermal radiation capability, can be effectively by heat
Uniformly scatter and radiate to rear shell 4, so as to effectively reduce the surface temperature of the mobile terminal.
Wherein, display module 1 includes the TP (Touch Panel, touch-screen) and LCM (Liquid being stacked
Crystal Module, LCD MODULE), the LCM is arranged between the TP and center 2.
In a kind of optional embodiment, shielding part 8 is provided between pcb board 3 and soaking radiation assembly 7.
In a kind of optional embodiment, the mobile terminal also includes the first heat-conductive assembly 9 and the second heat-conductive assembly 10；
First heat-conductive assembly 9 is arranged on the surface of thermal source part 5, and positioned between thermal source part 5 and center 2；Second heat-conductive assembly 10 is filled out
Fill in the space between pcb board 3 and thermal source part 5.Pass through the first heat-conductive assembly 9 and the second heat-conductive assembly 10 so that thermal source part 5
Package surface and bottom can be radiated simultaneously, can more efficiently reduce the temperature and mobile terminal of thermal source part 5
Surface temperature, optimizes the temperature rise of the touch-screen side, it is to avoid the earpiece area temperature positioned at the touch-screen side is too high, so that shadow
Ring user's communication experience.
Wherein, the first heat-conductive assembly 9 is filled into the thermal source part by needle-based dispensing or injecting type mode for dispensing glue
Surface.Second heat-conductive assembly 10 is filled into bottom and the pcb board of thermal source part 5 by needle-based dispensing or injecting type mode for dispensing glue
In 3 space, solder ball can be reduced by filling the second heat-conductive assembly 10 in the bottom of thermal source part 5 and the space of pcb board 3
Between the thermal resistance brought of the air gap so that the heat that thermal source part 5 is distributed can be effectively conducted to pcb board 3, and is laterally expanded
Scatter and, while one layer of flawless Underfill layer can be formed, can effectively reduce the thermal expansion due to thermal source part 5 and pcb board 3
The impact that coefficient is mismatched or external force is caused, reduction pcb board 3 deforms upon to obtain risk, can also effectively reduce the knot of thermal source part 5
Temperature, suppresses influence of the high temperature frequency reducing to the performance of mobile terminal hardware.The use of first heat-conductive assembly 9 and the second heat-conductive assembly 10
Temperature is between -40 DEG C to 120 DEG C.
In a kind of optional embodiment, the first heat-conductive assembly 9 and the second heat-conductive assembly 10 by binding agent and are led respectively
Hot filler is prepared from.Preferably, the binding agent uses epoxy resin, and the heat-conducting filler uses nano-scale copper powder.
The epoxy resin has the viscosity such as middle and high, and in the case where mobile terminal generates heat, is also able to maintain that higher viscosity.The
One heat-conductive assembly 9 and the second heat-conductive assembly 10 are respectively provided with excellent heat conductivility and insulating properties.Preferably, the first heat-conductive assembly
9 and second heat-conductive assembly 10 thermal conductivity factor be not less than 1W/mK.
Referring to Fig. 2, it is the schematic diagram of the heat accumulation component in Fig. 1, the heat accumulation component includes the first metal layer 61, inhaled
Hot dope layer 62, second metal layer 63 and heat conduction integument 64；The first metal layer 61 is separately positioned on second metal layer 63
The upper and lower surface of heat-absorbing paint layer 62；Heat conduction integument 64 is by the first metal layer 61, heat-absorbing paint layer 62 and second metal layer
63 wrap up；61 layers of wherein the first metal is located at the side of the display module；Second metal layer 63 is located at the center
Side.Preferably, the thickness range of the heat accumulation component is 0.2mm to 0.4mm.
