CN105873357A - Circuit board and mobile terminal - Google Patents
Circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105873357A CN105873357A CN201610286977.3A CN201610286977A CN105873357A CN 105873357 A CN105873357 A CN 105873357A CN 201610286977 A CN201610286977 A CN 201610286977A CN 105873357 A CN105873357 A CN 105873357A
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- China
- Prior art keywords
- heat
- circuit board
- plate body
- radiator part
- mixing material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a circuit board which comprises a board body and heat absorption and dissipation parts. The board body comprises two board faces, and the heat absorption and dissipation parts are arranged on at least one board face; each heat absorption and dissipation part comprises a mixed material with the materials properties of heat absorption, heat storage and heat dissipation functions, the mixed material is composed of a heat absorption and storage material and a heat conduction and dissipation material, and the heat conduction and dissipation material is used for transferring heat on the board body to the heat absorption and storage material which is used for absorbing and storing heat of the board body and storing the heat transferred by the heat conduction and dissipation material simultaneously. The invention further discloses a mobile terminal. Heat emitted by heating components of the circuit board can be absorbed directly through the mixed material arranged on the circuit board, direct heat dissipation is conducted on the position with larger heat emission quantity, and the heat dissipation property and reliability of the mobile terminal are improved.
Description
Technical field
The present invention relates to a kind of electronic device field, particularly relate to a kind of circuit board and mobile terminal.
Background technology
Along with the development of mobile phone industry, mobile phone configuration is more and more higher, and the electronic devices and components on circuit board of mobile phone are also
More and more, cause cell-phone heating amount to strain mutually greatly, if these heats do not reach control or transfer, can carry
Impact of both coming: 1, circuit board temperature can be made too high, affect the performance of electronic devices and components, even result in
Mobile phone computing is slack-off, affects Consumer's Experience.2, the heat that circuit board distributes is transferred to phone housing, outside causing
Shell temperature is higher, there will be the problems such as hot, boiling hot ear during use.
For solving the heating problem of mobile phone, be usually the most in the industry heat radiation graphite flake is arranged at inner walls or
On mobile phone shielding lid, chip is dispelled the heat indirectly, but send out when inventor states technical scheme on the implementation
Now relatively big by the limitation of position due to the setting of heat radiation graphite flake, the position that caloric value is bigger be cannot be carried out directly
Connect heat radiation, thus cause its heat dispersion poor.
Summary of the invention
In order to solve above-mentioned technical problem, the invention provides a kind of circuit board, including plate body and heat radiator
Part, described plate body includes two plate faces, and at least one of which plate face is provided with described heat radiator part；
Described heat radiator part includes the mixing material with the material properties of heat absorption, heat accumulation and heat sinking function,
Described mixing material is by absorbing heat heat accumulating and heat conduction and heat radiation material forms, and described heat conduction and heat radiation material will be for will
Heat on described plate body passes to described heat absorption heat accumulating, and described heat absorption heat accumulating is used for absorbing and storing up
Deposit the heat on described plate body, store the heat of described heat conduction and heat radiation conduct simultaneously.
Wherein, a wherein plate face of described plate body is used for arranging heating element, another plate face of described plate body
It is provided with described heat radiator part.
Further, it is provided with for the white space in the plate face that arranges described heating element at described plate body
Described heat radiator part.
Wherein, two plate faces of described plate body are all used for arranging heating element, at each plate of described plate body
The white space in face is provided with described heat radiator part.
Wherein, described circuit board also includes that protecting film, described protecting film are arranged on described heat radiator part,
And described protecting film is located remotely from the side of described plate body.
Wherein, at least one during described circuit board includes printed circuit board (PCB) and flexible PCB.
Wherein, joining between the described heat absorption heat accumulating in described mixing material and described heat conduction and heat radiation material
Ratio is 1:1.
