CN105517424B - The two-way anti-failure heat pipe temperature uniforming heat radiation devices and methods therefor of complementary electronic device substrate - Google Patents
The two-way anti-failure heat pipe temperature uniforming heat radiation devices and methods therefor of complementary electronic device substrate Download PDFInfo
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- CN105517424B CN105517424B CN201610059356.1A CN201610059356A CN105517424B CN 105517424 B CN105517424 B CN 105517424B CN 201610059356 A CN201610059356 A CN 201610059356A CN 105517424 B CN105517424 B CN 105517424B
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Abstract
The invention discloses a kind of two-way anti-failure heat pipe temperature uniforming heat radiation devices and methods therefors of complementary electronic device substrate.It includes condensation segment radiating fin, heat-radiating substrate entity, No.1 heat pipe heat, No. two heat pipe heats.The present invention can carry uniformly distributed or non-uniformly distributed plane heat source using the arrangement of the two radiating surfaces up and down area of heat-radiating substrate, utilize the heat pipe heat of two-way complementary structure, failure can be prevented under the conditions of the variable working condition of non-homogeneous hot-fluid and substrate and gravity at different angles, realizes and the samming of entire heat-radiating substrate is controlled；Condensation segment connects radiating fin, can be radiated by heat convection, prevent overtemperature, guarantee the normal work of electronic device.
Description
Technical field
The present invention relates to a kind of two-way anti-failure heat pipe temperature uniforming heat radiation devices of complementary electronic device substrate, belong to specific condition
Lower Cooling Technology of Electronic Device field.
Background technique
The volume of the high frequency of electronic device, high speed and integrated circuit is smaller and smaller, so that the electronic component of unit volume
Calorific value increased dramatically, and the rate of breakdown of electronic device is the raising with operating temperature and has exponent relation growth, electricity
Sub- device operation error 55% is all as caused by overheat, and to guarantee job stability and prolonging the service life, chip is most
High-temperature must not exceed 85 DEG C.
There are various features for dissipation from electronic devices at present, lack enough heat-dissipating spaces near heating sources；Heat source is distributed not
Uniformly, it needs effectively to be radiated from multiple heat sources；To prevent dust, corrosive gas, the rainwater etc. in external environment
Infringement to electronic device need to radiate in closed space；It is required that small in size and light weight.
In addition, being within the scope of a suitable temperature for the electronic device for keeping heating power different, it is sometimes desirable to
Using different temperature control measures, the uniform temperature of electronic device can be effectively kept using the excellent thermal conduction characteristic of heat pipe, to simplify heat
Control system improves the system level and reliability.
Heat dissipation of electronic device under the conditions of variable working condition is current constraint information, electronics and aeronautical and space technology development
One of factor.Traditional single heat pipe and flat-plate heat pipe structure cannot be well adapted for the heat dissipation under the conditions of variable working condition, need to lead to
It crosses other reasonable heat dissipations and guarantees that electronic device operates normally not overtemperature.
Summary of the invention
Object of the present invention is to guarantee that electronic device works normally under normal running (operation) conditions, prevents variable working condition conditional electronic device
The problems such as heat pipe fails in substrate causes substrate temperature distribution obvious uneven, and local temperature is excessively high and jeopardizes electronic device just
Often work.
To achieve the above object, the invention adopts the following technical scheme:
A kind of anti-failure heat pipe temperature uniforming heat radiation device of two-way complementary electronic device substrate includes condensation segment radiating fin, heat dissipation
Substrate solid, No.1 heat pipe heat, No. two heat pipe heats；In No.1 heat pipe heat, No. two heat pipe heat partial insertion heat-radiating substrate entities, institute
No.1 heat pipe heat, No. two heat pipe heats stated include condensation segment, adiabatic section and evaporator section, and wherein evaporator section is insertion heat-radiating substrate
Part in entity is provided with heat insulating coating on adiabatic section, and condensation segment radiating fin is welded on condensation segment, heat-radiating substrate entity
Side surface carry out insulation, heat-radiating substrate lower surface and upper surface carry plane heat source, and plane heat source is attached to heat-radiating substrate surface
Heat source arranges area.
Heat-radiating substrate uses the lesser metal material of aluminium alloy isodensity, and the shape of substrate front and back sides can be rectangle, positive six
The centrosymmetric structures such as side shape, octagon, the opposite two sided aperture of substrate, aperture depth can be according to insertion heat pipe evaporator sections
Need select, plate use 20 DEG C at material of the thermal coefficient more than 150W/ (m*K).
