1309149 九、發明說明： Η #/。月3丨日修(更)正替換頁 【發明所屬之技術領域】 種用於電子元 本發明涉及一種散熱裝置，尤其係指一 件散熱之散熱裝置。 【先前技術】 電子元件如中央處理器等在運行過程中產生大量之 熱’為確保電子元件之正常運行，其產生之熱需及時地散 發出去。通常，該電子元件上加裝一散熱裝置。 苇用之散熱裝置包括一金屬底板及從該底板延伸之複 數散熱鰭片。該底板貼置於發熱電子元件而吸收其產生之 熱量，進而將熱量傳遞至鰭片而散發到周圍空間。然而隨 著電子產業之發展，電子元件之運行頻率和功能日益提 升，其發熱量亦隨之增加。所述散熱器需加設一熱管以提 升其散熱性能。如圖1所示，一散熱裝置包括一底板1、設 於該底板1上表面之複數鰭片3及從該底板1向鰭片3傳熱之 二熱管2。該底板1之上表面設置二平行溝槽^，每一熱管2 包括一結合至相應溝槽Η内之直線形蒸發部21、穿過鰭片3 上部且平行於該蒸發部21之直線形冷凝部22及位於鰭片3 一側之連接該蒸發部21和冷凝部22之絕熱部23。使用時， δ亥底板1接觸電子元件而吸收該電子元件產生之熱量，部分 熱置由底板1直接傳遞至縛片3之下部，部分熱量由結合至 該底板1之熱管2蒸發部21吸收，進而通過絕熱部23和冷凝 部22傳遞至鰭片3之上部，從而，該電子元件產生之熱量由 7 ,1309149 正替換頁 .、、、曰片3散發至周圍空間。然~-- 中於底板1之中部，且由敎 &產生之熱量通常集 限，所以麻缸ί + 由…、& 2蒸發部21傳遞之熱量亦有 限所以底板1之中部仍有大 有 子元件之正當Μ — 里<*、、、里積聚。故，為確保電 ^ 仃，該散熱裝置需進-步改進。 【發明内容】 疋/汉進 有鑒·於此，實有必I# 、要k供一種散熱性能好之散熱裝置。 ㈣2㈣裝置用於電子7^件散熱，其包括—底板、置 献：及〜二ί數散熱鰭片、連接該底板和該鰭片之第-5折、、，，&於該底板之第二熱管，該第—熱管包括姓 二：底板之蒸發部和與該鰭片結合之冷凝部，該第二： :二括位：該底板中部之第一傳熱段和位於該底板相對兩 匕一 k傳熱段，及連接傳熱段和第二傳熱段 =-弟二傳熱段’該二第三傳熱段位於該底板之另兩相對 邊部。 與習知技術相比’所述第Hf折結合至所述底板 ，而將發熱電子元件產生之熱較為均勻之分佈至該底板上， 從：防止底板之中部熱量之過分積累，由底板向鰭片之傳 熱里增加，該散熱裝置之散熱性能得以提升。 【實施方式】 請參閱圖2,本發明散熱裝置包括一底板1〇、置於該底 板10之複數鰭片30、一對連接該底板10和鰭片30之第一熱 管7〇、及置於該底板10上之一第二熱管5〇。 所述底板10為一大致呈方形之導熱性能良好之金屬板 1309149 ---^—— fl卑。月曰修(見)正替換頁 體，如鋼板、鋁板等。該底板10之上表面設有—大致呈“S” 形之第-溝槽11G，以結合第二熱管5G。該第—溝槽110包 .括位於該底板10中部之-第一溝槽段ln、分別位於底板1〇 •一相對兩邊部之二第二溝槽段113。該二第二溝槽段⑴和 =一溝槽段111相互平行。每一第二溝槽段113和第一溝槽 段ill通過一第三溝槽段115連接。該二第三溝槽段115均大 致呈弧形，分別位於該底板10之另一相對兩邊部。該底板 10於每一第二溝槽段113和第一溝槽段U1之間且平行于第 二溝槽段113設有一第二溝槽120,以結合第一熱管7〇。 所述每一鰭片30為大致呈方形之金屬片體，其包括一 本體（未標示），該本體靠近其上部位置處設有大致位於 同-水平位置之分開之二開孔，該複數鰭片3()之開孔形成 結合第一熱管70之通道31〇。 所述每一第一熱管70大致呈“U、，其包括一蒸發部 710、平行於該蒸發部710之冷凝部72〇及連接該蒸發部 和冷凝部720之絕熱部730。其中，該冷凝部72〇略長於該蒸 發部710。該絕熱部730大致與該蒸發部71〇和冷凝部垂 直。該蒸發部710、絕熱部73〇及冷凝部72〇之連接處形成圓 角0 請參閱圖2和圖3,所述第二熱管5〇與所述底板ι〇之第 一溝槽110之彎曲形狀相同，大致呈“s，’形，其包括一第 一傳熱段510、與第一傳熱段51〇平行之二第二傳熱段52〇、 及連接該第一傳熱段510和第二傳熱段52〇相應端部之弧形 第三傳熱段530。該第—、二、三傳熱段51〇、52〇、53〇分 91309149 IX. Description of the invention: Η #/. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat. [Prior Art] Electronic components such as a central processing unit generate a large amount of heat during operation. To ensure the normal operation of the electronic components, the heat generated by them needs to be dissipated in time. Usually, a heat sink is attached to the electronic component. A heat sink for use includes a metal backplane and a plurality of heat sink fins extending from the backplane. The bottom plate is placed on the heat-generating electronic component to absorb the heat generated thereby, and the heat is transferred to the fins to be radiated to the surrounding space. However, with the development of the electronics industry, the frequency and function of electronic components are increasing, and the amount of heat generated is also increasing. The heat sink needs to be provided with a heat pipe to improve its heat dissipation performance. As shown in FIG. 1, a heat dissipating device includes a bottom plate 1, a plurality of fins 3 disposed on the upper surface of the bottom plate 1, and two heat pipes 2 for transferring heat from the bottom plate 1 to the fins 3. Two parallel grooves are disposed on the upper surface of the bottom plate 1. Each heat pipe 2 includes a linear evaporation