CN105792618A - Metal support and mobile terminal - Google Patents
Metal support and mobile terminal Download PDFInfo
- Publication number
- CN105792618A CN105792618A CN201610286923.7A CN201610286923A CN105792618A CN 105792618 A CN105792618 A CN 105792618A CN 201610286923 A CN201610286923 A CN 201610286923A CN 105792618 A CN105792618 A CN 105792618A
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- CN
- China
- Prior art keywords
- heat
- mainboard
- display screen
- heat conduction
- accumulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The embodiment of the invention discloses a metal support and a mobile terminal. The metal support comprises a body and a heat conducting and heat storing member. The heat conducting and heat storing member is arranged on the body. One surface of the body is provided with a mainboard, and the other surface is provided with a display screen. The body is used for fixing the mainboard and the display screen. The heat conducting and heat storing member is composed of hybrid material having the material properties of heat absorbing, heat storing and heat radiating functions. The hybrid material includes heat absorbing and heat storing material and heat conducting and heat radiating material. The heat conducting and heat radiating material is used for conducting heat generated by the mainboard and/or heat generated by the display screen to the heat absorbing and heat storing material. The heat absorbing and heat storing material is used for absorbing and storing heat conducted by the heat conducting and heat radiating material and heat generated by the mainboard and/or heat generated by the display screen. With application of the metal support and the mobile terminal, temperature of the display screen and/or the mainboard of the mobile terminal can be effectively reduced, and heat radiation performance of the mobile terminal can be enhanced.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of hardware bracket and mobile terminal.
Background technology
Along with the development of terminal technology, the function that mobile terminal such as mobile phone is capable of gets more and more, and brings great convenience.Meanwhile, mobile phone configuration is also more and more higher, and central processing unit (CentralProcessingUnit is called for short " CPU ") dominant frequency is more and more higher, and this power consumption resulting in mobile phone is increasing, and then causes that cell-phone heating amount also increases accordingly.If these heats can not get controlling or transfer, then the heater members being in the condition of high temperature can cause that mobile phone computing is slack-off, card even occurs.
Summary of the invention
The embodiment of the present invention provides a kind of hardware bracket and mobile terminal, it is possible to effectively reduces the display screen of mobile terminal and/or the temperature of mainboard, promotes the heat dispersion of mobile terminal.
Embodiments provide a kind of hardware bracket, including body and heat conduction heat accumulation part, described heat conduction heat accumulation part is arranged on described body, and the one side of described body is provided with mainboard, another side is provided with display screen, and described body is used for fixing described mainboard and described display screen；
Wherein, described heat conduction heat accumulation part is made up of the composite material of the material properties with heat absorption, heat accumulation and heat sinking function, described composite material includes heat absorption heat accumulating and heat conduction and heat radiation material, the heat that described heat conduction and heat radiation material produces for the heat produced by described mainboard and/or described display screen is conducted to described heat absorption heat accumulating, and described heat absorption heat accumulating is for absorbing and store the heat of described heat conduction and heat radiation conduct and the heat of the heat of described mainboard generation and/or the generation of described display screen.
Optionally, described body offering the first screw, described mainboard offers the second screw, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Optionally, described hardware bracket also includes fixing post, one end of described fixing post is fixing with described body to be connected, the other end of described fixing post offers the first screw, offering the second screw on described mainboard, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Optionally, the proportioning value between described heat absorption heat accumulating and described heat conduction and heat radiation material is 1:1.
Optionally, the decalescence heat accumulating that described heat absorption heat accumulating is made up of silicon dioxide and Polyethylene Glycol, and the proportioning value between described silicon dioxide and described Polyethylene Glycol is any one in 1:1～1:9；
Described heat conduction and heat radiation material is graphite or metal.
Optionally, described heat absorption heat accumulating is by with silicon dioxide for cyst wall, and what the microcapsule being capsule-core with Polyethylene Glycol was constituted.
Optionally, described heat conduction heat accumulation part also includes retarder thinner, bonding solution, protecting film and glue-line；Described composite material and described retarder thinner, described bonding solution are mixed to form painting cloth material; described painting cloth material coats the side of described protecting film; being coated with a side bonds of described painting cloth material in the side of described glue-line and described protecting film, the opposite side of described glue-line is bonding with described body.
Optionally, described heat conduction heat accumulation part also includes retarder thinner and bonding solution；Described composite material and described retarder thinner, described bonding solution are mixed to form painting cloth material, and described painting cloth material is coated at least one side of described body.
Optionally, described heat conduction heat accumulation part also includes titanate coupling agent and glue-line；Described composite material and described titanate coupling agent are mixed and made into flaky material, and the side of described glue-line is bonding with described flaky material, and the opposite side of described glue-line is bonding with described body.
Optionally, described hardware bracket also includes protecting film, and described protecting film is bonding to be arranged on described heat conduction heat accumulation part, and described protecting film is arranged at the side away from described body.
Correspondingly, the embodiment of the present invention additionally provides a kind of mobile terminal, and including display screen, mainboard and above-mentioned hardware bracket, described hardware bracket is arranged between described display screen and described mainboard, is used for fixing described display screen and described mainboard.
