CN105792619A - Heat radiation device and mobile terminal - Google Patents
Heat radiation device and mobile terminal Download PDFInfo
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- CN105792619A CN105792619A CN201610287123.7A CN201610287123A CN105792619A CN 105792619 A CN105792619 A CN 105792619A CN 201610287123 A CN201610287123 A CN 201610287123A CN 105792619 A CN105792619 A CN 105792619A
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- heat
- mobile terminal
- heat absorption
- accumulating
- accumulation part
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
Abstract
The invention discloses a heat radiation device which is applied to a mobile terminal. The heat radiation device comprises a heat conducting tube and a heat absorbing and heat storing member. The heat conducting tube comprises a vacuum tube body of which the two ends are sealed. The heat conducting end of the tube body is attached to the heat generation device of the mobile terminal. The heat radiation end of the tube body is contacted with the shell of the mobile terminal. A heat conducting medium is arranged in the tube body. The heat conducting medium is used for transmitting heat to the heat radiation end. The heat absorbing and heat storing member is arranged in an area in which the heat radiation end is contacted with the shell of the mobile terminal. The heat absorbing and heat storing member comprises heat absorbing and heat storing material having the material properties of heat absorbing and heat storing functions. Heat transmitted by the heat conducting tube is absorbed by the heat absorbing and the storing material firstly. When heat absorbed by the heat absorbing and the storing material is saturated, heat is transmitted to the shell of the mobile terminal so that heat radiation performance and reliability of the mobile terminal can be enhanced, and temperature of the shell of the mobile terminal having the heat radiation device can also be reduced.
Description
Technical field
The present invention relates to a kind of electronic device field, particularly relate to a kind of heat abstractor and mobile terminal.
Background technology
Development along with mobile phone industry, mobile phone configuration is more and more higher, central processing unit (CentralProcessingUnit/CPU) dominant frequency is more and more higher, power consumption is increasing, and also strain is big mutually to cause cell-phone heating amount, if these heats do not reach control or transfer, chip for cell phone temperature will be made too high, causing that mobile phone computing is slack-off, even card, affects the use of mobile phone.
For solving the heating problem of mobile phone, being usually in the industry at present uses the heat that chip is distributed by heat pipe to be directly delivered to handset shell, chip is dispelled the heat indirectly, find when but inventor states technical scheme on the implementation: the heat distributed by chip for cell phone due to heat pipe is transferred directly to handset shell, cause that case temperature is higher, during use, there will be the problems such as hot, boiling hot ear.
Summary of the invention
In order to solve above-mentioned technical problem, the invention provides a kind of heat abstractor, it is applied to mobile terminal, including heat pipe and heat absorption heat accumulation part, described heat pipe includes the vacuum tubings that two ends seal, and the heat conduction end of described body is attached on the electro-heat equipment of described mobile terminal, and the radiating end of described body contacts with the housing of described mobile terminal, being equiped with heat-conducting medium in described body, described heat-conducting medium is used for transferring heat to described radiating end；Be provided with described heat absorption heat accumulation part with the housing of described mobile terminal in the region that described radiating end contacts, described heat absorption heat accumulation part includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function.
Wherein, described heat conduction end is U-shaped, and described electro-heat equipment is contained in U-shaped described heat conduction end.
Wherein, described heat pipe also includes metal guide thermosphere, and described metal guide thermosphere is arranged on outside described body.
Wherein, described heat-conducting medium include water, supercritical carbon dioxide liquid, concentration be 90%～98% ethanol in any one.
Wherein, described electro-heat equipment includes at least one in chip, display screen and LED.
Wherein, described heat abstractor also includes protecting film, and described protecting film is arranged on described heat absorption heat accumulation part, and described protecting film is located remotely from the side of described body.
Wherein, described heat absorption heat accumulating includes silicon dioxide and Polyethylene Glycol, and the mass ratio of described silicon dioxide and Polyethylene Glycol is 1:1～1:9.
Wherein, described heat absorption heat accumulating by some with described silicon dioxide be cyst wall, with described Polyethylene Glycol be capsule-core microcapsule constituted.
Wherein, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, and described glue-line stacking is covered on described flaky material, and described flaky material is adhered on described housing by described glue-line.
Wherein, described heat absorption heat accumulation part also includes retarder thinner and bonding solution, and described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and coats on described housing.
