CN105792618B - A kind of hardware bracket and mobile terminal - Google Patents
A kind of hardware bracket and mobile terminal Download PDFInfo
- Publication number
- CN105792618B CN105792618B CN201610286923.7A CN201610286923A CN105792618B CN 105792618 B CN105792618 B CN 105792618B CN 201610286923 A CN201610286923 A CN 201610286923A CN 105792618 B CN105792618 B CN 105792618B
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- China
- Prior art keywords
- heat
- ontology
- mainboard
- accumulating
- conduction
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The embodiment of the invention discloses a kind of hardware bracket and mobile terminals, wherein, the hardware bracket includes ontology and heat conduction heat accumulation part, the heat conduction heat accumulation part is set on the ontology, the ontology is provided with mainboard on one side, another side is provided with display screen, and the ontology is for fixing the mainboard and the display screen；Wherein, the heat conduction heat accumulation part is made of the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, the mixing material includes heat absorption heat accumulating and heat conduction and heat radiation material, the heat conduction and heat radiation material is used to the heat that the mainboard generates and/or the heat that the display screen generates being conducted to the heat absorption heat accumulating, and the heat absorption heat accumulating is used to absorb and store the heat of the heat conduction and heat radiation material conduction and the heat that the mainboard generates and/or the heat that the display screen generates.Using the embodiment of the present invention, the display screen of mobile terminal and/or the temperature of mainboard can be effectively reduced, the heat dissipation performance of mobile terminal is promoted.
Description
Technical field
The present invention relates to electronic device field more particularly to a kind of hardware brackets and mobile terminal.
Background technology
With the continuous development of terminal technology, the function that can be realized on mobile terminal such as mobile phone is more and more, gives people
Bring great convenience.Meanwhile mobile phone configuration is also higher and higher, and central processing unit (Central Processing Unit, referred to as
" CPU ") dominant frequency is higher and higher, and this results in the power consumption of mobile phone increasing, and then cell-phone heating amount is caused also accordingly to increase.Such as
These heats of fruit cannot be controlled or be shifted, then the heating device in the condition of high temperature can cause mobile phone operation slack-off, even
There is interim card.
Invention content
A kind of hardware bracket of offer of the embodiment of the present invention and mobile terminal, can effectively reduce the display screen of mobile terminal
And/or the temperature of mainboard, promote the heat dissipation performance of mobile terminal.
An embodiment of the present invention provides a kind of hardware brackets, including ontology and heat conduction heat accumulation part, the heat conduction heat accumulation part to set
It is placed on the ontology, the ontology is provided with mainboard on one side, and another side is provided with display screen, and the ontology is for fixing institute
State mainboard and the display screen；
Wherein, the heat conduction heat accumulation part is made of the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function,
The mixing material includes heat absorption heat accumulating and heat conduction and heat radiation material, and the heat conduction and heat radiation material is for generating the mainboard
Heat and/or the heat that generates of the display screen be conducted to the heat absorption heat accumulating, the heat absorption heat accumulating is used to inhale
It receives and stores the heat of heat conduction and heat radiation material conduction and heat that the mainboard generates and/or the display screen generate
Heat.
Optionally, the first screw hole is offered on the ontology, the second screw hole is offered on the mainboard, and the mainboard passes through
Screw is fixedly connected with the cooperation of first screw hole, second screw hole with the ontology.
Optionally, the hardware bracket further includes fixed column, and one end of the fixed column is fixedly connected with the ontology, institute
The other end for stating fixed column offers the first screw hole, and the second screw hole is offered on the mainboard, and the mainboard passes through screw and institute
The cooperation for stating the first screw hole, second screw hole is fixedly connected with the ontology.
Optionally, the ratio of matching between the heat absorption heat accumulating and the heat conduction and heat radiation material is 1:1.
Optionally, the decalescence heat accumulating that the heat absorption heat accumulating is made of silica and polyethylene glycol,
And the ratio of matching between the silica and the polyethylene glycol is 1：1~1：Any one of 9；
The heat conduction and heat radiation material is graphite or metal.
Optionally, the heat absorption heat accumulating is by using silica as cyst wall, and using polyethylene glycol as micro- glue of capsule-core
What capsule was constituted.
Optionally, the heat conduction heat accumulation part further includes retarder thinner, bonds solution, protective film and glue-line；The mixing
Material is mixed to form coating material with the retarder thinner, the cohesive solution, and the coating material is coated on the protective film
Side, be coated with a side bonds of the coating material in the side of the glue-line and the protective film, the glue-line it is another
Side is Nian Jie with the ontology.
Optionally, the heat conduction heat accumulation part further includes retarder thinner and bonding solution；The mixing material and the dilution
Solvent, the cohesive solution are mixed to form coating material, and the coating material is coated in at least one side of the ontology.
Optionally, the heat conduction heat accumulation part further includes titanate coupling agent and glue-line；The mixing material and the metatitanic acid
Ester coupling agent is mixed and made into flaky material, and the side of the glue-line is Nian Jie with the flaky material, the other side of the glue-line with
The ontology bonding.
Optionally, the hardware bracket further includes protective film, and the protective film bonding is set on the heat conduction heat accumulation part,
And the protective film is set to the side far from the ontology.
Correspondingly, the embodiment of the present invention additionally provides a kind of mobile terminal, including display screen, mainboard and above-mentioned hardware
Holder, the hardware bracket are set between the display screen and the mainboard, for fixing the display screen and the mainboard.
