CN105828579A - Hardware support and mobile terminal - Google Patents
Hardware support and mobile terminal Download PDFInfo
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- CN105828579A CN105828579A CN201610287065.8A CN201610287065A CN105828579A CN 105828579 A CN105828579 A CN 105828579A CN 201610287065 A CN201610287065 A CN 201610287065A CN 105828579 A CN105828579 A CN 105828579A
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- Prior art keywords
- heat
- heat absorption
- mainboard
- absorption heat
- display screen
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
An embodiment of the invention discloses a hardware support and mobile terminal. The hardware support includes a body and a heat absorption and heat storage part, wherein the heat absorption and heat storage part is arranged on the body; one side of the body is provided with a mainboard, the other side is provided with a display screen, and the body is used for fixing the mainboard and the display screen; and the heat absorption and heat storage part is made of a heat absorption and heat storage material having material properties of heat absorption and heat storage functions, and the heat absorption and heat storage material is used for absorbing and storing heat generated by the mainboard and/or heat generated by the display screen. By adoption of the hardware support, the temperature of the display screen and/or mainboard of a mobile terminal can be effectively reduced, thereby improving the heat dissipation performance of the mobile terminal.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of hardware bracket and mobile terminal.
Background technology
Along with the development of terminal technology, the function that mobile terminal such as mobile phone is capable of gets more and more, brings great convenience.Meanwhile, mobile phone configuration is more and more higher, and central processing unit (CentralProcessingUnit is called for short " CPU ") dominant frequency is more and more higher, and this power consumption resulting in mobile phone is increasing, and then causes cell-phone heating amount to increase the most accordingly.If these heats can not get controlling or transfer, then the heater members being in the condition of high temperature can cause mobile phone computing slack-off, card even occurs.
Summary of the invention
The embodiment of the present invention provides a kind of hardware bracket and mobile terminal, it is possible to effectively reduces display screen and/or the temperature of mainboard of mobile terminal, promotes the heat dispersion of mobile terminal.
Embodiments providing a kind of hardware bracket, including body and heat absorption heat accumulation part, described heat absorption heat accumulation part is arranged on described body；
Wherein, the one side of described body is provided with mainboard, and another side is provided with display screen, and described body is used for fixing described mainboard and described display screen；
Described heat absorption heat accumulation part is made up of the heat absorption heat accumulating of the material properties with heat absorption and heat storage function, and described heat absorption heat accumulating is for absorbing and store heat and/or the heat of described display screen generation of the generation of described mainboard.
Optionally, described body offering the first screw, described mainboard offers the second screw, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Optionally, described hardware bracket also includes fixing post, one end of described fixing post is fixing with described body to be connected, the other end of described fixing post offers the first screw, offering the second screw on described mainboard, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Optionally, the decalescence heat accumulating that described heat absorption heat accumulating is made up of silicon dioxide and Polyethylene Glycol, and the proportioning value between described silicon dioxide and described Polyethylene Glycol is any one in 1:1～1:9.
Optionally, described heat absorption heat accumulating is by with silicon dioxide as cyst wall, and the microcapsule with Polyethylene Glycol as capsule-core is constituted.
Optionally, described heat absorption heat accumulation part also includes retarder thinner and bonding solution；Described heat absorption heat accumulating and described retarder thinner, described bonding solution are mixed to form painting cloth material, and described painting cloth material is coated at least one side of described body.
Optionally, described heat absorption heat accumulation part also includes protecting film；Described protecting film is bonding to be arranged on described painting cloth material, and described protecting film is located remotely from the side of described body.
Optionally, described heat absorption heat accumulation part also includes retarder thinner, bonding solution, protecting film and glue-line；Described heat absorption heat accumulating and described retarder thinner, described bonding solution are mixed to form painting cloth material; described painting cloth material coats the side of described protecting film; being coated with a side bonds of described painting cloth material in the side of described glue-line and described protecting film, the opposite side of described glue-line is bonding with described body.
Optionally, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line；Described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, and the side of described glue-line is bonding with described flaky material, and the opposite side of described glue-line is bonding with described body.
Optionally, described heat absorption heat accumulation part also includes protecting film；Described protecting film is bonding to be arranged on described flaky material, and described protecting film is located remotely from the side of described body.
The embodiment of the present invention additionally provides a kind of mobile terminal, and including display screen, mainboard and above-mentioned hardware bracket, described hardware bracket is arranged between described display screen and described mainboard, is used for fixing described display screen and described mainboard.