Wherein, the described heat absorption heat accumulating in described mixing material includes silicon dioxide and Polyethylene Glycol, institute
The mass ratio stating silicon dioxide and Polyethylene Glycol is 1:1～1:9, and the described heat conduction in described mixing material dissipates
Hot material is graphite or metal.
Further, described heat absorption heat accumulating by some with described silicon dioxide as cyst wall, with described poly-second
Glycol is that the microcapsule of capsule-core is constituted.
Wherein, described heat radiator part also includes titanate coupling agent and glue-line, described mixing material and described
Titanate coupling agent is mixed and made into flaky material, and described glue-line stacking is covered on described flaky material, described
Flaky material is adhered on described plate body by described glue-line.
Wherein, described heat radiator part also includes retarder thinner and bonding solution, described mixing material, described
Retarder thinner and described bonding solution mix and coat on described plate body.
Wherein, described heat radiator part also includes that substrate and glue-line, described mixing material coat described substrate
On, described glue-line stacking is covered on described mixing material, and described in be coated with mixing material substrate pass through
Described glue-line is adhered on described plate body.
The embodiment of the present invention additionally provides a kind of mobile terminal, including housing and above-mentioned part or all of circuit
Plate, thermal hole is offered at described shell rim position.
Implement the embodiment of the present invention, have the advantages that
The circuit board that the present invention provides includes plate body and heat radiator part, and plate body includes two plate faces, wherein
Being provided with described heat radiator part at least one plate face, described heat radiator part includes having heat absorption, heat accumulation
And the mixing material of the material properties of heat sinking function, described mixing material is by absorbing heat heat accumulating and heat conduction dissipates
Hot material forms, and the heat on described plate body is passed to described heat absorption heat accumulating by described heat conduction and heat radiation material,
Described heat absorption heat accumulating absorbs and stores the heat on described plate body, stores described heat conduction and heat radiation material simultaneously
The heat of conduction, the heat that the heating element on circuit board distributes can be directly by setting on circuit board
Mixing material absorbs, it is achieved that directly dispel the heat the position that caloric value is bigger, improves mobile whole
The thermal diffusivity of end and reliability.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, below by use required in embodiment
Accompanying drawing is briefly described, it should be apparent that, the accompanying drawing in describing below is only some enforcements of the present invention
Mode, for those of ordinary skill in the art, on the premise of not paying creative work, also may be used
To obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the printed circuit board (PCB) of embodiment of the present invention offer partial schematic diagram in mobile terminal；
Fig. 2 is the flexible PCB of embodiment of the present invention offer partial schematic diagram in mobile terminal；
Fig. 3 is the schematic diagram of the circuit board that the embodiment of the present invention provides；
Fig. 4 is the schematic diagram of the heat radiator part that first embodiment of the invention provides；
Fig. 5 is the schematic diagram of the heat radiator part that second embodiment of the invention provides；
Fig. 6 is the schematic diagram of the heat radiator part that third embodiment of the invention provides；
Fig. 7 is the schematic diagram of a kind of mobile terminal that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is entered
Row clearly and completely describes.
The mobile terminal that the present embodiments relate to can be any possess communication and the equipment of storage function, example
As: panel computer, mobile phone, electronic reader, remote controller, personal computer (Personal Computer,
PC), notebook computer, mobile unit, Web TV, wearable device etc. have the intelligence of network function and set
Standby.The circuit board that the embodiment of the present invention provides include printed circuit board (PCB) (English: Printed Circuit Board,
Be called for short: PCB) and flexible PCB (English: Flexible Printed Circuit, abbreviation: in FPC) extremely
Few one.Wherein, printed circuit board (PCB) schematic diagram in mobile terminal may refer to Fig. 1；Flexible PCB exists
Schematic diagram in mobile terminal may refer to Fig. 2.