Wherein, described heat absorption heat accumulation part also includes substrate and glue-line, described heat absorption heat accumulating is coated in described substrate, and described glue-line stacking is covered on described heat absorption heat accumulating, and described in be coated with heat absorption heat accumulating substrate be adhered on described housing by described glue-line.
The embodiment of the present invention additionally provides a kind of mobile terminal, part or all of including above-mentioned heat abstractor.
Implement the embodiment of the present invention, have the advantages that
The heat conduction end of heat pipe provided by the invention is attached on the electro-heat equipment of mobile terminal, heat for being distributed by electro-heat equipment is quickly delivered to radiating end, contact area at radiating end Yu the housing of mobile terminal is provided with heat absorption heat accumulation part, this heat absorption heat accumulation part includes the heat absorption heat accumulating with heat absorption and heat storage function, the heat of heat pipe transmission first passes through heat absorption heat accumulating and absorbs, after the heat of heat absorption heat accumulating absorption reaches capacity, transfer heat to the housing of mobile terminal again, thus, while the thermal diffusivity that improve mobile terminal and reliability, also reduce the case temperature of the mobile terminal with this heat abstractor.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, the accompanying drawing used required in embodiment will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the heat abstractor of embodiment of the present invention offer schematic layout pattern in mobile terminal；
Fig. 2 is the schematic diagram of the heat conduction end of the heat pipe that the embodiment of the present invention provides；
Fig. 3 is the schematic diagram of the heat absorption heat accumulation part that first embodiment of the invention provides；
Fig. 4 is the schematic diagram of the heat absorption heat accumulation part that second embodiment of the invention provides；
Fig. 5 is the schematic diagram of the heat absorption heat accumulation part that third embodiment of the invention provides；
Fig. 6 is the schematic diagram of a kind of mobile terminal that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
The mobile terminal that the present embodiments relate to can be any equipment possessing communication and storage function, such as: panel computer, mobile phone, electronic reader, remote controller, personal computer (PersonalComputer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have the smart machine of network function.The electro-heat equipment of the mobile terminal that the present embodiments relate to can include chip (such as central processor core, power management chip or charging management chip), display screen, LED etc..In following example, electro-heat equipment is introduced for chip.
If Fig. 1 to Fig. 2, Fig. 1 are the heat abstractor of embodiment of the present invention offer schematic layout patterns in mobile terminal.As it is shown in figure 1, heat abstractor includes heat pipe 1 and heat absorption heat accumulation part 3, heat pipe 1 includes the vacuum tubings that two ends seal, and the heat conduction end of body is attached on the chip 2 of mobile terminal, and the radiating end of body contacts with the housing 4 of mobile terminal；Tubular body is equiped with heat-conducting medium, by heat-conducting medium, the heat that heat pipe absorbs is delivered to radiating end, be provided with heat absorption heat accumulation part 3 with the housing 4 of mobile terminal in the region that radiating end contacts, described heat absorption heat accumulation part 3 includes the heat absorption heat accumulating 311a with the material properties of heat absorption and heat storage function.
Heat absorption heat accumulating 311a can be a kind of phase-change material, it can change physical property and can absorb substantial amounts of heat along with variations in temperature, increase along with the heat absorbed, heat absorption heat accumulating 311a gradates as another kind of phase mutually from one, can stably maintain another kind of phase after absorbing sufficient heat and no longer absorb heat, and when the heat that heat pipe 1 does not transmit heat or transmission is relatively low, heat absorption heat accumulating 311a carries out dispelling the heat and gradually along with reducing of heat is reverted to original phase mutually gradually by another kind.Wherein, heat absorption heat accumulating 311a can along with the change of temperature from solid phase to liquid phase or liquid phase to solid transformation, or solid phase is to gas phase or liquid phase to solid transformation, or liquid phase is to gas phase or gas phase to liquid phase.
In the present embodiment, the heat that chip is distributed by the heat conduction end of heat pipe is delivered to radiating end, first the heat of heat pipe transmission is absorbed by heat absorption heat accumulating, after the heat of heat absorption heat accumulating absorption reaches capacity, transfer heat to the housing of mobile terminal again, thus, while the thermal diffusivity that improve mobile terminal and reliability, also reduce the case temperature of the mobile terminal with this heat pipe.