The embodiment of the present invention is by arranging the heat absorption heat accumulation part of the heat accumulating that absorbs heat including the material properties with heat absorption and heat storage function on hardware bracket, the heat making it possible to produce the such as mainboard of the heater members in hardware bracket and/or display screen produces absorbs, and heat is stored, to realize reducing the temperature of heater members, the heat avoiding heater members is too high and causes running slower, the problems such as card even occur, it is ensured that mobile terminal is properly functioning.The embodiment of the present invention is by arranging heat absorption heat accumulation part on hardware bracket, enabling effectively reduces display screen and/or the heat of mainboard of mobile terminal, thus promotes the heat dispersion of mobile terminal.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of hardware bracket that one embodiment of the invention provides；
Fig. 2 is the composition schematic diagram of a kind of heat accumulation part that absorbs heat that one embodiment of the invention provides；
Fig. 3 is the structural representation of a kind of hardware bracket that another embodiment of the present invention provides；
Fig. 4 is the composition schematic diagram of a kind of heat accumulation part that absorbs heat that another embodiment of the present invention provides；
Fig. 5 is the structural representation of a kind of hardware bracket that further embodiment of this invention provides；
Fig. 6 is the schematic diagram of a kind of mobile terminal that one embodiment of the invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe may be embodied at least one embodiment of the present invention in conjunction with the embodiments.Each position in the description occurs that this phrase might not each mean identical embodiment, is not and the independent of other embodiments mutual exclusion or alternative embodiment.Those skilled in the art explicitly and are implicitly understood by, and embodiment described herein can combine with other embodiments.
It should be understood that, the involved mobile terminal of the embodiment of the present invention may include but be not limited to mobile phone (such as Android phone, iOS mobile phone etc.), panel computer, mobile internet device (MobileInternetDevices, be called for short " MID "), personal digital assistant (PersonalDigitalAssistant, be called for short " PDA "), wearable device etc..This mobile terminal is also referred to as subscriber equipment (UserEquipment, referred to as " UE "), terminal, wireless terminal or mobile station (MobileStation, referred to as " MS ") etc., and the embodiment of the present invention does not limits.
Embodiments provide a kind of hardware bracket and mobile terminal, it is possible to effectively reduce the temperature of the heater members such as display screen and/or mainboard of mobile terminal, promote the heat dispersion of mobile terminal.Describe in detail individually below.
Refer to the structural representation that Fig. 1, Fig. 1 are a kind of hardware brackets that one embodiment of the invention provides.As it is shown in figure 1, the described hardware bracket 1 of the embodiment of the present invention includes body 10 and heat absorption heat accumulation part 20, described heat absorption heat accumulation part 20 is arranged on described body 10.
Should be understood that in embodiments of the present invention, the one side of described body 10 is provided with mainboard, and another side is provided with display screen, and described body 10 is used for fixing described mainboard and described display screen.It is to say, this hardware bracket 1 is arranged between the display screen of terminal and mainboard, to fix this display screen and/or mainboard.Wherein, this hardware bracket is also called " housing hardware bracket ", or " inserts hardware bracket ", and the embodiment of the present invention does not limits.
Wherein, described heat absorption heat accumulation part 20 is made up of the heat absorption heat accumulating of the material properties with heat absorption and heat storage function, and described heat absorption heat accumulating is for absorbing and store heat and/or the heat of described display screen generation of the generation of described mainboard.Carry out absorbing heat and heat accumulation by the heat absorption heat accumulating included in described heat absorption heat accumulation part 20, the heat of the heater members in terminal such as display screen and/or mainboard can be absorbed and stores, to reduce the temperature of this display screen and/or mainboard.
In specific embodiment, heat absorption heat accumulating can be a kind of phase-change material, it can change physical property and absorb substantial amounts of heat along with variations in temperature, increase along with the heat absorbed, heat absorption heat accumulating gradates as another kind of phase mutually from one, and can stably remain another kind of after absorbing sufficient heat and mutually and no longer absorb heat.When display screen and/or mainboard and/or body 10 do not have thermal source to produce or heat is relatively low, heat absorption heat accumulating carries out dispelling the heat and gradually along with reducing of heat is gradually reverted to original phase mutually by another kind.Wherein, heat absorption heat accumulating can change to liquid phase or liquid phase to solid phase from solid phase along with the change of temperature, or solid phase changes to solid phase to gas phase or gas phase, or liquid phase to gas phase or gas phase to liquid phase.Such as, described heat absorption heat accumulating is by gradually absorbing heat, and its quality can from hard to soft, and to realize the function of heat accumulation, i.e. the quality of heat absorption heat accumulation part 20 can according to the increase of absorption heat from hard to soft.