The embodiment of the present invention by hardware bracket be arranged heat conduction heat accumulation part, and heat conduction heat accumulation part include with heat absorption,
The mixing material of the material properties of heat accumulation and heat sinking function, to such as mainboard of the heating device in hardware bracket and/or show
The heat that display screen generates is absorbed, and the heat to being absorbed carries out heat accumulation and heat dissipation, to realize the temperature for reducing heating device
Degree avoids the heat of heating device excessively high and causes operation slower, or even the problems such as interim card occurs, ensures that mobile terminal is normally transported
Row, and avoidable terminal enclosure temperature is excessively high, improves the heat dissipation performance of mobile terminal.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram for hardware bracket that one embodiment of the invention provides；
Fig. 2 is a kind of composition schematic diagram for heat conduction heat accumulation part that one embodiment of the invention provides；
Fig. 3 is a kind of structural schematic diagram for hardware bracket that another embodiment of the present invention provides；
Fig. 4 is a kind of composition schematic diagram for heat conduction heat accumulation part that another embodiment of the present invention provides；
Fig. 5 is a kind of structural schematic diagram for hardware bracket that further embodiment of this invention provides；
Fig. 6 is a kind of schematic diagram for mobile terminal that one embodiment of the invention provides.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
Containing at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
It should be understood that the involved mobile terminal of the embodiment of the present invention may include but be not limited to mobile phone (such as Android hands
Machine, iOS mobile phones etc.), it is tablet computer, mobile internet device (Mobile Internet Devices, referred to as " MID "), personal
Digital assistants (Personal Digital Assistant, referred to as " PDA "), wearable device etc..The mobile terminal may be used also
Referred to as user equipment (User Equipment, referred to as " UE "), terminal, wireless terminal or mobile station (Mobile Station,
Referred to as " MS ") etc., the embodiment of the present invention does not limit.
An embodiment of the present invention provides a kind of hardware bracket and mobile terminals, can effectively reduce the heater of mobile terminal
The heat of part such as display screen and/or mainboard, promotes the heat dissipation performance of mobile terminal.It is described in detail individually below.
Fig. 1 is referred to, Fig. 1 is a kind of structural schematic diagram for hardware bracket that one embodiment of the invention provides.Such as Fig. 1 institutes
Show, the hardware bracket 1 of the embodiment of the present invention includes ontology 10 and heat conduction heat accumulation part 20, and the heat conduction heat accumulation part 20 is set to
On the ontology 10.
It should be understood that in embodiments of the present invention, the ontology 10 is provided with mainboard on one side, and another side is provided with display
Screen, the ontology 10 is for fixing the mainboard and the display screen.That is, the hardware bracket 1 is set to the aobvious of terminal
Between display screen and mainboard, to fix the display screen and/or mainboard.Wherein, which is also known as " shell hardware bracket ", or
" inserts hardware bracket ".
Wherein, the heat conduction heat accumulation part 20 by the material properties with heat absorption, heat accumulation and heat sinking function mixing material group
At the mixing material includes heat absorption heat accumulating 21 and heat conduction and heat radiation material 22, and the heat conduction and heat radiation material 22 is used for institute
The heat of the heat and/or display screen generation of stating mainboard generation is conducted to the heat absorption heat accumulating 21, the heat absorption storage
Hot material 21 be used for absorb and store the heat conduction and heat radiation material 22 conduction heat and the mainboard generate heat and/or
The heat that the display screen generates.So as to be carried out by the heat accumulating 21 that absorbs heat included in the heat conduction heat accumulation part 20
Heat absorption and heat accumulation, are absorbed and are deposited to the heating device in terminal such as the heat on display screen and/or mainboard and/or ontology
Storage, to reduce the temperature of heating device, and can be right by heat conduction and heat radiation material 22 included in the heat conduction heat accumulation part 20
The heat absorbed radiates, and accelerates to radiate to the heat conduction heat accumulation part 20 to realize, further decreases the display
The temperature of screen and/or mainboard.Optionally, it is described heat absorption heat accumulating 21 and the heat conduction and heat radiation material 22 between can with ratio
Think 1:1, or can also be that other match ratio.
Optionally, the first screw hole can be offered on the ontology 10, and the second screw hole, the master can be offered on the mainboard
Plate is fixedly connected with the cooperation of first screw hole, second screw hole with the ontology 10 by screw.That is the hardware bracket 1
It can be connected by screw between mainboard.
Optionally, the hardware bracket 1 may also include fixed column, and one end of the fixed column is fixed with the ontology 10 to be connected
It connects, the other end of the fixed column offers the first screw hole, and the second screw hole is offered on the mainboard, and the mainboard passes through screw
It is fixedly connected with the ontology 10 with the cooperation of first screw hole, second screw hole.
It should be understood that the hardware bracket and mainboard and display screen can also in other way such as buckle, welding mode into
Row connection, the embodiment of the present invention do not limit.
In specific embodiment, heat absorption heat accumulating 21 can be a kind of phase-change material, can change with temperature change
Become physical property and absorb a large amount of heat, with the increase of the heat of absorption, heat absorption heat accumulating 21 gradually turns from a kind of phase
Another phase is turned to, and can stablize another phase of maintenance after absorbing sufficient heat and no longer absorb heat.As display screen and/or master
When plate and/or ontology 10 are generated without heat source or heat is relatively low, heat absorption heat accumulating 21 radiate and gradually with heat
Reduction mutually gradually revert to original phase by another.Wherein, heat absorption heat accumulating 21 can be as the variation of temperature be from admittedly
Opposite liquid phase either liquid phase change to solid phase or solid phase to gas phase either gas phase change to solid phase or liquid phase to gas phase or
Gas phase is to liquid phase.For example, the heat absorption heat accumulating 21 is by gradually absorbing heat, quality can from hard to soft, with
Realize heat accumulation function, i.e., the quality of heat conduction heat accumulation part 20 can according to absorb heat increase and from hard to soft.
