CN105825783A - Display screen bracket and terminal - Google Patents

Display screen bracket and terminal Download PDF

Info

Publication number
CN105825783A
CN105825783A CN201610287121.8A CN201610287121A CN105825783A CN 105825783 A CN105825783 A CN 105825783A CN 201610287121 A CN201610287121 A CN 201610287121A CN 105825783 A CN105825783 A CN 105825783A
Authority
CN
China
Prior art keywords
heat absorption
heat
absorption heat
display
accumulation part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610287121.8A
Other languages
Chinese (zh)
Other versions
CN105825783B (en
Inventor
吴寿宽
曾武春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201610287121.8A priority Critical patent/CN105825783B/en
Publication of CN105825783A publication Critical patent/CN105825783A/en
Priority to PCT/CN2017/080081 priority patent/WO2017185975A1/en
Application granted granted Critical
Publication of CN105825783B publication Critical patent/CN105825783B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Abstract

The embodiment of the invention discloses a display screen bracket. The display screen bracket comprises a body, a driving part and a heat absorption and heat storage part, wherein the body is of a plate-shaped structure; a light emitting diode screen is arranged on one face of the body; the driving part is arranged on the body and is used for driving the light emitting diode screen to carry out light emitting display; the heat absorption and heat storage part is arranged on the body; and the heat absorption and heat storage part comprises a heat absorption and heat storage material with material properties including heat absorption and heat storage functions, and is used for absorbing and storing heat dissipated by the driving part and the light emitting diode screen. Correspondingly, the embodiment of the invention further discloses a terminal. With the adoption of the display screen bracket and the terminal, the heat dissipated by a display screen is absorbed and stored, so that the loss of components is reduced, the problem of burning hands, burning ears and the like are avoided, and utilization experience of users is improved.

