CN105916350B - A kind of terminal device and associated method - Google Patents
A kind of terminal device and associated method Download PDFInfo
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- CN105916350B CN105916350B CN201610286961.2A CN201610286961A CN105916350B CN 105916350 B CN105916350 B CN 105916350B CN 201610286961 A CN201610286961 A CN 201610286961A CN 105916350 B CN105916350 B CN 105916350B
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- heat
- region
- dissipation region
- accumulating
- conduction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The embodiment of the invention discloses a kind of terminal devices and associated method, and terminal device includes：Treat heat dissipation region and heat radiator part, the heat radiator part is arranged at described treat in heat dissipation region；The heat radiator part includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, and the mixing material is made of heat absorption heat accumulating and heat conduction and heat radiation material；The heat conduction and heat radiation material is used for the heat transfer treated in heat dissipation region to the heat absorption heat accumulating, and the heat absorption heat accumulating is used to absorbing and storing the heat treated in heat dissipation region, while stores the heat of the heat conduction and heat radiation material conduction；It is described to treat that heat dissipation region includes the region of the heating device in the terminal device, at least one of the region of the outer surface region of the heating device.Using the present invention, the temperature of the heating device in mobile phone can be effectively reduced, and can be excessively high to avoid phone housing temperature.
Description
Technical field
The present invention relates to electronic device fields more particularly to a kind of terminal device and associated method.
Background technology
With the development of mobile phone industry, the accuracy of mobile phone is higher and higher, CPU (Central Processing Unit, center
Processor) dominant frequency is higher and higher so that and mobile phone can realize more, more complicated function, but also result in mobile phone simultaneously
Power consumption is increasing, and then cell-phone heating amount is caused also accordingly to become larger, if these heats cannot be controlled or shifted, then place
Mobile phone computing can be caused slack-off or even interim card in the heating device of the condition of high temperature, and these heats can also make phone housing temperature
Spend height, cause to have it is hot, scald ear the problems such as occur.
The content of the invention
The embodiment of the present invention provides a kind of terminal device and associated method, can effectively reduce heating device in mobile phone
Temperature, and can be excessively high to avoid phone housing temperature.
An embodiment of the present invention provides a kind of terminal device, including：Treat heat dissipation region and heat radiator part, the heat absorption dissipates
Warmware is arranged at described treat in heat dissipation region；
The heat radiator part includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, described mixed
Condensation material is made of heat absorption heat accumulating and heat conduction and heat radiation material；The heat conduction and heat radiation material is used to treat heat dissipation region by described
Heat transfer to the heat absorption heat accumulating, the heat absorption heat accumulating is for absorbing and store described treat in heat dissipation region
Heat, while store the heat of the heat conduction and heat radiation material conduction；
It is described treat heat dissipation region include the region of the heating device in the terminal device, the heating device it is outer
At least one of the region on surface region.
Correspondingly, the embodiment of the present invention additionally provides a kind of method for terminal device heat dissipation, including：
Setting heat radiator part in heat dissipation region is treated in the terminal device；The heat radiator part, which includes having, to be inhaled
The mixing material of the material properties of heat, heat accumulation and heat sinking function, the mixing material is by heat absorption heat accumulating and heat conduction and heat radiation material
Material composition；The heat conduction and heat radiation material is used for the heat transfer treated in heat dissipation region to the heat absorption heat accumulating, institute
It states heat absorption heat accumulating to be used to absorbing and storing the heat treated in heat dissipation region, while stores the heat conduction and heat radiation material and pass
The heat led；
It is described treat heat dissipation region include the region of the heating device in the terminal device, the heating device it is outer
At least one of the region on surface region.
Correspondingly, the embodiment of the present invention additionally provides a kind of manufacturing method of mixing material, including：
Polyethylene glycol is added in Ludox, after all dissolving, CaCl is added dropwise2Accelerator solution is made by stirring
Gelation reaction occurs in it, the gel of three-dimensional net structure is formed after standing, then air blast is done in 80 DEG C of baking ovens by the gel
When dry 24-28 is small, be subsequently cooled to room temperature, using formed by it is several using silica as cyst wall, using polyethylene glycol as the micro- of capsule-core
The gelatinous heat absorption heat accumulating that capsule is formed；
The gelatinous heat absorption heat accumulating is smashed to pieces and stirs into powder, and with powdered heat conduction and heat radiation material with
1:1 mass ratio is mixed, to form the mixing material.
The embodiment of the present invention in terminal device by treating to set heat radiator part, and heat radiator part in heat dissipation region
Including having the mixing material of the material properties of heat absorption, heat accumulation and heat sinking function, and the heat conduction and heat radiation material in mixing material
The heat transfer that material can be used for treat in heat dissipation region gives heat absorption heat accumulating, and heat absorption heat accumulating can be used for absorbing and storing treating
Heat in heat dissipation region, while the heat of heat conduction and heat radiation material conduction is stored, so as to reduce the temperature for treating heat dissipation region,
To ensure mobile phone normal operation, while the heat for treating heat dissipation region can also be avoided to be directly delivered on phone housing, Jin Erke
It is excessively high to avoid phone housing temperature.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of structure diagram for terminal device that one embodiment of the invention provides；
Fig. 2 is a kind of structure diagram for terminal device that another embodiment of the present invention provides；
Fig. 3 is a kind of structure diagram for terminal device that further embodiment of this invention provides.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment belongs to the scope of protection of the invention.
