CN105873357B - Circuit board and mobile terminal - Google Patents
Circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105873357B CN105873357B CN201610286977.3A CN201610286977A CN105873357B CN 105873357 B CN105873357 B CN 105873357B CN 201610286977 A CN201610286977 A CN 201610286977A CN 105873357 B CN105873357 B CN 105873357B
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- Prior art keywords
- heat
- circuit board
- plate body
- radiator part
- mixing material
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Abstract
The present invention discloses a kind of circuit board, including plate body and heat radiator part, and the plate body includes two plate faces, is provided with the heat radiator part at least one of them plate face；The heat radiator part includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, the mixing material is made of heat absorption heat accumulating and heat conduction and heat radiation material, the heat conduction and heat radiation material is used for the heat transfer on the plate body to the heat absorption heat accumulating, the heat absorption heat accumulating stores the heat of the heat conduction and heat radiation material conduction for absorbing and storing the heat on the plate body.The invention also discloses a kind of mobile terminals.The heat that heating element on circuit board distributes can directly be absorbed by the mixing material being arranged on circuit board, realized and directly radiated to the biggish position of calorific value, improve the thermal diffusivity and reliability of mobile terminal.
Description
Technical field
The present invention relates to a kind of electronic equipment field more particularly to a kind of circuit boards and mobile terminal.
Background technique
With the development of mobile phone industry, mobile phone configuration is higher and higher, and the electronic component on circuit board of mobile phone is also increasingly
It is more, cause cell-phone heating amount accordingly to become larger, if control or transfer is not achieved in these heats, both sides can be brought to influence: 1,
Circuit board temperature can be made excessively high, influence the performance of electronic component, it is slack-off to even result in mobile phone operation, influences user experience.2,
The heat transfer that circuit board distributes causes skin temperature higher to phone housing, when use will appear it is hot, scald ear etc. and ask
Topic.
It is at present in the industry usually that heat dissipation graphite flake is set to inner walls or Mobile phone screen for the heating problem for solving mobile phone
It covers and covers, to be radiated indirectly to chip, but discovery is due to the graphite flake that radiates when inventor states technical solution on the implementation
Setting it is larger by the limitation of position, can not directly be radiated to the biggish position of calorific value, so as to cause its heat dissipation performance
It is poor.
Summary of the invention
It is described in order to solve the above-mentioned technical problems, the present invention provides a kind of circuit board, including plate body and heat radiator part
Plate body includes two plate faces, is provided with the heat radiator part at least one of them plate face；
The heat radiator part includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, described
Mixing material is made of heat absorption heat accumulating and heat conduction and heat radiation material, and the heat conduction and heat radiation material is used for the heat on the plate body
Amount passes to the heat absorption heat accumulating, and the heat absorption heat accumulating is for absorbing and storing the heat on the plate body, simultaneously
Store the heat of the heat conduction and heat radiation material conduction.
Wherein, for heating element to be arranged, another plate face of the plate body is provided with a wherein plate face for the plate body
The heat radiator part.
Further, the white space for the plate face in the plate body being used to that the heating element to be arranged is provided with the suction
Hot radiating piece.
Wherein, two plate faces of the plate body are all used to that heating element to be arranged, in the sky of each plate face of the plate body
White region is provided with the heat radiator part.
Wherein, the circuit board further includes protective film, and the protective film is set on the heat radiator part, and the guarantor
Cuticula is located remotely from the side of the plate body.
Wherein, the circuit board includes at least one of printed circuit board and flexible circuit board.
Wherein, the heat absorption heat accumulating in the mixing material and between the heat conduction and heat radiation material it is with ratio
1:1。
Wherein, the heat absorption heat accumulating in the mixing material includes silica and polyethylene glycol, the dioxy
The mass ratio of SiClx and polyethylene glycol is 1:1~1:9, and the heat conduction and heat radiation material in the mixing material is graphite or gold
Belong to.
Further, the heat absorption heat accumulating is as cyst wall, with the polyethylene glycol using the silica by several
The micro-capsule of capsule-core is constituted.
Wherein, the heat radiator part further includes titanate coupling agent and glue-line, the mixing material and the titanate esters
Coupling agent is mixed and made into flaky material, and the glue-line stacking is covered on the flaky material, and the flaky material passes through described
Glue-line is adhered on the plate body.