Optionally, heat conduction heat accumulation part 20 may be disposed in any surface of ontology 10, or is respectively provided on the two sides of ontology 10.
When the heat on display screen and/or mainboard and/or ontology 10 reaches certain temperature, the heat absorption heat accumulating of heat conduction heat accumulation part 20
The heat on heat and/or ontology 10 that 21 heats that can be generated to display screen and/or mainboard generate carries out heat absorption and heat accumulation, and
It, can also be further by heat conduction and heat radiation material 22 by the conduct heat away to air of storage, to realize after temperature lowers
Cool down to display screen and/or mainboard and/or ontology 10, reliability is higher.
Phase transformation material further alternative, that the heat absorption heat accumulating 21 can be made of silica and polyethylene glycol
Material, and the ratio of matching between the silica and the polyethylene glycol can be 1：1~1：Any one of 9.Specifically, logical
It crosses a large amount of experiment to obtain, by silica and polyethylene glycol with mass ratio for 1：1~1：9 mixing can be obtained organic-multiple
Closing phase-change material has suitable phase transition temperature, can absorb the heat of display screen and/or mainboard in time.For example, the suction
The phase transition temperature that hot heat accumulating 21 is mixed to prepare can be 40 degree, i.e., the heat generated in the heat of display screen and/or mainboard
After reaching 40 degree, heat absorption heat accumulating 21 can carry out decalescence, be cooled down with the heat to display screen and/or mainboard.It answers
Understand, in other alternative-embodiments, heat absorption heat accumulating 21 can also be inorganic phase-changing material, or be composite phase-change material
Material etc..
Further alternative, the heat conduction and heat radiation material 22 can be graphite, metal or other heat sink materials.It is led with described
For hot heat sink material 22 is graphite, since the thermal conductivity of graphite is good, so graphite can conduct heat to faster it is described
It absorbs heat and carries out heat storage on heat accumulating 21, and the good heat dissipation effect of graphite in the x, y direction, so graphite can also be
While avoiding heat being directly emitted to the phone housing opposite with the ontology 10, effective heat radiation speed.
Further alternative, the heat absorption heat accumulating 21 can be by several using silica as cyst wall, and with poly- second
Glycol is that the microcapsules (micro-capsule) of capsule-core are constituted, to by the microcapsule structure, heat absorption heat accumulating 21 can preferably into
Row heat absorption and heat accumulation, to realize the cooling to terminal heating device.Specifically, when making the heat absorption heat accumulating 21, it can
Polyethylene glycol to be added in certain density Ludox, after all dissolving, CaCl2 accelerator solutions are added dropwise, in strength
Under stirring so that sol gel reaction occurs in Ludox for polyethylene glycol, and three-dimensional net structure gel is formed after standing；It will
Gel 24~48h of forced air drying in baking oven such as 80 DEG C of baking ovens of certain temperature, is cooled to room temperature, can finally access to have
A large amount of silica dioxide gels using after gel that machine silicon oxide compound generates under alkaline condition as cyst wall, with the poly- second after emulsification
Glycol is the micro-capsule of capsule-core.I.e. in each micro-capsule, silica wraps the polyethylene glycol as capsule-core as cyst wall so that
Polyethylene glycol will not leak during from solid-liquid.The heat absorption heat accumulating 21 of the formation microcapsule structure is being shown
Screen and/or the heat of mainboard and/or ontology 10 reach certain temperature such as after 40 degree, start absorption display screen and/or mainboard and/or
Heat on ontology 10, and capsule-core gradually increasing gradually from solid-liquid, to realize the suction to heat with heat itself
It receives and stores；After capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating 21 absorbs has been saturated, and stops absorbing heat
Amount, and after the temperature outside display screen and/or mainboard and/or ontology 10 is gradually decrease to preset temperature, capsule-core is by absorption
Heat comes out, and is transmitted in air, and capsule-core can gradually decreasing and be gradually converted to from liquid phase with its body heat
Solid phase, to radiate to the heat stored.It is converted by the cycle of above-mentioned solid phase to liquid phase, to realize to display screen
And/or mainboard cools down, and improves the heat dissipation performance and reliability of mobile terminal.It should be understood that in other embodiments, heat absorption
Heat accumulating 21 can also be other structures so that heat absorption heat accumulating 21 can by from be solid to gas phase cycle convert come
Cooling to the heating device of terminal.
Optionally, which can have different forms, according to the different shape of the heat conduction heat accumulation part 20,
Different setting methods can be then corresponded to, including is coated with setting, bonding setting on ontology 10 etc..Specifically, in this hair
In bright embodiment, the heat conduction heat accumulation part 20 may also include retarder thinner and bond solution；The mixing material and the dilution
Solvent, the cohesive solution are mixed to form coating material, and the coating material is coated in at least one side of the ontology 10.
