CN103209566A - Radiating structure - Google Patents
Radiating structure Download PDFInfo
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- CN103209566A CN103209566A CN2012100070397A CN201210007039A CN103209566A CN 103209566 A CN103209566 A CN 103209566A CN 2012100070397 A CN2012100070397 A CN 2012100070397A CN 201210007039 A CN201210007039 A CN 201210007039A CN 103209566 A CN103209566 A CN 103209566A
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- heat
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- radiator structure
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Abstract
A radiating structure is provided with a base layer, wherein a heat storage layer is arranged on the base layer, and a plurality of phase change material particles are arranged in the heat storage layer. A radiating layer is arranged on the heat storage layer, and a plurality of porous materials are arranged in the radiating layer. Therefore, when the base layer starts to generate heat, the heat storage layer can effectively adsorb heat sources generated by the base layer by aid of the high latent heat property of the phase change material particles, and the contact area of the radiating layer and the air can be increased by aid of the porous materials so as to fast dissipate the heat sources stored in the heat storage layer. Furthermore, the radiating structure has superior radiating capability and volume superiority compared with the existing radiators.
Description
Technical field
The present invention is relevant with a kind of radiator structure, refers to a kind of radiator structure that utilizes phase-transition material to dispel the heat especially.
Background technology
Regular meeting is on a heater at present; as electronic chip etc.; one radiator is set, in the hope of by this radiator this heater being dispelled the heat, guarantees that this heater can normal operation; wherein; this present radiator can have a body mostly, and a side of this body is to be arranged on this heater, and side then convexes with a plurality of fins in addition; can be for the contact area of increase with air, to promote radiating rate and effect.
Yet, because this radiator is to utilize heat conducting principle to dispel the heat, therefore the heat-sinking capability of this radiator is the quantity and size that depends on fin, cause this heat sink applications when chip for cell phone etc. need be in the field that narrow environment dispels the heat, its radiating effect will be had a greatly reduced quality, and can't effectively help this heater to dispel the heat, be with, this case inventor is after observing above-mentioned shortcoming, think that this known radiating mode has necessity of further improvement in fact, and with generation of the present invention is arranged.
Summary of the invention
The objective of the invention is is providing a kind of radiator structure with superior heat-sinking capability and volume advantage.
For reaching above-mentioned purpose, radiator structure provided by the present invention, it is to include a basic unit; And a reservoir, it is at least one side that is arranged at this basic unit, and is to be provided with a plurality of phase-transition material particles in this reservoir; Also have a heat dissipating layer, it is to be arranged at this reservoir side in addition of this basic unit relatively, and is to be provided with a plurality of porous materials in this heat dissipating layer.
As preferred version, wherein, this reservoir is to mix the back with a viscose by described phase-transition material particle to be constituted.
As preferred version, wherein, also further be provided with a plurality of cavernous auxiliary materials in this reservoir.
As preferred version, wherein, this basic unit is wherein a kind of or its combination that is selected from metal, pottery and graphite.
As preferred version, wherein, this basic unit is a heater.
As preferred version, wherein, this basic unit is a heat-carrying conductor.
As preferred version, wherein, this porous material is wherein a kind of or its combination that is selected from graphite, montmorillonite and aluminium oxide.
As preferred version, wherein, this auxiliary material is wherein a kind of or its combination that is selected from graphite, montmorillonite and aluminium oxide.
Radiator structure provided by the present invention, when this basic unit begins adstante febre, the high latent heat characteristic that this reservoir can have by described phase-transition material particle itself this moment, effectively absorption stores the thermal source that this basic unit sends, this heat dissipating layer then can by described porous material increase and air between contact area, dispel the heat with the thermal source that fast this reservoir is stored, thus, make radiator structure of the present invention not only have superior heat-sinking capability, and adopt the mode of fin heat radiation to compare the advantage that has more on the volume with known radiator, need be in the field that narrow environment dispels the heat and can be applied in chip for cell phone etc.