Wherein, the heat radiator part further includes retarder thinner and bonding solution, the mixing material, the retarder thinner
It mixes and is coated on the plate body with the bonding solution.
Wherein, the heat radiator part further includes substrate and glue-line, and the mixing material is coated in the substrate, described
Glue-line stacking is covered in the mixing material, and described in the substrate for being coated with mixing material is adhered to by the glue-line
On plate body.
The embodiment of the invention also provides a kind of mobile terminal, including shell and some or all of above-mentioned circuit board, institute
It states shell rim position and opens up thermal hole.
Implement the embodiment of the present invention, has the advantages that
Circuit board provided by the invention includes plate body and heat radiator part, and plate body includes two plate faces, and wherein at least one
The heat radiator part is provided in a plate face, the heat radiator part includes the material with heat absorption, heat accumulation and heat sinking function
Expect that the mixing material of attribute, the mixing material are made of heat absorption heat accumulating and heat conduction and heat radiation material, the heat conduction and heat radiation material
Material gives the heat transfer on the plate body to the heat absorption heat accumulating, and the heat absorption heat accumulating absorbs and stores the plate body
On heat, while storing the heat of heat conduction and heat radiation material conduction, the heat that the heating element on circuit board distributes can
It is absorbed with directly passing through the mixing material being arranged on circuit board, realizes and the biggish position of calorific value directly dissipate
Heat improves the thermal diffusivity and reliability of mobile terminal.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without any creative labor, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is partial schematic diagram of the printed circuit board provided in an embodiment of the present invention in mobile terminal；
Fig. 2 is partial schematic diagram of the flexible circuit board provided in an embodiment of the present invention in mobile terminal；
Fig. 3 is the schematic diagram of circuit board provided in an embodiment of the present invention；
Fig. 4 is the schematic diagram for the heat radiator part that first embodiment of the invention provides；
Fig. 5 is the schematic diagram for the heat radiator part that second embodiment of the invention provides；
Fig. 6 is the schematic diagram for the heat radiator part that third embodiment of the invention provides；
Fig. 7 is a kind of schematic diagram of mobile terminal provided in an embodiment of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by.
The present embodiments relate to mobile terminal can be any equipment for having communication and store function, such as: it is flat
Plate computer, mobile phone, electronic reader, remote controler, personal computer (Personal Computer, PC), laptop, vehicle
Carry the smart machine with network function such as equipment, Web TV, wearable device.Circuit board packet provided in an embodiment of the present invention
Include printed circuit board (English: Printed Circuit Board, abbreviation: PCB) and flexible circuit board (English: Flexible
At least one of Printed Circuit, referred to as: FPC).Wherein, schematic diagram of the printed circuit board in mobile terminal can be with
Referring to Fig. 1；Schematic diagram of the flexible circuit board in mobile terminal may refer to Fig. 2.
Referring to Fig. 3, Fig. 3 is the schematic diagram of circuit board provided in an embodiment of the present invention.As shown in figure 3, circuit board 3 includes
Plate body 31 and heat radiator part 32, plate body 31 includes two plate faces, respectively the first plate face 311 and the second plate face 312, in plate body
Heat radiator part 32 is provided in 31 at least one plate face, and (Fig. 3 is that heat radiator part is provided in two plate faces, at it
, can only heat radiator part be arranged in plate face wherein in his alternative embodiment), heat radiator part 32 include with heat absorption,
The mixing material 3211a of the material properties of heat accumulation and heat sinking function.Mixing material 3211a by heat absorption heat accumulating and it is thermally conductive dissipate
Hot material composition, heat conduction and heat radiation material are used to giving the heat transfer on plate body 31 into heat absorption heat accumulating, and heat absorption heat accumulating is used
In absorbing and store the heat on plate body 31, while storing the heat of heat conduction and heat radiation material conduction.
In the present embodiment, be provided with heat radiator part on circuit board, heat radiator part include by heat absorption heat accumulating and
The mixing material of heat conduction and heat radiation material composition, heat conduction and heat radiation material give the heat transfer on heating element to heat absorption heat accumulation material
Material, heat absorption heat accumulating absorbs heat, and the slow release again after absorbing to a certain extent, realize to calorific value compared with
Big position is directly radiated, and the thermal diffusivity and reliability of mobile terminal are improved.
