CN108761970A - A kind of electronic equipment and radiating subassembly - Google Patents
A kind of electronic equipment and radiating subassembly Download PDFInfo
- Publication number
- CN108761970A CN108761970A CN201810596692.9A CN201810596692A CN108761970A CN 108761970 A CN108761970 A CN 108761970A CN 201810596692 A CN201810596692 A CN 201810596692A CN 108761970 A CN108761970 A CN 108761970A
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- camera
- side wall
- main part
- radiating subassembly
- thermal insulation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
Abstract
This application involves a kind of electronic equipment and radiating subassemblies.Radiating subassembly includes：Camera；Center, including main part and main body, to the side wall extended perpendicular to the direction of main part, camera is arranged in the first side of main part；Heat pipe, one end are connect with camera heat conduction, and the other end extends from camera to sidewall direction and extends to the direction far from camera along side wall, and the heat that camera generates is directed to side wall.The heat that camera generates can be directed to the region of low temperature in center from there through the thermal conduction characteristic of heat pipe, and be spread heat around by the low temperature, effectively be removed.
Description
Technical field
This application involves technical field of electronic equipment, more particularly to a kind of electronic equipment and radiating subassembly.
Background technology
With advances in technology and pursuit of the people to living standard, it is directed to electronic equipment, is continually developed and perfect
Various functions are to meet needed for people.Such as present mobile phone, only phone, short message function can no longer meet people's
Demand, thus increase camera shooting, qq, wechat, etc. functions.And thus with bring power consumption, fever the problems such as.Such as image hair
Heat, a function to camera have an impact, and two to reduce the usage experience of user.
Invention content
The embodiment of the present application use a technical solution be：A kind of radiating subassembly is provided, including：
Camera；
Center, including main part and from the main part to the side wall extended perpendicular to the direction of the main part, institute
Camera is stated to be arranged in the first side of the main part；
Heat pipe, one end are connect with the camera heat conduction, and the other end extends simultaneously from the camera to the sidewall direction
Extend to the direction far from camera along the side wall, the heat that the camera generates is directed to the side wall.
The embodiment of the present application use another technical solution be：A kind of electronic equipment is provided, electronic equipment includes above
The radiating subassembly.
The heat that camera generates is directed on the side wall of center by the application by heat pipe, and the past side far from camera
To guiding, radiated to camera by side wall.Since the side wall far from camera is when camera is worked, the region
Temperature it is usually relatively low, from there through heat pipe thermal conduction characteristic can by camera generate heat be directed to low temperature in center
Region, and heat is spread around by the low temperature, is effectively removed.
Description of the drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present application, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.Wherein：
Fig. 1 is the structural schematic diagram that a kind of electronic equipment provided by the embodiments of the present application is overlooked；
Fig. 2 is schematic cross-sectional view of the electronic equipment shown in FIG. 1 along A1-A2 dotted lines；
Fig. 3 is the structural schematic diagram of the center of electronic equipment shown in FIG. 1；
Fig. 4 is the overlooking structure diagram of another electronic equipment provided by the embodiments of the present application；
Fig. 5 is the overlooking structure diagram of another electronic equipment provided by the embodiments of the present application；
Fig. 6 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application；
Fig. 7 is the structural schematic diagram of the center of electronic equipment shown in fig. 6；
Fig. 8 is the structural schematic diagram of another electronic equipment provided by the present application；
Fig. 9 is the structural schematic diagram of another electronic equipment provided by the present application.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the application, rather than the limit to the application
It is fixed.It also should be noted that illustrating only for ease of description, in attached drawing and the relevant part of the application and not all knot
Structure.Based on the embodiment in the application, those of ordinary skill in the art are obtained without creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Term " first ", " second " in the application etc. be for distinguishing different objects, rather than it is specific suitable for describing
Sequence.In addition, term " comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and
It further includes the steps that optionally not listing or unit to be, or further includes optionally for these processes, method, product or equipment
Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
It is the structural representation that a kind of electronic equipment provided by the embodiments of the present application is overlooked also referring to Fig. 1 and Fig. 3, Fig. 1
Figure, Fig. 2 is schematic cross-sectional view of the electronic equipment shown in FIG. 1 along A1-A2 dotted lines, and Fig. 3 is electronic equipment shown in FIG. 1
The structural schematic diagram of center.As shown in Figure 1-Figure 3, the electronic equipment 10 of the present embodiment include radiating subassembly 11, display screen 12 with
And battery 13.