It is the composition schematic diagram for the heat conduction heat accumulation part that one embodiment of the invention provides specifically, please also refer to Fig. 2.Such as
Shown in Fig. 2, the heat conduction heat accumulation part 20 by heat absorption heat accumulating 21, heat conduction and heat radiation material 22 and bonding solvent (retarder thinner and
Bond solution) it 23 is mixed to get.Wherein, heat absorption heat accumulating 21 and heat conduction and heat radiation material 22 can be powder, the heat absorption storage
Hot material 21, the heat conduction and heat radiation material 22 carry out being mixed to get mixing material, the mixing material and the bonding solvent 23
It is mixed to form the 20 corresponding coating material of heat conduction heat accumulation part so that the coating material directly has adhesive force, so as to
It is enough to be easily coated in any surface of the ontology 10 (or two sides is coated with), it is without still further increasing glue-line, i.e., described
Heat conduction heat accumulation part 20 refers to being coated on the ontology 10 to have the certain thickness coating material.Optionally, it is mixing
It is formed before the mixing material, the heat conduction and heat radiation material and the heat absorption heat accumulating can be smashed to pieces and carry out strength and stirred
Mix, to respectively obtain corresponding powder, i.e., mixed process refer to for powder the heat sink material and be powder the suction
The process that hot heat accumulating is mixed.Wherein, since the microcapsules in the heat absorption heat accumulating are much smaller than as powder
The size of the heat absorption heat accumulating of body, thus obtained after strong stirring be powder the heat absorption heat accumulating according to
Include so several complete microcapsules, the microcapsule structure in heat absorption heat accumulating can't be destroyed, is powder therefore
The heat absorption heat accumulating still has heat absorption, heat storage function, still has to be formed by the mixing material after mixing
Heat absorption, heat accumulation and heat sinking function.Wherein, which can be methanol dimethylbenzene, acrylic resin etc., present invention implementation
Example does not limit.
Further, it is passed when the coating material starts heating device such as display screen and/or mainboard in absorption terminal
When the heat passed, the polyethylene glycol in the coating material is gradually liquid by solid state change, and the coating material is gradually by hard
Soften, to realize the storage to heat；When the polyethylene glycol becomes liquid completely, the coating material stops absorbing heat
Amount, and after the temperature of the display screen and/or mainboard is gradually decrease to preset temperature, the polyethylene glycol is changed by liquid again
For solid-state, the heat of absorption is come out, the heat conduction and heat radiation material 22 in the coating material can accelerate to heat
Amount is distributed, and to come out the heat of absorption, the coating material gradually changes software strategy into software-hardware strategy at this time.
Optionally, the heat conduction heat accumulation part 20 may also include protective film；The protective film bonding is set to the coating material
On material, and the protective film is located remotely from the side of the ontology 10.That is, heat conduction heat accumulation part 20 (coating material) is applied
Be distributed in after the ontology 10, can also on the outside namely heat conduction heat accumulation part 20 far from ontology exposed part one side setting protection
Film, the heat conduction heat accumulation part 20 is protected with realization, is dust-proof etc..Further alternative, the protective film can be graphite etc.
Heat sink material, so as to further increase the radiating rate of the coating material.
Further, Fig. 3 is referred to, Fig. 3 is a kind of structural representation for hardware bracket that another embodiment of the present invention provides
Figure.As shown in figure 3, the hardware bracket 1 of the embodiment of the present invention includes ontology 10 and heat conduction heat accumulation part 30, the heat conduction heat accumulation
Part 30 is set on the ontology 10.The ontology 10 is set between mainboard and display screen, to fix the display screen and/or master
Plate.
Wherein, the heat conduction heat accumulation part 30 by the material properties with heat absorption, heat accumulation and heat sinking function mixing material group
At the mixing material includes heat absorption heat accumulating and heat conduction and heat radiation material, and the heat conduction and heat radiation material is used for the mainboard
The heat that the heat of generation and/or the display screen generate is conducted to the heat absorption heat accumulating, and the heat absorption heat accumulating is used
In the heat and/or the display screen production that absorb and store heat and mainboard generation that the heat conduction and heat radiation material is conducted
Raw heat.
Optionally, heat conduction heat accumulation part 30 may be disposed in any surface of ontology 10, or is respectively provided on the two sides of ontology 10.
When the heat on display screen and/or mainboard and/or ontology 10 reaches certain temperature, the heat absorption heat accumulating of heat conduction heat accumulation part 30
Can to display screen generate heat and/or mainboard generate heat and/or ontology 10 on heat carry out heat absorption and heat accumulation, and
After temperature lowers, further by the heat conduction and heat radiation material of heat conduction heat accumulation part 30 by the conduct heat away to air of storage,
Cooled down to display screen and/or mainboard and/or ontology 10 with further realizing.
Specifically, the proportioning of the heat absorption heat accumulating and the heat conduction and heat radiation material, the suction of the heat absorption heat accumulating
Hot cool principle, ingredient, manufacturing process, the ingredient and ontology 10 of the heat conduction and heat radiation material and display screen and/or mainboard
Connection structure may refer to the associated description in above-mentioned Fig. 1 corresponding embodiments, and details are not described herein again.
Further, in embodiments of the present invention, the heat conduction heat accumulation part 30 may include retarder thinner, bond solution, protect
Cuticula and glue-line；The mixing material is mixed to form coating material, the coating with the retarder thinner, the cohesive solution
Material is coated on the side of the protective film, and the one of the coating material is coated in the side of the glue-line and the protective film
Side bonds, the other side of the glue-line are Nian Jie with the ontology.That is, the embodiment of the present invention can will include heat absorption heat accumulation material
The mixing material of material and heat conduction and heat radiation material is coated on the protection after being mixed with bonding solvent (retarder thinner and bonding solution)
On film, the glue-line stacking is covered on the coating material, and the protective film for being coated with mixing material passes through the glue
Layer is adhered on the ontology, obtains the heat conduction heat accumulation part 30.