An embodiment of the present invention provides a kind of terminal device, the terminal device can include treating that heat dissipation region and heat absorption dissipate
Warmware, the heat radiator part are arranged at described treat in heat dissipation region；
The heat radiator part includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, described mixed
Condensation material is made of heat absorption heat accumulating and heat conduction and heat radiation material；The heat conduction and heat radiation material is used to treat heat dissipation region by described
Heat transfer to the heat absorption heat accumulating, the heat absorption heat accumulating is for absorbing and store described treat in heat dissipation region
Heat, while store the heat of the heat conduction and heat radiation material conduction；It is described to treat that heat dissipation region is included in the terminal device
The region of heating device, at least one of the region of the outer surface region of the heating device.
Wherein, the heat absorption heat accumulating is the material of the material properties with heat absorption and heat storage function；The mixing material
Expect to absorb the heat treated in heat dissipation region, and the mixing material stores absorbed heat, the mixing material
It radiates again to the heat stored；The heat for treating heat dissipation region comes from corresponding heating device.Wherein, according to institute
The different shape of heat radiator part is stated, being corresponding with different setting methods, (setting method can include coating and set, be viscous
Connect setting etc.), if for example, the heat radiator part is that when can be coated with form, can be coated on the heat radiator part
It is described to treat in heat dissipation region；If the heat radiator part is lamellar morphology, the heat radiator part can be adhered to institute
It states and treats in heat dissipation region.Wherein, by the heat absorption heat accumulating that the mixing material in the heat radiator part is included into
Row heat absorption and heat accumulation can absorb the heat for treating heat dissipation region and be stored in the heat absorption heat accumulating, with
The temperature of heat dissipation region is treated described in reduction, and then reduces the temperature of corresponding heating device, and can be kept away by storing heat
Treat that the heat of heat dissipation region is directly delivered to phone housing described in exempting from；Pass through the mixing material institute in the heat radiator part
Comprising heat conduction and heat radiation material radiate, can accelerate to radiate to the heat radiator part, further enhance to institute
State the cooling-down effect for treating heat dissipation region.
Optionally, the heat absorption heat accumulating that the mixing material in the heat radiator part is included can be phase transformation material
Material, for example, the heat absorption heat accumulating is by gradually absorbing heat, the quality of the heat absorption heat accumulating can from hard to soft,
To realize the function of heat accumulation, i.e., the quality of described heat radiator part also can according to the increase for absorbing heat and from hard to soft.
The embodiment of the present invention in terminal device by treating to set heat radiator part, and heat radiator part in heat dissipation region
Including having the mixing material of the material properties of heat absorption, heat accumulation and heat sinking function, so as to treat the heat in heat dissipation region
Amount is absorbed, and the heat to being absorbed carries out heat accumulation and heat dissipation, so as to reduce the temperature for treating heat dissipation region, and then is dropped
The temperature of low heating device, can be to avoid treating radiating area to ensure mobile phone normal operation, while by heat accumulation and the effect of heat dissipation
The heat in domain is directly delivered on phone housing, and then can be excessively high to avoid phone housing temperature.
Fig. 1 is referred to, is a kind of structure diagram for terminal device 1 that one embodiment of the invention provides；The terminal is set
Standby 1 inside includes treating heat dissipation region 101 and heat radiator part 102, and the heat radiator part 102, which is arranged at, described treats radiating area
On domain 101；The heat radiator part 102 includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function；Institute
Mixing material is stated for absorbing the heat treated in heat dissipation region 101, and the mixing material stores absorbed heat, institute
Mixing material is stated again to radiate to the heat stored；
It is described to treat that heat dissipation region 101 includes the region of the heating device in the terminal device 1, the heating device
At least one of the region of outer surface region.
Specifically, the region of the heating device in the terminal device 1 does not limit and described treats that heat dissipation region 101 is leaned on
The specific distance values of the nearly heating device, " close " here can be understood as heating device heat when transferring heat
The region transferred is concentrated, such as heating device is chip, and the heat of chip is to concentrate to be transferred to shield the screen of chip
Cover is covered, therefore, heat dissipation region 101 can be treated in the metal surface of the shielding case as described in；For another example the heating device is
Battery, and the heat of battery is to concentrate to be transferred to the cell phone rear cover that is oppositely arranged with the battery, therefore, can will be after the mobile phone
The inner surface (inner surface is the one side towards the battery) of lid treats heat dissipation region 101 described in being used as.Further, it is described
Treat that heat dissipation region 101 includes shielding case region, display screen area, display screen hardware bracket region, touch screen zone, cell rear cover
At least one region in inner surface of outer cover region, chip outer surface region, earpiece area, described in being set in different zones
Heat radiator part 102 can cool down to many places pyrotoxin in mobile phone, and comprehensive cooling is carried out to mobile phone to realize.Institute
It states and treats that heat dissipation region 101 can also be the front of respective devices and/or the region of reverse side, for example, described treat that heat dissipation region 101 is
During the shielding case region, it is specifically as follows the front and/or opposed region of the shield bracket and screening cover in the shielding case,
Can will be close to shielded heating device one side be known as front, then the another side being disposed opposite to each other be reverse side, the screening cover
It is covered on the shield bracket.It can be the device to radiate according to specific needs to the selection for treating heat dissipation region 101
Part and the effect of heat dissipation are flexibly selected, and are no longer repeated one by one here.