The embodiment of the present invention by arranging heat conduction heat accumulation part on hardware bracket, and heat conduction heat accumulation part includes having heat absorption, the composite material of the material properties of heat accumulation and heat sinking function, thus the heat that the heater members in hardware bracket such as mainboard and/or display screen are produced absorbs, and the heat absorbed is carried out heat accumulation and heat radiation, to realize reducing the temperature of heater members, the heat avoiding heater members is too high and causes running slower, the problems such as card even occur, ensure that mobile terminal is properly functioning, and terminal enclosure temperature can be avoided too high, improve the heat dispersion of mobile terminal.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of hardware bracket that one embodiment of the invention provides；
Fig. 2 is the composition schematic diagram of a kind of heat conduction heat accumulation part that one embodiment of the invention provides；
Fig. 3 is the structural representation of a kind of hardware bracket that another embodiment of the present invention provides；
Fig. 4 is the composition schematic diagram of a kind of heat conduction heat accumulation part that another embodiment of the present invention provides；
Fig. 5 is the structural representation of a kind of hardware bracket that further embodiment of this invention provides；
Fig. 6 is the schematic diagram of a kind of mobile terminal that one embodiment of the invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe may be embodied at least one embodiment of the present invention in conjunction with the embodiments.Each position in the description occurs that this phrase might not each mean identical embodiment, neither with the independent of other embodiments mutual exclusion or alternative embodiment.Those skilled in the art explicitly and are implicitly understood by, and embodiment described herein can combine with other embodiments.
It should be understood that, the involved mobile terminal of the embodiment of the present invention may include but be not limited to mobile phone (such as Android phone, iOS mobile phone etc.), panel computer, mobile internet device (MobileInternetDevices, be called for short " MID "), personal digital assistant (PersonalDigitalAssistant, be called for short " PDA "), wearable device etc..This mobile terminal is also referred to as subscriber equipment (UserEquipment, referred to as " UE "), terminal, wireless terminal or mobile platform (MobileStation, referred to as " MS ") etc., and the embodiment of the present invention does not limit.
Embodiments provide a kind of hardware bracket and mobile terminal, it is possible to effectively reduce the heat of the heater members such as display screen and/or mainboard of mobile terminal, promote the heat dispersion of mobile terminal.Describe in detail individually below.
Refer to the structural representation that Fig. 1, Fig. 1 are a kind of hardware brackets that one embodiment of the invention provides.As it is shown in figure 1, the described hardware bracket 1 of the embodiment of the present invention includes body 10 and heat conduction heat accumulation part 20, described heat conduction heat accumulation part 20 is arranged on described body 10.
Should be understood that in embodiments of the present invention, the one side of described body 10 is provided with mainboard, and another side is provided with display screen, and described body 10 is used for fixing described mainboard and described display screen.It is to say, this hardware bracket 1 is arranged between the display screen of terminal and mainboard, to fix this display screen and/or mainboard.Wherein, this hardware bracket is also called " housing hardware bracket ", or " inserts hardware bracket ".
Wherein, described heat conduction heat accumulation part 20 is made up of the composite material of the material properties with heat absorption, heat accumulation and heat sinking function, described composite material includes heat absorption heat accumulating 21 and heat conduction and heat radiation material 22, described heat conduction and heat radiation material 22 is used for the heat of heat and/or the described display screen generation produced by described mainboard and is conducted to described heat absorption heat accumulating 21, and described heat absorption heat accumulating 21 is for absorbing and store the heat of described heat conduction and heat radiation material 22 conduction and the heat of the heat of described mainboard generation and/or the generation of described display screen.It is thus possible to undertaken absorbing heat and heat accumulation by the heat absorption heat accumulating 21 comprised in described heat conduction heat accumulation part 20, heat on heater members in terminal such as display screen and/or mainboard and/or body is absorbed and stores, to reduce the temperature of heater members, and by the heat conduction and heat radiation material 22 comprised in described heat conduction heat accumulation part 20, the heat absorbed can be dispelled the heat, thus realizing accelerating described heat conduction heat accumulation part 20 is dispelled the heat, reduce the temperature of this display screen and/or mainboard further.Optionally, the proportioning value between described heat absorption heat accumulating 21 and described heat conduction and heat radiation material 22 can be 1:1, or can also be other proportioning values.
Optionally, described body 10 can offering the first screw, described mainboard can offer the second screw, described mainboard is connected by screw is fixing with described body 10 with the cooperation of described first screw, described second screw.Namely can be connected by screw between this hardware bracket 1 and mainboard.
Optionally, described hardware bracket 1 may also include fixing post, one end of described fixing post is fixing with described body 10 to be connected, the other end of described fixing post offers the first screw, offering the second screw on described mainboard, described mainboard is connected by screw is fixing with described body 10 with the cooperation of described first screw, described second screw.
Should be understood that this hardware bracket and mainboard and display screen are attached also by other mode such as buckle, the mode such as weld, the embodiment of the present invention does not limit.