Circuit board 3 can be single sided board, dual platen, four laminates or multi-layer board.
Single sided board is a kind of one side applies copper, and the welding of circuit lead and element is designed using the one side for having applied copper.If circuit
Plate 3 is single sided board, it is assumed that the first plate face 311 of plate body 31 is used to that heating element to be arranged, then the second plate face 312 of plate body 31
It is provided with heat radiator part 32.
Further, if circuit board 3 is single sided board, white space (the i.e. not set electronics of the first plate face 311 of plate body 31
The region of component) it is also provided with the heat radiator part 32.By the mixing material 3211a of two sides on circuit board 3
The heating element of setting radiates, and accelerates heat dissipation dynamics, further improves the thermal diffusivity and reliability of mobile terminal.
Dual platen includes top layer, bottom and insulating layer, and insulating layer is between top layer and bottom.The bottom and top layer of dual platen
Two-sided be all covered with copper, that is to say, that top layer and the two-sided of bottom can be routed and weld.If circuit board 3 is dual platen,
The entirety that plate body 31 is made of top layer, bottom and insulating layer.If the first plate face 311 of plate body 31 is top layer far from insulating layer
Side, then the second plate face 312 of plate body 31 be side of the bottom far from insulating layer.If the first plate face 311 of plate body 31 is bottom
Side of the layer far from insulating layer, then the second plate face 312 of plate body 31 is side of the top layer far from insulating layer.If circuit board 3 is double
Then heat radiator part 32 is all arranged in the white space of the first plate face 311 of plate body 31 and the second plate face 312 in panel.
Multi-layer board is then such as to place two power panel layers plus other layer between the top layer and bottom of dual platen.If electric
Road plate 3 is multi-layer board, then plate body 31 is by top layer, bottom and the layer that adds forms between the two a entirety.If plate body 31
The first plate face 311 be side of the top layer far from insulating layer, then the second plate face 312 of plate body 31 be bottom far from insulating layer one
Side.If the first plate face 311 of plate body 31 is side of the bottom far from insulating layer, the second plate face 312 of plate body 31 is that top layer is remote
Side from insulating layer.If circuit board 3 is multi-layer board, in the first plate face 311 of plate body 31 and the blank area of the second plate face 312
Heat radiator part 32 is all arranged in domain.
In order to further improve, circuit board 3 further includes protective film 33, and protective film 33 is set to heat radiator part 32
On, and protective film 33 is located remotely from the side of ontology 31.
In the present embodiment, protective film 33 is polyethylene terephthalate (PET), is layered in heat radiator part 32
On, protective film 33 further heat radiator part 32 can carry out shaping and have the function of dust-proof.Certainly, in other embodiments
In, the material of protective film 33 can also be other, such as silica gel.
The heat absorption heat accumulating and the heat conduction and heat radiation material in order to further improve, in mixing material 3211a
Between material is 1:1 with ratio.
In order to further improve, the heat absorption heat accumulating in mixing material 3211a is by polyethylene glycol and two
The mass ratio of the phase-changing energy storage material of silica composition, the silica and polyethylene glycol is 1:1~1:9, specific which is selected
Kind can be selected according to demand with ratio.Heat conduction and heat radiation material in mixing material 3211a is any one in graphite or metal
Kind.
In order to further improve, the heat absorption heat accumulating by it is several using the silica as cyst wall, with described
Polyethylene glycol is that the micro-capsule of capsule-core is constituted.