Radiating subassembly 11 includes camera 111, center 112 and heat pipe 113.
Wherein, the material of center 112 may include metal, glass and plastic cement etc..Metal material may include copper, aluminium, silver etc.
And at least two alloy.Preferably due to the hardness of metal and thermal conductivity etc., the material of the center 112 of the present embodiment
Preferably metal.
Center 112 includes side wall 1121 and main part 1122.Main part 1122 can be quadrilateral structure, including be oppositely arranged
First side 1123 and second side 1124.Side wall 1121 is four, the four edges of main body 1122 respectively to perpendicular to
The direction of main part 1122 extends.Specifically, the four edges of the first side 1123 of four 1121 main bodies 1122 of side wall to
Identical direction extends, and head and the tail intersect.The first side 1123 of four side walls 1121 and main part 1122 forms an appearance
Between emptying.Wherein, first side 1123 includes first area 1125 and second area 1126.
The four edges of the quadrilateral structure of the main part 1122 of the present embodiment can be right angle connection, can also be arc mistake
Cross connection.
It should be understood that in other embodiments, main part 1122 can also be other structures, such as polygonized structure, or circle
Shape structure etc..
Camera 111 is arranged in the first area 1125 of the first side 1123 of main part 1122.Specifically, main part
1122 have opened up a through-hole 1111 in corresponding first area 1125, and camera 111 is arranged in the through-hole 1111.
Camera 111 is a hexahedron structure, including the bottom surface 1112 being oppositely arranged and top surface 1113 and setting the bottom of at
Side 1114 between face 1112 and top surface 1113.After 111 turns of camera is fitted on through-hole 1111, bottom surface 1112 is close to center
112 the second sides 1124, and bottom surface 1112 can flush setting with the outer surface of center the second side 1124.
It is protruded relative to the surface of the first side of main part 1122 part of top surface 1113 and side 1114.And it is pushing up
The installation site 1115 of camera lens is provided on face 1113.
As shown in figures 1 and 3, two side walls 1126 and 1127 of the first area 1125 close to intersection.I.e. camera 111 leans on
The side wall 1126 of nearly center 112 and 1127 and be arranged.Side wall 1126 and 1127 is respectively Fig. 1 and left side wall shown in Fig. 3 and upper
Side wall.That is camera 111 is arranged in the upper left side position of center 112.
In other embodiments, camera 111 can also be arranged in other positions, such as only be set close to upper side wall 1126
It sets, and is arranged in 1126 corresponding medium position of upper side wall.Or it is arranged in the one end of upper side wall 1126 far from left side wall 1127
Position.
Further, thermal insulation barriers are further set between camera 111 and close side wall.
In the present embodiment, as shown in figures 1 and 3, side wall 1126 and 1127 is hollowed out in the position of corresponding camera 111
Processing forms groove 1128.Radiating subassembly 11 further includes thermal insulation barriers 14, is set to groove 1128.The material of thermal insulation barriers 14 can be used
Plastic cement can be integrally formed by way of injection molding with side wall 1126 and 1127.Thus it can guarantee side wall 1126 and 1127
Intensity.Certainly, side wall 1126 and 1127 and thermal insulation barriers 14 can also be separate piece, thermal insulation barriers 14 pass through nesting
Or the modes such as stickup are arranged in groove 1128.