The embodiment of the present invention is molded by the way that directly the corresponding coating material of mixing material is coated on protective film, then at this
Glue-line is set in mixing material to be pasted on ontology 10, carries out tabletting without tablet press machine so that simplify manufacturing process.Specifically
, it is described when the coating material starts the heat that heating device such as display screen and/or mainboard in absorption terminal are transmitted
Polyethylene glycol in coating material is gradually liquid by solid state change, the coating material gradually from hard to soft, to realize pair
The storage of heat；When the polyethylene glycol becomes liquid completely, the coating material stops absorbing heat, and in the display
After the temperature of screen and/or mainboard is gradually decrease to preset temperature, the polyethylene glycol is again solid-state by liquid variation, will be absorbed
Heat come out, the heat conduction and heat radiation material in the coating material can accelerate to distribute heat, to will
The heat of absorption comes out, and the coating material gradually changes software strategy into software-hardware strategy at this time.Wherein, the protective film can be to the coating
Material is protected, is dust-proof etc., and the protective film can be the heat sink materials such as graphite, to further increase the coating material
Radiating rate；Alternatively, the protective film can be polyethylene terephthalate (PET).Further alternative, the bonding is molten
Liquid can be methanol dimethylbenzene, and acrylic resin etc., the embodiment of the present invention does not limit.
It is a kind of group for heat conduction heat accumulation part 30 that another embodiment of the present invention provides please also refer to Fig. 4, Fig. 4 in conjunction with Fig. 3
At schematic diagram.As shown in figure 4, the heat conduction heat accumulation part 30 includes：Protective film 31, coating material 32, glue-line 33.Wherein, described
Coating material 32 be for including heat absorption heat accumulating and the heat conduction heat accumulating mixing material and the retarder thinner,
What the cohesive solution was mixed to get.The coating material 32 can be coated on the side of the protective film 31, in addition, the coating
Material 32 also with a side bonds of glue-line 33, obtains heat conduction heat accumulation part 30, and the other side of glue-line 33 can be bonded in the ontology
On 10, to be arranged the heat conduction heat accumulation part 30 on the ontology 10 of hardware bracket.Optionally, it is being mixed to form the mixing material
Before material, the heat conduction and heat radiation material and the heat absorption heat accumulating can be smashed and carried out to pieces strong stirring, to respectively obtain pair
The powder answered, i.e. mixed process refer to for powder the heat sink material and be that the heat absorption heat accumulating of powder mixes
The process of conjunction.Wherein, since the microcapsules in the heat absorption heat accumulating are much smaller than the heat absorption heat accumulation for powder
The size of material, thus obtained after strong stirring be powder the heat absorption heat accumulating in include still several complete
The microcapsules can't destroy the microcapsule structure in heat absorption heat accumulating, be the heat absorption heat accumulating of powder therefore
Still there is heat absorption, heat storage function, still there is heat absorption, heat accumulation and heat dissipation to be formed by the mixing material after mixing
Function.
Optionally, the cohesive solution can be methanol dimethylbenzene, acrylic resin etc.；The glue-line 33 can be the back of the body
Glue, double faced adhesive tape or other, the embodiment of the present invention does not limit.
In embodiments of the present invention, by being coated with setting heat conduction heat accumulation part, and heat conduction heat accumulation on the ontology of hardware bracket
Part includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, to the heater in hardware bracket
The heat that part such as mainboard and/or display screen generate is absorbed, and the heat to being absorbed carries out heat accumulation and heat dissipation, to realize drop
The temperature of low heating device avoids the heat of heating device excessively high and causes operation slower, or even the problems such as interim card occurs, ensures
Mobile terminal normal operation, and avoidable terminal enclosure temperature is excessively high, improves the heat dissipation performance of mobile terminal.
Further, Fig. 5 is referred to, Fig. 5 is a kind of structural representation for hardware bracket that further embodiment of this invention provides
Figure.As shown in figure 5, the hardware bracket 1 of the embodiment of the present invention includes ontology 10 and heat conduction heat accumulation part 40, the heat conduction heat accumulation
Part 40 is set on the ontology 10.The ontology 10 is set between mainboard and display screen, to fix the display screen and/or master
Plate.
Wherein, the heat conduction heat accumulation part 40 by the material properties with heat absorption, heat accumulation and heat sinking function mixing material group
At the mixing material includes heat absorption heat accumulating and heat conduction and heat radiation material, and the heat conduction and heat radiation material is used for the mainboard
The heat that the heat of generation and/or the display screen generate is conducted to the heat absorption heat accumulating, and the heat absorption heat accumulating is used
In the heat and/or the display screen production that absorb and store heat and mainboard generation that the heat conduction and heat radiation material is conducted
Raw heat.
Optionally, heat conduction heat accumulation part 40 may be disposed in any surface of ontology 10, or is respectively provided on the two sides of ontology 10.
When the heat on display screen and/or mainboard and/or ontology 10 reaches certain temperature, the heat absorption heat accumulating of heat conduction heat accumulation part 40
Can to display screen generate heat and/or mainboard generate heat and/or ontology 10 on heat carry out heat absorption and heat accumulation, and
After temperature lowers, further by the heat conduction and heat radiation material of heat conduction heat accumulation part 30 by the conduct heat away to air of storage,
Cooled down to display screen and/or mainboard and/or ontology 10 with further realizing.