Wherein, the mixing material is mixed to form by heat conduction and heat radiation material and heat absorption heat accumulating, and the heat conduction dissipates
Mass ratio between hot material and the heat absorption heat accumulating is 1:1, the heat absorption heat accumulating is that have heat absorption and heat accumulation work(
The material of the material properties of energy, the heat conduction and heat radiation material can be other heat conduction and heat radiation materials such as graphite, metal.
Further, the heat absorption heat accumulating in the mixing material is made of polyethylene glycol and silica
Phase-changing energy storage material, the mass ratio between the polyethylene glycol and the silica are 1:1-9:1, which kind of quality specifically selected
Than that can select according to demand.Wherein, making the detailed process of the heat absorption heat accumulating can be：Polyethylene glycol is added to
In certain density Ludox (concentration refers to the content of the silica in Ludox), after all dissolving, CaCl is added dropwise2Promote
Solidifying agent solution under strong stirring, brings it about gelation reaction, three-dimensional net structure gel is formed after standing；Gel is existed
When forced air drying 24-28 is small in 80 DEG C of baking ovens, be subsequently cooled to room temperature, you can obtain by several silica using after gel as
Cyst wall, the heat absorption heat accumulating being made of using the polyethylene glycol after emulsification the microcapsules of capsule-core.Wherein, the microcapsules
Capsule-core in polyethylene glycol for phase-changing energy storage material, i.e., described microcapsules, can be by the capsule-core by gradually absorbing heat
In polyethylene glycol gradually by solid state transformed for liquid, to realize the storage to heat, equally absorbed when the microcapsules
When heat gradually decreases, the polyethylene glycol in the capsule-core is also gradually converted into solid-state by liquid, with to the heat stored into
Row heat dissipation, wherein, it is that the self-temperature of the polyethylene glycol of liquid is not high, that is, the heat absorbed is all used to carry out phase
Become, and it is a slow radiation processes that the polyethylene glycol becomes solid process from liquid, so comprising several described micro-
The heat radiator part 102 of capsule can be directly delivered to phone housing in a short time to avoid the heat being absorbed into and cause
Phone housing temperature is excessively high.Further, due to existing for the cyst wall of the silica, it is possible to ensure as the poly- of liquid
Ethylene glycol will not flow out the microcapsules, and therefore, the polyethylene glycol in the capsule-core is gradually by the solid state transformed mistake for liquid
Cheng Zhong, the microcapsules are gradually from hard to soft, and then influence the quality of the heat absorption heat accumulating also from hard to soft.With described
The heat conduction and heat radiation material in mixing material is exemplified by graphite, since the thermal conductivity of graphite is good, so graphite can be faster
It conducts heat on the heat absorption heat accumulating and carries out heat storage, and the good heat dissipation effect of graphite in the x, y direction, institute
The radiating rate of the mixing material can be improved with graphite.Wherein, it is necessary to first will before the mixing material is mixed to form
The heat conduction and heat radiation material and for it is gelatinous it is described heat absorption heat accumulating carry out strong stirring, to respectively obtain corresponding powder
Body, i.e. mixed process refer to the heat conduction and heat radiation material for powder and are that the heat absorption heat accumulating of powder mixes
Process；Wherein, since the microcapsules in the heat absorption heat accumulating are much smaller than the heat absorption heat accumulation material for powder
The size of material, thus obtained after strong stirring be powder the heat absorption heat accumulating in still include several complete institutes
Microcapsules are stated, are that the heat absorption heat accumulating of powder still has heat absorption, heat storage function, so as to be formed after mixing therefore
The mixing material still there is heat absorption, heat accumulation and heat sinking function.
Further, the heat radiator part 102 further include retarder thinner and bond solution (such as：Methanol dimethylbenzene, third
Olefin(e) acid resin etc.)；Heat radiator coating material is mixed to form for the mixing material and retarder thinner bonding solution of powder
Material so that the heat radiator coating material directly has adhesive force, and the heat radiator coating material can be coated on described treat
In heat dissipation region 101, i.e., described heat radiator part 102, which refers to be coated on, described treats there is certain thickness in heat dissipation region 101
The heat radiator coating material.When the heat radiator coating material starts to treat the heat in heat dissipation region 101 described in absorption
During amount, the polyethylene glycol in the heat radiator coating material is gradually liquid by solid state change, the heat absorption at this time
Coating material radiate also gradually from hard to soft, to realize storage to heat；When the polyethylene glycol becomes liquid completely, institute
It states heat radiator coating material to stop absorbing heat, and preset temperature is gradually decrease in the temperature for treating heat dissipation region 101
Afterwards, the polyethylene glycol is again solid-state by liquid variation, the heat of absorption is come out, the heat radiator coating material
In the ingredient of the heat conduction and heat radiation material can accelerate to distribute heat, the heat radiator coating material at this time
Gradually change software strategy into software-hardware strategy.
Optionally, the heat radiator part 102 further includes protective film；The protective film bonding is arranged at the heat radiator
On coating material, and heat dissipation region 101 is treated away from described.I.e. described heat radiator coating material treats heat dissipation region described in being coated on
After on 101, the protective film is set in the exposed part bonding of the heat radiator coating material.The protective film can be right
The heat radiator coating material is protected, is dust-proof, and the protective film can be the heat conduction and heat radiation materials such as graphite, with further
Improve the radiating rate of the heat radiator coating material.