In specific embodiment, heat absorption heat accumulating 21 can be a kind of phase-change material, it can change physical property and absorb substantial amounts of heat along with variations in temperature, increase along with the heat absorbed, heat absorption heat accumulating 21 gradates as another kind of phase mutually from one, and can stably maintain after absorbing sufficient heat another kind of mutually and no longer absorb heat.When display screen and/or mainboard and/or body 10 do not have thermal source to produce or heat is relatively low, heat absorption heat accumulating 21 carries out dispelling the heat and gradually along with reducing of heat is reverted to original phase mutually gradually by another kind.Wherein, heat absorption heat accumulating 21 can along with the change of temperature from solid phase to liquid phase or liquid phase to solid transformation, or solid phase is to gas phase or gas phase to solid transformation, or liquid phase is to gas phase or gas phase to liquid phase.Such as, described heat absorption heat accumulating 21 is by absorbing heat gradually, and its quality can from hard to soft, and to realize the function of heat accumulation, namely the quality of heat conduction heat accumulation part 20 can according to the increase of absorption heat from hard to soft.
Optionally, heat conduction heat accumulation part 20 may be disposed in any surface of body 10, or is respectively provided with on the two sides of body 10.When the heat on display screen and/or mainboard and/or body 10 reaches uniform temperature, heat on the heat that the heat that display screen produces and/or mainboard produce and/or body 10 can be absorbed heat and heat accumulation by the heat absorption heat accumulating 21 of heat conduction heat accumulation part 20, and after temperature lowers, also can pass through heat conduction and heat radiation material 22 further by the conduct heat away of storage to air, to realize display screen and/or mainboard and/or body 10 are lowered the temperature, reliability is higher.
Further alternative, that described heat absorption heat accumulating 21 can be made up of silicon dioxide and Polyethylene Glycol phase-change material, and the proportioning value between described silicon dioxide and described Polyethylene Glycol can be any one in 1:1～1:9.Concrete, drawn by substantial amounts of experiment, by silicon dioxide and Polyethylene Glycol with mass ratio for 1:1～1:9 mixing can prepare organic-composite phase-change material has suitable phase transition temperature, it is possible to absorb the heat of display screen and/or mainboard in time.For example, the phase transition temperature that the mixing of this heat absorption heat accumulating 21 prepares can be 40 degree, namely, after the heat produced at the heat of display screen and/or mainboard reaches 40 degree, heat absorption heat accumulating 21 can carry out decalescence, lowers the temperature with the heat to display screen and/or mainboard.Should be understood that in other alternative-embodiments, heat absorption heat accumulating 21 can also be inorganic phase-changing material, or is composite phase-change material etc..
Further alternative, described heat conduction and heat radiation material 22 can be graphite, metal or other heat sink materials.For described heat conduction and heat radiation material 22 for graphite, owing to the heat conductivity of graphite is good, so graphite can conduct heat to carry out heat storage on described heat absorption heat accumulating 21 faster, and the good heat dissipation effect that graphite is in the x, y direction, so graphite can also while avoiding heat is directly emitted to the phone housing relative with described body 10, effective heat radiation speed.
Further alternative, described heat absorption heat accumulating 21 can be with silicon dioxide for cyst wall by some, and what the microcapsule (microcapsule) being capsule-core with Polyethylene Glycol was constituted, thereby through this microcapsule structure, heat absorption heat accumulating 21 can better carry out absorbing heat and heat accumulation, to realize the cooling to terminal heater members.Concrete, when making described heat absorption heat accumulating 21, Polyethylene Glycol can be joined in certain density Ludox, after all dissolving, dropping CaCl2 accelerator solution, under strong stirring so that sol gel reaction occurs Polyethylene Glycol in Ludox, after standing, form three-dimensional net structure gel；By gel forced air drying 24～48h in baking oven such as 80 DEG C of baking ovens of uniform temperature, be cooled to room temperature, can access a large amount of silica dioxide gels after gel produced in the basic conditions with organo-siloxane compound be cyst wall, the microcapsule that is capsule-core with the Polyethylene Glycol after emulsifying.Namely in each microcapsule, silicon dioxide wraps the Polyethylene Glycol as capsule-core as cyst wall so that Polyethylene Glycol will not leak from the process of solid-liquid.The heat absorption heat accumulating 21 of this formation microcapsule structure is after the heat of display screen and/or mainboard and/or body 10 reaches uniform temperature such as 40 degree, start to absorb the heat on display screen and/or mainboard and/or body 10, and capsule-core itself is gradually increased gradually from solid-liquid along with heat, to realize the absorption to heat and storage；After capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating 21 absorbs is saturated, it stops absorbing heat, and after the temperature outside display screen and/or mainboard and/or body 10 is gradually decrease to preset temperature, the heat of absorption is come out by capsule-core, it is delivered in air, and capsule-core can be converted to solid phase from liquid phase gradually along with gradually decreasing of its fever of the body amount, so that stored heat is dispelled the heat.Changed by the circulation of above-mentioned solid phase to liquid phase, it is achieved thereby that display screen and/or mainboard are lowered the temperature, improve heat dispersion and the reliability of mobile terminal.Should be understood that in other embodiments, heat absorption heat accumulating 21 can also be other structures so that heat absorption heat accumulating 21 can by carrying out the cooling of the heater members to terminal from the circulation conversion being solid to gas phase.