Refer to the schematic diagram that Fig. 3, Fig. 3 are the circuit boards that the embodiment of the present invention provides.As it is shown on figure 3, it is electric
Road plate 3 includes plate body 31 and heat radiator part 32, and plate body 31 includes two plate faces, the respectively first plate face
311 and the second plate face 312, at least one plate face of plate body 31 is provided with heat radiator part 32 (Fig. 3
It is all to be provided with heat radiator part on two plate faces, in other alternative embodiments, can only the most wherein one
Individual plate face arranges heat radiator part), heat radiator part 32 includes having heat absorption, heat accumulation and heat sinking function
The mixing material 3211a of material properties.Material 3211a is by heat accumulating and the heat conduction and heat radiation material group of absorbing heat in mixing
Becoming, heat conduction and heat radiation material for passing to the heat accumulating that absorbs heat by the heat on plate body 31, and absorb heat heat accumulating
For absorbing and store the heat on plate body 31, store the heat of heat conduction and heat radiation conduct simultaneously.
In the present embodiment, circuit board being provided with heat radiator part, heat radiator part includes by heat absorption heat accumulation
Material and the mixing material of heat conduction and heat radiation material composition, the heat on heating element is passed by heat conduction and heat radiation material
Passing heat absorption heat accumulating, heat is absorbed by heat absorption heat accumulating, and after absorbing to a certain degree again
Slowly release, it is achieved that is directly dispelled the heat in the position that caloric value is bigger, improve the heat radiation of mobile terminal
Property and reliability.
Circuit board 3 can be single sided board, dual platen, four laminates or multi-layer sheet.
Single sided board is that a kind of one side applies copper, utilizes one side design circuit lead and the welding of element having applied copper.
If circuit board 3 is single sided board, it is assumed that the first plate face 311 of plate body 31 is used for arranging heating element, then
Second plate face 312 of plate body 31 is provided with heat radiator part 32.
Further, if circuit board 3 is single sided board, the white space in the first plate face 311 of plate body 31 is (i.e.
It is not provided with the region of electronic devices and components) it is also provided with described heat radiator part 32.By the mixing of both sides
The heating element arranged on circuit board 3 is dispelled the heat by material 3211a, accelerates heat radiation dynamics, carries further
The thermal diffusivity of high mobile terminal and reliability.
Dual platen includes top layer, bottom and insulating barrier, and insulating barrier is between top layer and bottom.The end of dual platen
Layer and the two-sided of top layer are all covered with copper, say, that top layer and the two-sided of bottom can connect up and weld.
If circuit board 3 is dual platen, then the entirety that plate body 31 is made up of top layer, bottom and insulating barrier.If plate
First plate face 311 of body 31 is the top layer side away from insulating barrier, then the second plate face 312 of plate body 31 is the end
Layer is away from the side of insulating barrier.If the first plate face 311 of plate body 31 is the bottom side away from insulating barrier, then
Second plate face 312 of plate body 31 is the top layer side away from insulating barrier.If circuit board 3 is dual platen, then exist
First plate face 311 of plate body 31 and the white space in the second plate face 312 all arrange heat radiator part 32.
Multi-layer sheet is then plus other layer between the top layer and bottom of dual platen, as placed two power supply flaggies.
If circuit board 3 is multi-layer sheet, then plate body 31 be made up of top layer, bottom and the layer that adds between the two one
Individual entirety.If the first plate face 311 of plate body 31 is the top layer side away from insulating barrier, then the second of plate body 31
Plate face 312 is the bottom side away from insulating barrier.If the first plate face 311 of plate body 31 is that bottom is away from insulation
The side of layer, then the second plate face 312 of plate body 31 is the top layer side away from insulating barrier.If circuit board 3 is
Multi-layer sheet, then the white space in the first plate face 311 of plate body 31 and the second plate face 312 all arranges to absorb heat and dissipates
Warmware 32.
In order to further improve, circuit board 3 also includes that protecting film 33, protecting film 33 are arranged at heat absorption and dissipate
On warmware 32, and protecting film 33 is located remotely from the side of body 31.
In the present embodiment, protecting film 33 is polyethylene terephthalate (PET), and it is layered in heat absorption
On radiating piece 32, protecting film 33 can carry out shaping and have dust-proof effect by heat radiator part 32 further.