Description

A kind of display/panel bracket and terminal
Technical field
The present invention relates to technical field of electronic equipment, particularly relate to a kind of display/panel bracket and terminal.
Background technology
Along with such as the development of the terminals such as smart mobile phone, the configuration of its display screen is more and more higher, and the thing followed is that heating problem is the most increasingly severe.On the one hand, display screen is generally light-emitting diode screen, such as LED screen, OLED (OrganicLED, organic LED) screen etc., the process that its luminescence process inherently generates heat;On the other hand, the picture refreshing rate of the lower display screen of high configuration is fast so that the actuator power consumption of driven for emitting lights diode screen increases, and causes heating to increase.
After display screen heating, heat concentrates on a region cannot quick heat radiating so that temperature drastically raises, and the components and parts of terminal are caused loss, there is also simultaneously hot, scald the problems such as ear, have impact on the experience of user.Visible, the most effectively dispelling the heat display screen is the problem needing solution at present badly.
Summary of the invention
Embodiments provide a kind of display/panel bracket and terminal, it is possible to achieve absorb and store the heat that display screen distributes.
Embodiment of the present invention first aspect provides a kind of display/panel bracket, and described display/panel bracket includes body, actuator and heat absorption heat accumulation part, the plate-shaped structure of described body, wherein:
The one side of described body is used for arranging light-emitting diode screen;
Described actuator is arranged at described body, is used for driving described light-emitting diode screen to carry out luminescence display;
Described heat absorption heat accumulation part is arranged at described body, and described heat absorption heat accumulation part includes having the heat absorption heat accumulating of the material properties of heat absorption and heat storage function, for the heat absorbing and storing described actuator and described light-emitting diode screen distributes.
In the first possible implementation of first aspect, described heat absorption heat accumulation part is arranged on the another side deviating from described light-emitting diode screen of described body.
In the possible implementation of the second of first aspect, described actuator includes that drive circuit module, described heat absorption heat accumulation part are connected with described drive circuit module.
In the third possible implementation of first aspect, described actuator also includes that control chip, described heat absorption heat accumulation part are connected with the pin of described control chip.
In the 4th kind of possible implementation of first aspect, described heat absorption heat accumulating includes that silicon dioxide and Polyethylene Glycol, the mass ratio of described silicon dioxide and Polyethylene Glycol are 1:1 to 1:9.
In conjunction with the 4th kind of possible implementation of first aspect, in the 5th kind of possible implementation, described heat absorption heat accumulating is made up of some microcapsules with described silicon dioxide as cyst wall, with described Polyethylene Glycol as capsule-core.
The 5th kind of possible implementation in conjunction with first aspect, in the 6th kind of possible implementation, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, described glue-line stacking is covered on described flaky material, and described flaky material is adhered on the another side of described body by described glue-line.
The 5th kind of possible implementation in conjunction with first aspect, in the 7th kind of possible implementation, described heat absorption heat accumulation part also includes retarder thinner and bonding solution, and described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and coats on the another side of described body.
The 5th kind of possible implementation in conjunction with first aspect, in the 8th kind of possible implementation, described heat absorption heat accumulation part also includes substrate and glue-line, described heat absorption heat accumulating is coated in described substrate, described glue-line stacking is covered in described substrate, and described in be coated with heat absorption heat accumulating substrate be adhered on the another side of described body by described glue-line.
In conjunction with first aspect or the 6th to the 8th kind of possible implementation of first aspect, in the 9th kind of possible implementation, described heat absorption heat accumulation part also includes that protecting film, described protecting film are arranged on described heat absorption heat accumulation part.
Embodiment of the present invention second aspect provides a kind of terminal, and described terminal includes the display/panel bracket that above-mentioned first aspect provides.
Therefore, display/panel bracket in the embodiment of the present invention, including body, actuator and heat absorption heat accumulation part, the plate-shaped structure of body, wherein, the one side of body is used for arranging light-emitting diode screen, actuator is arranged at body and carries out luminescence display for driven for emitting lights diode screen, heat absorption heat accumulation part is arranged on the another side of body, this heat absorption heat accumulation part includes having the heat absorption heat accumulating of the material properties of heat absorption and heat storage function and for the heat absorbing and storing actuator and light-emitting diode screen distributes, make not only to reduce the temperature of display screen but also the heat being transferred to display screen surface can be reduced, thus reduce the loss of components and parts and avoid scalding one's hand, scald the problems such as ear, improve the experience of user.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the decomposing schematic representation of a kind of display screen of the prior art;