Optionally, heat absorption heat accumulation part 20 may be disposed in any surface of body 10, or is respectively provided with on the two sides of body 10.When the heat on display screen and/or mainboard and/or body 10 reaches uniform temperature, heat on the heat of display screen generation and/or the heat of mainboard generation and/or body 10 can be absorbed heat and heat accumulation by the heat absorption heat accumulating of heat absorption heat accumulation part 20, and after temperature lowers, by the conduct heat away of storage in air, to realize display screen and/or mainboard and/or body 10 are lowered the temperature.
Optionally, described body 10 can offer the first screw, described mainboard can offer the second screw, described mainboard is connected by screw is fixing with described body 10 with the cooperation of described first screw, described second screw.I.e. can be connected by screw between this hardware bracket 1 and mainboard.
Optionally, described hardware bracket 1 may also include fixing post, one end of described fixing post is fixing with described body 10 to be connected, the other end of described fixing post offers the first screw, offering the second screw on described mainboard, described mainboard is connected by screw is fixing with described body 10 with the cooperation of described first screw, described second screw.
Should be understood that this hardware bracket and mainboard and display screen are attached also by other mode such as buckle, the mode such as weld, the embodiment of the present invention does not limits.
Further alternative, that described heat absorption heat accumulating can be made up of silicon dioxide and Polyethylene Glycol phase-change material, and the proportioning value between described silicon dioxide and described Polyethylene Glycol can be any one in 1:1～1:9.Concrete, drawn by substantial amounts of experiment, by silicon dioxide and Polyethylene Glycol, with mass ratio as 1:1～the organic-composite phase-change material that can prepare of 1:9 mixing has suitable phase transition temperature, it is possible to absorb display screen and/or the heat of mainboard in time.For example, the phase transition temperature that this heat absorption heat accumulating is mixed to prepare can be 40 degree, and after the heat i.e. produced at the heat of display screen and/or mainboard reaches 40 degree, heat absorption heat accumulating can carry out decalescence, lowers the temperature with the heat to display screen and/or mainboard.Should be understood that in other alternative-embodiments, heat absorption heat accumulating can also be inorganic phase-changing material, or is composite phase-change material etc..
Further alternative, described heat absorption heat accumulating can be with silicon dioxide as cyst wall by some, and microcapsule (microcapsule) with Polyethylene Glycol as capsule-core is constituted, thus by this microcapsule structure, heat absorption heat accumulating can preferably carry out absorbing heat and heat accumulation, thus carry out the slow release of heat to a certain extent, to realize the cooling to terminal heater members.Concrete, when making described heat absorption heat accumulating, Polyethylene Glycol can be joined in certain density Ludox, after all dissolving, dropping CaCl2 accelerator solution, under strong stirring so that Polyethylene Glycol occurs sol gel reaction in Ludox, after standing, form three-dimensional net structure gel；By gel forced air drying 24～48h in the baking oven such as 80 DEG C of baking ovens of uniform temperature, it is cooled to room temperature, a large amount of silica dioxide gels after gel produced in the basic conditions with the organo-siloxane compound microcapsule as cyst wall, with the Polyethylene Glycol after emulsifying as capsule-core can be accessed.I.e. in each microcapsule, silicon dioxide wraps the Polyethylene Glycol as capsule-core as cyst wall so that Polyethylene Glycol will not leak during solid-liquid.nullThe heat absorption heat accumulating of this formation microcapsule structure is after the heat of display screen and/or mainboard and/or body 10 reaches uniform temperature such as 40 degree，Start to absorb the heat on display screen and/or mainboard and/or body 10，And capsule-core itself is gradually increased gradually from solid-liquid along with heat，After capsule-core is converted to liquid phase，The heat that heat absorption heat accumulating absorbs is the most saturated，It stops absorbing heat，And after the temperature outside display screen and/or mainboard and/or body 10 is gradually decrease to preset temperature，The heat of absorption is come out by capsule-core，It is delivered in air，And capsule-core gradually can be converted to solid phase from liquid phase along with gradually decreasing of its fever of the body amount，Changed by the circulation of above-mentioned solid phase to liquid phase，It is achieved thereby that display screen and/or mainboard are lowered the temperature，Improve heat dispersion and the reliability of mobile terminal.Should be understood that in other embodiments, heat absorption heat accumulating can also be other structures so that heat absorption heat accumulating can be by carrying out the cooling of the heater members to terminal from the circulation conversion being solid to gas phase.