Certainly, in other embodiments, the material of protecting film 33 can also be other, such as silica gel.
In order to further improve, described heat absorption heat accumulating and described heat conduction in mixing material 3211a dissipate
Proportioning value between hot material is 1:1.
In order to further improve, the described heat absorption heat accumulating in mixing material 3211a is by Polyethylene Glycol
With the phase-changing energy storage material of silicon dioxide composition, the mass ratio of described silicon dioxide and Polyethylene Glycol is 1:1～1:
9, concrete which kind of proportioning value of selection can be selected according to demand.Heat conduction and heat radiation material in mixing material 3211a
For any one in graphite or metal.
In order to further improve, described heat absorption heat accumulating by some with described silicon dioxide as cyst wall,
Microcapsule with described Polyethylene Glycol as capsule-core is constituted.
Wherein, the detailed process making described heat absorption heat accumulating can be: is joined necessarily by Polyethylene Glycol
In the Ludox of concentration, after all dissolving, drip CaCl2 accelerator solution, under strong stirring so that it is
There is gelation reaction, after standing, form three-dimensional net structure gel；Gel air blast in 80 DEG C of baking ovens is done
Dry 24-28 hour, be then cooled to room temperature, i.e. available by some silicon dioxide after gel as cyst wall,
The described heat radiator material that constituted of microcapsule being capsule-core with the Polyethylene Glycol after emulsifying.Wherein, described
Polyethylene Glycol in the capsule-core of microcapsule is phase-changing energy storage material, and the most described microcapsule passes through gradually to absorb heat,
Can by the Polyethylene Glycol in described capsule-core gradually by solid state transformed for liquid, to realize the storage to heat,
Same when the heat that described microcapsule is absorbed gradually decreases, the Polyethylene Glycol in described capsule-core the most gradually by
Liquid is converted into solid-state, to dispel the heat the heat stored, wherein, for the described Polyethylene Glycol of liquid
Self-temperature the highest, the heat i.e. absorbed all is used for carrying out phase transformation, and described Polyethylene Glycol is by liquid
The process becoming solid-state is a radiation processes slowly, so comprising the described heat absorption of some described microcapsules
Radiating piece 32 causes phone housing temperature to be directly delivered to phone housing in avoiding the heat short time absorbed
Spend height.Further, owing to existing for the cyst wall of described silicon dioxide, it is possible to ensure as liquid
Polyethylene Glycol will not flow out described microcapsule, and therefore, the Polyethylene Glycol in described capsule-core is gradually turned by solid-state
During turning to liquid, described microcapsule is the most from hard to soft, and then affects described heat absorption heat accumulating
Quality the most from hard to soft.Described heat conduction and heat radiation material in described mixing material 3211a as a example by graphite, by
Good in the heat conductivity of graphite, thus graphite can to conduct heat to described heat absorption heat accumulating faster enterprising
Row heat stores, and the good heat dissipation effect that graphite is in the x, y direction, thus graphite can also avoid by
While heat is directly emitted to the phone housing relative with described plate body 31, improve dissipating of described mixing material
Thermal velocity.Wherein, before being mixed to form described mixing material, need first by described heat conduction and heat radiation material and
Carry out strong stirring for gelatinous described heat absorption heat accumulating, to respectively obtain the powder body of correspondence, i.e. mix
Process refers to mix the described heat conduction and heat radiation material for powder body and the described heat absorption heat accumulating for powder body
Process；Wherein, owing to the described microcapsule in described heat absorption heat accumulating is much smaller than for described in powder body
The size of mixing material 3211a, so in the described heat absorption heat accumulating for powder body obtained after strong stirring
Still comprising some complete described microcapsules, therefore, the described heat absorption heat accumulating for powder body still has
Heat absorption, heat storage function, thus after mixing the described mixing material that formed still have heat absorption, heat accumulation and
Heat sinking function.Certainly, in other embodiments, mixing material 3211a can also be inorganic phase-changing material, or
Other composite phase-change materials of person etc..