The thickness of thermal insulation barriers 14 can be equal to the depth of groove 1128.The length of thermal insulation barriers 14 can be with the length phase of groove 1128
Deng.The length of camera 111 can be equal to the length of thermal insulation barriers 14, thus can be by the side wall corresponding with its position of camera 111
1126 and 1127 are thermally isolated.Prevent the heat that camera 111 generates from concentrating in center in its vicinity, to prevent electronics
Local heating of the equipment 10 in the position of camera 111 is excessive, influences the performance of camera and the experience of user.
In other embodiments, the thickness of thermal insulation barriers 14 can also be more than the depth of groove 1128.The length of thermal insulation barriers 14
The length of camera 111 can also be more than.It can further improve the intensity of side wall 1126 and 1127 and the heat to camera 111
Isolation effect.
It should be understood that when camera 111 is arranged in other positions, the relationship between thermal insulation barriers is similar described previously,
Details are not described herein.
The second area 1126 in the first side 1123 of main part 1122 is arranged in battery 13.Wherein, second area 1126
Typically it is arranged far from first area 1125.Such as shown in Fig. 1 and 3, first area 1125 is arranged in 112 upper left position of center
It sets, second area 1126 is arranged in 112 middle parts of center and lower position.Battery 13 usually generates when charging larger
Heat, heat during powering use are relatively small.Therefore, in the state of 111 use of camera, in general, the firstth area
The heat of the heat ratio second area 1126 in domain 1125 is high.
Heat pipe 113 is arranged on center 112, and one end is connect with 111 heat conduction of camera, the other end from camera 111 to
1121 direction of side wall extends and extends to the direction far from camera 111 along side wall 1121, the heat that camera 111 is generated
Amount is directed to side wall 1121.
Heat pipe 113 utilizes Transformation Principle and capillarity so that metal of the heat transference efficiency of itself than same material
Hundred times are higher by thousands of times.Heat pipe 113 is the copper pipe of a vacuum, and the working fluid that the inside is noted is the medium that heat is transmitted.
Working fluid can be pure water.There is liquid sucting core structure in heat pipe wall.By the capillary force that liquid-sucking core generates, make condensed fluid from cold
Solidifying end returns to evaporation ends.
Because after being evacuated inside heat pipe 113, liquid is reinjected before sealing, so, the pressure inside heat pipe 113
Power is that the steam pressure after being evaporated by working fluid determines.As long as heating 113 surface of heat pipe, working fluid will evaporate.It steams
Therefore the other parts that the temperature and pressure of originator steam is all slightly higher than heat pipe produce pressure difference in heat pipe 113, promote
Colder one end in steam flow heat pipe.When steam condenses on the heat pipe walls, steam releases the latent heat of vaporization, thus will be hot
It has been transmitted to condensation end.Later, the liquid sucting core structure of heat pipe makes condensed liquid return evaporation ends.As long as there is heat source heating, this
One process will recycle progress.
In the state of 111 use of camera, the heat of first area 1125 is higher.The heat pipe 113 of first area 1125
Temperature increases, working fluid evaporation, and the temperature and pressure of steam is all higher than the other parts of heat pipe 113.It is produced in heat pipe 113
Pressure difference promotes one end far from camera 111 in steam flow heat pipe.When steam condenses on the heat pipe walls, steam
The latent heat of vaporization is released, to which heat has been transmitted to the one end of side wall 1121 far from camera 111 so that heat can be far from first
It is removed in the side wall 1121 in region 1125.
In the present embodiment, it is arranged fluted 1129 on the side wall 1121 of center 112.Groove 1129 is located at the from side wall 1121
Position near one region 1125 extends to the direction far from first area 1125.Since side wall 1127 and side wall 1126 lean on close-shot
As the setting of head 111, and the length of side wall 1127 is longer than side wall 1126, therefore groove is arranged on side wall 1127 in the present embodiment
1129。
One end of heat pipe 113 is contacted with the surface of camera 111 to form heat conduction connection.The present embodiment, heat pipe 113 are specific
It is that the top surface 1113 protruded relative to main part 1122 with camera 111 contacts, and does not cover the installation site 1115 of camera lens.