Optionally, this heat absorption heat accumulation part 20 can have different forms, according to the different shape of described heat absorption heat accumulation part 20, then can corresponding different method to set up, including being coated with setting, bonding being arranged on body 10 etc..Further, in embodiments of the present invention, described heat absorption heat accumulation part 20 also includes retarder thinner and bonding solution；Described heat absorption heat accumulating and described retarder thinner, described bonding solution are mixed to form painting cloth material, and described painting cloth material is coated at least one side of described body 10.
Concrete, it is the composition schematic diagram of the heat absorption heat accumulation part that one embodiment of the invention provides please also refer to Fig. 2, Fig. 2.As in figure 2 it is shown, this heat absorption heat accumulation part 20 is mixed to get by heat absorption heat accumulating 21, bonding solvent (retarder thinner and bonding solution) 22.Wherein, heat absorption heat accumulating 21 can be powder body, described heat absorption heat accumulating 21 is mixed to form the painting cloth material that described heat absorption heat accumulation part 20 is corresponding with described bonding solvent 22, described painting cloth material is made directly to have adhesive force, it is thus possible to advantageously coat (or two sides is coated with) in any surface of described body 10, and without still further increasing glue-line, the most described heat absorption heat accumulation part 20 refers to coat has certain thickness described painting cloth material on described body 10.Further, when the heat that heater members such as display screen and/or mainboard that described painting cloth material starts to absorb in terminal are transmitted, Polyethylene Glycol in described painting cloth material is gradually liquid by solid state change, and described painting cloth material the most from hard to soft, thus realizes the storage to heat；When described Polyethylene Glycol becomes liquid completely, described painting cloth material stops absorbing heat, and after the temperature of described display screen and/or mainboard is gradually decrease to preset temperature, described Polyethylene Glycol is changed to solid-state by liquid again, thus the heat of absorption is come out, described painting cloth material gradually changes software strategy into software-hardware strategy.Wherein, this powder body can be by smashing to pieces heat absorption heat accumulating 21 and strong stirring obtains, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, i.e. do not interfere with the heat absorption heat storage function of heat absorption heat accumulating.Optionally, this bonding solution can be methanol dimethylbenzene, and acrylic resin etc., the embodiment of the present invention does not limits.
Optionally, described heat absorption heat accumulation part 20 may also include protecting film；Described protecting film is bonding to be arranged on described painting cloth material, and described protecting film is located remotely from the side of described body 10.It is to say, will heat absorption heat accumulation part 20 after (painting cloth material) coat described body 10, also at outside namely heat absorption heat accumulation part 20, protecting film can be set away from the one side of body exposed part, to realize this heat absorption heat accumulation part 20 is protected, dust-proof.Further alternative, described protecting film can be the heat sink materials such as graphite such that it is able to improves the radiating rate of described painting cloth material further.
Further, the structural representation that Fig. 3, Fig. 3 are a kind of hardware brackets that another embodiment of the present invention provides is referred to.As it is shown on figure 3, the described hardware bracket 1 of the embodiment of the present invention includes body 10 and heat absorption heat accumulation part 30, described heat absorption heat accumulation part 30 is arranged on described body 10.Described body 10 is arranged between mainboard and display screen, to fix this display screen and/or mainboard.
Wherein, described heat absorption heat accumulation part 30 is made up of the heat absorption heat accumulating of the material properties with heat absorption and heat storage function, and described heat absorption heat accumulating is for absorbing and store heat and/or the heat of described display screen generation of the generation of described mainboard.
Optionally, heat absorption heat accumulation part 30 may be disposed in any surface of body 10, or is respectively provided with on the two sides of body 10.When the heat on display screen and/or mainboard and/or body 10 reaches uniform temperature, heat on the heat of display screen generation and/or the heat of mainboard generation and/or body 10 can be absorbed heat and heat accumulation by the heat absorption heat accumulating of heat absorption heat accumulation part 30, and after temperature lowers, by the conduct heat away of storage in air, to realize display screen and/or mainboard and/or body 10 are lowered the temperature.
Concrete, the absorbing and cooling temperature principle of described heat absorption heat accumulating, composition, manufacturing process and body 10 may refer to the associated description in the corresponding embodiment of above-mentioned Fig. 1 with the attachment structure etc. of display screen and/or mainboard, and here is omitted.
Further, in embodiments of the present invention, described heat absorption heat accumulation part 30 can include retarder thinner, bonding solution, protecting film and glue-line；Described heat absorption heat accumulating and described retarder thinner, described bonding solution are mixed to form painting cloth material; described painting cloth material coats the side of described protecting film; being coated with a side bonds of described painting cloth material in the side of described glue-line and described protecting film, the opposite side of described glue-line is bonding with described body.