Description of drawings
For being illustrated more clearly in the present invention, below in conjunction with preferred embodiment and conjunction with figs. describes in detail as after, wherein:
Fig. 1 is the cutaway view of preferred embodiment of the present invention.
Fig. 2 is the use schematic diagram of preferred embodiment of the present invention.
Fig. 3 is the cutaway view of another preferred embodiment of the present invention.
Embodiment
Seeing also shown in Figure 1ly, is the cutaway view for preferred embodiment of the present invention, and it is to disclose a kind of radiator structure 100 is arranged, and this radiator structure 100 mainly includes:
One basic unit 10, it is wherein a kind of or its combination that is selected from metal, pottery and graphite, also can be a heater, as an electronic chip, or is a heat-carrying conductor, as heat pipe etc., in present embodiment, this basic unit 10 is made of metal.
One reservoir 20, it is at least one side that is arranged at this basic unit 10, and be to be provided with a plurality of phase-transition material particles 21 (Phase Change Materials in this reservoir 20, PCM), in present embodiment, described phase-transition material particle 21 is earlier with after a viscose 22 mixes, and coats this basic unit 10 again to form this reservoir 20.
One heat dissipating layer 30, it is the side in addition that is arranged at these reservoir 20 relative these basic units 10, and is to be provided with a plurality of porous materials 31 in this heat dissipating layer 30, in present embodiment, this porous material 31 is wherein a kind of or its combinations that are selected from graphite, montmorillonite and aluminium oxide.
Please continue to consult shown in Figure 1 again, when making this radiator structure 100, the user is as long as be ready to this basic unit 10 earlier, afterwards again with described phase-transition material particle 21 with after this viscose 22 mixes, coat a side of this basic unit 10, just can in this basic unit 10, form this reservoir 20, when taking advantage of the unhardened maturation still of this viscose 22 at last, described porous material 31 is laid in the side in addition of these reservoir 20 relative these basic units 10, just can on this reservoir 20, form this heat dissipating layer 30, and finish the manufacturing of this radiator structure 100, what deserves to be mentioned is that the user also can utilize other modes to form this reservoir 20, for example prior to this viscose 22 of coating in this basic unit 10, it is first-class more described phase-transition material particle 21 to be laid in this viscose 22, only is a kind of preferable feasible mode shown in the present embodiment, can't limit claim of the present invention.
Please consult shown in Figure 2 more simultaneously, it is the use schematic diagram for preferred embodiment of the present invention, because the basic unit 10 in the present embodiment is a metal, therefore the user can make earlier to finish this radiator structure 100, again this radiator structure 100 is arranged on the heater 200, as an electronic chip, thus, when this basic unit 10 begins adstante febre by the thermal source that the heat conduction receives this heater 200, this moment, this reservoir 20 can be by the described phase-transition material particle 21 high latent heat characteristics that have own, gradually changed in the liquid phase change process by solid-state being heated, effectively draw and store the thermal source that this basic unit 10 sends, and then the temperature of this heater 200 can be controlled within the specific limits, to guarantee that this heater 200 can not influence running because of overheated, 30 of this heat dissipating layers can increase contact area with air by described porous material 31 simultaneously, fast described phase-transition material particle 21 is dispelled the heat, thus, make radiator structure of the present invention not only can have superior heat-sinking capability, and adopt the mode of fin heat radiation to compare the advantage that has more on the volume with known radiator, need be in the field that narrow environment dispels the heat and can be applied in chip for cell phone etc.
Please consult shown in Figure 3 again, it is the cutaway view for another preferred embodiment of the present invention, this radiator structure 100 is to be with aforementioned preferred embodiment difference, further be provided with a plurality of cavernous auxiliary materials 23 in this reservoir 20, and should auxiliary material 23 be wherein a kind of or its combinations that are selected from graphite, montmorillonite and aluminium oxide, and be filled in 21 of described phase-transition material particles, can be for strengthening heat-conducting effect, with the heat-sinking capability of this radiator structure 100 of further increase.