The embodiment of the present invention is inhaled by treating to set heat radiator part 102 in heat dissipation region 101 in terminal device 1
Hot radiating piece 102 includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, so as to treat heat dissipation
Heat in region 101 is absorbed, and the heat to being absorbed carries out heat accumulation and heat dissipation, and heat dissipation region is treated so as to reduce
101 temperature, and then reduce the temperature of heating device, to ensure mobile phone normal operation, while by heat accumulation and the effect of heat dissipation,
It can be directly delivered to avoid the heat for treating heat dissipation region 101 on phone housing, and then can be excessively high to avoid phone housing temperature.
Fig. 2 is referred to again, is a kind of structure diagram for terminal device 1 that another embodiment of the present invention provides；The end
End equipment 1 includes：Treat heat dissipation region 101 and heat radiator part 103, the heat radiator part 103, which is arranged at, described treats radiating area
On domain 101；
The heat radiator part 103 includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, described
Mixing material is made of heat absorption heat accumulating and heat conduction and heat radiation material；The heat conduction and heat radiation material is used to treat heat dissipation region by described
To the heat absorption heat accumulating, the heat absorption heat accumulating described treats radiating area for absorbing and storing for heat transfer on 101
Heat on domain 101, while store the heat of the heat conduction and heat radiation material conduction；It is described to treat that heat dissipation region 101 is included close to institute
State the region of the heating device in terminal device 1, at least one of the region of the outer surface region of the heating device.
Wherein, the mixing material is mixed to form by heat conduction and heat radiation material and heat absorption heat accumulating, and the heat conduction dissipates
The ingredient of hot material, the ingredient of the heat absorption heat accumulating and manufacturing process may refer to the corresponding embodiments of above-mentioned Fig. 1, here
No longer repeated.
Further, the heat radiator part 103 further include retarder thinner, bond solution (such as：Methanol dimethylbenzene, third
Olefin(e) acid resin etc.), protective film and glue-line；It is mixed to form for the mixing material and retarder thinner bonding solution of powder
Heat radiator coating material so that the heat radiator coating material directly has adhesive force, the heat radiator coating material
The one side of the protective film is coated on, the one side of the glue-line in the protective film with being coated with the heat radiator coating material
A side bonds, the opposite side of the glue-line treats that heat dissipation region 101 is be bonded with described.When the heat radiator coating material starts
It is described in the heat radiator coating material described in absorption when the heat that the heating device in heat dissipation region 101 is transferred
Polyethylene glycol is gradually liquid by solid state change, the heat radiator coating material at this time also gradually from hard to soft, to realize
Storage to heat；When the polyethylene glycol becomes liquid completely, the heat radiator coating material stops absorbing heat, and
After the temperature of the heating device is gradually decrease to preset temperature, the polyethylene glycol is again solid-state by liquid variation, will
The heat of absorption comes out, and the ingredient of the heat conduction and heat radiation material in the heat radiator coating material can accelerate to heat
Amount is distributed, and the heat radiator coating material at this time also gradually changes software strategy into software-hardware strategy.Wherein, the protective film can be to described
Heat radiator coating material is protected, is dust-proof, and the protective film can be the heat conduction and heat radiation materials such as graphite, to further improve
The radiating rate of the heat radiator coating material.Optionally, all it is coated with the heat radiator in the both sides of the protective film
Coating material, by the arbitrary one side of the protective film and a side bonds of the glue-line, the opposite side of the glue-line is treated with described
Heat dissipation region 101 is bonded.
The embodiment of the present invention is inhaled by treating to set heat radiator part 103 in heat dissipation region 101 in terminal device 1
Hot radiating piece 103 includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, so as to treat heat dissipation
Heat in region 101 is absorbed, and the heat to being absorbed carries out heat accumulation and heat dissipation, and heat dissipation region is treated so as to reduce
101 temperature, and then reduce the temperature of heating device, to ensure mobile phone normal operation, while by heat accumulation and the effect of heat dissipation,
It can be directly delivered to avoid the heat for treating heat dissipation region 101 on phone housing, and then can be excessively high to avoid phone housing temperature.
Fig. 3 is referred to again, is a kind of structure diagram for terminal device 1 that further embodiment of this invention provides；The end
End equipment 1 includes：Treat heat dissipation region 101 and heat radiator part 104, the heat radiator part 104, which is arranged at, described treats radiating area
On domain 101；
The heat radiator part 104 includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, described
Mixing material is made of heat absorption heat accumulating and heat conduction and heat radiation material；The heat conduction and heat radiation material is used to treat heat dissipation region by described
To the heat absorption heat accumulating, the heat absorption heat accumulating described treats radiating area for absorbing and storing for heat transfer on 101
Heat on domain 101, while store the heat of the heat conduction and heat radiation material conduction；It is described to treat that heat dissipation region 101 is included close to institute
State the region of the heating device in terminal device 1, at least one of the region of the outer surface region of the heating device.
Wherein, the mixing material is mixed to form by heat conduction and heat radiation material and heat absorption heat accumulating, and the heat conduction dissipates
The ingredient of hot material, the ingredient of the heat absorption heat accumulating and manufacturing process may refer to the corresponding embodiments of above-mentioned Fig. 1, here
No longer repeated.