The embodiment of the present invention by directly coating molding on protecting film by painting cloth material corresponding for the heat accumulating that absorbs heat, then arranges glue-line to be pasted on body 10 on heat absorption heat accumulating, it is not necessary to tablet machine carries out tabletting so that simplify manufacturing process.Concrete, when the heat that heater members such as display screen and/or mainboard that described painting cloth material starts to absorb in terminal are transmitted, Polyethylene Glycol in described painting cloth material is gradually liquid by solid state change, and described painting cloth material the most from hard to soft, thus realizes the storage to heat；When described Polyethylene Glycol becomes liquid completely, described painting cloth material stops absorbing heat, and after the temperature of described display screen and/or mainboard is gradually decrease to preset temperature, described Polyethylene Glycol is changed to solid-state by liquid again, thus the heat of absorption is come out, described painting cloth material gradually changes software strategy into software-hardware strategy.Wherein, described painting cloth material can be protected by described protecting film, dust-proof, and described protecting film can be the heat sink materials such as graphite, to improve the radiating rate of described painting cloth material further；Or, described protecting film can be polyethylene terephthalate (PET).Optionally, this bonding solution can be methanol dimethylbenzene, and acrylic resin etc., the embodiment of the present invention does not limits.
In conjunction with Fig. 3, it is the structural representation of a kind of heat accumulation part 30 that absorbs heat that another embodiment of the present invention provides please also refer to Fig. 4, Fig. 4.As shown in Figure 4, described heat absorption heat accumulation part 30 includes: protecting film 31, painting cloth material 32, glue-line 33.Wherein, described painting cloth material 32 is to be mixed to get with described retarder thinner, described bonding solution for the described heat absorption heat accumulating of powder body.Described painting cloth material 32 is coated on the side of described protecting film 31; in addition; described painting cloth material 32 also with a side bonds of glue-line 33, the opposite side of glue-line 33 can be bonded on described body 10, thus is arranged on the body 10 of hardware bracket by this heat absorption heat accumulation part 30.Wherein, this powder body can be by smashing to pieces heat absorption heat accumulating and strong stirring obtains, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, i.e. do not interfere with the heat absorption heat storage function of heat absorption heat accumulating.
Optionally, described glue-line 33 can be gum, double faced adhesive tape or other etc., the embodiment of the present invention does not limits.
In embodiments of the present invention, by coating on the body of hardware bracket, heat absorption heat accumulation part is set, make it possible to realize the heat of display screen and/or mainboard is absorbed by the heat absorption heat accumulating in heat absorption heat accumulation part, and by heat storage at self, after display screen and/or mainboard are lowered the temperature, by the heat of storage is dispersed in air, to realize display screen and/or mainboard are lowered the temperature, the embodiment of the present invention can effectively reduce the display screen of mobile terminal and/or the temperature of mainboard, avoid terminal enclosure temperature too high, the heat of heater members is too high and causes running slower, the problems such as card even occur, thus improve the heat dispersion of mobile terminal.
Further, the structural representation that Fig. 5, Fig. 5 are a kind of hardware brackets that further embodiment of this invention provides is referred to.As it is shown in figure 5, the described hardware bracket 1 of the embodiment of the present invention includes body 10 and heat absorption heat accumulation part 40, described heat absorption heat accumulation part 40 is arranged on described body 10.Described body 10 is arranged between mainboard and display screen, to fix this display screen and/or mainboard.
Wherein, described heat absorption heat accumulation part 40 is made up of the heat absorption heat accumulating of the material properties with heat absorption and heat storage function, and described heat absorption heat accumulating is for absorbing and store heat and/or the heat of described display screen generation of the generation of described mainboard.
Optionally, heat absorption heat accumulation part 40 may be disposed in any surface of body 10, or is respectively provided with on the two sides of body 10.When the heat on display screen and/or mainboard and/or body 10 reaches uniform temperature, heat on the heat of display screen generation and/or the heat of mainboard generation and/or body 10 can be absorbed heat and heat accumulation by the heat absorption heat accumulating of heat absorption heat accumulation part 40, and after temperature lowers, by the conduct heat away of storage in air, to realize display screen and/or mainboard and/or body 10 are lowered the temperature.
Concrete, the absorbing and cooling temperature principle of described heat absorption heat accumulating, composition, manufacturing process and body 10 may refer to the associated description in the corresponding embodiment of above-mentioned Fig. 1 with the attachment structure etc. of display screen and/or mainboard, and here is omitted.