The other end of heat pipe 113 extends from camera 111 to side wall 1127 and is arranged in groove 1129, to be embedded in center 112
It is internal on side wall 1127.
The thickness of heat pipe 113 can be equal to the thickness of groove 1129.Therefore, the outer surface of heat pipe 113 is relative to side wall 1127
It flushes.
In other embodiments, the thickness of heat pipe 113 can be more than the thickness of groove 1129.The outer surface of heat pipe 13 relative to
Side wall 1127 protrudes.
Radiating subassembly 11 further comprises that thermal insulation barriers 114, thermal insulation barriers 114 are arranged in side of the heat pipe 113 far from side wall,
That is thermal insulation barriers 14 are arranged between battery 13 and heat pipe 113, and cover the heat pipe 113 of 13 position of corresponding battery.And it is heat-insulated
The size of part 114 can be equal to or more than the size of the corresponding heat pipe in 13 position of battery 113.For preventing the heat of heat pipe 113 from passing
It is delivered in battery 13 and battery 13 is made to generate heat.The material that thermal insulation barriers 114 use can be plastic cement, heat-insulated foam etc..
Display screen 12, which is arranged, to be arranged in the side of the second side 1124 of center 112.The ground of display screen 12 can be glass
Glass.May be other materials.
Radiating subassembly 11 further comprises that second in display screen 12 and center 112 is arranged in radiating piece 115, radiating piece 115
Between side 1124, the heat in center 112 can be further transmitted to by radiating piece 115 on display screen 12, pass through display
Screen 12 carries out auxiliary heat dissipation.If the ground of display screen 12 is glass material, also have preferable heat-sinking capability, it is whole to improve
The heat-sinking capability of a electronic equipment 10.
In the present embodiment, the bottom surface 1112 of camera 111 can be contacted with radiating piece 115.In other embodiments, can also
The bottom surface 1112 of camera 111 and the interval of radiating piece 115 are arranged.
The preferable material of the heat dissipations such as graphite or metal can be used in radiating piece 115.
Referring to Fig. 4, Fig. 4 is the overlooking structure diagram of another electronic equipment provided by the embodiments of the present application.Fig. 4 institutes
The electronic equipment 20 that shows with previously described electronic equipment 10 the difference is that：The heat pipe of electronic equipment 20 shown in Fig. 4
213 be two, is extended respectively from the top surface of camera 211 2113 to the direction of side wall 2126 and 2127, and further distinguish
It is embedded in side wall 2126 and 2127, concrete structure is as it was noted above, details are not described herein.
The heat that camera 211 generates is directed on side wall by two heat pipes 213 and is removed by the present embodiment, into one
Step improves heat-sinking capability.
Referring to Fig. 5, Fig. 5 is the overlooking structure diagram of another electronic equipment provided by the embodiments of the present application.Fig. 5 institutes
The electronic equipment 30 that shows with previously described electronic equipment 10 the difference is that：The heat pipe of electronic equipment 30 shown in fig. 5
313 are all embedded in side wall 3127.It is arranged close to one end of camera 311 between thermal insulation barriers 34 and camera 311, and
And contacted by the side 3114 of proximal wall 3127 to form heat conduction connection with camera 211, the other end is to far from camera 311
Direction extends.
It should be understood that the set-up mode of the heat pipe of the present embodiment can also be applied in electronic equipment shown in Fig. 4.
Fig. 6 and Fig. 7 are please referred to, Fig. 6 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application.Fig. 7
It is the structural schematic diagram of the center of electronic equipment shown in fig. 6.As shown in Figure 6 and Figure 7, the electronic equipment 40 of the present embodiment includes
Radiating subassembly 41, display screen 42 and battery (not shown).
Radiating subassembly 41 includes camera 411, center 412 and heat pipe 413.
Center 412 includes side wall 4121 and main part 4122.Main part 4122 can be quadrilateral structure, and side wall 4121 is four
A, the four edges of main body 4122 extend to perpendicular to the direction of main part 4122 respectively.The extension side of four side walls 4121
To identical, and head and the tail intersect.One accommodating space of formation of four side walls 4121 and main part 4122.Wherein, main part
4122 include the first area 4125 for camera 411 to be arranged and the second area 4126 for battery to be arranged.