In a kind of optional embodiment, heat conduction integument 64 includes the first PET (Polyethylene
Terephthalate, polyethylene terephthalate) layer 64a and the second pet layer 64b；First pet layer 64a is arranged on
On one metal level 61；Second pet layer 64b is arranged in second metal layer 63；First pet layer 64a edge and the second pet layer
64b edge bonding, to cause heat conduction integument 64 to wrap up the first metal layer 61, heat-absorbing paint layer 62 and second metal layer
63.Preferably, the first pet layer 64a and the second pet layer 64b thickness are 0.01mm.Wherein, the first pet layer 74a and second
Pet layer 74b has relatively low gas, vapor permeability and excellent high- and low-temperature resistance performance, can barrier gas and water, oil and
Its own mechanical performance is kept while peculiar smell under the conditions of high and low temperature.Pass through the first pet layer 64a and the second pet layer 64b envelope
Side is handled so that heat-absorbing paint layer 62 is sealed, and prevents heat-absorbing paint layer 62 from revealing.Wherein, the first metal layer 61 and
Two metal levels 63 62 are played a supporting role to heat-absorbing paint layer, further by heat conduction integument 64 wrap up the first metal layer 61,
Heat-absorbing paint layer 62 and the figurate heat accumulation component of the formation tool of second metal layer 63, it is to avoid due to heat-absorbing paint layer
62 form is uncertain to cause the shape of the heat accumulation component to change, so as to be unfavorable for the heat accumulation component in mobile terminal
In application.
In a kind of optional embodiment, the first metal layer 61 and second metal layer 63 use layers of copper.
In a kind of optional embodiment, second metal layer 63 includes two layers of layers of copper being stacked or is stacked
Layers of copper and aluminium lamination.Second 64b layers of metal is located at close to the side of the center, by setting two layers of layers of copper or being stacked
Layers of copper and aluminium lamination, the heat absorption that more efficiently can be transmitted the thermal source part to the center is simultaneously oriented to heat-absorbing paint
Layer 62.
Preferably, the layers of copper uses C1100 red coppers, and its thickness range is 0.025mm to 0.1mm；The aluminium lamination is used
A1050 aluminiums, its thickness range is 0.025mm to 0.1mm.
In a kind of optional embodiment, it is additionally provided with heat conduction integument 64 for the heat accumulation component to be bonded into institute
State the colloid layer 65 of center.Specifically, the side of colloid layer 65 is pasted onto on the second pet layer 64b, opposite side be pasted onto it is described in
On frame.Preferably, the thickness of colloid layer 65 is 0.005mm.
In a kind of optional embodiment, colloid layer 65 uses pressure sensitive adhesive or conducting resinl.Wherein described pressure sensitive adhesive has
The characteristic of aggressive tack and permanent adhesive, can be pasted onto what the heat accumulation component was fastened on the center；The conducting resinl tool
There is certain viscosity, while can play a part of preventing electromagnetic interference.
In a kind of optional embodiment, the thermal capacity for the material that heat-absorbing paint layer 62 is used is not less than 300J/K.Enter
One step, the thermal conductivity factor of the material that heat-absorbing paint layer 62 is used is in 0.1W/mK between 1W/mK.
In a kind of optional embodiment, heat-absorbing paint layer 62 is made using distilled water or by phase changing resin and copper powder mixing
Standby heat conduction phase-change material.Preferably, the thickness range of heat-absorbing paint layer 62 is 0.1mm to 0.3mm.The distilled water or
The heat conduction phase-change material produces phase transformation after absorbing certain heat, heat storage is got up by phase transition process so that heat
It is delivered to after the heat accumulation component not directly to display module transmission, but is got up by the heat accumulation component storage, so that
So that the surface temperature of mobile terminal will not be raised suddenly, simultaneously as the temperature of the thermal source part will not be raised drastically, so that
The frequency reducing strategy of system will not be triggered, and then does not interfere with the hardware performance of mobile terminal.