Fig. 2 is the structural representation of a kind of display/panel bracket that the embodiment of the present invention provides;
Fig. 3 is the structural representation of a kind of heat accumulation part that absorbs heat that the embodiment of the present invention provides;
Fig. 4 is the preparation schematic diagram of a kind of heat accumulation part that absorbs heat that the embodiment of the present invention provides;
Fig. 5 is the structural representation of the another kind of heat absorption heat accumulation part that the embodiment of the present invention provides;
Fig. 6 is the preparation schematic diagram of the another kind of heat absorption heat accumulation part that the embodiment of the present invention provides;
Fig. 7 is the structural representation of another heat absorption heat accumulation part that the embodiment of the present invention provides;
Fig. 8 is the preparation schematic diagram of another heat absorption heat accumulation part that the embodiment of the present invention provides;
Fig. 9 is the structural representation of a kind of terminal that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
The terminal that the embodiment of the present invention is provided, the electronic equipment such as including smart mobile phone, panel computer, intelligence wearable device, digital audio & video players, electronic reader, handheld game machine and vehicle electronic device.In the embodiment of the present invention, described terminal is configured with display screen, and described display screen can be light-emitting diode screen, such as LED screen, OLED screen etc., is not especially limited here.
Fig. 1 is the decomposing schematic representation of a kind of display screen of the prior art, and display screen at least includes light-emitting diode screen and display/panel bracket as shown in the figure.Light-emitting diode screen is arranged at the one side of display/panel bracket, it should be pointed out that the process that lumination of light emitting diode process is inherently generated heat.Display/panel bracket acts primarily as the support to light-emitting diode screen, fixing and protective effect, and general, the body of display/panel bracket is five gold copper-base alloys, such as aluminium alloy etc..
Fig. 2 is the structural representation of a kind of display/panel bracket that the embodiment of the present invention provides.As shown in the figure the display/panel bracket in the embodiment of the present invention at least can include body 110, actuator 120 and heat absorption heat accumulation part 130, the plate-shaped structure of body 110, wherein:
The one side of body 110 is for arranging the light-emitting diode screen described by Fig. 1.General, the body of display/panel bracket is five gold copper-base alloys, such as aluminium alloy etc..
Actuator 120 is arranged at body 110, carries out luminescence display for driven for emitting lights diode screen.Concrete, actuator 120 electrically connects with light-emitting diode screen, when actuator 120 exports corresponding driving voltage to light-emitting diode screen and drives electric current, and light-emitting diode screen luminescence display.It addition, actuator 120 is arranged on the particular location on body 110, the present embodiment is not construed as limiting, optionally, as in figure 2 it is shown, actuator 120 is arranged at the top of body 110.
Heat absorption heat accumulation part 130 is arranged at body 110, and heat absorption heat accumulation part 130 includes the heat absorption heat accumulating 131a with the material properties of heat absorption and heat storage function, for the heat absorbing and storing actuator and light-emitting diode screen distributes.Optionally, heat absorption heat accumulation part 130 is arranged on the another side deviating from light-emitting diode screen of body 110.Further alternative, heat absorption heat accumulation part 130 is oppositely arranged across body 110 with light-emitting diode screen, is transferred to the heat of body 110 to absorb rapidly and to store light-emitting diode screen.
Further, actuator 120 includes that drive circuit module 121, heat absorption heat accumulation part 130 are connected with drive circuit module 121.It should be understood that, drive circuit module 121 includes the contour heating element of switching tube, driving chip, stabilivolt and barretter, is the main pyrotoxin of actuator 120.Visible, heat absorption heat accumulation part 130 is connected with drive circuit module 121, can absorb rapidly and heat that stored drive circuit module 121 distributes.
Optionally, actuator 120 also includes that control chip 122, heat absorption heat accumulation part 130 are connected with the pin of control chip 122.It should be understood that, control chip 122 is the secondary pyrotoxin of actuator 120.In like manner, heat absorption heat accumulation part 130 is connected with the pin of control chip 122, can absorb rapidly and heat that storage control chip 122 distributes.
In the present embodiment, heat absorption heat accumulating 131a can be a kind of phase-change material, it can change physical property and can absorb substantial amounts of heat along with variations in temperature, increase along with the heat absorbed, heat absorption heat accumulating 131a gradates as another kind of phase mutually from one, can stably remain another kind of after absorbing sufficient heat mutually and no longer to absorb heat, and when body 110 does not has thermal source to produce or heat is relatively low, heat absorption heat accumulating 131a carries out dispelling the heat and gradually along with reducing of heat is gradually reverted to original phase mutually by another kind.Wherein, heat absorption heat accumulating 131a can change to liquid phase or liquid phase to solid phase from solid phase along with the change of temperature, or solid phase changes to solid phase to gas phase or liquid phase, or liquid phase to gas phase or gas phase to liquid phase.