The four edges of the quadrilateral structure of the main part 4122 of the present embodiment can be right angle connection, can also be arc mistake
Cross connection.
It should be understood that in other embodiments, main part 4122 can also be other structures, such as polygonized structure, or circle
Shape structure etc..
As shown in fig. 7, two side walls 4126 and 4127 of the first area 4125 close to intersection.I.e. camera 411 is in
The side wall 4126 of frame 412 and 4127 and be arranged.Side wall 4126 and 4127 is respectively left side wall and upper side wall shown in Fig. 7.Also
It is to say that the camera 411 of the present embodiment is arranged in the upper left side position of center 412.Camera 411 and close two side walls
Thermal insulation barriers (not shown) are further set between 4126 and 4127.
Specifically, side wall 4126 and 4127 carries out hollowing out processing formation groove 4128 in the position of corresponding camera 411.
Thermal insulation barriers are set to groove 4128.Plastic cement can be used in the material of thermal insulation barriers, can by way of injection molding with side wall 4126
It is integrally formed with 4127.Thus it can guarantee the intensity of side wall 4126 and 4127.It can also be arranged by modes such as nested or stickups
In groove 4128.
Thermal insulation barriers are with the relationship of groove 4128 and camera 411 as it was noted above, details are not described herein.
Unlike previously described center：The camera 411 of the present embodiment is arranged on main part 4122.This implementation
Also groove 4124 is arranged in the position of the first area of main part 4,122 4125 in example.On groove 4124 and side wall 4126 and 4127
Groove 4128 is connected to.Thermal insulation barriers 45 are further set on groove 4124, which can be with the thermal insulation barriers on groove 4128
It is integrally formed.
Camera 411 is arranged on the thermal insulation barriers 45 of groove 4124, thus can further prevent the generation of camera 411
Heat is transmitted on the main part 4122 of first area 4215.
Referring to Fig. 8, Fig. 8 is the structural schematic diagram of another electronic equipment provided by the present application.As shown in figure 8, this reality
The electronic equipment 50 for applying example includes radiating subassembly 51, display screen (not shown) and battery 53.
Radiating subassembly 51 includes camera 511, center 512 and heat pipe 513.
Center 512 includes side wall 5121 and main part 5122.Main part 5122 can be quadrilateral structure, and side wall 5121 is four
A, the four edges of main body 5122 extend to perpendicular to the direction of main part 5122 respectively.The extension side of four side walls 5121
To identical, and head and the tail intersect.One accommodating space of formation of four side walls 5121 and main part 5122.Wherein, main part
5122 include the first area 5125 for camera 511 to be arranged and the second area 5123 for battery 53 to be arranged.
The four edges of the quadrilateral structure of the main part 5122 of the present embodiment can be right angle connection, can also be arc mistake
Cross connection.
It should be understood that in other embodiments, main part 5122 can also be other structures, such as polygonized structure, or circle
Shape structure etc..
As shown in figure 8, two side walls 5126 and 5127 of the first area 5125 close to intersection.I.e. camera 511 is in
The side wall 5126 of frame 512 and 5127 and be arranged.Side wall 5126 and 5127 is respectively left side wall and upper side wall shown in Fig. 8.Also
It is to say that the camera 511 of the present embodiment is arranged in the upper left side position of center 512.It is set between camera 511 and close side wall
Set thermal insulation barriers.
Specifically, side wall 5126 and 5127 carries out hollowing out processing formation groove 5128 in the position of corresponding camera 511.
Radiating subassembly 51 further comprises thermal insulation barriers 54, is set to groove 5128.Plastic cement can be used in the material of thermal insulation barriers 54, can pass through
The mode of injection molding is integrally formed with side wall 5126 and 5127.Thus it can guarantee the intensity of side wall 5126 and 5127.It can also
It is arranged in groove 5128 by modes such as nested or stickups.