Claims (8)
1. radiator structure, it includes:
One basic unit;
One reservoir, it is arranged at least one side of this basic unit, and is provided with a plurality of phase-transition material particles in this reservoir;
One heat dissipating layer, it is arranged at this reservoir side in addition of this basic unit relatively, and is provided with a plurality of porous materials in this heat dissipating layer.
2. according to the described radiator structure of claim 1, wherein, this reservoir mixes the back by described phase-transition material particle and is constituted with a viscose.
3. according to claim 1 or 2 described radiator structures, wherein, also further be provided with a plurality of cavernous auxiliary materials in this reservoir.
4. according to the described radiator structure of claim 1, wherein, this basic unit is selected from wherein a kind of or its combination of metal, pottery and graphite.
5. according to the described radiator structure of claim 1, wherein, this basic unit is a heater.
6. according to the described radiator structure of claim 1, wherein, this basic unit is a heat-carrying conductor.
7. according to the described radiator structure of claim 1, wherein, this porous material is selected from wherein a kind of or its combination of graphite, montmorillonite and aluminium oxide.
8. according to the described radiator structure of claim 3, wherein, this auxiliary material is selected from wherein a kind of or its combination of graphite, montmorillonite and aluminium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100070397A CN103209566A (en) | 2012-01-11 | 2012-01-11 | Radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100070397A CN103209566A (en) | 2012-01-11 | 2012-01-11 | Radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103209566A true CN103209566A (en) | 2013-07-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100070397A Pending CN103209566A (en) | 2012-01-11 | 2012-01-11 | Radiating structure |
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| Country | Link |
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| CN (1) | CN103209566A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106817880A (en) * | 2015-11-27 | 2017-06-09 | 小米科技有限责任公司 | Can heat accumulation radiating device and electronic equipment, heat accumulation radiating implementation method |
| WO2017185960A1 (en) * | 2016-04-29 | 2017-11-02 | 广东欧珀移动通信有限公司 | Terminal device and related method |
| CN108990365A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Radiator structure, shell and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1336992A2 (en) * | 2002-02-15 | 2003-08-20 | Delphi Technologies, Inc. | Thermally-capacitive phase change encapsulant for electronic devices |
| CN1491438A (en) * | 2001-04-06 | 2004-04-21 | 信越化学工业株式会社 | Radiating structural body of electronic part and radiating sheet used for radiating structural body |
| TWM351450U (en) * | 2008-07-24 | 2009-02-21 | Yi-Min Lin | Integrated circuit having porous ceramic heat dissipation plate |
| CN201285762Y (en) * | 2008-11-06 | 2009-08-05 | 同济大学 | Electronic heat radiation apparatus based on phase change energy accumulation nano capsule |
-
2012
- 2012-01-11 CN CN2012100070397A patent/CN103209566A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1491438A (en) * | 2001-04-06 | 2004-04-21 | 信越化学工业株式会社 | Radiating structural body of electronic part and radiating sheet used for radiating structural body |
| EP1336992A2 (en) * | 2002-02-15 | 2003-08-20 | Delphi Technologies, Inc. | Thermally-capacitive phase change encapsulant for electronic devices |
| TWM351450U (en) * | 2008-07-24 | 2009-02-21 | Yi-Min Lin | Integrated circuit having porous ceramic heat dissipation plate |
| CN201285762Y (en) * | 2008-11-06 | 2009-08-05 | 同济大学 | Electronic heat radiation apparatus based on phase change energy accumulation nano capsule |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106817880A (en) * | 2015-11-27 | 2017-06-09 | 小米科技有限责任公司 | Can heat accumulation radiating device and electronic equipment, heat accumulation radiating implementation method |
| CN106817880B (en) * | 2015-11-27 | 2019-05-21 | 小米科技有限责任公司 | Can heat accumulation heat dissipation device and electronic equipment, heat accumulation radiate implementation method |
| WO2017185960A1 (en) * | 2016-04-29 | 2017-11-02 | 广东欧珀移动通信有限公司 | Terminal device and related method |
| CN108990365A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Radiator structure, shell and electronic equipment |
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Application publication date: 20130717 |