The No.1 heat pipe heat, No. two heat pipe heats are in a center of symmetry about heat-radiating substrate entity center of gravity, No.1 heat pipe heat,
Fill heat-conducting glue in the gap of No. two heat pipe heats and heat-radiating substrate entity.Working medium is in the No.1 heat pipe heat, No. two heat pipe heats
Acetone, ethyl alcohol or heptane, working range are full of liquid-sucking core in 0 DEG C~150 DEG C, filling amount 5%~15%.
Heat pipe quantity is one or more in the No.1 heat pipe heat or No. two heat pipe heats.The heat-radiating substrate entity
On can offer aperture, fillet, groove.
Layout area of the heat-radiating substrate tow sides region as plane heat source can arrange uniformly distributed or non-uniformly distributed face heat
Source.Heat-radiating substrate side and the two sides of stretching are adiabatic section, are relatively at a distance condensation segment, to improve convection transfer rate, are used
Fin extended surface.
Evaporator section is fitted closely using highly heat-conductive material and heat-radiating substrate inner wall, to reduce thermal contact resistance.Heat pipe needs to select
With with higher capillary attraction and compared with the liquid sucting core structure or composite construction of low flow resistance, according to thermic load and can specifically exchange work
Condition situation is preferentially chosen.The heat that plane heat source is applied to heat-radiating substrate is transferred to condensation segment to two sides by heat pipe, and condensation segment is adopted
Heat is taken away with heat convection mode, a plurality of extension fin surfaces are set on tube wall.In view of start-up course prevents condensation segment
Liquid solidification, heat-pipe working medium select acetone, ethyl alcohol, heptane, and working range is at 0 DEG C~150 DEG C, and the liquid compatible with heat resistant material
Body, working fluid are full of liquid-sucking core.
Through the implementation of the above technical solution, the present invention is double because having used compared to single heat pipe and flat-plate heat pipe technology
To complementary heat pipe combination, reduces the thermal conduction resistance of heat-radiating substrate, make the thermal coefficient of entire heat-radiating substrate under specific condition
It improves a lot, makes the temperature field of heat-radiating substrate tend to uniformly, ensure that the even temperature effect of heat-radiating substrate, it is super to prevent part
The situation of temperature.It is dissipated when changing variable working condition condition such as heat-radiating substrate plane and horizontal sextant angle using the heat pipe combination of two-way complementation
Thermal energy power is unlikely to completely lose, even if it is to improve the reliable of substrate heat dissipation along gravitational conditions that, which against gravity, still there is one end in one end,
Property.Without using structures such as loop circuit heat pipe and liquid storage devices, relatively convenient is processed, it is at low cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the anti-failure heat pipe temperature uniforming heat radiation device of two-way complementary electronic device substrate；
Fig. 2 is the schematic side view of dissipation from electronic devices substrate；
Fig. 3 is the top view in dissipation from electronic devices substrate plane heat source arrangement area；
In figure: condensation segment radiating fin 1, condensation segment 2, adiabatic section 3, heat-radiating substrate insulation side 4, heat-radiating substrate entity 5,
Evaporator section 6, No.1 heat pipe heat 7, heat-radiating substrate lower surface 8, heat-radiating substrate upper surface 9, two heat pipe heat 10, heat-radiating substrate surface
Heat source arranges area 11.
Specific embodiment
As shown in Figure 1, 2, 3, the anti-failure heat pipe temperature uniforming heat radiation device of two-way complementary electronic device substrate includes that condensation segment dissipates
7, No. two hot fin 1, heat-radiating substrate entity 5, No.1 heat pipe heat heat pipe heats 10；It inserts 7, No. two 10 parts of heat pipe heat of No.1 heat pipe heat
Enter in heat-radiating substrate entity 5, described 7, No. two heat pipe heats 10 of No.1 heat pipe heat include condensation segment 2, adiabatic section 3 and evaporator section
6, wherein evaporator section 6 is the part being inserted into heat-radiating substrate entity 5, is provided with heat insulating coating, condensation segment radiating fin on adiabatic section 3
Piece 1 is welded on condensation segment 2, and the side surface 4 of heat-radiating substrate entity 5 carries out insulation, heat-radiating substrate lower surface 8 and upper surface
9 carrying plane heat sources, plane heat source are attached to heat-radiating substrate surface heat source arrangement area 11.