It should be understood that, heat absorption heat accumulation part 130 is arranged on the outer surface of body 110, and most heats that actuator 120 and light-emitting diode screen distribute are transferred to a concentrated area of body 110.When the heat of this concentrated area reaches uniform temperature, the heat absorption heat accumulating 131a in heat absorption heat accumulation part 130 absorbs and stores the heat of this concentrated area.(no longer generating heat after such as quitting work so that temperature reduces) after the temperature of this concentrated area lowers, the heat of storage is dispersed in air by the heat absorption heat accumulating 131a in heat absorption heat accumulation part 130.
Optionally, heat absorption heat accumulating 131a preferably comprises the silicon dioxide and Polyethylene Glycol that mass ratio is 1:1 to 1:9.Inventor is drawn by substantial amounts of experiment, organic-composite phase-change material that silicon dioxide and Polyethylene Glycol can prepare with mass ratio for 1:1 to 1:9 mixing is had suitable phase transition temperature, it is possible to absorb actuator 120 and the heat of light-emitting diode screen in time.Concrete, the phase transition temperature that this heat absorption heat accumulating 131a is mixed to prepare is 40 degree, i.e. after the heat absorbing actuator 120 and light-emitting diode screen generation reaches 40 degree, heat absorption heat accumulating 131a carries out decalescence, the heat absorbing actuator 120 and light-emitting diode screen is taken away, to lower the temperature it.Certainly, in other embodiments, heat absorption heat accumulating 131a can also be inorganic phase-changing material, or composite phase-change material etc..
Further, heat absorption heat accumulating 131a is made up of some microcapsules with silicon dioxide as cyst wall, with Polyethylene Glycol as capsule-core.The heat absorption heat accumulating 131a of this microcapsule structure can preferably carry out the heat accumulation that absorbs heat, and then reaches preferably heat dispersion.Concrete, Polyethylene Glycol is joined in certain density Ludox, after all dissolving, drip CaCl2Accelerator solution, under strong stirring so that Polyethylene Glycol occurs sol gel reaction in Ludox, forms three-dimensional net structure gel after standing;By gel forced air drying 24 to 48h in 80 DEG C of baking ovens, it is cooled to room temperature, a large amount of microcapsules with silica dioxide gel as cyst wall, with the Polyethylene Glycol after emulsifying as capsule-core produced in the basic conditions with organo-siloxane compound can be accessed.I.e. in each microcapsule, silicon dioxide wraps the Polyethylene Glycol as capsule-core as cyst wall so that Polyethylene Glycol will not leak during solid-liquid, it is possible to is well lived by Silica-coated.After the heat absorption heat accumulating temperature around of this formation microcapsule structure reaches 40 degree, start to absorb heat, and capsule-core itself is gradually increased gradually from solid-liquid along with heat, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating 131a absorbs is the most saturated, it stops absorbing heat, and after temperature is gradually decrease to preset temperature around, the heat of absorption is come out by capsule-core, it is delivered in air, and capsule-core gradually can be converted to solid phase from liquid phase along with gradually decreasing of its fever of the body amount, changed by the circulation of above-mentioned solid phase to liquid phase, thus actuator 120 and light-emitting diode screen are lowered the temperature.Certainly, in other embodiments, heat absorption heat accumulating 131a can also be other structure so that heat absorption heat accumulating 131a can lower the temperature by changing from the circulation being solid to gas phase.
As the embodiment of the first, referring to Fig. 3, heat absorption heat accumulation part 130 as depicted also includes titanate coupling agent 131b and glue-line 132.Concrete, as shown in Figure 4, heat absorption heat accumulating 131a and titanate coupling agent 131b being mixed and made into flaky material 131, glue-line 132 stacking is covered on flaky material 131, and flaky material 131 is adhered on body 110 by glue-line 132.It is to be noted, by heat absorption heat accumulating 131a and titanate coupling agent 131b is mixed and made into flaky material 131, it is connected on flaky material 131 form heat absorption heat accumulation part 130 by glue-line 132 stacking again, make heat absorption heat accumulation part plasticity higher, it is easier to realize being combined with other parts.
During implementing, heat absorption heat accumulating 131a can be smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating 131a, i.e. do not interfere with the heat absorption heat storage function of heat absorption heat accumulating 131a, add titanate coupling agent 131b hydrophobically modified at the heat absorption heat accumulating 131a of powder and obtain inorganic plan organic composite shaping phase-change material, again this inorganic plan organic composite shaping phase-change material is prepared flake i.e. flaky material 131 through tabletting machine, flaky material 131 stacking again connects upper glue layer 132 and forms heat absorption heat accumulation part 130.Optionally, glue-line 132 can be gum, double faced adhesive tape or mould release membrance etc..Heat absorption heat accumulation part 130 can be cut into definite shape according to the shape of the junction with other parts so that is easier to combine.
Referring to Fig. 3, heat absorption heat accumulation part 130 as depicted also includes that protecting film 133, protecting film 133 are arranged at heat absorption heat accumulation part 130 surface, and protecting film 130 is located remotely from the side of body 110.Optionally, protecting film 133 is polyethylene terephthalate (PET), and its stacking is connected on flaky material 131, and opposing with glue-line 132, and flaky material 131 can be shaped and have dust-proof effect by protecting film 133 further.Certainly, in other embodiments, the material of protecting film 133 can also be other, such as silica gel.