Specifically, the proportioning of the heat absorption heat accumulating and the heat conduction and heat radiation material, the suction of the heat absorption heat accumulating
Hot cool principle, ingredient, manufacturing process, the ingredient and ontology 10 of the heat conduction and heat radiation material and display screen and/or mainboard
Connection structure may refer to the associated description in above-mentioned Fig. 1 corresponding embodiments, and details are not described herein again.
Further, in embodiments of the present invention, the heat conduction heat accumulation part 40 may include titanate coupling agent, mixing material
And glue-line；The mixing material and the titanate coupling agent are mixed and made into flaky material, the side of the glue-line with described
Shape material is bonded, and the other side of the glue-line is Nian Jie with the ontology 10.
Specifically, when making the flaky material, the titanate esters can be added in the mixing material for powder
Coupling agent obtains organic composite shaping phase-change material, and thin slice is made in the organic composite shaping phase-change material through tabletting machine
Shape forms the flaky material of definite shape after cropped, and lamination adhesive glue-line forms heat conduction heat accumulation part 40 to flaky material again.
When the flaky material starts the heat that heating device such as display screen and/or mainboard in absorption terminal are transmitted, described
The polyethylene glycol in shape material is gradually liquid by solid state change, the flaky material gradually from hard to soft, to realize
Storage to heat；When the polyethylene glycol becomes liquid completely, the flaky material stops absorbing heat, and described aobvious
After display screen and/or the temperature of mainboard are gradually decrease to preset temperature, the polyethylene glycol is again solid-state by liquid variation, will be inhaled
The heat of receipts comes out, and the heat conduction and heat radiation material 22 in the coating material can accelerate to distribute heat, from
And come out the heat of absorption, the flaky material gradually changes software strategy into software-hardware strategy at this time.Wherein, which can be by that will inhale
Hot heat accumulating is smashed to pieces and strong stirring obtains, since the diameter of powder is far longer than the diameter of each micro-capsule, will not
The microcapsule structure in heat absorption heat accumulating is destroyed, that is, does not interfere with the heat absorption heat storage function of heat absorption heat accumulating.
Optionally, which can be cut into according to the shape of the ontology 10 of hardware bracket 1, obtain heat conduction storage
Warmware 40, and the heat conduction heat accumulation part 40 is fitted on ontology 10, i.e., the shape of the heat conduction heat accumulation part 40 can be with ontology 10
Shape matches, to realize heat absorption, heat accumulation and the function of heat dissipation.To by the way that mixing material is mixed with titanate coupling agent
Flaky material is made, then is connected on flaky material by glue-line stacking and forms heat conduction heat accumulation part 40, not only so that heat conduction heat accumulation
Part 40 can go to be cut according to the shape of ontology 10, and then can have preferably cooperation with the ontology 10 of hardware bracket 1,
It can be to preferably carrying out heat absorption heat accumulation, realization cools down to display screen and/or mainboard, promotes the heat dissipation performance of mobile terminal
And reliability, and the heat conduction heat accumulation part 40 of sheet is directly stained with, and coating is cooled into without waiting for it, and it is easy to use.
Further alternative, the glue-line can be gum, double faced adhesive tape or release film etc..
Further alternative, the heat conduction heat accumulation part 40 may also include protective film；The protective film bonding is set to described
On flaky material, and the protective film is located remotely from the side of the ontology 10.That is, heat conduction heat accumulation part 40 is corresponding
Flaky material is adhered on one side after the ontology 10, can also the flaky material another side namely heat conduction heat accumulation part 40 it is remote
Protective film is arranged in one side from ontology exposed part, is protected to the flaky material with realization, is dust-proof.It is further alternative,
The protective film can be the heat sink materials such as graphite, so as to further increase the radiating rate of the flaky material.
In other alternative-embodiments, the heat conduction heat accumulation part 40 may include titanate coupling agent, heat absorption heat accumulating,
Heat conduction and heat radiation material and glue-line；The heat absorption heat accumulating is mixed and made into flaky material, the glue with the titanate coupling agent
The heat conduction and heat radiation material, the glue is arranged in the side of the side of layer and one side bonds of the flaky material, the flaky material
The other side of layer is Nian Jie with the ontology 10.It, can be specifically, when making the corresponding flaky material of the heat absorption heat accumulating
To add the titanate coupling agent in the heat absorption heat accumulating of powder, organic composite shaping phase-change material is obtained, through pressure
Flake is made in the organic composite shaping phase-change material by the tabletting of piece machine, forms the sheet material of definite shape after cropped
Material, and it (is such as coated with or passes through glue-line and be bonded) the heat conduction heat accumulating in the setting of the side of the flaky material, flaky material is another
Lamination adhesive glue-line forms heat conduction heat accumulation part 40 again for side.To realize the heat absorption, heat accumulation and heat sinking function, to promote movement
The heat dissipation performance of terminal.
In embodiments of the present invention, it is stored up by being bonded the corresponding heat conduction of setting flaky material on the ontology 10 of hardware bracket
Warmware 40, and heat conduction heat accumulation part 40 includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, to right
The heat that heating device such as mainboard and/or display screen in hardware bracket generate is absorbed, and the heat to being absorbed carries out
Heat accumulation and heat dissipation avoid the heat of heating device excessively high and cause operation slower, even to realize the temperature for reducing heating device
There is the problems such as interim card, ensures mobile terminal normal operation, and avoidable terminal enclosure temperature is excessively high, improves mobile terminal
Heat dissipation performance.