Optionally, this heat conduction heat accumulation part 20 can have different forms, the different shape according to described heat conduction heat accumulation part 20, then can corresponding different method to set up, including being coated with setting, bonding being arranged on body 10 etc..Concrete, in embodiments of the present invention, described heat conduction heat accumulation part 20 may also include retarder thinner and bonding solution；Described composite material and described retarder thinner, described bonding solution are mixed to form painting cloth material, and described painting cloth material is coated at least one side of described body 10.
Concrete, please also refer to Fig. 2, it is the composition schematic diagram of the heat conduction heat accumulation part that one embodiment of the invention provides.As in figure 2 it is shown, this heat conduction heat accumulation part 20 is mixed to get by heat absorption heat accumulating 21, heat conduction and heat radiation material 22 and bonding solvent (retarder thinner and bonding solution) 23.Wherein, heat absorption heat accumulating 21 and heat conduction and heat radiation material 22 can be powder body, described heat absorption heat accumulating 21, described heat conduction and heat radiation material 22 carries out being mixed to get composite material, described composite material is mixed to form the painting cloth material that described heat conduction heat accumulation part 20 is corresponding with described bonding solvent 23, described painting cloth material is made directly to have adhesive force, it is thus possible to coat (or two sides is coated with) in any surface of described body 10 easily, without still further increasing glue-line, namely described heat conduction heat accumulation part 20 refers to coat have certain thickness described painting cloth material on described body 10.Optionally, before being mixed to form described composite material, described heat conduction and heat radiation material and described heat absorption heat accumulating can be smashed to pieces and carried out strong stirring, to respectively obtain the powder body of correspondence, namely mixed process refers to the process that the described heat sink material for powder body and the described heat absorption heat accumulating for powder body are mixed.Wherein, owing to the described microcapsule in described heat absorption heat accumulating is the size much smaller than the described heat absorption heat accumulating for powder body, so the described heat absorption heat accumulating for powder body obtained after strong stirring still comprises some complete described microcapsules, it can't destroy the microcapsule structure in heat absorption heat accumulating, therefore, described heat absorption heat accumulating for powder body still has heat absorption, heat storage function, thus the described composite material formed after mixing still has heat absorption, heat accumulation and heat sinking function.Wherein, this bonding solution can be methanol dimethylbenzene, and acrylic resin etc., the embodiment of the present invention does not limit.
Further, when the heat that heater members such as display screen and/or mainboard that described painting cloth material starts to absorb in terminal transmit, Polyethylene Glycol in described painting cloth material is liquid by solid state change gradually, described painting cloth material gradually from hard to soft, thus realizing the storage to heat；When described Polyethylene Glycol becomes liquid completely, described painting cloth material stops absorbing heat, and after the temperature of described display screen and/or mainboard is gradually decrease to preset temperature, described Polyethylene Glycol is changed to solid-state by liquid again, so that the heat of absorption is come out, described heat conduction and heat radiation material 22 in described painting cloth material can accelerate heat is distributed, thus being come out by the heat of absorption, now described painting cloth material changes software strategy into software-hardware strategy gradually.
Optionally, described heat conduction heat accumulation part 20 may also include protecting film；Described protecting film is bonding to be arranged on described painting cloth material, and described protecting film is located remotely from the side of described body 10.That is; after heat conduction heat accumulation part 20 (painting cloth material) is coated described body 10; also at outside namely heat conduction heat accumulation part 20, protecting film can be set away from the one side of body exposed part, to realize this heat conduction heat accumulation part 20 is protected, dust-proof etc..Further alternative, described protecting film can be the heat sink materials such as graphite such that it is able to improves the radiating rate of described painting cloth material further.
Further, the structural representation that Fig. 3, Fig. 3 are a kind of hardware brackets that another embodiment of the present invention provides is referred to.As it is shown on figure 3, the described hardware bracket 1 of the embodiment of the present invention includes body 10 and heat conduction heat accumulation part 30, described heat conduction heat accumulation part 30 is arranged on described body 10.Described body 10 is arranged between mainboard and display screen, to fix this display screen and/or mainboard.
Wherein, described heat conduction heat accumulation part 30 is made up of the composite material of the material properties with heat absorption, heat accumulation and heat sinking function, described composite material includes heat absorption heat accumulating and heat conduction and heat radiation material, the heat that described heat conduction and heat radiation material produces for the heat produced by described mainboard and/or described display screen is conducted to described heat absorption heat accumulating, and described heat absorption heat accumulating is for absorbing and store the heat of described heat conduction and heat radiation conduct and the heat of the heat of described mainboard generation and/or the generation of described display screen.
Optionally, heat conduction heat accumulation part 30 may be disposed in any surface of body 10, or is respectively provided with on the two sides of body 10.When the heat on display screen and/or mainboard and/or body 10 reaches uniform temperature, heat on the heat that the heat that display screen produces and/or mainboard produce and/or body 10 can be absorbed heat and heat accumulation by the heat absorption heat accumulating of heat conduction heat accumulation part 30, and after temperature lowers, further by the heat conduction and heat radiation material of heat conduction heat accumulation part 30 by the conduct heat away of storage to air, to realize further display screen and/or mainboard and/or body 10 are lowered the temperature.