Wherein, the detailed process for making the heat absorption heat accumulating can be with are as follows: is added to polyethylene glycol certain density
In silica solution, after all dissolutions, CaCl2 accelerator solution is added dropwise and brings it about gelation reaction under strong stirring, it is quiet
It postpones to form three-dimensional net structure gel；By gel forced air drying 24-28 hours in 80 DEG C of baking ovens, then cool to room temperature,
It can be obtained and be made of by cyst wall, using the polyethylene glycol after emulsifying as the microcapsules of capsule-core several silica using after gel
The heat radiator material.Wherein, the polyethylene glycol in the capsule-core of the microcapsules is phase-changing energy storage material, i.e., described micro- glue
Capsule by gradually absorbing heat, can by the polyethylene glycol in the capsule-core gradually by it is solid state transformed be liquid, to realize to heat
The storage of amount, equally when the heat that the microcapsules are absorbed gradually decreases, polyethylene glycol in the capsule-core also gradually by
Liquid is converted into solid-state, to radiate to the heat stored, wherein for liquid the polyethylene glycol self-temperature simultaneously
Not high, that is, the heat absorbed is all used to carry out phase transformation, and it is one slow that the polyethylene glycol, which becomes solid process from liquid,
Slow radiation processes, so the heat radiator part 32 comprising several microcapsules is to avoid the heat short time being absorbed into
It is inside directly delivered to phone housing and causes phone housing temperature excessively high.Further, due to existing for the silica
Cyst wall, it is possible to guarantee that the polyethylene glycol for liquid will not flow out the microcapsules, therefore, the poly- second two in the capsule-core
For alcohol gradually by solid state transformed for during liquid, the microcapsules are gradually from hard to soft, and then to influence the heat absorption heat accumulation
The quality of material is also from hard to soft.The heat conduction and heat radiation material in the mixing material 3211a is by taking graphite as an example, due to graphite
Thermal conductivity it is good, so graphite can conduct heat on the heat absorption heat accumulating progress heat storage faster, and
The good heat dissipation effect of graphite in the x, y direction, so graphite can also avoid being directly emitted to heat and the plate body 31
While opposite phone housing, the radiating rate of the mixing material is improved.Wherein, be mixed to form the mixing material it
Before, it needs first to carry out strong stirring by the heat conduction and heat radiation material and for the gelatinous heat absorption heat accumulating, to obtain respectively
To corresponding powder, i.e., mixed process refer to the heat conduction and heat radiation material for powder and be powder the heat absorption heat accumulation material
Expect mixed process；Wherein, since the microcapsules in the heat absorption heat accumulating are much smaller than for described in powder
The size of mixing material 3211a, thus obtained after strong stirring be powder the heat absorption heat accumulating in still include
Therefore several complete microcapsules still have heat absorption, heat storage function for the heat absorption heat accumulating of powder, thus
The mixing material is formed by after mixing still has heat absorption, heat accumulation and heat sinking function.Certainly, in other embodiments,
Mixing material 3211a can also be inorganic phase-changing material or other composite phase-change materials etc..
As shown in figure 4, Fig. 4 is a kind of heat radiator part 321 that first embodiment of the invention provides.In order to further
It improves, heat radiator part 321 further includes titanate coupling agent 3211b and glue-line 3212, and mixing material 3211a and titanate esters are coupled
Agent 3211b is mixed and made into flaky material 3211, and the stacking of glue-line 3212 is covered on flaky material 3211, and flaky material 3211 passes through
Glue-line 3212 is adhered on plate body 31.
By the way that mixing material 3211a and titanate coupling agent 3211b are mixed and made into flaky material 3211, then pass through glue-line
It is more square that 3212 stackings are connected to formation heat radiator part 321,321 application of heat radiator part of sheet on flaky material 3211
Just, it is directly stained with, is cooled into coating without waiting for it.
In the present embodiment, mixing material 3211a is first by heat conduction and heat radiation material and for gelatinous heat absorption heat accumulating
Strong stirring is carried out, to respectively obtain corresponding powder；Since the microcapsules in the heat absorption heat accumulating are to be much smaller than
For the size of the mixing material 3211a of powder, thus obtained after strong stirring be powder the heat absorption heat accumulation material
Still comprising several complete microcapsules in material, therefore, still there is heat absorption, storage for the heat absorption heat accumulating of powder
Heat function, so that being formed by the mixing material still after mixing has heat absorption, heat accumulation and heat sinking function.Powdered
Mixing material 3211a addition titanate coupling agent 3211b obtains inorganic quasi- organic composite shaping phase-change material, then this is inorganic quasi-
It is flaky material 3211, the company of stacking again of flaky material 3211 that flake, which is made, through tabletting machine in organic composite shaping phase-change material
It connects glue-line 3212 and forms heat radiator part 321.It should be understood that glue-line 3212 can be gum, double-sided adhesive or release film etc..