Further, in embodiments of the present invention, described heat absorption heat accumulation part 40 can include titanate coupling agent, heat absorption heat accumulating and glue-line；Described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, and the side of described glue-line is bonding with described flaky material, and the opposite side of described glue-line is bonding with described body 10.
Concrete, when making described flaky material, described titanate coupling agent can be added in for the described heat absorption heat accumulating of powder body, obtain organic composite shaping phase-change material, through tabletting machine, this organic composite shaping phase-change material is prepared flake, forming the described flaky material of definite shape after cropped, flaky material lamination adhesive glue-line again forms heat absorption heat accumulation part 40.When the heat that heater members such as display screen and/or mainboard that described flaky material starts to absorb in terminal are transmitted, described Polyethylene Glycol in described flaky material is gradually liquid by solid state change, described flaky material the most from hard to soft, thus realizes the storage to heat；When described Polyethylene Glycol becomes liquid completely, described flaky material stops absorbing heat, and after the temperature of described display screen and/or mainboard is gradually decrease to preset temperature, described Polyethylene Glycol is changed to solid-state by liquid again, thus the heat of absorption is come out, described flaky material gradually changes software strategy into software-hardware strategy.Wherein, this powder body can be by smashing to pieces heat absorption heat accumulating and strong stirring obtains, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, i.e. do not interfere with the heat absorption heat storage function of heat absorption heat accumulating.Thus by heat absorption heat accumulating and titanate coupling agent are mixed and made into flaky material, it is connected on flaky material form heat absorption heat accumulation part 40 by glue-line stacking again, not only make heat absorption heat accumulation part 40 can go to cut according to the shape of body 10, and then can have with the body 10 of hardware bracket 1 and preferably coordinate, can be to preferably carrying out the heat accumulation that absorbs heat, realize display screen and/or mainboard are lowered the temperature, improve heat dispersion and the reliability of mobile terminal, and the heat absorption heat accumulation part 40 of lamellar is directly stained with, it is cooled into coating without waiting for it, easy to use.
Optionally, this flaky material can be cut into according to the shape of the body 10 of hardware bracket 1, obtain the heat accumulation part 40 that absorbs heat, and this heat absorption heat accumulation part 40 is fitted on body 10, the i.e. shape of this heat absorption heat accumulation part 40 with the mating shapes of body 10, thus can realize heat absorption and the function of heat accumulation.Further alternative, described glue-line can be gum, double faced adhesive tape or mould release membrance etc..
Further alternative, described heat absorption heat accumulation part 40 may also include protecting film；Described protecting film is bonding to be arranged on described flaky material, and described protecting film is located remotely from the side of described body 10.That is; after the one side of the flaky material of heat absorption heat accumulation part 40 correspondence is adhered to described body 10; also at the another side of this flaky material namely heat absorption heat accumulation part 40, protecting film can be set away from the one side of body exposed part, to realize this flaky material is protected, dust-proof etc..Further alternative, described protecting film can be the heat sink materials such as graphite such that it is able to improves the radiating rate of described flaky material further.
In embodiments of the present invention, by bonding on the body 10 of hardware bracket, the heat absorption heat accumulation part 40 that flaky material is corresponding is set, make it possible to realize the heat of display screen and/or mainboard is absorbed by the heat absorption heat accumulating in heat absorption heat accumulation part 40, and by heat storage at self, after display screen and/or mainboard are lowered the temperature, by the heat of storage is dispersed in air, to realize display screen and/or mainboard are lowered the temperature, the embodiment of the present invention can effectively reduce the display screen of mobile terminal and/or the temperature of mainboard, thus promote the heat dispersion of mobile terminal, the heat avoiding heater members is too high and causes running slower, the problems such as card even occur.
Refer to the schematic diagram that Fig. 6, Fig. 6 are a kind of mobile terminals that one embodiment of the invention provides.As shown in Figure 6, described mobile terminal 100 includes that shell, display screen, mainboard and hardware bracket, described hardware bracket are arranged between described display screen and described mainboard, is used for fixing described display screen and described mainboard.Wherein, described hardware bracket includes body and heat absorption heat accumulation part, and described heat absorption heat accumulation part is arranged on described body；The one side of described body is provided with mainboard, and another side is provided with display screen.
Wherein, described heat absorption heat accumulation part is made up of the heat absorption heat accumulating of the material properties with heat absorption and heat storage function, and described heat absorption heat accumulating is for absorbing and store heat and/or the heat of described display screen generation of the generation of described mainboard.