The heat radiator part 104 further includes titanate coupling agent and glue-line；The mixing material is even with the titanate esters
Connection agent is mixed and made into heat radiator flaky material, and the one side of the glue-line is Nian Jie with the heat radiator flaky material, the glue
The opposite side of layer treats that heat dissipation region 101 is be bonded with described.It should be understood that the glue-line can be gum, double faced adhesive tape or release
Film etc..Wherein, making the detailed process of the heat radiator flaky material can be：Add in the mixing material for powder
Add the titanate coupling agent, to obtain organic composite shaping phase-change material, flake is made through tabletting machine, after cropped
Form the heat radiator flaky material of definite shape.When the heat radiator flaky material starts to treat radiating area described in absorption
During the heat that the heating device in domain 101 is transferred, the polyethylene glycol in the heat radiator flaky material is gradually by solid
State variation for liquid, the heat radiator flaky material at this time also gradually from hard to soft, to realize the storage to heat；Work as institute
When stating polyethylene glycol and becoming liquid completely, the heat radiator flaky material stops absorbing heat, and in the heating device
After temperature is gradually decrease to preset temperature, the polyethylene glycol is again solid-state by liquid variation, and the heat of absorption is given out
Come, the ingredient of the heat conduction and heat radiation material in the heat radiator flaky material can accelerate to distribute heat, at this time
The heat radiator flaky material also gradually change software strategy into software-hardware strategy.
Optionally, the heat radiator part 104 further includes protective film；The protective film bonding is arranged at the heat radiator
On flaky material, and heat dissipation region 101 is treated away from described.I.e. described heat radiator flaky material treats heat dissipation region described in being bonded in
After on 101, the protective film is set in the exposed part bonding of the heat radiator flaky material.The protective film can be right
The heat radiator flaky material is protected, is dust-proof, and the protective film can be the heat conduction and heat radiation materials such as graphite, with further
Improve the radiating rate of the heat radiator flaky material.
The embodiment of the present invention is inhaled by treating to set heat radiator part 104 in heat dissipation region 101 in terminal device 1
Hot radiating piece 104 includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, so as to treat heat dissipation
Heat in region 101 is absorbed, and the heat to being absorbed carries out heat accumulation and heat dissipation, and heat dissipation region is treated so as to reduce
101 temperature, and then reduce the temperature of heating device, to ensure mobile phone normal operation, while by heat accumulation and the effect of heat dissipation,
It can be directly delivered to avoid the heat for treating heat dissipation region 101 on phone housing, and then can be excessively high to avoid phone housing temperature.
One embodiment of the invention provides a kind of method for terminal device heat dissipation, the method includes the steps：
Setting heat radiator part in heat dissipation region is treated in the terminal device；The heat radiator part, which includes having, to be inhaled
The mixing material of the material properties of heat, heat accumulation and heat sinking function, the mixing material is by heat absorption heat accumulating and heat conduction and heat radiation material
Material composition；The heat conduction and heat radiation material is used for the heat transfer treated in heat dissipation region to the heat absorption heat accumulating, institute
It states heat absorption heat accumulating to be used to absorbing and storing the heat treated in heat dissipation region, while stores the heat conduction and heat radiation material and pass
The heat led；It is described to treat that heat dissipation region includes the region of the heating device in the terminal device, the heating device
At least one of region of outer surface region.
Optionally, in one embodiment, the heat radiator part further include retarder thinner and bond solution, then it is described
In the terminal device treat in heat dissipation region set heat radiator part the step of, specifically include：By the mixing material and institute
It states retarder thinner and bonds solution mixing, to form heat radiator coating material；The heat radiator coating material is coated on institute
It states and treats in heat dissipation region.Further, the heat radiator part further includes protective film, then is coated with the heat radiator described
Material is coated on after the step treated in heat dissipation region, is further included：Protective film bonding is arranged at the heat absorption to dissipate
On thermal coating material；The protective film treats heat dissipation region away from described.
Optionally, in one embodiment, the heat radiator part further include retarder thinner, bond solution, protective film with
And glue-line, then it is described in the terminal device treat in heat dissipation region set heat radiator part the step of, specifically include：By institute
It states mixing material to mix with retarder thinner bonding solution, to form heat radiator coating material；The heat radiator is applied
Cloth material is coated on the one side of the protective film, and is dissipated the heat absorption is coated in the one side of the glue-line and the protective film
One side bonds of thermal coating material, and the opposite side of the glue-line is treated that heat dissipation region is Nian Jie with described.
Optionally, in one embodiment, the heat radiator part further includes titanate coupling agent and glue-line, then it is described
In the terminal device treat in heat dissipation region set heat radiator part the step of, specifically include：By the mixing material and institute
Titanate coupling agent mixing is stated, heat radiator flaky material is made；By the one side of the glue-line and the heat radiator sheet
Material is bonded, and the opposite side of the glue-line being treated, heat dissipation region is Nian Jie with described.Further, the heat radiator part also wraps
Include protective film, then it is Nian Jie with the heat radiator flaky material in the one side by the glue-line, and by the another of the glue-line
One side with it is described treat the step of heat dissipation region is Nian Jie after, further include：Protective film bonding is arranged at the heat radiator
On flaky material；The protective film treats heat dissipation region away from described.
Wherein, the heat radiator material is mixed to form by heat sink material and heat absorption heat accumulating, the heat dissipation material
Mass ratio between material and the heat absorption heat accumulating is 1:1, the heat absorption heat accumulating is with heat absorption and heat storage function
The material of material properties.The heat absorption heat accumulating in the heat radiator material is made of polyethylene glycol and silica
Decalescence heat accumulating, mass ratio between the polyethylene glycol and the silica is 1:1-9:1；The heat dissipation material
Material is graphite or metal.The heat absorption heat accumulating is by several silica using after gel as cyst wall, with the poly- second after emulsification
Glycol is formed for the microcapsules of capsule-core.