Referring to Fig. 3, it is the schematic diagram of soaking radiation assembly in Fig. 1, the soaking radiation assembly is included from the PCB
Metal level 71, graphene layer 72 and heat radiation layer 73 that the direction of plate to the rear shell is cascading.Due to graphene
For individual layer atomic structure so that graphene layer 72 has the superpower capacity of heat transmission, the thermal conductivity factor of graphene layer 72 is more than or waited
In 5000W/mK.Preferably, metal level 71 uses layers of copper, and the thickness of metal level 71 is set to 0.05mm.Graphene layer 72 passes through
Chemical vapour deposition technique formation is on the surface of metal level 71, and metal level 71 is played a supporting role to graphene layer 72, while can be
Radiating efficiency is further improved on the basis of the radiating of graphene layer 72.Can be effectively by heat by metal level 71 and graphene layer 72
Uniformly spread out and transmitted to heat radiation layer 73, heat is radiate by heat radiation layer 73 to the rear shell.
In a kind of optional embodiment, the soaking radiation assembly also include be arranged on the metal level 71 be used for
The colloid layer 74 that shielding part 7 is bonded.Preferably, colloid layer 74 is made using double faced adhesive tape, and the thickness of colloid layer 74 is set to
0.025mm。
In a kind of optional embodiment, the soaking radiation assembly also includes release film layer 75, and release film layer 75 is set
On the colloid layer 74.Release film layer 75 plays a protective role to colloid layer 74, it is to avoid the pollutant such as dust is adsorbed onto colloid
74 surface of layer, influence the bonding effect of colloid layer 74.
In a kind of optional embodiment, the thickness of the soaking radiation assembly is arranged on 0.15mm between 0.25mm.
In a kind of optional embodiment, heat radiation layer 73 is nanometer carbon coating.Preferably, the thickness of the nanometer carbon coating
Degree is set to 0.025mm.The nanometer carbon coating has stronger radianting capacity, can be to being delivered to the heat of heat radiation layer 73
Effectively radiated to the rear shell, it is to avoid the accumulation of heat, radiating efficiency is improved, so as to reduce the surface temperature of mobile terminal.
In a kind of optional embodiment, the heat emissivity coefficient of heat radiation layer 73 is not less than 0.95.
Further, the mobile terminal can be mobile phone, tablet personal computer, notebook etc..The thermal source part is heat generating core
Piece.
Compared with prior art, a kind of beneficial effect of mobile terminal provided in an embodiment of the present invention is：The movement
Terminal includes display module, center, pcb board and the rear shell being cascading；Set between the center and the pcb board
There is thermal source part；It is provided between the display module and the center for absorbing and storing the heat that the thermal source part is produced
Heat accumulation component；It is provided between the pcb board and the rear shell for the heat for producing the thermal source part to the rear shell spoke
The soaking radiation assembly penetrated.Absorbed by the heat accumulation component and store heat, heat in the short time can be reduced whole in movement
The risk that the inside at end is rapidly gathered, with cause mobile terminal temperature will not suddenly change, improve user temperature rise experience simultaneously
Ensure that the hardware performance of mobile terminal is normal；The soaking radiation assembly has stronger thermal radiation capability, the thermal source part production
Raw heat transfer is to the soaking radiation assembly and is uniformly scattered, while the soaking radiation assembly can be effectively by warm
Measure and radiated to the rear shell, the radiating efficiency of mobile terminal is improved, so as to effectively reduce the surface temperature of the mobile terminal.
Above is the preferred embodiment of the present invention, it is noted that for those skilled in the art,
Under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as this hair
Bright protection domain.
Claims (10)
1. a kind of mobile terminal, it is characterised in that including：Display module, center, pcb board and the rear shell being cascading；
Thermal source part is provided between the center and the pcb board；It is provided between the display module and the center for absorbing
And store the heat accumulation component for the heat that the thermal source part is produced；It is provided between the pcb board and the rear shell for by described in
The soaking radiation assembly that the heat that thermal source part is produced is radiated to the rear shell.
2. mobile terminal as claimed in claim 1, it is characterised in that the mobile terminal also includes the first heat-conductive assembly and the
Two heat-conductive assemblies, first heat-conductive assembly is arranged on the surface of the thermal source part, and positioned at the thermal source part and it is described in
Between frame；Second heat-conductive assembly is filled in the space between the pcb board and the thermal source part.