As shown in Figure 4, Fig. 4 is a kind of heat radiator part 321 that first embodiment of the invention provides.In order to more
Further improving, heat radiator part 321 also includes titanate coupling agent 3211b and glue-line 3212, mixing
Material 3211a and titanate coupling agent 3211b is mixed and made into flaky material 3211, and glue-line 3212 stacking pastes
On flaky material 3211, flaky material 3211 is adhered on plate body 31 by glue-line 3212.
By mixing material 3211a and titanate coupling agent 3211b is mixed and made into flaky material 3211, then lead to
Cross glue-line 3212 stacking to be connected on flaky material 3211 form heat radiator part 321, the heat radiator of lamellar
Part 321 is applied more convenient, is directly stained with, and is cooled into coating without waiting for it.
In the present embodiment, mixing material 3211a is first by heat conduction and heat radiation material with for gelatinous heat absorption heat accumulation
Material carries out strong stirring, to respectively obtain the powder body of correspondence；Described in described heat absorption heat accumulating
Microcapsule is the size much smaller than the described mixing material 3211a for powder body, so obtain after strong stirring
For the described heat absorption heat accumulating of powder body still comprising some complete described microcapsules, therefore, for powder body
Described heat absorption heat accumulating still there is heat absorption, heat storage function, thus the described mixing formed after mixing
Material still has heat absorption, heat accumulation and heat sinking function.Titanate esters is added at the mixing material 3211a of powder
Coupling agent 3211b obtains inorganic plan organic composite shaping phase-change material, then the phase that shaped by this inorganic plan organic composite
Become material and prepare flake i.e. flaky material 3211 through tabletting machine, in flaky material 3211 stacking again connection
Glue-line 3212 forms heat radiator part 321.It should be understood that glue-line 3212 can be gum, double faced adhesive tape or
Mould release membrance etc..The shape that heat radiator part 321 can be pasted as required is cut into definite shape, is fitted in plate
On body 31, it is achieved heat absorption, heat accumulation and heat sinking function.
As it is shown in figure 5, Fig. 5 is the heat radiator part 322 that second embodiment of the invention provides.With the present invention
The basic structure of the heat radiator part 321 that one embodiment provides is roughly the same, and its difference is, this enforcement
Heat radiator part 322 in example also includes retarder thinner and bonding solution, mixing material, retarder thinner and bonding
Coat on plate body 31 after solution mixing.
By retarder thinner, bonding solution are formed heat radiator part 322 with mixing material mixing so that heat absorption
Radiating piece 332 directly has adhesive force, it is not necessary to still further increases glue-line and can coat upper plate body 31, thus
Provide one and use advantageously heat radiator part 322.
In the present embodiment, mixing material is first by heat conduction and heat radiation material with for gelatinous heat absorption heat accumulating
Carry out strong stirring, to respectively obtain the powder body of correspondence；Due to the described micro-glue in described heat absorption heat accumulating
Capsule is much smaller than the size of described mixing material for powder body, thus obtain after strong stirring for powder body
Described heat absorption heat accumulating still comprises some complete described microcapsules, therefore, for the described suction of powder body
Hot heat accumulating still has heat absorption, heat storage function, thus the described mixing material formed after mixing is still
There is heat absorption, heat accumulation and heat sinking function.Heat absorption heat accumulating in powder is added to retarder thinner and adds
Add special binder solution mixing (such as: methanol dimethylbenzene, acrylic resin etc.) so that heat radiator part 322
There is adhesive force, directly use the form of coating to be piled into certain thickness heat radiator part 322 and be attached to plate body
On 31, thus realize heat absorption, heat accumulation and heat sinking function.