In order to further improve, as in figure 2 it is shown, the heat conduction end of heat pipe 1 is U-shaped, electro-heat equipment 2 is contained in U-shaped heat conduction end, and the contact surface being increased heat pipe and chip by U-shaped heat conduction end is connect, so that heat pipe can better absorb the heat that chip distributes.
In order to further improve, heat pipe 1 also includes metal guide thermosphere, and metal guide thermosphere is arranged on outside body.The heat that chip distributes can be delivered to radiating end from heat pipe by metal guide thermosphere further, thus having further speeded up the heat radiation of chip.Wherein, metal guide thermosphere can be made up of the simple metal material of the good heat conductivity such as copper, aluminum, ferrum or mixed-metal materials.
In order to further improve, the good medium of heat conductivility such as ethanol that heat-conducting medium includes water, supercritical carbon dioxide liquid, concentration are 90%～98%, the heat of heat conduction end quickly can be delivered to radiating end on the one hand, on the other hand in the process of transmission heat, a part of heat can be absorbed, further speeded up the heat radiation of chip.
In order to further improve, heat abstractor also includes protecting film 5, and protecting film 5 is arranged on heat absorption heat accumulation part 3, and protecting film 5 is located remotely from the side of body 4.By arranging protecting film 5 on heat absorption heat accumulation part 3, so that heat absorption heat accumulation part 3 to be protected further, improve thermal diffusivity and the reliability of mobile terminal.
In order to further improve, heat absorption heat accumulating 311a preferably comprises the silicon dioxide and Polyethylene Glycol that mass ratio is 1:1～1:9.Inventor is drawn by substantial amounts of experiment, by silicon dioxide and Polyethylene Glycol with mass ratio for 1:1～1:9 mixing can prepare organic-composite phase-change material has suitable phase transition temperature, the heat of heat pipe transmission can be absorbed in time, improve heat radiation and the reliability of mobile terminal further.Concrete, the phase transition temperature that this heat absorption heat accumulating 311a mixing prepares is 40 degree, and namely after the heat of heat pipe 1 transmission reaches 40 degree, heat absorption heat accumulating 311a carries out decalescence, is taken away by the heat of heat pipe, thus chip 2 is lowered the temperature.Certainly, in other embodiments, heat absorption heat accumulating 311a can also be inorganic phase-changing material, or composite phase-change material etc..
In order to further improve, heat absorption heat accumulating 311a by some with silicon dioxide be cyst wall, with Polyethylene Glycol be capsule-core microcapsule constituted.The heat of heat pipe 1 transmission preferably can be carried out heat absorption heat accumulation by the heat absorption heat accumulating 311a of this microcapsule structure, and then reaches preferably heat dispersion.Concrete, Polyethylene Glycol is joined in certain density Ludox, after all dissolving, drip CaCl2Accelerator solution, under strong stirring so that sol gel reaction occurs Polyethylene Glycol in Ludox, forms three-dimensional net structure gel after standing；By gel forced air drying 24～48h in 80 DEG C of baking ovens, be cooled to room temperature, can access with organo-siloxane compound produce in the basic conditions a large amount of with silica dioxide gel be cyst wall, the microcapsule that is capsule-core with the Polyethylene Glycol after emulsifying.Namely in each microcapsule, silicon dioxide wraps the Polyethylene Glycol as capsule-core as cyst wall so that Polyethylene Glycol will not leak from the process of solid-liquid, it is possible to is well lived by Silica-coated.The heat absorption heat accumulating of this formation microcapsule structure is after the heat that heat pipe 1 transmits reaches 40 degree, start to absorb the heat of heat pipe 1, and capsule-core itself is gradually increased gradually from solid-liquid along with heat, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating 311a absorbs is saturated, and it stops absorbing heat, if chip 2 continues heat radiation, the heat that chip 2 distributes then is delivered to the housing 4 of mobile terminal by heat pipe 1, is dispelled the heat by the housing 4 of mobile terminal.After the heat distributed when chip 2 is gradually decrease to preset temperature, the heat of absorption is come out by capsule-core, it is delivered in air, and capsule-core can be converted to solid phase from liquid phase gradually along with gradually decreasing of its fever of the body amount, changed by the circulation of above-mentioned solid phase to liquid phase, thus chip 2 is lowered the temperature, improve heat dispersion and the reliability of mobile terminal.Certainly, in other embodiments, heat absorption heat accumulating 311a can also be other structure so that heat absorption heat accumulating 311a can by lowering the temperature from the circulation conversion being solid to gas phase to chip 2.