The embodiment of the present invention in terminal device by treating to set heat radiator part, and heat radiator part in heat dissipation region
Including having the mixing material of the material properties of heat absorption, heat accumulation and heat sinking function, so as to treat the heat in heat dissipation region
Amount is absorbed, and the heat to being absorbed carries out heat accumulation and heat dissipation, so as to reduce the temperature for treating heat dissipation region, and then is dropped
The temperature of low heating device, can be to avoid treating radiating area to ensure mobile phone normal operation, while by heat accumulation and the effect of heat dissipation
The heat in domain is directly delivered on phone housing, and then can be excessively high to avoid phone housing temperature.
One embodiment of the invention provides a kind of manufacturing method of mixing material, including：It is molten that polyethylene glycol is added to silicon
In glue, after all dissolving, CaCl is added dropwise2Accelerator solution brings it about gelation reaction by stirring, three is formed after standing
Tie up network structure gel, then by the gel forced air drying 24-28 is small in 80 DEG C of baking ovens when, be subsequently cooled to room temperature, with
It is formed by several gelatinous heat absorption heat accumulation materials being made of using silica cyst wall, the microcapsules using polyethylene glycol as capsule-core
Material；The gelatinous heat absorption heat accumulating is smashed to pieces and stirs into powder, and with powdered heat conduction and heat radiation material with 1:1
Mass ratio is mixed, to form the mixing material.
Optionally, retarder thinner and special binder solution can also be added in the mixing material to be mixed,
To form the mixing material available for coating；The special binder solution is methanol dimethylbenzene or acrylic resin.
Optionally, titanate coupling agent can also be added in the mixing material, to form the mixing material of setting, warp
Tablet press machine carries out the mixing material of the setting tabletting to be made laminar mixing material, then by the laminar mixing
Material is Nian Jie with glue-line, then the laminar mixing material with the glue-line is cut, and can be used for gluing to be formed
Mixing material connecing and for sheet.
Wherein, the mass ratio between the silica in the polyethylene glycol and the Ludox is 1:1-9:1.
The embodiment of the present invention by heat conduction and heat radiation material and heat absorption heat accumulating by being mixed to form mixing material so that mixing
Material has heat absorption, the material properties of heat accumulation and heat sinking function, therefore, can be with if applying mixing material in mobile phone
The temperature of heating device is reduced, it, can be to avoid in mobile phone to ensure mobile phone normal operation, while by heat accumulation and the effect of heat dissipation
Portion's heat is directly delivered on phone housing, and then can be excessively high to avoid phone housing temperature.
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, therefore equivalent variations made according to the claims of the present invention, it is still within the scope of the present invention.
Claims (16)
1. a kind of terminal device, which is characterized in that including：Treat heat dissipation region and heat radiator part, the heat radiator part is set
It is treated in described in heat dissipation region；
The heat radiator part includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, the mixing material
Material is made of heat absorption heat accumulating and heat conduction and heat radiation material；The heat conduction and heat radiation material is used for the heat treated in heat dissipation region
Amount passes to the heat absorption heat accumulating, and the heat absorption heat accumulating is used to absorbing and storing the heat treated in heat dissipation region
Amount, while store the heat of the heat conduction and heat radiation material conduction；Wherein, it is described heat absorption heat accumulating be by it is several with gel after
Silica is made of cyst wall, the microcapsules using the polyethylene glycol after emulsification as capsule-core；Wherein, when the microcapsules are gradual
When absorbing heat, by the polyethylene glycol in the capsule-core gradually by solid state transformed for liquid, to realize the storage to heat；Work as institute
When stating the heat that microcapsules are absorbed and gradually decreasing, the polyethylene glycol in the capsule-core is gradually converted into solid-state by liquid, with
It radiates to the heat stored；When the capsule-core is when the heat to being stored radiates, the heat conduction and heat radiation material
The heat further distributed to the capsule-core radiates；Between the heat conduction and heat radiation material and the heat absorption heat accumulating
Mass ratio is 1:1；
Region, the outer surface of the heating device treated heat dissipation region and include the heating device in the terminal device
At least one of region region；It is described to treat that heat dissipation region includes shielding the metal surface of the shielding case of chip and electricity
The inner surface of the rear cover for the mobile terminal that pond is oppositely arranged；
Wherein, by first by the heat conduction and heat radiation material and for it is gelatinous it is described heat absorption heat accumulating carry out strong stirring, with
Respectively obtain corresponding powder, and will be for the heat conduction and heat radiation material of powder and be that the heat absorption heat accumulating of powder carries out
Mixing, obtains the heat radiator part；The heat that the heat conduction and heat radiation material absorbs multiple microcapsules is in X and Y side
It radiates upwards；
Wherein, the heat radiator part further includes titanate coupling agent and glue-line；
The mixing material is mixed and made into heat radiator flaky material, the one side of the glue-line and institute with the titanate coupling agent
Heat radiator flaky material bonding is stated, the opposite side of the glue-line treats that heat dissipation region is Nian Jie with described.
2. terminal device as described in claim 1, which is characterized in that described to treat that heat dissipation region includes shielding case region, display
Shield in region, display screen hardware bracket region, cell rear cover inner surface of outer cover region, chip outer surface region, earpiece area
At least one region.
3. terminal device as described in claim 1, which is characterized in that the heat radiator part further includes retarder thinner and bonding
Solution；
The mixing material bonds solution with the retarder thinner and is mixed to form heat radiator coating material, and the heat radiator applies
Cloth material is coated on described treat in heat dissipation region.