3. mobile terminal as claimed in claim 1, it is characterised in that the heat accumulation component includes the first metal layer, heat absorption and applied
The bed of material, second metal layer and heat conduction integument；The first metal layer is separately positioned on the suction with the second metal layer
The upper and lower surface of hot dope layer；The heat conduction integument by the first metal layer, the heat-absorbing paint layer and described second
Metal level is wrapped up；Wherein described the first metal layer is located at the side of the display module；The second metal layer is located at institute
State the side of center.
4. mobile terminal as claimed in claim 3, it is characterised in that the heat conduction integument includes the first pet layer and the
Two pet layers；First pet layer is arranged on the first metal layer；Second pet layer is arranged on the second metal layer
On；The edge at the edge of first pet layer and second pet layer is bonded, to cause the heat conduction integument parcel described
The first metal layer, heat-absorbing paint layer and the second metal layer.
5. mobile terminal as claimed in claim 3, it is characterised in that the second metal layer includes two layers of bronze medal being stacked
Layer or the layers of copper and aluminium lamination being stacked.
6. mobile terminal as claimed in claim 3, it is characterised in that be additionally provided with the heat conduction integument for by described in
Heat accumulation component is bonded to the colloid layer of the center.
7. mobile terminal as claimed in claim 1, it is characterised in that set between the pcb board and the soaking radiation assembly
It is equipped with shielding part.
8. the mobile terminal as described in claim 1 or 7, it is characterised in that the soaking radiation assembly is included from the pcb board
Metal level, graphene layer and the heat radiation layer being cascading to the direction of the rear shell.
9. mobile terminal as claimed in claim 8, it is characterised in that the soaking radiation assembly also includes being arranged on the gold
Belong to the colloid layer for being used to bond with the shielding part on layer.
10. mobile terminal as claimed in claim 9, it is characterised in that the soaking radiation assembly also includes release film layer, institute
Release film layer is stated to be arranged on the colloid layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710566621.XA CN107249284B (en) | 2017-07-12 | 2017-07-12 | A kind of mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710566621.XA CN107249284B (en) | 2017-07-12 | 2017-07-12 | A kind of mobile terminal |
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| Publication Number | Publication Date |
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| CN107249284A true CN107249284A (en) | 2017-10-13 |
| CN107249284B CN107249284B (en) | 2019-07-12 |
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ID=60015351
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710566621.XA Expired - Fee Related CN107249284B (en) | 2017-07-12 | 2017-07-12 | A kind of mobile terminal |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107872944A (en) * | 2017-11-29 | 2018-04-03 | 东莞市鸿艺电子有限公司 | A kind of heat storage type temprature control method of mobile device |
| CN108770294A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of radiating subassembly and electronic device |
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| WO2017080069A1 (en) * | 2015-11-11 | 2017-05-18 | 海能达通信股份有限公司 | Heat dissipation device of heating device, mobile terminal and heat radiation assembly ofpower amplifier |
| CN206212529U (en) * | 2016-10-21 | 2017-05-31 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203353019U (en) * | 2013-05-28 | 2013-12-18 | 东莞劲胜精密组件股份有限公司 | Graphene metal cooling fin and electronic product cooling structure |
| CN203968561U (en) * | 2014-06-25 | 2014-11-26 | 乐视致新电子科技（天津）有限公司 | A kind of heat abstractor and electronic equipment |
| WO2017080069A1 (en) * | 2015-11-11 | 2017-05-18 | 海能达通信股份有限公司 | Heat dissipation device of heating device, mobile terminal and heat radiation assembly ofpower amplifier |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107872944A (en) * | 2017-11-29 | 2018-04-03 | 东莞市鸿艺电子有限公司 | A kind of heat storage type temprature control method of mobile device |
| CN107872944B (en) * | 2017-11-29 | 2019-09-06 | 东莞市鸿艺电子有限公司 | A kind of heat storage type temprature control method of mobile device |
| CN108770294A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of radiating subassembly and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107249284B (en) | 2019-07-12 |
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