As it is shown on figure 3, the one heat absorption heat accumulation part 31 that Fig. 3 is first embodiment of the invention to be provided.In order to further improve, heat absorption heat accumulation part 31 also includes titanate coupling agent 311b and glue-line 312, heat absorption heat accumulating 311a and titanate coupling agent 311b is mixed and made into flaky material 311, glue-line 312 stacking is covered on flaky material 311, and flaky material 311 is adhered on housing 4 by glue-line 312.
By heat absorption heat accumulating 311a and titanate coupling agent 311b is mixed and made into flaky material 311, it is connected on flaky material 311 again through glue-line 312 stacking and forms heat absorption heat accumulation part 31, the heat absorption heat accumulation part 31 of lamellar is applied more convenient, is directly stained with, is cooled into coating without waiting for it.
In the present embodiment, heat absorption heat accumulating 311a is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating 311a, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating 311a, add titanate coupling agent 311b hydrophobically modified at pulverous heat absorption heat accumulating 311a and obtain inorganic plan organic composite shaping phase-change material, this inorganic plan organic composite shaping phase-change material is prepared through tabletting machine flake and flaky material 311 again, flaky material 311 stacking again connects upper glue layer 312 and forms heat absorption heat accumulation part 31.It should be understood that glue-line 312 can be gum, double faced adhesive tape or mould release membrance etc..Heat absorption heat accumulation part 31 can be cut into definite shape according to the shape of housing, is fitted on housing 4, it is achieved the function of heat absorption heat accumulation.In the present embodiment, on the side that radiating end contacts, heat absorption heat accumulation part 31 is only covered with housing, in other alternative embodiments, it is also possible to cover heat absorption heat accumulation part 31 in remaining side of housing.
In the present embodiment, protecting film 313 is polyethylene terephthalate (PET), and its stacking is connected on flaky material 311, and opposing with glue-line 312, and flaky material 311 can be shaped and have dust-proof effect by protecting film 313 further.Certainly, in other embodiments, the material of protecting film 313 can also be other, such as silica gel.
As shown in Figure 4, Fig. 4 is the heat absorption heat accumulation part 32 that second embodiment of the invention provides.The basic structure of the heat absorption heat accumulation part 31 provided with first embodiment of the invention is roughly the same, it is different in that, heat absorption heat accumulation part 32 in the present embodiment also includes retarder thinner and bonding solution, coats on housing 4 after heat absorption heat accumulating, retarder thinner and the mixing of bonding solution.
By retarder thinner, bonding solution are mixed to form heat absorption heat accumulation part 32 with heat absorption heat accumulating, heat absorption heat accumulation part 32 is made directly to have adhesive force, upper shell 4 can be coated, thus providing a kind of use advantageously heat absorption heat accumulation part 32 without still further increasing glue-line.
In the present embodiment, heat absorption heat accumulating is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating, it is added to retarder thinner at pulverous heat absorption heat accumulating and adds the mixing of special binder solution (such as: methanol dimethylbenzene, acrylic resin etc.), heat absorption heat accumulation part 32 is made to have adhesive force, directly adopt the form of coating to be piled into certain thickness heat absorption heat accumulation part 32 and be attached on housing 4, thus realizing the function of heat absorption heat accumulation.
Such as Fig. 5, the third embodiment of the present invention is provided a kind of heat absorption heat accumulation part 33, the basic structure of the heat absorption heat accumulation part 31 provided with first embodiment of the invention is roughly the same, it is different in that, heat absorption heat accumulation part 32 in the present embodiment also includes substrate 332 and glue-line 333, heat absorption heat accumulating 331 is coated in substrate 332, and glue-line 333 stacking is connected on heat absorption heat accumulating 331, and glue-line 333 is adhered on housing 4.
By directly heat absorption heat accumulating 331 being coated molding in substrate 332, then at heat absorption heat accumulating 331, glue-line 333 is set to be pasted on housing 4, it is not necessary to tablet machine carries out tabletting, makes relatively simple.