As the second embodiment, referring to Fig. 5, heat absorption heat accumulation part 130 as depicted also includes that retarder thinner 131c and bonding solution 131d, heat absorption heat accumulating 131a, retarder thinner 131c and bonding solution 131d mix and coat on body 110.Concrete, as shown in Figure 6, retarder thinner 131c, bonding solution 131d are mixed to form heat absorption heat accumulation part 130 with heat absorption heat accumulating 131a so that heat absorption heat accumulation part 130 directly has adhesive force, can coat on body 110 without still further increasing glue-line, thus improve facility.
During implementing, heat absorption heat accumulating 131a is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, i.e. do not interfere with the heat absorption heat storage function of heat absorption heat accumulating, it is added to retarder thinner 131c at the heat absorption heat accumulating 131a of powder and adds special binder solution 131d (such as: methanol dimethylbenzene, acrylic resin etc.) mixing, heat absorption heat accumulation part 130 is made to have adhesive force, directly use the form of coating to be piled into certain thickness heat absorption heat accumulation part 130 to be attached on body 110, thus realize the function of heat absorption heat accumulation.
Referring to Fig. 5, heat absorption heat accumulation part 130 as depicted also includes that protecting film 133, protecting film 133 are arranged at heat absorption heat accumulation part 130 surface, and protecting film 130 is located remotely from the side of body 110.Optionally, protecting film 133 is polyethylene terephthalate (PET), and protecting film 133 can be shaped further and have dust-proof effect.Certainly, in other embodiments, the material of protecting film 133 can also be other, such as silica gel.
As the third embodiment, referring to Fig. 7, heat absorption heat accumulation part 130 as depicted also includes substrate 134 and glue-line 132, and heat absorption heat accumulating 131a coats in substrate 134, and glue-line 132 stacking is connected in substrate 134, and glue-line 132 is adhered on body 110.Concrete, as shown in Figure 8, directly heat absorption heat accumulating 131a is coated molding in substrate 134, then glue-line 132 is set in substrate 134 to be pasted on body 110, it is not necessary to tablet machine carries out tabletting, makes relatively simple.
During implementing, substrate 134 is polyethylene terephthalate (PET), heat absorption heat accumulating 131a is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating 131a, i.e. do not interfere with the heat absorption heat storage function of heat absorption heat accumulating 131a, the heat absorption heat accumulating 131a of powder is directly coated at molding in substrate 134, the substrate 134 with heat absorption heat accumulating 131a is adhered on body 110 by glue-line 132, realize the heat absorption heat storage function of heat absorption heat accumulation part 130.It should be understood that glue-line can be gum, double faced adhesive tape or other etc..
Referring to Fig. 7, heat absorption heat accumulation part 130 as depicted also includes that protecting film 133, protecting film 133 are arranged at heat absorption heat accumulation part 130 surface, and protecting film 130 is located remotely from the side of body 110.Optionally, protecting film 133 is polyethylene terephthalate (PET), and protecting film 133 can be shaped further and have dust-proof effect.Certainly, in other embodiments, the material of protecting film 133 can also be other, such as silica gel.
Fig. 9 is the structural representation of a kind of display/panel bracket that the embodiment of the present invention provides.Terminal 200 in the embodiment of the present invention includes the display/panel bracket described by above-mentioned Fig. 2 as shown in the figure.
Display/panel bracket in the embodiment of the present invention, including body, actuator and heat absorption heat accumulation part, the plate-shaped structure of body, wherein, the one side of body is used for arranging light-emitting diode screen, actuator is arranged at body and carries out luminescence display for driven for emitting lights diode screen, heat absorption heat accumulation part is arranged on the another side of body, this heat absorption heat accumulation part includes having the heat absorption heat accumulating of the material properties of heat absorption and heat storage function and for the heat absorbing and storing actuator and light-emitting diode screen distributes, make not only to reduce the temperature of display screen but also the heat being transferred to display screen surface can be reduced, thus reduce the loss of components and parts and avoid scalding one's hand, scald the problems such as ear, improve the experience of user.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means that the specific features, structure, material or the feature that combine this embodiment or example description are contained at least one embodiment or the example of the present invention.In this manual, the schematic representation of above-mentioned term is necessarily directed to identical embodiment or example.And, the specific features of description, structure, material or feature can be to combine in one or more embodiments in office or example in an appropriate manner.Additionally, in the case of the most conflicting, the feature of the different embodiments described in this specification or example and different embodiment or example can be combined and combine by those skilled in the art.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include at least one this feature.In describing the invention, " multiple " are meant that at least two, such as two, three etc., unless otherwise expressly limited specifically.
The above disclosed present pre-ferred embodiments that is only, certainly can not limit the interest field of the present invention, the equivalent variations therefore made according to the claims in the present invention with this, still belong to the scope that the present invention is contained.