Such as Fig. 6, the third embodiment of the present invention is provided a kind of heat radiator part 323, real with the present invention first
The basic structure executing the heat radiator part 321 that example provides is roughly the same, and its difference is, in the present embodiment
Heat radiator part 323 also include substrate 3232 and glue-line 3233, substrate 3232 coated by mixing material 3231
On, glue-line 3233 stacking is connected to mix on material 3231, and glue-line 3233 is adhered on plate body 31.
By directly mixing material 3231 being coated molding in substrate 3232, then set at mixing material 3231
Put glue-line 3233 to be pasted on plate body 31, it is not necessary to tablet machine carries out tabletting, makes relatively simple.
In the present embodiment, mixing material 3231 is first by heat conduction and heat radiation material with for gelatinous heat absorption heat accumulation
Material carries out strong stirring, to respectively obtain the powder body of correspondence；Described in described heat absorption heat accumulating
Microcapsule is much smaller than the size of described mixing material for powder body, thus obtain after strong stirring for powder
The described heat absorption heat accumulating of body still comprises some complete described microcapsules, therefore, for the institute of powder body
State heat absorption heat accumulating and still there is heat absorption, heat storage function, thus the described mixing material formed after mixing
Still there is heat absorption, heat accumulation and heat sinking function.Substrate 3232 is polyethylene terephthalate (PET),
The mixing material 3231 of powder is directly coated at molding in substrate 3232, by the base of mixing material 3231
The end 3232, is adhered on plate body 31 by glue-line 3233, it is achieved the heat absorption of heat radiator part 323, heat accumulation and
Heat sinking function.It should be understood that glue-line can be gum, double faced adhesive tape or other etc..
Refer to the schematic diagram of the mobile terminal 7 that Fig. 7, Fig. 7 provide, mobile terminal for the embodiment of the present invention
7 include the above-mentioned circuit board mentioned and housing.Wherein, circuit board includes above-mentioned heat radiator part 321,322
With 323 in any one.
Mobile terminal is during fabrication, it is first determined need to arrange the position of heat radiator part on circuit board, then
Heat radiator part is set in defined location, then components and parts are set on circuit boards, finally by circuit board package
In mobile terminal.Wherein, heat radiator part includes that the material with heat absorption, heat accumulation and heat sinking function belongs to
Property mixing material, mixing material, by absorbing heat heat accumulating and heat conduction and heat radiation material forms, forms microcapsule structure
Heat absorption heat accumulating after the heat that heating element distributes reaches 40 degree, start to absorb heating element and dissipate
The heat sent out, and capsule-core itself is gradually from solid-liquid, and after capsule-core is converted to liquid phase, absorb heat heat accumulation
The heat of absorbed is the most saturated, and it stops absorbing heat, and is gradually decrease to preset in outside temperature
After temperature, the heat of absorption is come out by capsule-core, is delivered in air, and capsule-core can be along with its fever of the body
Gradually decreasing of amount and gradually from liquid-solid, by the circulating phase-change of the heat accumulating that absorbs heat, thus to heating
Components and parts are lowered the temperature, and then improve heat dispersion and the reliability of mobile terminal.
The mobile terminal that the present invention provides is by arranging heat radiator part on circuit boards, and heat radiator part includes
The mixing material being made up of heat absorption heat accumulating and heat conduction and heat radiation material, heat conduction and heat radiation material is by heating element
On heat pass to the heat accumulating that absorbs heat, heat is absorbed by heat absorption heat accumulating, and is absorbing one
The most slowly discharge after determining degree, it is achieved that is directly dispelled the heat in the position that caloric value is bigger, improve movement
The thermal diffusivity of terminal and reliability.
The mobile terminal that the present invention provides is by arranging protecting film, with to heat radiator part on heat radiator part
Protect further, improve thermal diffusivity and the reliability of mobile terminal.