In the present embodiment, substrate 332 is polyethylene terephthalate (PET), heat absorption heat accumulating 331 is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating 331, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating 331, pulverous heat absorption heat accumulating 331 is directly coated at molding in substrate 332, the substrate 332 with heat absorption heat accumulating 331 is adhered on housing 4 by glue-line 333, it is achieved the heat absorption heat storage function of heat absorption heat accumulation part 33.It should be understood that glue-line can be gum, double faced adhesive tape or other etc..
Referring to the schematic diagram of the mobile terminal 6 that Fig. 6, Fig. 6 provide for the embodiment of the present invention, mobile terminal 6 includes above-mentioned heat abstractor, shell and the electro-heat equipment mentioned.Wherein, heat abstractor includes any one in above-mentioned heat absorption heat accumulation part 31,32 and 33.
When mobile terminal during fabrication, first the heat pipe of heat abstractor and the contact position of housing are determined, heat absorption heat accumulation part is set in the side contacted with heat pipe of housing, then the position of heat pipe is determined, the heat conduction end making heat pipe can be attached on chip, and the radiating end of heat pipe can contact with housing.Wherein, form the heat absorption heat accumulating of microcapsule structure after the heat that heat pipe transmits reaches 40 degree, start the heat on heat pipe, and capsule-core itself is gradually from solid-liquid, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating absorbs is saturated, it stops absorbing heat, and after the temperature outside heat pipe is gradually decrease to preset temperature, the heat of absorption is come out by capsule-core, it is delivered in air, and capsule-core can along with gradually decreasing of its fever of the body amount gradually from liquid-solid, circulating phase-change by the heat accumulating that absorbs heat, thus chip is lowered the temperature, improve heat dispersion and the reliability of mobile terminal.
The heat that chip is distributed by mobile terminal provided by the invention by the heat conduction end of heat pipe is delivered to radiating end, first the heat of heat pipe transmission is absorbed by heat absorption heat accumulating, after the heat of heat absorption heat accumulating absorption reaches capacity, transfer heat to the housing of mobile terminal again, thus, while the thermal diffusivity that improve mobile terminal and reliability, also reduce the case temperature of the mobile terminal with this heat pipe.
The contact surface that mobile terminal provided by the invention increases heat pipe and chip by the U-shaped heat conduction end of heat pipe connects, and makes heat pipe can better absorb the heat that chip distributes, thus, further increase thermal diffusivity and the reliability of mobile terminal.
The mobile terminal provided by the invention metal guide thermosphere by heat pipe, it is possible to further the heat that chip distributes is delivered to radiating end from heat pipe, thus having further speeded up the heat radiation of chip.Wherein, metal guide thermosphere can be made up of the simple metal material of the good heat conductivity such as copper, aluminum, ferrum or mixed-metal materials.
The heat of heat conduction end is quickly delivered to radiating end by heat-conducting mediums such as ethanol that water, supercritical carbon dioxide liquid, concentration are 90%～98% by mobile terminal provided by the invention, the heat of heat conduction end quickly can be delivered to radiating end on the one hand, on the other hand in the process of transmission heat, heat-conducting medium can absorb a part of heat, has further speeded up the heat radiation of chip.
Mobile terminal provided by the invention, by arranging protecting film on heat absorption heat accumulation part, so that heat absorption heat accumulation part to be protected further, improves thermal diffusivity and the reliability of mobile terminal.
Mobile terminal provided by the invention has suitable phase transition temperature also by by the organic phase change material that silicon dioxide and Polyethylene Glycol can prepare with mass ratio for 1:1～1:9 mixing, the heat of chip can be absorbed in time, improve the reliability of chip and mobile terminal further.
Mobile terminal provided by the invention makes microcapsule structure also by by heat absorption heat accumulating, it is possible to the heat preferably chip distributed carries out heat absorption heat accumulation, and then reaches preferably heat dispersion.
Mobile terminal provided by the invention is mixed and made into flaky material also by by heat absorption heat accumulating and titanate coupling agent, it is connected on flaky material again through glue-line stacking and forms heat absorption heat accumulation part, not only make heat absorption heat accumulation part can go to cut according to the shape of body, and the application of the heat absorption heat accumulation part of lamellar is more convenient, directly it is stained with, is cooled into coating without waiting for it.
Mobile terminal provided by the invention is mixed to form heat absorption heat accumulation part also by by retarder thinner, bonding solution with heat absorption heat accumulating, heat absorption heat accumulation part is made directly to have adhesive force, can coat on body without still further increasing glue-line, thus providing a kind of use advantageously heat absorption heat accumulation part.