Unlike embodiment above：In the present embodiment, thermal insulation barriers 54 further comprise two cross-talk thermal insulation barriers, 541 He
542, the setting at two cross-talk thermal insulation barriers 541 and 542 interval is between side wall and camera 511.As shown in figure 8, sub- thermal insulation barriers 541
It is arranged between side wall 5126 and camera 511.Sub- thermal insulation barriers 542 are arranged between side wall 5127 and camera 511.
The setting of sub- thermal insulation barriers 541 and 542 can be identical with previously described thermal insulation barriers 14, and details are not described herein.
The sub- thermal insulation barriers 541 and 542 at the present embodiment setting interval can reduce the material of thermal insulation barriers in the case where ensureing heat-insulated
Matter, to achieve the purpose that reduce cost.
It should be understood that in other embodiments, the sub- thermal insulation barriers of other quantity can also be arranged, be arranged at intervals on groove
In 5128.
Referring to Fig. 9, Fig. 9 is the structural schematic diagram of another electronic equipment provided by the present application.As shown in figure 9, this reality
The electronic equipment 60 for applying example includes radiating subassembly 61, display screen (not shown) and battery 63.
Radiating subassembly 61 includes camera 611, center 612 and heat pipe 613.
Center 612 includes side wall 6121 and main part 6122.Main part 6122 can be quadrilateral structure, and side wall 6121 is four
A, the four edges of main body 6122 extend to perpendicular to the direction of main part 6122 respectively.The extension side of four side walls 6121
To identical, and head and the tail intersect.One accommodating space of formation of four side walls 6121 and main part 6122.Wherein, main part
6122 include the first area 6124 for camera 611 to be arranged and the second area 6123 for battery 63 to be arranged.Heat pipe 613
Second area 6123 is extended to from first area 6124, by the heat transfer of the camera 611 of first area 6124 to second
In region 613.It specifically can be as it was noted above, details are not described herein.
The four edges of the quadrilateral structure of the main part 6122 of the present embodiment can be right angle connection, can also be arc mistake
Cross connection.
It should be understood that in other embodiments, main part 6122 can also be other structures, such as polygonized structure, or circle
Shape structure etc..
As shown in figure 9, two side walls 6126 and 6127 of the first area 6124 close to intersection.I.e. camera 611 is in
The side wall 6126 of frame 612 and 6127 and be arranged.Side wall 6126 and 6127 is respectively left side wall and upper side wall shown in Fig. 9.Also
It is to say that the camera 611 of the present embodiment is arranged in the upper left side position of center 612.Camera 611 and close two side walls
Thermal insulation barriers 64 are further set between 6126 and 6127.
Specifically, side wall 6126 and 6127 carries out hollowing out processing formation groove 6128 in the position of corresponding camera 611.
Radiating subassembly 61 further comprises thermal insulation barriers 64, is set to groove 6128.Plastic cement can be used in the material of thermal insulation barriers 64, can pass through
The mode of injection molding is integrally formed with side wall 6126 and 6127.Thus it can guarantee the intensity of side wall 6126 and 6127.It can also
It is arranged in groove 6128 by modes such as nested or stickups.
Unlike embodiment above：In the present embodiment, thermal insulation barriers 64 are provided only on the handing-over of side wall 6126 and 6127
Place.Left upper in center 612 is set.
The setting of thermal insulation barriers 64 can be identical with previously described thermal insulation barriers 14, and details are not described herein.
Thermal insulation barriers 64 are arranged in the junction of side wall 6126 and 6127 in the present embodiment, can be reduced in the case where ensureing heat-insulated
The material of thermal insulation barriers, to achieve the purpose that reduce cost.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the claims of the application, every to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field includes similarly in the scope of patent protection of the application.
