CN204362492U - A kind of Novel heat-conducting insulation two-sided tape - Google Patents
A kind of Novel heat-conducting insulation two-sided tape Download PDFInfo
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- CN204362492U CN204362492U CN201520055336.8U CN201520055336U CN204362492U CN 204362492 U CN204362492 U CN 204362492U CN 201520055336 U CN201520055336 U CN 201520055336U CN 204362492 U CN204362492 U CN 204362492U
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- Prior art keywords
- heat
- layer
- conducting
- insulating
- conducting insulation
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- 238000009413 insulation Methods 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010439 graphite Substances 0.000 claims abstract description 7
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims description 6
- 239000012774 insulation material Substances 0.000 claims 4
- 229910017083 AlN Inorganic materials 0.000 claims 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 1
- 241000446313 Lamella Species 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 41
- 239000011810 insulating material Substances 0.000 abstract description 12
- 239000012790 adhesive layer Substances 0.000 abstract description 10
- 239000002390 adhesive tape Substances 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 239000012782 phase change material Substances 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 229910000397 disodium phosphate Inorganic materials 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一种新型导热绝缘双面胶带，包括基材，所述基材为镀铜石墨片或者镀镍石墨片，而在基材的两面分别成型有一层导热绝缘材料层，而在导热绝缘材料层的外层则成型有一层掺有无机相变材料颗粒的绝缘可移胶层，并在此绝缘可移胶层的外层则成型有一层离型层。本实用新型实现了材料无痕粘接性、导热性和绝缘性，在保证待加工面的散热性能的同时兼顾了在小型零部件和凹凸面的贴合性能。
A novel heat-conducting and insulating double-sided adhesive tape, including a base material, the base material is a copper-plated graphite sheet or a nickel-plated graphite sheet, and a layer of heat-conducting insulating material is formed on both sides of the base material, and a layer of heat-conducting insulating material is formed on the layer of heat-conducting insulating material. The outer layer is formed with an insulating removable adhesive layer mixed with inorganic phase change material particles, and a release layer is formed on the outer layer of the insulating removable adhesive layer. The utility model realizes the traceless adhesion, thermal conductivity and insulation of the material, and takes into account the lamination performance of small parts and concave-convex surfaces while ensuring the heat dissipation performance of the surface to be processed.
Description
技术领域 technical field
本实用新型涉及导热散热材料领域，具体为一种新型导热绝缘双面胶带。 The utility model relates to the field of heat-conducting and heat-dissipating materials, in particular to a novel heat-conducting and insulating double-sided adhesive tape.
背景技术 Background technique
随着整个电子市场的发展，手机等电子产品的更新换代的周期越来越短，消费者对手机这类电子产品的消费越来越注重产品的综合性能，而各大手机和电脑厂商在配制方面达到一个瓶颈时，产品的散热性能成为各终端需考虑首要因素。 With the development of the entire electronic market, the replacement cycle of mobile phones and other electronic products is getting shorter and shorter. When a bottleneck is reached in one aspect, the heat dissipation performance of the product becomes the primary factor to be considered by each terminal.
在传统电子产品导热散热方面首先考虑到的是采用导热硅胶以及其他一些黏附性能好的产品填充保护框内的间隙，排除空气，使热量通过导热硅胶导出，从而实现热源温度的降低。但传统导热硅胶较低的导热系数，限制了其热传导的效率，无法实现热量的快速导出，导致其使用范围得到较大的限制，无法满足一些特殊场合的要求。 In terms of heat conduction and heat dissipation of traditional electronic products, the first thing to consider is to use thermal silica gel and other products with good adhesion to fill the gaps in the protective frame, remove air, and let the heat be exported through thermal silica gel, thereby reducing the temperature of the heat source. However, the low thermal conductivity of traditional heat-conducting silica gel limits its heat conduction efficiency and cannot achieve rapid heat export, resulting in a relatively limited range of use and cannot meet the requirements of some special occasions.
实用新型内容 Utility model content
本实用新型所解决的技术问题在于提供一种新型导热绝缘双面胶带，以解决上述背景技术中的缺点。 The technical problem solved by the utility model is to provide a novel heat-conducting and insulating double-sided adhesive tape to solve the above-mentioned shortcomings in the background technology.
本实用新型所解决的技术问题采用以下技术方案来实现： The technical problem solved by the utility model adopts the following technical solutions to realize:
一种新型导热绝缘双面胶带，包括基材，其中，所述基材为镀铜石墨片或者镀镍石墨片，而在基材的两面分别成型有一层导热绝缘材料层，而在导热绝缘材料层的外层则成型有一层掺有无机相变材料颗粒的绝缘可移胶层，并在此绝缘可移胶层的外层则成型有一层离型层。 A novel heat-conducting and insulating double-sided adhesive tape, including a base material, wherein the base material is a copper-plated graphite sheet or a nickel-plated graphite sheet, and a layer of heat-conducting insulating material is respectively formed on both sides of the base material, and a layer of heat-conducting insulating material is formed on both sides of the base material. The outer layer of the layer is formed with a layer of insulating removable adhesive layer mixed with inorganic phase change material particles, and the outer layer of the insulating removable adhesive layer is formed with a layer of release layer.