Heat-radiating substrate lower surface 8 and upper surface 9 can carry plane heat source, plane heat source can it is uniformly distributed using the methods of patch or
Non- to be evenly arranged on heat-radiating substrate surface heat source arrangement area 11, to reduce thermal contact resistance when fitting, fitting should be close as far as possible, available
Heat-conducting silicone grease etc. has the material connection or filling of high thermal conductivity.5 main structure of heat-radiating substrate entity should be central symmetry,
Front and back sides are the structures such as rectangle, regular hexagon, allow the presence of the process structures such as aperture, fillet, groove, but cannot influence to lead
Body.Plate should be using the metal material with preferable thermal coefficient, while density is relatively low, with alleviator weight.Two or
Two groups of No.1 heat pipe heats 7 with liquid-sucking core and No. two heat pipe heats 10 are arranged in insertion heat-radiating substrate 5 in a center of symmetry, guarantee heat pipe
Evaporator section outer surface is well contacted with heat-radiating substrate inner surface, and interference fit, filling highly heat-conductive material or integration can be used
Processing method.Plough groove type liquid-sucking core, sintering metal can be used in the liquid sucting core structure that No.1 heat pipe heat 7 and No. two heat pipe heats 10 are selected
Powder type liquid-sucking core, screen type liquid-sucking core, fiber type liquid-sucking core or arterial highway liquid-sucking core, preferentially according to thermic load and variable working condition situation
It chooses.Heat pipe selects metal material such as copper, it is contemplated that and the compatibility and start-up course of metal material prevent condensation segment liquid from solidifying,
Heat-pipe working medium selects the working ranges such as acetone, ethyl alcohol, heptane at 0 DEG C~150 DEG C, with the good fluid of tube material compatibility, fills
Liquid measure 5%~15%, it is ensured that liquid-sucking core can be full of.Heat-radiating substrate side surface 4 should have heat insulating coating etc. to carry out insulation, prevent
Only the heat of heat-radiating substrate is distributed to the space that should not be transmitted.Adiabatic section 3 also carries out insulation, concentrates heat and transmits to cold
Solidifying section.A plurality of radiating fins 1 are provided in 2 outside wall surface of condensation segment, the radiating fin 1 on each heat pipe is evenly distributed on pipe
It is excellent to contact radiating fin 1 with condensation segment 2 in outside wall surface, the method or integration processing of metal welding can be used
Method.Condensation segment 2, which is placed among heat-dissipating space, to radiate.
It illustratively can be used for the anti-failure heat pipe temperature uniforming heat radiation device of two-way complementary electronic device substrate of variable working condition below
Specific work process: electronic device plane heat source be arranged in heat-radiating substrate surface heat source arrangement area 11, by way of heat transfer
Heat-radiating substrate entity 5 is passed to, the heat in heat-radiating substrate entity 5 diffuses to No.1 heat pipe heat 7 and No. two heat pipes by thermally conductive
Other regions in the evaporator section 6 and substrate of group 10.Liquid working substance is curved in liquid-sucking core in No.1 heat pipe heat 7 and No. two heat pipe heats 10
Evaporative phase-change on lunar surface, absorb amount of heat, by steam channel reach condensation segment 2, steam condensation heat release, condensation segment wall surface and
Fin 1 is completed to function of environment heat emission, liquid returns to evaporation by capillary force and possible gravity booster action by Convective heat tranfer cooling
Section 6 works on.Since latent heat of phase change is huge compared with sensible heat, the thermal resistance of No.1 heat pipe heat 7 and No. two heat pipe heats 10 is relatively low, leads
Hot coefficient is therefore very high.The mean coefficient of heat conductivity of heat-radiating substrate entity 5 is improved, the uniform temperature of heat-radiating substrate is also improved.One
The thermal resistance of number heat pipe heat 7 and No. two heat pipe heats 10 is very low, and heat is effectively passed to condensation segment 2 by heat pipe, passes through heat convection
Mode take away, so that heat-radiating substrate 5 and heat-radiating substrate surface heat source is arranged the not overtemperature of area 11.
Under the conditions of variable working condition, heat-radiating substrate surface heat source arranges that hot-fluid difference can be very big in area 11, but two-way complementation
Two heat pipes cover most regions of heat-radiating substrate 5, lower thermal resistance effectively guides the flow direction of heat, makes in substrate
Hot-fluid is intended to heat pipe evaporator section 6, and then heat-radiating substrate 5 is made to still keep preferable even temperature effect.When variable working condition is heat dissipation base
When plate plane carries out the rotation of all directions around center of gravity, without paying close attention to using gravity field direction as the plane of normal direction, it is only necessary to close
Note is parallel to the plane of gravity field direction, at this moment the No.1 heat pipe heat 7 of two-way complementation and No. two heat pipe heats 10 will present one it is suitable
The case where inverse gravity of gravity one is run, wherein the heat pipe run against gravity is since gravity hinders capillary force, working performance decline,
But another then receives the booster action of gravity, and working performance will enhance, and compensates for the effect decline of another.It is applied to scattered
The heat in hot substrate surfaces heat source arrangement area 11 is unlikely to have nowhere to go, therefore heat will not gather in heat-radiating substrate entity 5,
So electronic device overtemperature still can be prevented, it is ensured that its reliability service.