Concrete, the proportioning of described heat absorption heat accumulating and described heat conduction and heat radiation material, the absorbing and cooling temperature principle of described heat absorption heat accumulating, composition, manufacturing process, the composition of described heat conduction and heat radiation material and body 10 may refer to the associated description in the corresponding embodiment of above-mentioned Fig. 1 with the attachment structure of display screen and/or mainboard, repeat no more herein.
Further, in embodiments of the present invention, described heat conduction heat accumulation part 30 can include retarder thinner, bonding solution, protecting film and glue-line；Described composite material and described retarder thinner, described bonding solution are mixed to form painting cloth material; described painting cloth material coats the side of described protecting film; being coated with a side bonds of described painting cloth material in the side of described glue-line and described protecting film, the opposite side of described glue-line is bonding with described body.That is; the embodiment of the present invention can be coated on described protecting film after being mixed with bonding solvent (retarder thinner and bonding solution) by the composite material that include heat absorption heat accumulating and heat conduction and heat radiation material; described glue-line stacking is covered on described painting cloth material; and described in be coated with the protecting film of composite material and be adhered on described body by described glue-line, obtain this heat conduction heat accumulation part 30.
The embodiment of the present invention by directly coating molding on protecting film by painting cloth material corresponding for composite material, then arranges glue-line on this composite material to be pasted on body 10, it is not necessary to tablet machine carries out tabletting so that simplify manufacturing process.Concrete, when the heat that heater members such as display screen and/or mainboard that described painting cloth material starts to absorb in terminal transmit, Polyethylene Glycol in described painting cloth material is liquid by solid state change gradually, described painting cloth material gradually from hard to soft, thus realizing the storage to heat；When described Polyethylene Glycol becomes liquid completely, described painting cloth material stops absorbing heat, and after the temperature of described display screen and/or mainboard is gradually decrease to preset temperature, described Polyethylene Glycol is changed to solid-state by liquid again, so that the heat of absorption is come out, described heat conduction and heat radiation material in described painting cloth material can accelerate heat is distributed, thus being come out by the heat of absorption, now described painting cloth material changes software strategy into software-hardware strategy gradually.Wherein, described painting cloth material can be protected by described protecting film, dust-proof etc., and described protecting film can be the heat sink materials such as graphite, to improve the radiating rate of described painting cloth material further；Or, described protecting film can be polyethylene terephthalate (PET).Further alternative, this bonding solution can be methanol dimethylbenzene, and acrylic resin etc., the embodiment of the present invention does not limit.
In conjunction with Fig. 3, it is the composition schematic diagram of a kind of heat conduction heat accumulation part 30 that another embodiment of the present invention provides please also refer to Fig. 4, Fig. 4.As shown in Figure 4, described heat conduction heat accumulation part 30 includes: protecting film 31, painting cloth material 32, glue-line 33.Wherein, described painting cloth material 32 is to be mixed to get with described retarder thinner, described bonding solution for including the composite material of described heat absorption heat accumulating and described heat conduction heat accumulating.Described painting cloth material 32 can be coated on the side of described protecting film 31; additionally, described painting cloth material 32 also with a side bonds of glue-line 33, obtain heat conduction heat accumulation part 30; the opposite side of glue-line 33 can be bonded on described body 10, thus being arranged on the body 10 of hardware bracket by this heat conduction heat accumulation part 30.Optionally, before being mixed to form described composite material, described heat conduction and heat radiation material and described heat absorption heat accumulating can be smashed to pieces and carried out strong stirring, to respectively obtain the powder body of correspondence, namely mixed process refers to the process that the described heat sink material for powder body and the described heat absorption heat accumulating for powder body are mixed.Wherein, owing to the described microcapsule in described heat absorption heat accumulating is the size much smaller than the described heat absorption heat accumulating for powder body, so the described heat absorption heat accumulating for powder body obtained after strong stirring still comprises some complete described microcapsules, it can't destroy the microcapsule structure in heat absorption heat accumulating, therefore, described heat absorption heat accumulating for powder body still has heat absorption, heat storage function, thus the described composite material formed after mixing still has heat absorption, heat accumulation and heat sinking function.
Optionally, described bonding solution can be methanol dimethylbenzene, acrylic resin etc.；Described glue-line 33 can be gum, double faced adhesive tape or other, the embodiment of the present invention does not limit.
In embodiments of the present invention, by coating on the body of hardware bracket, heat conduction heat accumulation part is set, and heat conduction heat accumulation part includes having heat absorption, the composite material of the material properties of heat accumulation and heat sinking function, thus the heat that the heater members in hardware bracket such as mainboard and/or display screen are produced absorbs, and the heat absorbed is carried out heat accumulation and heat radiation, to realize reducing the temperature of heater members, the heat avoiding heater members is too high and causes running slower, the problems such as card even occur, ensure that mobile terminal is properly functioning, and terminal enclosure temperature can be avoided too high, improve the heat dispersion of mobile terminal.