4. terminal device as claimed in claim 3, which is characterized in that the heat radiator part further includes protective film；
The protective film bonding is arranged on the heat radiator coating material, and treats heat dissipation region away from described.
5. terminal device as described in claim 1, which is characterized in that the heat radiator part further includes retarder thinner, bonding
Solution, protective film and glue-line；
The mixing material bonds solution with the retarder thinner and is mixed to form heat radiator coating material, and the heat radiator applies
Cloth material is coated on the one side of the protective film, and the one side of the glue-line is applied with being coated with the heat radiator in the protective film
One side bonds of cloth material, the opposite side of the glue-line treat that heat dissipation region is Nian Jie with described.
6. terminal device as described in claim 1, which is characterized in that the heat radiator part further includes protective film；
The protective film bonding is arranged on the heat radiator flaky material, and treats heat dissipation region away from described.
7. terminal device as described in claim 1, which is characterized in that the heat absorption heat accumulating in the mixing material is
The decalescence heat accumulating being made of polyethylene glycol and silica, the matter between the polyethylene glycol and the silica
Amount is than being 1:1-9:1；The heat conduction and heat radiation material is graphite or metal.
8. terminal device as claimed in claim 7, which is characterized in that it is described heat absorption heat accumulating by it is several with after gel two
Silica is that cyst wall, the microcapsules using the polyethylene glycol after emulsification as capsule-core are formed.
A kind of 9. method for terminal device heat dissipation, which is characterized in that including：
Setting heat radiator part in heat dissipation region is treated in the terminal device；The heat radiator part include with heat absorption,
The mixing material of the material properties of heat accumulation and heat sinking function, the mixing material is by heat absorption heat accumulating and heat conduction and heat radiation material group
Into；The heat conduction and heat radiation material is used for the heat transfer treated in heat dissipation region to the heat absorption heat accumulating, the suction
Hot heat accumulating is used to absorbing and storing the heat treated in heat dissipation region, while stores the heat conduction and heat radiation material conduction
Heat；Wherein, the heat absorption heat accumulating is as cyst wall, with the polyethylene glycol after emulsification by several silica using after gel
It is made of the microcapsules of capsule-core；Wherein, when the microcapsules gradually absorb heat, by the polyethylene glycol in the capsule-core
Gradually by solid state transformed for liquid, to realize the storage to heat；It, will when the heat that the microcapsules are absorbed gradually decreases
Polyethylene glycol in the capsule-core is gradually converted into solid-state by liquid, to radiate to the heat stored；When the capsule-core
When the heat to being stored radiates, the heat that the heat conduction and heat radiation material further distributes the capsule-core dissipates
Heat；Mass ratio between the heat conduction and heat radiation material and the heat absorption heat accumulating is 1:1；
Region, the outer surface of the heating device treated heat dissipation region and include the heating device in the terminal device
At least one of region region；It is described to treat that heat dissipation region includes shielding the metal surface of the shielding case of chip and electricity
The inner surface of the rear cover for the mobile terminal that pond is oppositely arranged；
Wherein, by first by the heat conduction and heat radiation material and for it is gelatinous it is described heat absorption heat accumulating carry out strong stirring, with
Respectively obtain corresponding powder, and will be for the heat conduction and heat radiation material of powder and be that the heat absorption heat accumulating of powder carries out
Mixing, obtains the heat radiator part；The heat that the heat conduction and heat radiation material absorbs multiple microcapsules is in X and Y side
It radiates upwards；
Wherein, the heat radiator part further includes titanate coupling agent and glue-line,
It is then described to treat setting heat radiator part in heat dissipation region in the terminal device, including：
The mixing material is mixed with the titanate coupling agent, heat radiator flaky material is made；
The one side of the glue-line is Nian Jie with the heat radiator flaky material, and the opposite side of the glue-line is waited to dissipate with described
Thermal region is bonded.
10. method as claimed in claim 9, which is characterized in that the heat radiator part further includes retarder thinner and bonding is molten
Liquid,
It is then described to treat setting heat radiator part in heat dissipation region in the terminal device, including：
The mixing material is bonded solution with the retarder thinner to mix, to form heat radiator coating material；
The heat radiator coating material is coated on described treat in heat dissipation region.
11. method as claimed in claim 9, which is characterized in that it is molten that the heat radiator part further includes retarder thinner, bonding
Liquid, protective film and glue-line,
It is then described to treat setting heat radiator part in heat dissipation region in the terminal device, including：
The mixing material is bonded solution with the retarder thinner to mix, to form heat radiator coating material；
The heat radiator coating material is coated on to the one side of the protective film, and by the one side of the glue-line and the protection
A side bonds of the heat radiator coating material are coated in film, and the opposite side of the glue-line is treated into heat dissipation region with described
Bonding.
12. method as claimed in claim 9, which is characterized in that the heat absorption heat accumulating is by several dioxies with after gel
SiClx is that cyst wall, the microcapsules using the polyethylene glycol after emulsification as capsule-core are formed.