在本实用新型中，导热绝缘双面胶带的厚度为1.8~3mm。 In the present utility model, the thickness of the thermally conductive and insulating double-sided adhesive tape is 1.8-3mm.
在本实用新型中，所述基材厚度为0.4~0.6mm。 In the present utility model, the thickness of the base material is 0.4-0.6mm.
在本实用新型中，所述导热绝缘材料层为导热系数高的氧化铝箔片层或氮化铝箔片层，厚度为0.2~0.3mm。 In the utility model, the thermally conductive insulating material layer is an aluminum oxide foil layer or an aluminum nitride foil layer with a high thermal conductivity, and the thickness is 0.2-0.3mm.
在本实用新型中，所述绝缘可移胶层中掺有的无机相变材料颗粒为硫酸钠或者氯化钠或者磷酸氢钠的饱和结晶体颗粒。 In the present invention, the inorganic phase change material particles mixed in the insulating removable adhesive layer are saturated crystal particles of sodium sulfate, sodium chloride or sodium hydrogen phosphate.
在本实用新型中，所述绝缘可移胶层中采用的胶料为具有良好填充性和无痕粘接性的丙烯酸胶。 In the utility model, the glue material used in the insulating removable glue layer is acrylic glue with good filling property and traceless adhesion.
有益效果：本实用新型的导热绝缘双面胶带集填充、粘接、补强、导热、散热等功能于一体，同时实现了无痕粘接性、导热性和绝缘性，同时实现了在小型零部件和凹凸面的贴合性能，可用于形状复杂的料上，适用于平板电脑、手机、LCD 显示器等各种消费类电子产品的填充、导热、散热领域。 Beneficial effects: the thermally conductive and insulating double-sided adhesive tape of the utility model integrates the functions of filling, bonding, reinforcement, heat conduction, and heat dissipation, and simultaneously realizes traceless adhesion, thermal conductivity, and insulation. The bonding performance of parts and concave-convex surfaces can be used on materials with complex shapes, and it is suitable for filling, heat conduction, and heat dissipation of various consumer electronic products such as tablet computers, mobile phones, and LCD displays.
附图说明 Description of drawings
图1为本实用新型较佳实施例的示意图。 Fig. 1 is a schematic diagram of a preferred embodiment of the present invention.
其中：1、上层离型层；2、上层绝缘可移胶层；3、上层导热绝缘材料层；4、基材；5、下层导热绝缘材料层；6、下层绝缘可移胶层；7、下层离型层。 Among them: 1. Upper release layer; 2. Upper insulating removable adhesive layer; 3. Upper thermally conductive insulating material layer; 4. Base material; 5. Lower thermally conductive insulating material layer; 6. Lower insulating removable adhesive layer; 7. The lower release layer.
具体实施方式 Detailed ways
为了使本实用新型实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体图示，进一步阐述本实用新型。 In order to make the technical means, creative features, goals and effects achieved by the utility model easy to understand, the utility model will be further elaborated below in conjunction with specific illustrations.
参见图1的一种新型导热绝缘双面胶带的较佳实施例，在本实施例中，导热绝缘双面胶带的厚度为2mm，包括由镀铜石墨片制成的胶带基材4，此基材4的厚度为0.5mm，其两面为对称结构，一面自基材4向外依次为上层导热绝缘材料层3、上层绝缘可移胶层2以及上层离型层1，而另一面自基材4向外依次为下层导热绝缘材料层5、下层绝缘可移胶层6、下层离型层7。 Referring to the preferred embodiment of a novel heat-conducting and insulating double-sided adhesive tape of Fig. 1, in the present embodiment, the thickness of the heat-conducting and insulating double-sided adhesive tape is 2mm, including the adhesive tape substrate 4 made of copper-plated graphite sheet, this base The thickness of the material 4 is 0.5mm, and its two sides are symmetrical structures. One side from the base material 4 is the upper layer of thermally conductive insulating material layer 3, the upper layer of insulating removable adhesive layer 2 and the upper layer of release layer 1, while the other side is from the base material 4. 4. Outwards are the lower layer of thermally conductive insulating material 5, the lower layer of insulating removable adhesive layer 6, and the lower layer of release layer 7.