Further, the structural representation that Fig. 5, Fig. 5 are a kind of hardware brackets that further embodiment of this invention provides is referred to.As it is shown in figure 5, the described hardware bracket 1 of the embodiment of the present invention includes body 10 and heat conduction heat accumulation part 40, described heat conduction heat accumulation part 40 is arranged on described body 10.Described body 10 is arranged between mainboard and display screen, to fix this display screen and/or mainboard.
Wherein, described heat conduction heat accumulation part 40 is made up of the composite material of the material properties with heat absorption, heat accumulation and heat sinking function, described composite material includes heat absorption heat accumulating and heat conduction and heat radiation material, the heat that described heat conduction and heat radiation material produces for the heat produced by described mainboard and/or described display screen is conducted to described heat absorption heat accumulating, and described heat absorption heat accumulating is for absorbing and store the heat of described heat conduction and heat radiation conduct and the heat of the heat of described mainboard generation and/or the generation of described display screen.
Optionally, heat conduction heat accumulation part 40 may be disposed in any surface of body 10, or is respectively provided with on the two sides of body 10.When the heat on display screen and/or mainboard and/or body 10 reaches uniform temperature, heat on the heat that the heat that display screen produces and/or mainboard produce and/or body 10 can be absorbed heat and heat accumulation by the heat absorption heat accumulating of heat conduction heat accumulation part 40, and after temperature lowers, further by the heat conduction and heat radiation material of heat conduction heat accumulation part 30 by the conduct heat away of storage to air, to realize further display screen and/or mainboard and/or body 10 are lowered the temperature.
Concrete, the proportioning of described heat absorption heat accumulating and described heat conduction and heat radiation material, the absorbing and cooling temperature principle of described heat absorption heat accumulating, composition, manufacturing process, the composition of described heat conduction and heat radiation material and body 10 may refer to the associated description in the corresponding embodiment of above-mentioned Fig. 1 with the attachment structure of display screen and/or mainboard, repeat no more herein.
Further, in embodiments of the present invention, described heat conduction heat accumulation part 40 can include titanate coupling agent, composite material and glue-line；Described composite material and described titanate coupling agent are mixed and made into flaky material, and the side of described glue-line is bonding with described flaky material, and the opposite side of described glue-line is bonding with described body 10.
Concrete, when making described flaky material, described titanate coupling agent can be added in for the described composite material of powder body, obtain organic composite shaping phase-change material, through tabletting machine, this organic composite shaping phase-change material is prepared flake, forming the described flaky material of definite shape after cropped, flaky material lamination adhesive glue-line again forms heat conduction heat accumulation part 40.When the heat that heater members such as display screen and/or mainboard that described flaky material starts to absorb in terminal transmit, described Polyethylene Glycol in described flaky material is liquid by solid state change gradually, described flaky material gradually from hard to soft, thus realizing storage to heat；When described Polyethylene Glycol becomes liquid completely, described flaky material stops absorbing heat, and after the temperature of described display screen and/or mainboard is gradually decrease to preset temperature, described Polyethylene Glycol is changed to solid-state by liquid again, so that the heat of absorption is come out, described heat conduction and heat radiation material 22 in described painting cloth material can accelerate heat is distributed, thus being come out by the heat of absorption, now described flaky material changes software strategy into software-hardware strategy gradually.Wherein, this powder body can be through smashing heat absorption heat accumulating to pieces and strong stirring obtains, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating.
Optionally, this flaky material can be cut into according to the shape of the body 10 of hardware bracket 1, obtain heat conduction heat accumulation part 40, and this heat conduction heat accumulation part 40 is fitted on body 10, namely the shape of this heat conduction heat accumulation part 40 can with the mating shapes of body 10, thus realizing the function of heat absorption, heat accumulation and heat radiation.It is mixed and made into flaky material thereby through by composite material and titanate coupling agent, it is connected on flaky material again through glue-line stacking and forms heat conduction heat accumulation part 40, not only make heat conduction heat accumulation part 40 can go to cut according to the shape of body 10, and then can have with the body 10 of hardware bracket 1 and preferably coordinate, can to better carrying out heat absorption heat accumulation, realize display screen and/or mainboard are lowered the temperature, promote heat dispersion and the reliability of mobile terminal, and the heat conduction heat accumulation part 40 of lamellar is directly stained with, it is cooled into coating without waiting for it, easy to use.Further alternative, described glue-line can be gum, double faced adhesive tape or mould release membrance etc..
Further alternative, described heat conduction heat accumulation part 40 may also include protecting film；Described protecting film is bonding to be arranged on described flaky material, and described protecting film is located remotely from the side of described body 10.That is; after the one side of the flaky material of heat conduction heat accumulation part 40 correspondence is adhered to described body 10; also at the another side of this flaky material namely heat conduction heat accumulation part 40, protecting film can be set away from the one side of body exposed part, to realize this flaky material is protected, dust-proof.Further alternative, described protecting film can be the heat sink materials such as graphite such that it is able to improves the radiating rate of described flaky material further.