The shape that heat radiator part 321 can according to need stickup is cut into certain shapes, is fitted on plate body 31, realizes heat absorption, storage
Heat and heat sinking function.
As shown in figure 5, Fig. 5 is the heat radiator part 322 that second embodiment of the invention provides.With first embodiment of the invention
The basic structure of the heat radiator part 321 of offer is roughly the same, the difference is that, the heat radiator part in the present embodiment
322 further include retarder thinner and bonding solution, is coated on plate body 31 after mixing material, retarder thinner and bonding solution mixing.
By the way that retarder thinner, bonding solution and mixing material are mixed to form heat radiator part 322, so that heat radiator part
332 directly have adhesive force, can be coated on upper plate body 31 without still further increasing glue-line, to provide a kind of using more
Convenient heat radiator part 322.
In the present embodiment, mixing material is first to carry out by force by heat conduction and heat radiation material and for gelatinous heat absorption heat accumulating
Power stirring, to respectively obtain corresponding powder；Since the microcapsules in the heat absorption heat accumulating are much smaller than as powder
The mixing material size, so obtained after strong stirring be powder the heat absorption heat accumulating in still include
Therefore several complete microcapsules still have heat absorption, heat storage function for the heat absorption heat accumulating of powder, thus
The mixing material is formed by after mixing still has heat absorption, heat accumulation and heat sinking function.In powdered heat absorption heat accumulation material
Material is added to retarder thinner and addition special binder solution mixing (such as: methanol dimethylbenzene, acrylic resin etc.), so that heat absorption
Radiating piece 322 has adhesive force, and the form that heat radiator part 322 directlys adopt coating is piled into certain thickness and is attached to plate body 31
On, to realize heat absorption, heat accumulation and heat sinking function.
Such as Fig. 6, the third embodiment of the present invention provides a kind of heat radiator part 323, mentions with first embodiment of the invention
The basic structure of the heat radiator part 321 of confession is roughly the same, the difference is that, the heat radiator part 323 in the present embodiment
It further include substrate 3232 and glue-line 3233, mixing material 3231 is coated in substrate 3232, and the stacking of glue-line 3233 is connected to mixing
On material 3231, and glue-line 3233 is adhered on plate body 31.
It is formed by the way that directly mixing material 3231 is coated in substrate 3232, then glue-line is set in mixing material 3231
3233 to be pasted on plate body 31, carries out tabletting without tablet press machine, makes relatively simple.
In the present embodiment, mixing material 3231 be first by heat conduction and heat radiation material and for gelatinous heat absorption heat accumulating into
Row strong stirring, to respectively obtain corresponding powder；Since the microcapsules in the heat absorption heat accumulating are to be much smaller than to be
The size of the mixing material of powder, thus obtained after strong stirring be in the heat absorption heat accumulating of powder still
Comprising several complete microcapsules, therefore, still there is heat absorption, heat storage function for the heat absorption heat accumulating of powder,
There is heat absorption, heat accumulation and heat sinking function to be formed by the mixing material still after mixing.Substrate 3232 is poly- to benzene
Powdered mixing material 3231 is directly coated in substrate 3232 and forms, by mixing material by naphthalate (PET)
3231 substrate 3232 is adhered on plate body 31 by glue-line 3233, realizes heat absorption, heat accumulation and the heat dissipation function of heat radiator part 323
Energy.It should be understood that glue-line can be gum, double-sided adhesive or other etc..
Referring to Fig. 7, Fig. 7 is the schematic diagram of a mobile terminal 7 provided in an embodiment of the present invention, mobile terminal 7 includes upper
State the circuit board and shell referred to.Wherein, circuit board includes any one in above-mentioned heat radiator part 321,322 and 323.
Mobile terminal is during fabrication, it is first determined the position for needing to be arranged heat radiator part on circuit board, then in determination
Position heat radiator part is set, then component is set on circuit boards, finally by circuit board package in mobile terminal.Its
In, heat radiator part includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, and mixing material is by absorbing heat
Heat accumulating and heat conduction and heat radiation material composition, the heat absorption heat accumulating for forming microcapsule structure are reached in the heat that heating element distributes
To after 40 degree, start to absorb the heat that distributes of heating element, and capsule-core itself is gradually from solid-liquid, when capsule-core all turns
After turning to liquid phase, the heat that heat absorption heat accumulating absorbs has been saturated, and stops absorbing heat, and is gradually dropped in external temperature
Down to after preset temperature, capsule-core comes out the heat of absorption, is transmitted in air, and capsule-core can be with its body heat
Gradually decrease and gradually from liquid-solid, by the circulating phase-change for the heat accumulating that absorbs heat, to be dropped to heating element
Temperature, and then improve the heat dissipation performance and reliability of mobile terminal.