portion 21 coupled to the corresponding groove, a linear condensation passing through the upper portion of the fin 3 and parallel to the evaporation portion 21. The portion 22 and the heat insulating portion 23 on the side of the fin 3 that connects the evaporation portion 21 and the condensation portion 22. In use, the bottom plate 1 contacts the electronic component to absorb the heat generated by the electronic component, and part of the heat is directly transferred from the bottom plate 1 to the lower portion of the die 3, and part of the heat is absorbed by the heat pipe 2 evaporation portion 21 coupled to the bottom plate 1. Further, the heat insulating portion 23 and the condensing portion 22 are transmitted to the upper portion of the fin 3, so that the heat generated by the electronic component is discharged by the slabs 3, 1309, 149, and the slab 3 to the surrounding space. However, the heat generated by 敎& There are legitimate elements of the sub-components - the accumulation of <*, ,, and . Therefore, in order to ensure the electric power, the heat sink needs to be further improved. [Summary of the Invention] 疋/汉进有鉴·This, there must be I#, to provide a heat dissipation device with good heat dissipation performance. (4) The 2 (4) device is used for heat dissipation of the electronic device, and includes: a bottom plate, a set: and a heat sink fin, a fifth bend connecting the bottom plate and the fin, and a & a heat pipe comprising a second name: an evaporation portion of the bottom plate and a condensation portion combined with the fin, the second: a second bracket: a first heat transfer portion in the middle of the bottom plate and two opposite sides of the bottom plate a k heat transfer section, and a connection heat transfer section and a second heat transfer section = - the second heat transfer section 'the second heat transfer section is located at the other two opposite sides of the bottom plate. Compared with the prior art, the Hf fold is coupled to the bottom plate, and the heat generated by the heat-generating electronic component is more evenly distributed to the bottom plate, from: preventing excessive accumulation of heat in the middle portion of the bottom plate, from the bottom plate to the fin As the heat transfer of the sheet increases, the heat dissipation performance of the heat sink is improved. [Embodiment] Referring to FIG. 2, a heat dissipating device of the present invention includes a bottom plate 1 , a plurality of fins 30 disposed on the bottom plate 10, a pair of first heat pipes 7 connected to the bottom plate 10 and the fins 30, and placed thereon. One of the second heat pipes 5 该 on the bottom plate 10. The bottom plate 10 is a substantially square metal plate with good thermal conductivity 1309149 ---^ - fl. Yuexiu repair (see) is replacing the body, such as steel plates, aluminum plates, etc. The upper surface of the bottom plate 10 is provided with a first-groove 11G having a substantially "S" shape to join the second heat pipe 5G. The first trench 110 includes a first trench segment ln located in the middle of the bottom plate 10, and two second trench segments 113 