Claims (1)
1. a kind of heat dissipating method of the anti-failure heat pipe temperature uniforming heat radiation device of two-way complementary electronic device substrate, the two-way complementary electrical
The sub- anti-failure heat pipe temperature uniforming heat radiation device of device substrate comprising condensation segment radiating fin (1), heat-radiating substrate entity (5), No.1
Heat pipe heat (7), No. two heat pipe heats (10)；No.1 heat pipe heat (7), No. two heat pipe heat (10) partial insertion heat-radiating substrate entities (5)
In, the No.1 heat pipe heat (7), No. two heat pipe heats (10) include condensation segment (2), adiabatic section (3) and evaporator section (6),
Middle evaporator section (6) is the part being inserted into heat-radiating substrate entity (5), and heat insulating coating, condensation segment heat dissipation are provided on adiabatic section (3)
Fin (1) is welded on condensation segment (2), and the side surface (4) of heat-radiating substrate entity (5) carries out insulation, heat-radiating substrate following table
Face (8) and upper surface (9) carry plane heat source, and plane heat source is attached to heat-radiating substrate surface heat source arrangement area (11), the No.1 heat
Pipe group (7), No. two heat pipe heats (10) are in a center of symmetry about heat-radiating substrate entity (5) entity center of gravity, No.1 heat pipe heat (7), two
Fill heat-conducting glue in the gap of number heat pipe heat (10) and heat-radiating substrate entity (5)；The No.1 heat pipe heat (7), No. two heat pipe heats
It (10) is straight tube；The No.1 heat pipe heat (7), No. two interior working medium of heat pipe heat (10) are acetone, ethyl alcohol or heptane, working range
At 0 DEG C ~ 150 DEG C, filling amount 5% ~ 15% is full of liquid-sucking core；The liquid-sucking core that No.1 heat pipe heat (7) and No. two heat pipe heats (10) are selected
Structure uses plough groove type liquid-sucking core, sintering metal powder formula liquid-sucking core, screen type liquid-sucking core, fiber type liquid-sucking core or arterial highway imbibition
Core, heat pipe select metal material；
It is characterized by: electronic device plane heat source is arranged in heat-radiating substrate surface heat source arrangement area (11), heat is passed by heat
The mode led passes to heat-radiating substrate entity (5), and the heat in heat-radiating substrate entity (5) diffuses to No.1 heat pipe heat by thermally conductive
(7) and the evaporator section 6 of No. two heat pipe heats (10) and other regions in substrate；
No.1 heat pipe heat (7) and No. two interior liquid working substance of heat pipe heat (10) evaporative phase-changes on liquid-sucking core meniscus absorb heat,
Condensation segment (2) are reached by steam channel, steam condensation heat release, condensation segment wall surface and fin (1) are completed by Convective heat tranfer cooling
To function of environment heat emission, liquid returns to evaporator section (6) by capillary force and gravity booster action and works on；
When variable working condition is rotation of the heat-radiating substrate plane around center of gravity progress all directions, the No.1 heat pipe heat of two-way complementation
(7) and a case where heat pipe heat is run along one heat pipe heat of gravity against gravity will be presented in No. two heat pipe heats (10), wherein inverse weight
The heat pipe heat of power operation is since gravity hinders capillary force, working performance decline, but another heat pipe heat then receives the auxiliary of gravity
Effect is helped, working performance will enhance, and compensate for the effect decline of another heat pipe heat, be applied to heat-radiating substrate surface heat source arrangement
The heat in area (11) will not gather in heat-radiating substrate entity (5), it is ensured that reliability service.
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| CN107504847A (en) * | 2017-09-14 | 2017-12-22 | 济南大学 | A kind of heat-pipe elements of two-way heat transfer |
| CN107613731A (en) * | 2017-09-22 | 2018-01-19 | 浙江大学 | Suitable for the on-plane surface flat hot pipe radiator structure of aero-space electronic equipment |
| CN107687784A (en) * | 2017-09-25 | 2018-02-13 | 济南大学 | A kind of two-way long heat pipe of energy translation-angle |
| CN109588015B (en) * | 2018-12-21 | 2020-12-29 | 中国航空工业集团公司西安航空计算技术研究所 | Distributed heat storage system |
| CN110131796A (en) * | 2019-05-20 | 2019-08-16 | 广东美的暖通设备有限公司 | Radiator, air conditioner and its control method, computer readable storage medium |
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| CN101616566B (en) * | 2008-06-25 | 2012-07-04 | 富准精密工业(深圳)有限公司 | Heat sink |
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