For mobile terminal provided by the invention by the way that heat radiator part is arranged on circuit boards, heat radiator part includes by absorbing heat
The mixing material of heat accumulating and heat conduction and heat radiation material composition, heat conduction and heat radiation material is by the heat transfer on heating element to suction
Hot heat accumulating, heat absorption heat accumulating absorbs heat, and the slow release again after absorbing to a certain extent, realizes pair
The biggish position of calorific value is directly radiated, and the thermal diffusivity and reliability of mobile terminal are improved.
Mobile terminal provided by the invention by the way that protective film is arranged on heat radiator part, with to heat radiator part carry out into
The protection of one step, improves the thermal diffusivity and reliability of mobile terminal.
The mobile terminal provided by the invention also heat conduction and heat radiation material made of graphite or metal etc. is by heating element
The heat distributed is quickly conducted to heat absorption heat accumulating, with mass ratio is 1:1~1:9 mixing energy by silica and polyethylene glycol
Enough heat accumulatings obtained that absorbs heat, can absorb heat in time, absorb to a certain extent alternatively, temperature reaches a certain level
Afterwards, the heat of absorption is carried out slow release again by heat absorption heat accumulating, further increases the reliability of chip and mobile terminal.
Mobile terminal provided by the invention also passes through the heat accumulating that will absorb heat and microcapsule structure is made, can be preferably to fever member
The heat that device distributes carries out heat absorption heat accumulation, and then reaches preferable heat dissipation performance.
Mobile terminal provided by the invention also by the way that mixing material and titanate coupling agent are mixed and made into flaky material, then
It is connected to formation heat radiator part on flaky material by glue-line stacking, not only enables heat radiator part according to certain shape
Shape goes to be cut, and the heat radiator part of sheet is directly stained with, is cooled into without waiting for it using more convenient
Coating.
Mobile terminal provided by the invention is also dissipated by the way that retarder thinner, bonding solution and mixing material are mixed to form heat absorption
Warmware can be coated on plate body, to provide so that heat radiator part directly has adhesive force without still further increasing glue-line
It is a kind of to use advantageously heat radiator part.
For mobile terminal provided by the invention also by the way that mixing material to be coated in substrate, glue-line stacking is covered on mixing material
On material, and the substrate for being coated with mixing material is adhered on the plate body by glue-line.By the way that directly mixing material is coated on
It is formed in substrate, then carries out tabletting without tablet press machine, production is more simple to be pasted on plate body in mixing material setting glue-line
It is single.
Mobile terminal provided by the invention also passes through the thermal hole that shell rim position opens up, and will generate inside mobile terminal
Heat be dispersed into outside mobile terminal, and then improve the heat dissipation performance and reliability of mobile terminal.
It is the preferred embodiment of the present invention above, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection scope.
Claims (12)
1. a kind of circuit board, which is characterized in that including plate body and heat radiator part, the plate body includes two plate faces, wherein
The heat radiator part is provided at least one plate face；
The heat radiator part includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, the mixing
Material is made of heat absorption heat accumulating and heat conduction and heat radiation material, and the heat conduction and heat radiation material is used to pass the heat on the plate body
The heat absorption heat accumulating is passed, the heat absorption heat accumulating stores simultaneously for absorbing and storing the heat on the plate body
The heat of the heat conduction and heat radiation material conduction, the heat radiator part further include titanate coupling agent and glue-line, and the heat absorption dissipates
Warmware is the mixing material and the titanate coupling agent is mixed and made into flaky material, and the heat radiator part passes through the glue
Layer is fitted on the white space of the plate face；
The circuit board further includes protective film, and the protective film is set on the heat radiator part, and the protective film is located at
Side far from the plate body, the protective film are polyethylene terephthalate or silica gel.