13. a kind of manufacturing method of mixing material, which is characterized in that including：
Polyethylene glycol is added in Ludox, after all dissolving, CaCl is added dropwise2Accelerator solution is brought it about by stirring
Gelation reaction, forms the gel of three-dimensional net structure after standing, then by the gel in 80 DEG C of baking ovens forced air drying 24-28
Hour, be subsequently cooled to room temperature, using formed by it is several using silica as cyst wall, using polyethylene glycol as the microcapsules institute structure of capsule-core
Into gelatinous heat absorption heat accumulating；
The gelatinous heat absorption heat accumulating is smashed to pieces and stirs into powder, and with powdered heat conduction and heat radiation material with 1:1
Mass ratio mixed, to form the mixing material；The mixing material is heat radiator part, and the heat radiator part is set
It is placed in and treats in heat dissipation region；It is described to treat that heat dissipation region includes shielding the metal surface, opposite with battery of the shielding case of chip
The inner surface of the rear cover of the mobile terminal of setting；
Wherein, when the microcapsules gradually absorb heat, by the polyethylene glycol in the capsule-core gradually by solid state transformed for liquid
State, to realize the storage to heat；When the heat that the microcapsules are absorbed gradually decreases, by the poly- second two in the capsule-core
Alcohol is gradually converted into solid-state by liquid, to radiate to the heat stored；When the capsule-core the heat to being stored into
During row heat dissipation, the heat that the heat conduction and heat radiation material further distributes the capsule-core radiates；
Wherein, the heat that the heat conduction and heat radiation material absorbs multiple microcapsules radiates in x and y direction；
Wherein, the heat radiator part further includes titanate coupling agent and glue-line；
The mixing material is mixed and made into heat radiator flaky material, the one side of the glue-line and institute with the titanate coupling agent
Heat radiator flaky material bonding is stated, the opposite side of the glue-line treats that heat dissipation region is Nian Jie with described.
14. manufacturing method as claimed in claim 13, which is characterized in that further include：
Retarder thinner and special binder solution are added in the mixing material to be mixed, to be formed available for coating
Mixing material；
The special binder solution is methanol dimethylbenzene or acrylic resin.
15. manufacturing method as claimed in claim 13, which is characterized in that further include：
Titanate coupling agent is added in the mixing material, to form the mixing material of setting, through tablet press machine to the setting
Mixing material carry out tabletting so that laminar mixing material is made, it is then the laminar mixing material is Nian Jie with glue-line,
The laminar mixing material with the glue-line is cut again, to form available for bonding and mixing for sheet
Condensation material.
16. such as claim 13 to 15 any one of them manufacturing method, which is characterized in that
The mass ratio between silica in the polyethylene glycol and the Ludox is 1:1-9:1.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610286961.2A CN105916350B (en) | 2016-04-29 | 2016-04-29 | A kind of terminal device and associated method |
| PCT/CN2017/079591 WO2017185960A1 (en) | 2016-04-29 | 2017-04-06 | Terminal device and related method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610286961.2A CN105916350B (en) | 2016-04-29 | 2016-04-29 | A kind of terminal device and associated method |
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| CN105916350B true CN105916350B (en) | 2018-05-29 |
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| CN105916350B (en) * | 2016-04-29 | 2018-05-29 | 广东欧珀移动通信有限公司 | A kind of terminal device and associated method |
| WO2018119925A1 (en) * | 2016-12-29 | 2018-07-05 | 华为技术有限公司 | Heat dissipation device and terminal apparatus thereof |
| CN111793471B (en) * | 2020-06-30 | 2022-04-08 | 东莞新能德科技有限公司 | Composite phase change material, application method of composite phase change material and battery |
| CN115331549A (en) * | 2022-08-01 | 2022-11-11 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and electronic device |
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| CN101333094A (en) * | 2008-07-29 | 2008-12-31 | 武汉理工大学 | Method for preparing phase change asphalt pavement material |
| CN102241963A (en) * | 2011-05-20 | 2011-11-16 | 宁波诺丁汉大学 | Shape-stabilized phase change energy storage material with high-thermal conductivity and preparation method thereof |
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| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN101503618A (en) * | 2009-03-09 | 2009-08-12 | 中国科学技术大学 | Silicon dioxide gel micro-encapsulated phase change energy storage material and preparation thereof |
| CN103209566A (en) * | 2012-01-11 | 2013-07-17 | 新晟化工原料企业有限公司 | Radiating structure |
| US9226428B2 (en) * | 2012-06-28 | 2015-12-29 | Intel Corporation | High heat capacity electronic components and methods for fabricating |
| US9250027B2 (en) * | 2013-05-01 | 2016-02-02 | Finisar Corporation | Thermal management structures for optoelectronic systems |
| JP6167873B2 (en) * | 2013-06-27 | 2017-07-26 | ソニー株式会社 | Electronic device and control method of electronic device |
| CN104449590B (en) * | 2014-12-05 | 2017-09-15 | 中国工程物理研究院化工材料研究所 | A kind of Nano capsule of phase-changing energy storage material and preparation method thereof |
| CN104650929A (en) * | 2015-01-27 | 2015-05-27 | 上海应用技术学院 | Halogen-free flame-retardant temperature controlled microcapsules and preparation method thereof |
| CN105916350B (en) * | 2016-04-29 | 2018-05-29 | 广东欧珀移动通信有限公司 | A kind of terminal device and associated method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101333094A (en) * | 2008-07-29 | 2008-12-31 | 武汉理工大学 | Method for preparing phase change asphalt pavement material |
| CN102241963A (en) * | 2011-05-20 | 2011-11-16 | 宁波诺丁汉大学 | Shape-stabilized phase change energy storage material with high-thermal conductivity and preparation method thereof |
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| CN105916350A (en) | 2016-08-31 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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Granted publication date: 20180529 |