在本实施例中，所述上层导热绝缘材料层3以及下层导热绝缘材料层5均为导热系数高的氮化铝箔片层，厚度为0.3mm；而上层绝缘可移胶层2与下层绝缘可移胶层6中采用的胶料均为丙烯酸胶，且在两胶料层中掺有硫酸钠饱和结晶体颗粒。 In this embodiment, the upper layer of thermally conductive insulating material layer 3 and the lower layer of thermally conductive insulating material layer 5 are both aluminum nitride foil layers with a high thermal conductivity, with a thickness of 0.3mm; while the upper insulating removable adhesive layer 2 and the lower insulating layer can be The glue used in the glue transfer layer 6 is all acrylic glue, and sodium sulfate saturated crystal particles are mixed in the two glue layers.
本实施例的绝缘导热散热胶带在绝缘无痕可移胶中掺杂着快速吸热和高储热的相变材料配合导热系数较高的氮化铝箔片层，制成类似导热硅胶片的垫片，用以贴合热源，填充间隙，并实现迅速吸收、传导热量和辐射散热，使发热元件保持在安全运行温度以内，并通过填充氮化铝层以及导热优良的基材，使产品的导热系数得到较大提高，弥补了传统导热硅胶导热系数低的不足，同时，利用相变材料作填充物，可快速吸收和储存热量，并同时通过填充高辐射系数的散热粉体，使材料在通过热传递散热的同时还可通过热辐射散发大量热量。 In the insulating heat-conducting and heat-dissipating adhesive tape of this embodiment, a phase-change material with rapid heat absorption and high heat storage is mixed with an insulating non-marking removable glue, and an aluminum nitride foil layer with a high thermal conductivity is used to make a pad similar to a heat-conducting silicone sheet. The sheet is used to fit the heat source, fill the gap, and realize rapid absorption, heat conduction and radiation heat dissipation, so that the heating element can be kept within the safe operating temperature, and the heat conduction of the product can be achieved by filling the aluminum nitride layer and the substrate with excellent heat conduction The coefficient has been greatly improved, making up for the lack of low thermal conductivity of traditional heat-conducting silica gel. At the same time, using phase-change materials as fillers can quickly absorb and store heat, and at the same time, by filling heat-dissipating powder with high emissivity coefficient, the material can pass through While heat transfer dissipates heat, it can also dissipate a large amount of heat through thermal radiation.
以上显示和描述了本实用新型的基本原理、主要特征和本实用新型的优点。本行业的技术人员应该了解，本实用新型不受上述实施例的限制，上述实施例和说明书中描述的只是说明本实用新型的原理，在不脱离本实用新型精神和范围的前提下，本实用新型还会有各种变化和改进，这些变化和改进都落入要求保护的本实用新型范围内。本实用新型要求保护范围由所附的权利要求书及其等效物界定。 The basic principles, main features and advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions only illustrate the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model The new model also has various changes and improvements, and these changes and improvements all fall within the scope of the claimed utility model. The scope of protection required by the utility model is defined by the appended claims and their equivalents.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520055336.8U CN204362492U (en) | 2015-01-27 | 2015-01-27 | A kind of Novel heat-conducting insulation two-sided tape |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520055336.8U CN204362492U (en) | 2015-01-27 | 2015-01-27 | A kind of Novel heat-conducting insulation two-sided tape |
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| CN204362492U true CN204362492U (en) | 2015-05-27 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611800A (en) * | 2015-12-24 | 2016-05-25 | 平湖阿莱德实业有限公司 | Easy-to-clean heat-conducting phase-changing gasket, and preparation method and preparation system therefor |
| CN106189913A (en) * | 2016-08-24 | 2016-12-07 | 湖南省普瑞达内装材料有限公司 | Heat conduction adhesive tape and heat-conducting double-sided adhesive tape |
| CN106922104A (en) * | 2015-12-24 | 2017-07-04 | 北京中石伟业科技股份有限公司 | Heat conduction phase transformation pad of a kind of easy to clean and preparation method thereof and system |
-
2015
- 2015-01-27 CN CN201520055336.8U patent/CN204362492U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611800A (en) * | 2015-12-24 | 2016-05-25 | 平湖阿莱德实业有限公司 | Easy-to-clean heat-conducting phase-changing gasket, and preparation method and preparation system therefor |
| CN106922104A (en) * | 2015-12-24 | 2017-07-04 | 北京中石伟业科技股份有限公司 | Heat conduction phase transformation pad of a kind of easy to clean and preparation method thereof and system |
| CN106189913A (en) * | 2016-08-24 | 2016-12-07 | 湖南省普瑞达内装材料有限公司 | Heat conduction adhesive tape and heat-conducting double-sided adhesive tape |
| CN106189913B (en) * | 2016-08-24 | 2018-11-23 | 湖南省普瑞达内装材料有限公司 | Heat-conducting glue band and heat-conducting double-sided adhesive tape |
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Granted publication date: 20150527 |