The mobile terminal that the present invention provides will heating unit also by the heat conduction and heat radiation material that graphite or metal etc. are made
The heat that device distributes quickly is conducted to the heat accumulating that absorbs heat, by silicon dioxide and Polyethylene Glycol with mass ratio for 1:
1～1:9 mixes the heat absorption heat accumulating that can prepare, it is possible to absorbs heat in time, is absorbing to a certain degree
Or, after temperature reaches to a certain degree, the heat of absorption is slowly discharged by heat absorption heat accumulating again, enters
One step improves chip and the reliability of mobile terminal.
The mobile terminal that the present invention provides makes microcapsule structure also by by heat absorption heat accumulating, it is possible to the most right
The heat that heating element distributes carries out the heat accumulation that absorbs heat, and then reaches preferably heat dispersion.
The mobile terminal that the present invention provides is mixed and made into lamellar material also by by mixing material and titanate coupling agent
Material, then be connected on flaky material form heat radiator part by glue-line stacking, not only make heat radiator part
Can go to cut according to certain shape, and the application of the heat radiator part of lamellar is more convenient, directly
It is stained with, is cooled into coating without waiting for it.
The mobile terminal that the present invention provides is formed with mixing material mixing also by by retarder thinner, bonding solution
Heat radiator part so that heat radiator part directly has adhesive force, it is not necessary to still further increasing glue-line can be coated with
On plate body, thus provide one and use advantageously heat radiator part.
The mobile terminal that the present invention provides is also by coating in substrate by mixing material, and glue-line stacking is covered on
On mixing material, and the substrate being coated with mixing material is adhered on described plate body by glue-line.By directly
Mixing material is coated molding in substrate, then at mixing material, glue-line is set to be pasted on plate body, it is not necessary to
Tablet machine carries out tabletting, makes relatively simple.
The thermal hole that the mobile terminal that the present invention provides is offered also by shell rim position, by mobile terminal
The heat that portion produces is dispersed into outside mobile terminal, and then improves heat dispersion and the reliability of mobile terminal.
It is above the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For Yuan, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these change
Enter and retouching is also considered as protection scope of the present invention.
Claims (13)
1. a circuit board, it is characterised in that include plate body and heat radiator part, described plate body includes two
Plate face, at least one of which plate face is provided with described heat radiator part；
Described heat radiator part includes the mixing material with the material properties of heat absorption, heat accumulation and heat sinking function,
Described mixing material is by absorbing heat heat accumulating and heat conduction and heat radiation material forms, and described heat conduction and heat radiation material will be for will
Heat on described plate body passes to described heat absorption heat accumulating, and described heat absorption heat accumulating is used for absorbing and storing up
Deposit the heat on described plate body, store the heat of described heat conduction and heat radiation conduct simultaneously.
2. circuit board as claimed in claim 1, it is characterised in that a wherein plate face of described plate body is used for
Arranging heating element, another plate face of described plate body is provided with described heat radiator part.
3. circuit board as claimed in claim 2, it is characterised in that be used for arranging described sending out at described plate body
The white space in the plate face of hot components and parts is provided with described heat radiator part.
4. circuit board as claimed in claim 1, it is characterised in that two plate faces of described plate body are all used for
Arranging heating element, the white space in each plate face of described plate body is provided with described heat radiator part.
5. circuit board as claimed in claim 1, it is characterised in that described circuit board also includes protecting film,
Described protecting film is arranged on described heat radiator part, and described protecting film is located remotely from the side of described plate body.
6. circuit board as claimed in claim 1, it is characterised in that described circuit board includes printed circuit board (PCB)
With at least one in flexible PCB.
7. circuit board as claimed in claim 1, it is characterised in that the described heat absorption in described mixing material
Proportioning value between heat accumulating and described heat conduction and heat radiation material is 1:1.
8. circuit board as claimed in claim 1, it is characterised in that the described heat absorption in described mixing material
Heat accumulating include silicon dioxide and Polyethylene Glycol, the mass ratio of described silicon dioxide and Polyethylene Glycol be 1:1～
1:9, the described heat conduction and heat radiation material in described mixing material is graphite or metal.