In other alternative-embodiments, described heat conduction heat accumulation part 40 can include titanate coupling agent, heat absorption heat accumulating, heat conduction and heat radiation material and glue-line；Described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, the side of described glue-line and described flaky material one side bonds, and the side of described flaky material arranges described heat conduction and heat radiation material, and the opposite side of described glue-line is bonding with described body 10.Concrete, when the flaky material that the described heat absorption heat accumulating of making is corresponding, described titanate coupling agent can be added in for the described heat absorption heat accumulating of powder body, obtain organic composite shaping phase-change material, through tabletting machine, this organic composite shaping phase-change material is prepared flake, form the described flaky material of definite shape after cropped, and (such as coating or bonding etc. by glue-line) this heat conduction heat accumulating is set in the side of this flaky material, flaky material opposite side lamination adhesive glue-line again forms heat conduction heat accumulation part 40.Thus realizing this heat absorption, heat accumulation and heat sinking function, to promote the heat dispersion of mobile terminal.
In embodiments of the present invention, by bonding on the body 10 of hardware bracket, the heat conduction heat accumulation part 40 that flaky material is corresponding is set, and heat conduction heat accumulation part 40 includes having heat absorption, the composite material of the material properties of heat accumulation and heat sinking function, thus the heat that the heater members in hardware bracket such as mainboard and/or display screen are produced absorbs, and the heat absorbed is carried out heat accumulation and heat radiation, to realize reducing the temperature of heater members, the heat avoiding heater members is too high and causes running slower, the problems such as card even occur, ensure that mobile terminal is properly functioning, and terminal enclosure temperature can be avoided too high, improve the heat dispersion of mobile terminal.
Refer to the structural representation that Fig. 6, Fig. 6 are a kind of mobile terminals that one embodiment of the invention provides.As shown in Figure 6, described mobile terminal 100 includes shell, display screen, mainboard and hardware bracket, and described hardware bracket is arranged between described display screen and described mainboard, is used for fixing described display screen and described mainboard.Wherein, described hardware bracket includes body and heat conduction heat accumulation part, and described heat conduction heat accumulation part is arranged on described body；The one side of described body is provided with mainboard, and another side is provided with display screen.
Wherein, described heat conduction heat accumulation part is made up of the composite material of the material properties with heat absorption, heat accumulation and heat sinking function, described composite material includes heat absorption heat accumulating and heat conduction and heat radiation material, the heat that described heat conduction and heat radiation material produces for the heat produced by described mainboard and/or described display screen is conducted to described heat absorption heat accumulating, and described heat absorption heat accumulating is for absorbing and store the heat of described heat conduction and heat radiation conduct and the heat of the heat of described mainboard generation and/or the generation of described display screen.
When mobile terminal 100 during fabrication, by arranging heat conduction heat accumulation part at the body of hardware bracket, and hardware bracket is arranged at be fixed between display screen and mainboard after be assemblied in mobile terminal.Wherein, the heat absorption heat accumulating forming microcapsule structure can after the heat of body reaches uniform temperature such as 40 degree, start to absorb the heat on display screen and/or mainboard and/or body, and capsule-core itself is gradually from solid phase to liquid phase, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating absorbs is saturated, it stops absorbing heat, and after the temperature of display screen and/or mainboard and/or body is gradually decrease to preset temperature, the heat of absorption can be come out by the heat conduction and heat radiation material of microcapsule structure, it is delivered in air, and capsule-core can along with gradually decreasing of its fever of the body amount gradually from liquid phase to solid phase, circulating phase-change by the heat accumulating that absorbs heat, thus display screen and/or mainboard and/or body are lowered the temperature, thus improve heat dispersion and the reliability of mobile terminal.
Optionally, described body offering the first screw, described mainboard offers the second screw, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Optionally, described hardware bracket also includes fixing post, one end of described fixing post is fixing with described body to be connected, the other end of described fixing post offers the first screw, offering the second screw on described mainboard, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
Optionally, the proportioning value between described heat absorption heat accumulating and described heat conduction and heat radiation material is 1:1.
Optionally, the decalescence heat accumulating that described heat absorption heat accumulating is made up of silicon dioxide and Polyethylene Glycol, and the proportioning value between described silicon dioxide and described Polyethylene Glycol is any one in 1:1～1:9；
Described heat conduction and heat radiation material is graphite or metal.
Optionally, described heat absorption heat accumulating is by with silicon dioxide for cyst wall, and what the microcapsule being capsule-core with Polyethylene Glycol was constituted.
Optionally, described heat conduction heat accumulation part also includes retarder thinner, bonding solution, protecting film and glue-line；Described composite material and described retarder thinner, described bonding solution are mixed to form painting cloth material; described painting cloth material coats the side of described protecting film; being coated with a side bonds of described painting cloth material in the side of described glue-line and described protecting film, the opposite side of described glue-line is bonding with described body.
Optionally, described heat conduction heat accumulation part also includes retarder thinner and bonding solution；Described composite material and described retarder thinner, described bonding solution are mixed to form painting cloth material, and described painting cloth material is coated at least one side of described body.
Optionally, described heat conduction heat accumulation part also includes titanate coupling agent and glue-line；Described composite material and described titanate coupling agent are mixed and made into flaky material, and the side of described glue-line is bonding with described flaky material, and the opposite side of described glue-line is bonding with described body.