When mobile terminal 100 during fabrication, by the body of hardware bracket arrange heat absorption heat accumulation part, and hardware bracket is arranged at be fixed between display screen and mainboard after be assemblied in mobile terminal.Wherein, the heat absorption heat accumulating forming microcapsule structure can be after the heat of body reaches uniform temperature such as 40 degree, start to absorb the heat on display screen and/or mainboard and/or body, and capsule-core itself is gradually from solid phase to liquid phase, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating absorbs is the most saturated, it stops absorbing heat, and after the temperature of display screen and/or mainboard and/or body is gradually decrease to preset temperature, the heat of absorption is come out by capsule-core, it is delivered in air, and capsule-core can be along with gradually decreasing of its fever of the body amount gradually from liquid phase to solid phase, circulating phase-change by the heat accumulating that absorbs heat, thus display screen and/or mainboard and/or body are lowered the temperature, thus improve heat dispersion and the reliability of mobile terminal.
Optionally, described body offering the first screw, described mainboard offers the second screw, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Optionally, described hardware bracket also includes fixing post, one end of described fixing post is fixing with described body to be connected, the other end of described fixing post offers the first screw, offering the second screw on described mainboard, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Optionally, the decalescence heat accumulating that described heat absorption heat accumulating is made up of silicon dioxide and Polyethylene Glycol, and the proportioning value between described silicon dioxide and described Polyethylene Glycol is any one in 1:1～1:9.
Optionally, described heat absorption heat accumulating is by with silicon dioxide as cyst wall, and the microcapsule with Polyethylene Glycol as capsule-core is constituted.
Optionally, described heat absorption heat accumulation part also includes retarder thinner and bonding solution；Described heat absorption heat accumulating and described retarder thinner, described bonding solution are mixed to form painting cloth material, and described painting cloth material is coated at least one side of described body.
Optionally, described heat absorption heat accumulation part also includes protecting film；Described protecting film is bonding to be arranged on described painting cloth material, and described protecting film is located remotely from the side of described body.
Optionally, described heat absorption heat accumulation part also includes retarder thinner, bonding solution, protecting film and glue-line；Described heat absorption heat accumulating and described retarder thinner, described bonding solution are mixed to form painting cloth material; described painting cloth material coats the side of described protecting film; being coated with a side bonds of described painting cloth material in the side of described glue-line and described protecting film, the opposite side of described glue-line is bonding with described body.
Optionally, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line；Described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, and the side of described glue-line is bonding with described flaky material, and the opposite side of described glue-line is bonding with described body.
Optionally, described heat absorption heat accumulation part also includes protecting film；Described protecting film is bonding to be arranged on described flaky material, and described protecting film is located remotely from the side of described body.
Further alternative, thermal hole also can be offered on the body of this hardware bracket, and/or offer thermal hole at the shell edge position of described mobile terminal so that the heat stored can be dispelled the heat by this heat absorption heat accumulation part faster, thus promotes the heat dispersion of mobile terminal.
Concrete, the concrete structure of described hardware bracket and described heat absorption heat accumulation part can refer to the associated description of Fig. 1 to Fig. 5 correspondence embodiment, and here is omitted.
In embodiments of the present invention, can be by arranging the heat absorption heat accumulation part of the heat accumulating that absorbs heat including the material properties with heat absorption and heat storage function on hardware bracket, the heat making it possible to produce the such as mainboard of the heater members in hardware bracket and/or display screen produces absorbs, and heat is stored, to realize reducing the temperature of heater members, the heat avoiding heater members is too high and causes running relatively slow, the problems such as card pauses even occurs, it is ensured that mobile terminal is properly functioning.The embodiment of the present invention is by arranging heat absorption heat accumulation part on hardware bracket, enabling effectively reduces display screen and/or the heat of mainboard of mobile terminal, thus promotes the heat dispersion of mobile terminal.
The above disclosed present pre-ferred embodiments that is only, certainly can not limit the interest field of the present invention, the equivalent variations therefore made according to the claims in the present invention with this, still belong to the scope that the present invention is contained.
Claims (11)
1. a hardware bracket, it is characterised in that including body and heat absorption heat accumulation part, described heat absorption heat accumulation part is arranged on described body；
Wherein, the one side of described body is provided with mainboard, and another side is provided with display screen, and described body is used for fixing described mainboard and described display screen；
Described heat absorption heat accumulation part is made up of the heat absorption heat accumulating of the material properties with heat absorption and heat storage function, and described heat absorption heat accumulating is for absorbing and store heat and/or the heat of described display screen generation of the generation of described mainboard.