Fig. 6 is referred to, Fig. 6 is a kind of structural schematic diagram for mobile terminal that one embodiment of the invention provides.Such as Fig. 6 institutes
Show, the mobile terminal 100 includes shell, display screen, mainboard and hardware bracket, and the hardware bracket is set to the display
Between screen and the mainboard, for fixing the display screen and the mainboard.Wherein, the hardware bracket includes ontology and heat conduction
Heat accumulation part, the heat conduction heat accumulation part are set on the ontology；The ontology is provided with mainboard on one side, and another side is provided with aobvious
Display screen.
Wherein, the heat conduction heat accumulation part is made of the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function,
The mixing material includes heat absorption heat accumulating and heat conduction and heat radiation material, and the heat conduction and heat radiation material is for generating the mainboard
Heat and/or the heat that generates of the display screen be conducted to the heat absorption heat accumulating, the heat absorption heat accumulating is used to inhale
It receives and stores the heat of heat conduction and heat radiation material conduction and heat that the mainboard generates and/or the display screen generate
Heat.
When mobile terminal 100 during fabrication, heat conduction heat accumulation part is arranged by the ontology in hardware bracket, and by hardware bracket
It is set to after being fixed between display screen and mainboard and is assemblied in mobile terminal.Wherein, the heat absorption heat accumulation of microcapsule structure is formed
Material can start to absorb the heat on display screen and/or mainboard and/or ontology after the heat of ontology reaches such as 40 degree of certain temperature
Amount, and capsule-core itself, gradually from solid phase to liquid phase, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating absorbs is
Through saturation, stop absorbing heat, and after the temperature of display screen and/or mainboard and/or ontology is gradually decrease to preset temperature,
The heat conduction and heat radiation material of microcapsule structure can come out the heat of absorption, be transmitted in air, and capsule-core can be with its body
Gradually decreasing for heat and gradually from liquid phase to solid phase, by the circulating phase-change for the heat accumulating that absorbs heat, to display screen and/or
Mainboard and/or ontology cool down, and thus improve the heat dissipation performance and reliability of mobile terminal.
Optionally, the first screw hole is offered on the ontology, the second screw hole is offered on the mainboard, and the mainboard passes through
Screw is fixedly connected with the cooperation of first screw hole, second screw hole with the ontology.
Optionally, the hardware bracket further includes fixed column, and one end of the fixed column is fixedly connected with the ontology, institute
The other end for stating fixed column offers the first screw hole, and the second screw hole is offered on the mainboard, and the mainboard passes through screw and institute
The cooperation for stating the first screw hole, second screw hole is fixedly connected with the ontology.
Optionally, the ratio of matching between the heat absorption heat accumulating and the heat conduction and heat radiation material is 1:1.
Optionally, the decalescence heat accumulating that the heat absorption heat accumulating is made of silica and polyethylene glycol,
And the ratio of matching between the silica and the polyethylene glycol is 1：1~1：Any one of 9；
The heat conduction and heat radiation material is graphite or metal.
Optionally, the heat absorption heat accumulating is by using silica as cyst wall, and using polyethylene glycol as micro- glue of capsule-core
What capsule was constituted.
Optionally, the heat conduction heat accumulation part further includes retarder thinner, bonds solution, protective film and glue-line；The mixing
Material is mixed to form coating material with the retarder thinner, the cohesive solution, and the coating material is coated on the protective film
Side, be coated with a side bonds of the coating material in the side of the glue-line and the protective film, the glue-line it is another
Side is Nian Jie with the ontology.
Optionally, the heat conduction heat accumulation part further includes retarder thinner and bonding solution；The mixing material and the dilution
Solvent, the cohesive solution are mixed to form coating material, and the coating material is coated in at least one side of the ontology.
Optionally, the heat conduction heat accumulation part further includes titanate coupling agent and glue-line；The mixing material and the metatitanic acid
Ester coupling agent is mixed and made into flaky material, and the side of the glue-line is Nian Jie with the flaky material, the other side of the glue-line with
The ontology bonding.
Optionally, the hardware bracket further includes protective film, and the protective film bonding is set on the heat conduction heat accumulation part,
And the protective film is set to the side far from the ontology.
It is further alternative, thermal hole can be also opened up on the ontology of the hardware bracket, and/or in the outer of the mobile terminal
Shell edge opens up thermal hole so that and the heat conduction heat accumulation part can faster radiate to the heat stored, to
Promote the heat dissipation performance of mobile terminal.
Implement specifically, the concrete structure of the hardware bracket and the heat conduction heat accumulation part can refer to Fig. 1 to Fig. 5 and correspond to
The associated description of example, details are not described herein again.
In embodiments of the present invention, can include with heat absorption, heat accumulation and heat sinking function by being arranged on hardware bracket
The heat conduction heat accumulation part of the mixing material of material properties, enabling by the heat absorption heat accumulating to the fever in hardware bracket
The heat that device such as mainboard and/or display screen generate is absorbed and is stored, and to realize the temperature for reducing heating device, passes through institute
It states heat conduction and heat radiation material to radiate, then further enhances the cooling-down effect to heating device, avoid the heat of heating device
It is excessively high and cause operation slower, or even there is the problems such as interim card, ensure that the normal operation of mobile terminal, and can avoid outside terminal
Shell temperature is excessively high, improves the heat dissipation performance of mobile terminal.
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, therefore equivalent changes made in accordance with the claims of the present invention, is still within the scope of the present invention.