Optionally, described hardware bracket also includes protecting film, and described protecting film is bonding to be arranged on described heat conduction heat accumulation part, and described protecting film is arranged at the side away from described body.
Further alternative, the body of this hardware bracket also can be offered thermal hole, and/or offer thermal hole at the shell edge position of described mobile terminal so that stored heat can be dispelled the heat by this heat conduction heat accumulation part faster, thus promoting the heat dispersion of mobile terminal.
Concrete, the concrete structure of described hardware bracket and described heat conduction heat accumulation part can refer to the associated description of Fig. 1 to Fig. 5 correspondence embodiment, repeats no more herein.
In embodiments of the present invention, can pass through to arrange on hardware bracket to include that there is heat absorption, the heat conduction heat accumulation part of the composite material of the material properties of heat accumulation and heat sinking function, make it possible to the heat by the heater members in hardware bracket such as mainboard and/or display screen are produced by described heat absorption heat accumulating absorb and store, to realize reducing the temperature of heater members, dispelled the heat by described heat conduction and heat radiation material, then further enhance the cooling-down effect to heater members, the heat avoiding heater members is too high and causes running slower, the problems such as card even occur, ensure that the properly functioning of mobile terminal, and terminal enclosure temperature can be avoided too high, improve the heat dispersion of mobile terminal.
Above disclosed it is only present pre-ferred embodiments, certainly can not limit the interest field of the present invention, the equivalent variations therefore made according to the claims in the present invention with this, still belong to the scope that the present invention contains.
Claims (11)
1. a hardware bracket, it is characterised in that including body and heat conduction heat accumulation part, described heat conduction heat accumulation part is arranged on described body, and the one side of described body is provided with mainboard, and another side is provided with display screen, described body is used for fixing described mainboard and described display screen；
Wherein, described heat conduction heat accumulation part is made up of the composite material of the material properties with heat absorption, heat accumulation and heat sinking function, described composite material includes heat absorption heat accumulating and heat conduction and heat radiation material, the heat that described heat conduction and heat radiation material produces for the heat produced by described mainboard and/or described display screen is conducted to described heat absorption heat accumulating, and described heat absorption heat accumulating is for absorbing and store the heat of described heat conduction and heat radiation conduct and the heat of the heat of described mainboard generation and/or the generation of described display screen.
2. hardware bracket according to claim 1, it is characterised in that offer the first screw on described body, described mainboard offers the second screw, and described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
3. hardware bracket according to claim 1, it is characterized in that, described hardware bracket also includes fixing post, one end of described fixing post is fixing with described body to be connected, the other end of described fixing post offers the first screw, offering the second screw on described mainboard, described mainboard is connected by screw is fixing with described body with the cooperation of described first screw, described second screw.
4. the hardware bracket according to any one of claim 1-3, it is characterised in that the proportioning value between described heat absorption heat accumulating and described heat conduction and heat radiation material is 1:1.
5. the hardware bracket according to any one of claim 1-3, it is characterised in that
The decalescence heat accumulating that described heat absorption heat accumulating is made up of silicon dioxide and Polyethylene Glycol, and the proportioning value between described silicon dioxide and described Polyethylene Glycol is any one in 1:1～1:9；
Described heat conduction and heat radiation material is graphite or metal.
6. hardware bracket according to claim 5, it is characterised in that described heat absorption heat accumulating is by with silicon dioxide for cyst wall, and what the microcapsule being capsule-core with Polyethylene Glycol was constituted.
7. hardware bracket according to claim 1, it is characterised in that described heat conduction heat accumulation part also includes retarder thinner, bonding solution, protecting film and glue-line；Described composite material and described retarder thinner, described bonding solution are mixed to form painting cloth material; described painting cloth material coats the side of described protecting film; being coated with a side bonds of described painting cloth material in the side of described glue-line and described protecting film, the opposite side of described glue-line is bonding with described body.
8. hardware bracket according to claim 1, it is characterised in that described heat conduction heat accumulation part also includes retarder thinner and bonding solution；Described composite material and described retarder thinner, described bonding solution are mixed to form painting cloth material, and described painting cloth material is coated at least one side of described body.
9. hardware bracket according to claim 1, it is characterised in that described heat conduction heat accumulation part also includes titanate coupling agent and glue-line；Described composite material and described titanate coupling agent are mixed and made into flaky material, and the side of described glue-line is bonding with described flaky material, and the opposite side of described glue-line is bonding with described body.
10. hardware bracket according to claim 8 or claim 9, it is characterised in that described hardware bracket also includes protecting film, described protecting film is bonding to be arranged on described heat conduction heat accumulation part, and described protecting film is arranged at the side away from described body.
11. a mobile terminal, it is characterised in that include display screen, mainboard and the hardware bracket as described in any one of claim 1 to 10, described hardware bracket is arranged between described display screen and described mainboard, is used for fixing described display screen and described mainboard.
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| CN201610286923.7A CN105792618B (en) | 2016-04-29 | 2016-04-29 | A kind of hardware bracket and mobile terminal |
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| CN201610286923.7A CN105792618B (en) | 2016-04-29 | 2016-04-29 | A kind of hardware bracket and mobile terminal |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. |
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