Claims (13)
1. the radiating subassembly of a kind of electronic equipment, which is characterized in that the radiating subassembly includes：
Camera；
Center, including main part and from the main part to the side wall extended perpendicular to the direction of the main part, it is described to take the photograph
As head is arranged in the first side of the main part；
Heat pipe, one end are connect with the camera heat conduction, the other end extend from the camera to the sidewall direction and along
The side wall extends to the direction far from camera, and the heat that the camera generates is directed to the side wall.
2. radiating subassembly according to claim 1, which is characterized in that
The main part is quadrilateral structure, and the side wall is four, from the four edges of the main part respectively to perpendicular to institute
The direction for stating main part extends, and four side wall head and the tail intersect；
The camera is arranged on the main part, and close at least one side wall；
The other end of the heat pipe extends from the camera to the direction of at least one side wall.
3. radiating subassembly according to claim 2, which is characterized in that the other end of the heat pipe is from the camera
At least one direction of the side wall close to the camera extends.
4. radiating subassembly according to claim 3, which is characterized in that set between the camera and the close side wall
Set first thermal insulation barriers.
5. radiating subassembly according to claim 4, which is characterized in that the close side wall of the camera is taken the photograph described in correspondence
As the first groove of position setting of head, first thermal insulation barriers are set to first groove.
6. radiating subassembly according to claim 5, which is characterized in that the length of first thermal insulation barriers and described first recessed
The equal length of slot, and be integrally formed with the side wall.
7. radiating subassembly according to claim 4 or 5, which is characterized in that first thermal insulation barriers further comprise at least
Two cross-talk thermal insulation barriers, the setting at at least two cross-talk thermal insulation barriers intervals is between the side wall and the camera.
8. radiating subassembly according to claim 4 or 5, which is characterized in that the side wall that the camera intersects close to two
Junction, first thermal insulation barriers are arranged in the junction.
9. radiating subassembly according to claim 1, which is characterized in that the heat pipe is embedded in the interior.
10. radiating subassembly according to claim 9, which is characterized in that the second groove, institute are arranged on the side wall of the center
It states heat pipe one end to be contacted with the camera to form heat conduction connection, the other end is set after from the camera to the side wall extending
It sets in second groove.
11. radiating subassembly according to claim 10, which is characterized in that side of the heat pipe far from the side wall into
The second thermal insulation barriers are arranged in one step.
12. radiating subassembly according to claim 1, which is characterized in that the main part it is opposite with the first side
Second side on radiating piece is set.
13. a kind of electronic equipment, which is characterized in that the electronic equipment includes claim 1-12 any one of them heat dissipation groups
Part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810596692.9A CN108761970B (en) | 2018-06-11 | 2018-06-11 | Electronic equipment and heat dissipation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810596692.9A CN108761970B (en) | 2018-06-11 | 2018-06-11 | Electronic equipment and heat dissipation assembly |
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| Publication Number | Publication Date |
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| CN108761970A true CN108761970A (en) | 2018-11-06 |
| CN108761970B CN108761970B (en) | 2021-07-27 |
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| CN201810596692.9A Active CN108761970B (en) | 2018-06-11 | 2018-06-11 | Electronic equipment and heat dissipation assembly |
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| CN103151318A (en) * | 2013-03-07 | 2013-06-12 | 北京中石伟业科技股份有限公司 | Heat dissipation managing system and method between heating chip and shell in electronic equipment |
| CN106304817A (en) * | 2015-06-04 | 2017-01-04 | 宏碁股份有限公司 | Electronic installation |
| CN105828572A (en) * | 2015-11-30 | 2016-08-03 | 维沃移动通信有限公司 | Heat radiation device and electronic apparatus |
| CN205623043U (en) * | 2016-03-31 | 2016-10-05 | 联想(北京)有限公司 | Electronic equipment |
| CN105792619A (en) * | 2016-04-29 | 2016-07-20 | 广东欧珀移动通信有限公司 | Heat radiation device and mobile terminal |
| CN206237466U (en) * | 2016-11-18 | 2017-06-09 | 郑州人造金刚石及制品工程技术研究中心有限公司 | A kind of novel mobile phone heat abstractor |
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