9. circuit board as claimed in claim 8, it is characterised in that described heat absorption heat accumulating by some with
Described silicon dioxide is cyst wall, microcapsule with described Polyethylene Glycol as capsule-core is constituted.
10. the circuit board as according to any one of claim 1～9, it is characterised in that described heat radiator part
Also include that titanate coupling agent and glue-line, described mixing material and described titanate coupling agent are mixed and made into lamellar
Material, described glue-line stacking is covered on described flaky material, and described flaky material is bonding by described glue-line
On described plate body.
11. circuit boards as according to any one of claim 1～9, it is characterised in that described heat radiator part
Also including retarder thinner and bonding solution, described mixing material, described retarder thinner and described bonding solution are mixed
Merge and coat on described plate body.
12. circuit boards as according to any one of claim 1～9, it is characterised in that described heat radiator part
Also including that substrate and glue-line, described mixing material are coated in described substrate, described glue-line stacking is covered on institute
State mixing material on, and described in be coated with mixing material substrate be adhered on described plate body by described glue-line.
13. 1 kinds of mobile terminals, it is characterised in that include housing and such as any one of claim 1～12 institute
The circuit board stated, thermal hole is offered at described shell rim position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610286977.3A CN105873357B (en) | 2016-04-29 | 2016-04-29 | Circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610286977.3A CN105873357B (en) | 2016-04-29 | 2016-04-29 | Circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105873357A true CN105873357A (en) | 2016-08-17 |
| CN105873357B CN105873357B (en) | 2019-03-01 |
Family
ID=56629928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610286977.3A Active CN105873357B (en) | 2016-04-29 | 2016-04-29 | Circuit board and mobile terminal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022252019A1 (en) * | 2021-05-31 | 2022-12-08 | 华为数字能源技术有限公司 | Power adapter and electronic device system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1695787A (en) * | 2005-03-29 | 2005-11-16 | 东华大学 | Synthesizing inorganic microcapsules of storing energy through phase change by using method of solution precipitation polymerization |
| CN1793277A (en) * | 2006-01-06 | 2006-06-28 | 华南理工大学 | Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide |
| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN101333094A (en) * | 2008-07-29 | 2008-12-31 | 武汉理工大学 | Method for preparing phase change asphalt pavement material |
| CN101418990A (en) * | 2007-10-26 | 2009-04-29 | 河南桑达能源环保有限公司 | Solar heat absorption plate |
| CN102241963A (en) * | 2011-05-20 | 2011-11-16 | 宁波诺丁汉大学 | Shape-stabilized phase change energy storage material with high-thermal conductivity and preparation method thereof |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
| US20140002998A1 (en) * | 2012-06-28 | 2014-01-02 | Intel Corporation | High heat capacity electronic components and methods for fabricating |
-
2016
- 2016-04-29 CN CN201610286977.3A patent/CN105873357B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1695787A (en) * | 2005-03-29 | 2005-11-16 | 东华大学 | Synthesizing inorganic microcapsules of storing energy through phase change by using method of solution precipitation polymerization |
| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN1793277A (en) * | 2006-01-06 | 2006-06-28 | 华南理工大学 | Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide |
| CN101418990A (en) * | 2007-10-26 | 2009-04-29 | 河南桑达能源环保有限公司 | Solar heat absorption plate |
| CN101333094A (en) * | 2008-07-29 | 2008-12-31 | 武汉理工大学 | Method for preparing phase change asphalt pavement material |
| CN102241963A (en) * | 2011-05-20 | 2011-11-16 | 宁波诺丁汉大学 | Shape-stabilized phase change energy storage material with high-thermal conductivity and preparation method thereof |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
| US20140002998A1 (en) * | 2012-06-28 | 2014-01-02 | Intel Corporation | High heat capacity electronic components and methods for fabricating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022252019A1 (en) * | 2021-05-31 | 2022-12-08 | 华为数字能源技术有限公司 | Power adapter and electronic device system |
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| CN105873357B (en) | 2019-03-01 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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