Claims (10)
1. a kind of hardware bracket, which is characterized in that including ontology and heat conduction heat accumulation part, the heat conduction heat accumulation part is set to described
On body, the ontology is provided with mainboard on one side, and another side is provided with display screen, and the ontology is for fixing the mainboard and institute
State display screen；
Wherein, the heat conduction heat accumulation part is made of the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, described
Mixing material is mixed to get by heat absorption heat accumulating and heat conduction and heat radiation material and bonding solvent, and the bonding solvent includes dilution
Solvent and bonding solution, what the heat and/or the display screen that the heat conduction and heat radiation material is used to generate the mainboard generated
Heat is conducted to the heat absorption heat accumulating, the heat absorption heat accumulating by it is several using silica as cyst wall and with poly- second two
Alcohol is that the microcapsules of capsule-core are constituted, and the heat absorption heat accumulating is used to absorb and store the heat of the heat conduction and heat radiation material conduction
And the heat that the heat that generates of the mainboard and/or the display screen generate, wherein the heat absorption heat accumulating and described lead
Hot heat sink material is that powder carries out being mixed to get mixing material, also, before being mixed to form the mixing material, is led described
Strong stirring is smashed and carried out to hot heat sink material and the heat absorption heat accumulating to pieces, to respectively obtain corresponding powder, the mixing
Be to for powder the heat sink material and be that the heat absorption heat accumulating of powder mixes, in the heat absorption heat accumulating
The microcapsules be much smaller than for powder the heat absorption heat accumulating size, obtain being powder after strong stirring
Include still the complete microcapsules in the heat absorption heat accumulating.
2. hardware bracket according to claim 1, which is characterized in that offer the first screw hole, the master on the ontology
The second screw hole is offered on plate, the mainboard passes through screw and first screw hole, the cooperation of second screw hole and described
Body is fixedly connected.
3. hardware bracket according to claim 1, which is characterized in that the hardware bracket further includes fixed column, described solid
One end of fixed column is fixedly connected with the ontology, and the other end of the fixed column offers the first screw hole, is opened up on the mainboard
There is the second screw hole, the mainboard, which is fixed by the cooperation of screw and first screw hole, second screw hole with the ontology, to be connected
It connects.
4. according to claim 1-3 any one of them hardware brackets, which is characterized in that the heat absorption heat accumulating is led with described
Quality proportioning value between hot heat sink material is 1:1.
5. according to claim 1-3 any one of them hardware brackets, which is characterized in that
The decalescence heat accumulating that the heat absorption heat accumulating is made of silica and polyethylene glycol, and the titanium dioxide
Quality proportioning value between silicon and the polyethylene glycol is 1：1~1：Any one of 9；
The heat conduction and heat radiation material is graphite or metal.
6. hardware bracket according to claim 1, which is characterized in that the heat conduction heat accumulation part further includes protective film and glue
Layer；The heat absorption heat accumulating and the heat conduction and heat radiation material in the mixing material and the retarder thinner, the bonding
Solution is mixed to form coating material, and the coating material is coated on the side of the protective film, the side of the glue-line with it is described
A side bonds of the coating material are coated in protective film, the other side of the glue-line is Nian Jie with the ontology.
7. hardware bracket according to claim 1, which is characterized in that the heat absorption heat accumulating in the mixing material
It is mixed to form coating material with the heat conduction and heat radiation material and the retarder thinner, the cohesive solution, the coating material applies
It is distributed in at least one side of the ontology.
8. hardware bracket according to claim 1, which is characterized in that the heat conduction heat accumulation part further includes titanate coupling agent
And glue-line；The mixing material and the titanate coupling agent are mixed and made into flaky material, the side of the glue-line with described
Shape material is bonded, and the other side of the glue-line is Nian Jie with the ontology.
9. hardware bracket according to claim 7 or 8, which is characterized in that the hardware bracket further includes protective film, described
Protective film bonding is set on the heat conduction heat accumulation part, and the protective film is set to the side far from the ontology.
10. a kind of mobile terminal, which is characterized in that including display screen, mainboard and as described in any one of claim 1 to 9
Hardware bracket, the hardware bracket are set between the display screen and the mainboard, for fix the display screen with it is described
Mainboard.
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| CN201610286923.7A CN105792618B (en) | 2016-04-29 | 2016-04-29 | A kind of hardware bracket and mobile terminal |
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| CN201610286923.7A CN105792618B (en) | 2016-04-29 | 2016-04-29 | A kind of hardware bracket and mobile terminal |
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| CN109413932A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof |
| CN111836505A (en) * | 2019-04-15 | 2020-10-27 | 辰展股份有限公司 | Thermal phase change heat storage module |
| CN110505797A (en) * | 2019-09-19 | 2019-11-26 | Oppo广东移动通信有限公司 | Heat-radiating substrate, the manufacturing method of heat-radiating substrate and electronic equipment |
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| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN101942290A (en) * | 2010-08-09 | 2011-01-12 | 西南交通大学 | Method for preparing polyethylene glycol/silicon dioxide composite shape-stabilized phase change energy storage material and product thereof |
| CN202019374U (en) * | 2010-10-13 | 2011-10-26 | 中兴通讯股份有限公司 | Supporting plate for main board with broken board structure in mobile phone |
| CN103374333B (en) * | 2012-04-13 | 2016-04-27 | 南京德朔实业有限公司 | Composite phase change material |
| CN202871774U (en) * | 2012-11-13 | 2013-04-10 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Storage, conduction and dissipation integrated high-power electronic device |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. |
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