Hardware bracket the most according to claim 1, it is characterised in that offer the first screw on described body, described mainboard offers the second screw, and described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Hardware bracket the most according to claim 1, it is characterized in that, described hardware bracket also includes fixing post, one end of described fixing post is fixing with described body to be connected, the other end of described fixing post offers the first screw, offering the second screw on described mainboard, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Hardware bracket the most according to claim 1, it is characterized in that, the decalescence heat accumulating that described heat absorption heat accumulating is made up of silicon dioxide and Polyethylene Glycol, and the proportioning value between described silicon dioxide and described Polyethylene Glycol is any one in 1:1～1:9.
Hardware bracket the most according to claim 4, it is characterised in that described heat absorption heat accumulating is by with silicon dioxide as cyst wall, and the microcapsule with Polyethylene Glycol as capsule-core constituted.
6. according to the hardware bracket described in any one of claim 1 to 5, it is characterised in that described heat absorption heat accumulation part also includes retarder thinner and bonding solution；Described heat absorption heat accumulating and described retarder thinner, described bonding solution are mixed to form painting cloth material, and described painting cloth material is coated at least one side of described body.
Hardware bracket the most according to claim 6, it is characterised in that described heat absorption heat accumulation part also includes protecting film；Described protecting film is bonding to be arranged on described painting cloth material, and described protecting film is located remotely from the side of described body.
8. according to the hardware bracket described in any one of claim 1 to 5, it is characterised in that described heat absorption heat accumulation part also includes retarder thinner, bonding solution, protecting film and glue-line；Described heat absorption heat accumulating and described retarder thinner, described bonding solution are mixed to form painting cloth material; described painting cloth material coats the side of described protecting film; being coated with a side bonds of described painting cloth material in the side of described glue-line and described protecting film, the opposite side of described glue-line is bonding with described body.
9. according to the hardware bracket described in any one of claim 1 to 5, it is characterised in that described heat absorption heat accumulation part also includes titanate coupling agent and glue-line；Described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, and the side of described glue-line is bonding with described flaky material, and the opposite side of described glue-line is bonding with described body.
Hardware bracket the most according to claim 9, it is characterised in that described heat absorption heat accumulation part also includes protecting film；Described protecting film is bonding to be arranged on described flaky material, and described protecting film is located remotely from the side of described body.
11. 1 kinds of mobile terminals, it is characterised in that include display screen, mainboard and the hardware bracket as described in any one of claim 1 to 10, described hardware bracket is arranged between described display screen and described mainboard, is used for fixing described display screen and described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287065.8A CN105828579A (en) | 2016-04-29 | 2016-04-29 | Hardware support and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287065.8A CN105828579A (en) | 2016-04-29 | 2016-04-29 | Hardware support and mobile terminal |
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| Publication Number | Publication Date |
|---|---|
| CN105828579A true CN105828579A (en) | 2016-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610287065.8A Pending CN105828579A (en) | 2016-04-29 | 2016-04-29 | Hardware support and mobile terminal |
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| CN (1) | CN105828579A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021070562A1 (en) * | 2019-10-07 | 2021-04-15 | 富士フイルム株式会社 | Layered body and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1793277A (en) * | 2006-01-06 | 2006-06-28 | 华南理工大学 | Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
| CN104449590A (en) * | 2014-12-05 | 2015-03-25 | 中国工程物理研究院化工材料研究所 | Phase-change energy-storage material nanocapsule and preparation method thereof |
| CN105050805A (en) * | 2012-07-27 | 2015-11-11 | 奥特拉斯技术有限责任公司 | Systems, structures and materials for electronic device cooling |
| CN105307453A (en) * | 2014-07-25 | 2016-02-03 | 三星电子株式会社 | Electronic device including heating element |
-
2016
- 2016-04-29 CN CN201610287065.8A patent/CN105828579A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1793277A (en) * | 2006-01-06 | 2006-06-28 | 华南理工大学 | Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
| CN105050805A (en) * | 2012-07-27 | 2015-11-11 | 奥特拉斯技术有限责任公司 | Systems, structures and materials for electronic device cooling |
| CN105307453A (en) * | 2014-07-25 | 2016-02-03 | 三星电子株式会社 | Electronic device including heating element |
| CN104449590A (en) * | 2014-12-05 | 2015-03-25 | 中国工程物理研究院化工材料研究所 | Phase-change energy-storage material nanocapsule and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021070562A1 (en) * | 2019-10-07 | 2021-04-15 | 富士フイルム株式会社 | Layered body and electronic device |
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