respectively located on the opposite side of the substrate. The two second trench segments (1) and = a trench segment 111 are parallel to each other. Each of the second trench segments 113 and the first trench segments ill are connected by a third trench segment 115. The two third groove segments 115 are substantially arcuate and are respectively located on the other opposite sides of the bottom plate 10. The bottom plate 10 is provided with a second groove 120 between each of the second groove segments 113 and the first groove segment U1 and parallel to the second groove segment 113 to join the first heat pipe 7〇. Each of the fins 30 is a substantially square metal sheet body including a body (not labeled), and the body is provided with two separate openings substantially at the same-horizontal position near the upper portion thereof, the plurality of fins The opening of the sheet 3() forms a channel 31〇 that joins the first heat pipe 70. Each of the first heat pipes 70 is substantially "U", and includes an evaporation portion 710, a condensation portion 72 parallel to the evaporation portion 710, and a heat insulating portion 730 connecting the evaporation portion and the condensation portion 720. The condensation The portion 72 is slightly longer than the evaporation portion 710. The heat insulating portion 730 is substantially perpendicular to the evaporation portion 71 and the condensation portion. The connection portion between the evaporation portion 710, the heat insulating portion 73, and the condensation portion 72 is rounded. 2 and FIG. 3, the second heat pipe 5'' has the same curved shape as the first groove 110 of the bottom plate ι, and has a substantially "s," shape, which includes a first heat transfer section 510, and the first The heat transfer section 51 is parallel to the second heat transfer section 52A, and the arcuate third heat transfer section 530 connecting the respective ends of the first heat transfer section 510 and the second heat transfer section 52. The first, second and third heat transfer sections 51〇, 52〇, 53〇 9
1309149 別結合至底板10第一溝槽110之第一、二、三溝槽段111、 113、115。從而，該第一傳熱段510位於該底板10之中部， 二第二傳熱段520位於底板10之相對兩邊部，二第三傳熱段 * 530位於底板10之另相對兩邊部。 請參閱圖4至圖6，所述第一熱管70之二蒸發部710結合 至所述底板10相應之第二溝槽120内，從而該二蒸發部710 分別位於所述第二熱管50之第一傳熱段510和二第二傳熱 段520之間。第一熱管70之二冷凝部720從所述鰭片30之相 對兩側穿入所述鰭片30之通道310内，且其末端突伸而出， 二絕熱部730分別位於鰭片30之相對兩侧。該鰭片30之下端 緣適當延伸而與該底板10之兩邊部接觸。 使用時，所述底板10貼合至發熱電子元件而吸收該電 子元件產生之熱量，第二熱管50之第一傳熱段510從該底板 10吸熱，並通過第二傳熱段520傳至底板10之邊部。該底板 10上之部分熱量直接傳遞至所述鰭片30之下部，部分熱量 由第一熱管70之蒸發部710吸收並通過絕熱部730和冷凝 段720傳遞至鰭片30之上部，進而由鰭片30散發至周圍空 間。 與習知技術相比，所述第二熱管5 0彎折結合至所述底 板10而將發熱電子元件產生之熱較為均勻之分佈至該底板 10上，從而減小底板10之中部熱量之積聚，使熱量更加快 速之由底板10向鰭片30傳遞，從而該散熱裝置之散熱性能 得以提升。 10 .1309149 __…„.wiwrd-*—1·----------------- ------ 丨明？I日修土钇碭 綜上所述，本發明符合發明專利要件，爰依法提出 =申凊。惟，以上該者僅為本發明之較佳實施例，舉凡熟 :本案技藝之人士，在爰依本發明精神所作之等效修飾 變化，皆應涵蓋於以下之申請專利範圍内。 一 【圖式簡單說明】 圖1係習知技術中一散熱裝置之立體分解圖。 圖2係本發明散熱裝置之立體分解圖。 圖3係圖2之部分組裝圖。 圖4係圖3進一步之組裝圖。 圖5係圖4之組裝圖。 圖6係圖5之俯視圖。 【主要元件符號說明】 〈習知技術〉 底板 1 溝槽 11 熱管 2 蒸發部 21 冷凝部 22 絕熱部 23 鰭片 3 〈本發明〉 底板 10 第一溝槽 110 第一溝槽段 111 第二溝槽段 113 第三溝槽段 115 第二溝槽 120 鰭片 30 通道 310 11 1309149 併(。