2. circuit board as described in claim 1, which is characterized in that a wherein plate face for the plate body is for being arranged first device that generates heat
Part, another plate face of the plate body are provided with the heat radiator part.
3. circuit board as claimed in claim 2, which is characterized in that be used to be arranged the plate of the heating element in the plate body
The white space in face is provided with the heat radiator part.
4. circuit board as described in claim 1, which is characterized in that two plate faces of the plate body are all used to be arranged the first device of fever
Part is provided with the heat radiator part in the white space of each plate face of the plate body.
5. circuit board as described in claim 1, which is characterized in that the circuit board includes printed circuit board and flexible circuit board
At least one of.
6. circuit board as described in claim 1, which is characterized in that the heat absorption heat accumulating and institute in the mixing material
Stating between heat conduction and heat radiation material is 1:1 with ratio.
7. circuit board as described in claim 1, which is characterized in that the heat absorption heat accumulating in the mixing material includes
The mass ratio of silica and polyethylene glycol, the silica and polyethylene glycol is 1:1~1:9, in the mixing material
The heat conduction and heat radiation material is graphite or metal.
8. circuit board as claimed in claim 7, which is characterized in that the heat absorption heat accumulating is by several with the silica
It is constituted for cyst wall, by the micro-capsule of capsule-core of the polyethylene glycol.
9. such as circuit board according to any one of claims 1 to 8, which is characterized in that the glue-line stacking is covered on described
On shape material, the flaky material is adhered on the plate body by the glue-line.
10. such as circuit board according to any one of claims 1 to 8, which is characterized in that the heat radiator part further includes dilution
Solvent and bonding solution, the mixing material, the retarder thinner and the bonding solution are mixed and are coated on the plate body.
11. such as circuit board according to any one of claims 1 to 8, which is characterized in that the heat radiator part further includes substrate
And glue-line, the mixing material are coated in the substrate, the glue-line stacking is covered in the mixing material, and the painting
The substrate for being furnished with mixing material is adhered on the plate body by the glue-line.
12. a kind of mobile terminal, which is characterized in that including shell and circuit board as claimed in any one of claims 1 to 11,
The shell rim position opens up thermal hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610286977.3A CN105873357B (en) | 2016-04-29 | 2016-04-29 | Circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610286977.3A CN105873357B (en) | 2016-04-29 | 2016-04-29 | Circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105873357A CN105873357A (en) | 2016-08-17 |
| CN105873357B true CN105873357B (en) | 2019-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610286977.3A Active CN105873357B (en) | 2016-04-29 | 2016-04-29 | Circuit board and mobile terminal |
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| CN (1) | CN105873357B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP4319495A1 (en) * | 2021-05-31 | 2024-02-07 | Huawei Digital Power Technologies Co., Ltd. | Power adapter and electronic device system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN101333094A (en) * | 2008-07-29 | 2008-12-31 | 武汉理工大学 | Method for preparing phase change asphalt pavement material |
| CN101418990A (en) * | 2007-10-26 | 2009-04-29 | 河南桑达能源环保有限公司 | Solar heat absorption plate |
| CN102241963A (en) * | 2011-05-20 | 2011-11-16 | 宁波诺丁汉大学 | Shape-stabilized phase change energy storage material with high-thermal conductivity and preparation method thereof |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
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| US9226428B2 (en) * | 2012-06-28 | 2015-12-29 | Intel Corporation | High heat capacity electronic components and methods for fabricating |
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| CN1695787A (en) * | 2005-03-29 | 2005-11-16 | 东华大学 | Synthesizing inorganic microcapsules of storing energy through phase change by using method of solution precipitation polymerization |
| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN1793277A (en) * | 2006-01-06 | 2006-06-28 | 华南理工大学 | Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide |
| CN101418990A (en) * | 2007-10-26 | 2009-04-29 | 河南桑达能源环保有限公司 | Solar heat absorption plate |
| CN101333094A (en) * | 2008-07-29 | 2008-12-31 | 武汉理工大学 | Method for preparing phase change asphalt pavement material |
| CN102241963A (en) * | 2011-05-20 | 2011-11-16 | 宁波诺丁汉大学 | Shape-stabilized phase change energy storage material with high-thermal conductivity and preparation method thereof |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
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