Claims (11)

1. a display/panel bracket, it is characterised in that described display/panel bracket includes body, actuator and heat absorption heat accumulation part, the plate-shaped structure of described body, wherein:
The one side of described body is used for arranging light-emitting diode screen;
Described actuator is arranged at described body, is used for driving described light-emitting diode screen to carry out luminescence display;
Described heat absorption heat accumulation part is arranged at described body, and described heat absorption heat accumulation part includes having the heat absorption heat accumulating of the material properties of heat absorption and heat storage function, for the heat absorbing and storing described actuator and described light-emitting diode screen distributes.
2. display/panel bracket as claimed in claim 1, it is characterised in that described heat absorption heat accumulation part is arranged on the another side deviating from described light-emitting diode screen of described body.
3. display/panel bracket as claimed in claim 1, it is characterised in that described actuator includes that drive circuit module, described heat absorption heat accumulation part are connected with described drive circuit module.
4. display/panel bracket as claimed in claim 1, it is characterised in that described actuator also includes that control chip, described heat absorption heat accumulation part are connected with the pin of described control chip.
5. display/panel bracket as claimed in claim 1, it is characterised in that described heat absorption heat accumulating includes that silicon dioxide and Polyethylene Glycol, the mass ratio of described silicon dioxide and Polyethylene Glycol are 1:1 to 1:9.
6. display/panel bracket as claimed in claim 5, it is characterised in that described heat absorption heat accumulating is made up of some microcapsules with described silicon dioxide as cyst wall, with described Polyethylene Glycol as capsule-core.
7. display/panel bracket as claimed in claim 6, it is characterized in that, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, described glue-line stacking is covered on described flaky material, and described flaky material is adhered on the another side of described body by described glue-line.
8. display/panel bracket as claimed in claim 6, it is characterised in that described heat absorption heat accumulation part also includes retarder thinner and bonding solution, and described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and coats on the another side of described body.
9. display/panel bracket as claimed in claim 6, it is characterized in that, described heat absorption heat accumulation part also includes substrate and glue-line, described heat absorption heat accumulating is coated in described substrate, described glue-line stacking is covered in described substrate, and described in be coated with heat absorption heat accumulating substrate be adhered on the another side of described body by described glue-line.
10. the display/panel bracket as described in claim 7-9 any one, it is characterised in that described heat absorption heat accumulation part also includes that protecting film, described protecting film are arranged on described heat absorption heat accumulation part.
11. 1 kinds of terminals, it is characterised in that described terminal includes the display/panel bracket as described in claim 1-10 any one.
CN201610287121.8A 2016-04-29 2016-04-29 Display screen support and terminal Expired - Fee Related CN105825783B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610287121.8A CN105825783B (en) 2016-04-29 2016-04-29 Display screen support and terminal
PCT/CN2017/080081 WO2017185975A1 (en) 2016-04-29 2017-04-11 Display screen frame and terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610287121.8A CN105825783B (en) 2016-04-29 2016-04-29 Display screen support and terminal