Mobile terminal provided by the invention is also by coating in substrate by heat absorption heat accumulating, and glue-line stacking is covered on heat absorption heat accumulating, and the substrate being coated with heat absorption heat accumulating is adhered on described body by glue-line.By directly heat absorption heat accumulating being coated molding in substrate, then at heat absorption heat accumulating, glue-line is set to be pasted on body, it is not necessary to tablet machine carries out tabletting, makes relatively simple.
Being above the preferred embodiment of the present invention, it is noted that for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (12)
1. a heat abstractor, it is applied to mobile terminal, it is characterized in that, including heat pipe and heat absorption heat accumulation part, described heat pipe includes the vacuum tubings that two ends seal, and the heat conduction end of described body is attached on the electro-heat equipment of described mobile terminal, and the radiating end of described body contacts with the housing of described mobile terminal, being equiped with heat-conducting medium in described body, described heat-conducting medium is used for transferring heat to described radiating end；
Be provided with described heat absorption heat accumulation part with the housing of described mobile terminal in the region that described radiating end contacts, described heat absorption heat accumulation part includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function.
2. heat abstractor as claimed in claim 1, it is characterised in that described heat conduction end is U-shaped, and described electro-heat equipment is contained in U-shaped described heat conduction end.
3. heat abstractor as claimed in claim 1, it is characterised in that described heat pipe also includes metal guide thermosphere, and described metal guide thermosphere is arranged on outside described body.
4. heat abstractor as claimed in claim 1, it is characterised in that described heat-conducting medium includes water, supercritical carbon dioxide liquid, concentration be 90%～98% ethanol in any one.
5. heat abstractor as claimed in claim 1, it is characterised in that described electro-heat equipment includes at least one in chip, display screen and LED.
6. heat abstractor as claimed in claim 1, it is characterised in that described heat abstractor also includes protecting film, and described protecting film is arranged on described heat absorption heat accumulation part, and described protecting film is located remotely from the side of described body.
7. the heat abstractor as described in any one of claim 1～6, it is characterised in that described heat absorption heat accumulating includes silicon dioxide and Polyethylene Glycol, the mass ratio of described silicon dioxide and Polyethylene Glycol is 1:1～1:9.
8. heat abstractor as claimed in claim 7, it is characterised in that described heat absorption heat accumulating by some with described silicon dioxide be cyst wall, with described Polyethylene Glycol be capsule-core microcapsule constituted.
9. heat abstractor as claimed in claim 8, it is characterized in that, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, described glue-line stacking is covered on described flaky material, and described flaky material is adhered on described housing by described glue-line.
10. heat abstractor as claimed in claim 8, it is characterised in that described heat absorption heat accumulation part also includes retarder thinner and bonding solution, and described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and coats on described housing.
11. heat abstractor as claimed in claim 8, it is characterized in that, described heat absorption heat accumulation part also includes substrate and glue-line, described heat absorption heat accumulating is coated in described substrate, described glue-line stacking is covered on described heat absorption heat accumulating, and described in be coated with heat absorption heat accumulating substrate be adhered on described housing by described glue-line.
12. a mobile terminal, it is characterised in that include the heat abstractor as described in any one of claim 1～11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287123.7A CN105792619A (en) | 2016-04-29 | 2016-04-29 | Heat radiation device and mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287123.7A CN105792619A (en) | 2016-04-29 | 2016-04-29 | Heat radiation device and mobile terminal |
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| CN105792619A true CN105792619A (en) | 2016-07-20 |
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| CN113157072A (en) * | 2016-12-29 | 2021-07-23 | 华为技术有限公司 | Heat dissipation device and terminal equipment thereof |
| CN110140017A (en) * | 2017-10-23 | 2019-08-16 | Oppo广东移动通信有限公司 | The control method of radiator, terminal and radiator |
| CN108614384A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A kind of electronic equipment and radiating subassembly |
| CN108761970A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of electronic equipment and radiating subassembly |
| CN108614384B (en) * | 2018-06-11 | 2021-04-27 | Oppo广东移动通信有限公司 | Electronic equipment and heat dissipation assembly |
| CN109449729A (en) * | 2018-09-20 | 2019-03-08 | 深圳市大德激光技术有限公司 | A kind of optical fiber coiling device of ultrafast pulsed laser device |
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