Publications (2)

Publication Number Publication Date
CN105825783A true CN105825783A (en) 2016-08-03
CN105825783B CN105825783B (en) 2019-12-27

Family

ID=56528061

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610287121.8A Expired - Fee Related CN105825783B (en) 2016-04-29 2016-04-29 Display screen support and terminal

Country Status (2)

Country Link
CN (1) CN105825783B (en)
WO (1) WO2017185975A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017185975A1 (en) * 2016-04-29 2017-11-02 广东欧珀移动通信有限公司 Display screen frame and terminal
WO2023056692A1 (en) * 2021-10-09 2023-04-13 武汉华星光电半导体显示技术有限公司 Display apparatus and display terminal

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1793277A (en) * 2006-01-06 2006-06-28 华南理工大学 Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide
CN101333094A (en) * 2008-07-29 2008-12-31 武汉理工大学 Method for preparing phase change asphalt pavement material
CN101503618A (en) * 2009-03-09 2009-08-12 中国科学技术大学 Silicon dioxide gel micro-encapsulated phase change energy storage material and preparation thereof
CN102155729A (en) * 2011-04-28 2011-08-17 华南理工大学 Heat dissipation method of LED (light-emitting diode) device and device
CN103146355A (en) * 2011-12-07 2013-06-12 北京中石伟业科技股份有限公司 Heat-absorbing material
CN103773322A (en) * 2014-02-08 2014-05-07 中国电子科技集团公司第三十三研究所 Phase change microcapsule heat conduction material and preparation method thereof
CN104449590A (en) * 2014-12-05 2015-03-25 中国工程物理研究院化工材料研究所 Phase-change energy-storage material nanocapsule and preparation method thereof
CN105472941A (en) * 2014-09-30 2016-04-06 联发科技(新加坡)私人有限公司 Mobile phone and manufacturing method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103374333B (en) * 2012-04-13 2016-04-27 南京德朔实业有限公司 Composite phase change material
KR20140006378A (en) * 2012-07-04 2014-01-16 삼성전자주식회사 Display apparatus
CN203896662U (en) * 2014-06-27 2014-10-22 广东欧珀移动通信有限公司 Mobile terminal composite type heat radiating structure and mobile phone
FR3024770B1 (en) * 2014-08-11 2016-09-02 Valeo Systemes Thermiques THERMAL EXCHANGE PLATE FOR THERMAL MANAGEMENT OF BATTERY PACK
KR102413323B1 (en) * 2015-02-06 2022-06-27 엘지전자 주식회사 Mobile terminal
CN105825783B (en) * 2016-04-29 2019-12-27 Oppo广东移动通信有限公司 Display screen support and terminal

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1793277A (en) * 2006-01-06 2006-06-28 华南理工大学 Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide
CN101333094A (en) * 2008-07-29 2008-12-31 武汉理工大学 Method for preparing phase change asphalt pavement material
CN101503618A (en) * 2009-03-09 2009-08-12 中国科学技术大学 Silicon dioxide gel micro-encapsulated phase change energy storage material and preparation thereof
CN102155729A (en) * 2011-04-28 2011-08-17 华南理工大学 Heat dissipation method of LED (light-emitting diode) device and device
CN103146355A (en) * 2011-12-07 2013-06-12 北京中石伟业科技股份有限公司 Heat-absorbing material
CN103773322A (en) * 2014-02-08 2014-05-07 中国电子科技集团公司第三十三研究所 Phase change microcapsule heat conduction material and preparation method thereof
CN105472941A (en) * 2014-09-30 2016-04-06 联发科技(新加坡)私人有限公司 Mobile phone and manufacturing method thereof
CN104449590A (en) * 2014-12-05 2015-03-25 中国工程物理研究院化工材料研究所 Phase-change energy-storage material nanocapsule and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017185975A1 (en) * 2016-04-29 2017-11-02 广东欧珀移动通信有限公司 Display screen frame and terminal
WO2023056692A1 (en) * 2021-10-09 2023-04-13 武汉华星光电半导体显示技术有限公司 Display apparatus and display terminal

Also Published As

Publication number Publication date
WO2017185975A1 (en) 2017-11-02
CN105825783B (en) 2019-12-27

Similar Documents

Publication Publication Date Title
CN105792620A (en) Chip, circuit board and mobile terminal
CN105744811A (en) Housing and mobile terminal
CN102548355B (en) Electronic equipment
CN105873417B (en) A kind of chip, circuit board and mobile terminal
CN105744425A (en) Telephone receiver assembly and mobile terminal
CN105916351A (en) Shielding case and mobile terminal
WO2017185969A1 (en) Terminal housing and mobile terminal
CN105825783A (en) Display screen bracket and terminal
CN106061198A (en) Screen assembly and mobile terminal
CN107004650A (en) Composition for assembling electronic device
CN105792619A (en) Heat radiation device and mobile terminal
CN105763689B (en) A kind of display/panel bracket and terminal
CN105828551A (en) Rear shell and mobile terminal
CN105933582A (en) Pick-up head and mobile terminal
CN105916350B (en) A kind of terminal device and associated method
CN206878134U (en) A kind of thermal management module and battery pack for cylindrical battery
CN107333033B (en) Camera and mobile terminal
CN105792618B (en) A kind of hardware bracket and mobile terminal
CN105885094B (en) A kind of Heat dissipation composition and the preparation method and application thereof
CN106118541B (en) A kind of glue and preparation method thereof and adhesive tape and component containing the glue
CN204362492U (en) A kind of Novel heat-conducting insulation two-sided tape
CN105744732A (en) Circuit board and mobile terminal
CN205960020U (en) Encapsulation of chip level white light LED
CN107343375A (en) A kind of rear shell and mobile terminal
CN105792616A (en) Touch screen assembly and mobile terminal

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18

Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18

Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191227

CF01 Termination of patent right due to non-payment of annual fee