月4日修(勢正替換頁 第二熱管 50 第一傳熱段 510 第二傳熱段 520 第三傳熱段 530 第一熱管 70 蒸發部 710 冷凝部 720 絕熱部 730 121309149 is not bonded to the first, second, and third groove segments 111, 113, 115 of the first trench 110 of the substrate 10. Thus, the first heat transfer section 510 is located in the middle of the bottom plate 10, the second heat transfer sections 520 are located on opposite sides of the bottom plate 10, and the second heat transfer sections * 530 are located on the opposite sides of the bottom plate 10. Referring to FIG. 4 to FIG. 6 , the two evaporation portions 710 of the first heat pipe 70 are coupled to the corresponding second trenches 120 of the bottom plate 10 , so that the two evaporation portions 710 are respectively located at the second heat pipe 50 . A heat transfer section 510 and two second heat transfer sections 520. The second heat pipe 70 condensing portion 720 penetrates into the channel 310 of the fin 30 from opposite sides of the fin 30, and the end thereof protrudes out, and the two heat insulating portions 730 are respectively located at the opposite side of the fin 30. On both sides. The lower end edge of the fin 30 is appropriately extended to be in contact with both side portions of the bottom plate 10. In use, the bottom plate 10 is attached to the heat-generating electronic component to absorb heat generated by the electronic component, and the first heat transfer section 510 of the second heat pipe 50 absorbs heat from the bottom plate 10 and is transmitted to the bottom plate through the second heat transfer section 520. The side of 10. Part of the heat on the bottom plate 10 is directly transmitted to the lower portion of the fin 30, and part of the heat is absorbed by the evaporation portion 710 of the first heat pipe 70 and transmitted to the upper portion of the fin 30 through the heat insulating portion 730 and the condensation portion 720, thereby being finned. The sheet 30 is distributed to the surrounding space. Compared with the prior art, the second heat pipe 50 is bent and coupled to the bottom plate 10 to distribute the heat generated by the heat-generating electronic components to the bottom plate 10 more uniformly, thereby reducing the accumulation of heat in the bottom plate 10. The heat is transferred from the bottom plate 10 to the fins 30 more quickly, so that the heat dissipation performance of the heat sink is improved. 10 .1309149 __...„.wiwrd-*—1·----------------- ------ 丨明?I日修土钇砀Overview, The present invention complies with the requirements of the invention patent, and is stipulated according to the law. However, the above is only a preferred embodiment of the present invention, and the person skilled in the art has changed the equivalent modification in accordance with the spirit of the present invention. 1 is a simplified exploded view of a heat sink in the prior art. Fig. 2 is an exploded perspective view of the heat sink of the present invention. Figure 4 is a further assembly diagram of Figure 3. Figure 5 is an assembly diagram of Figure 4. Figure 6 is a top view of Figure 5. [Major component symbol description] <Prior Art> Base plate 1 Groove 11 Heat pipe 2 Evaporation portion 21 Condensation portion 22 Insulation portion 23 Fin 3 <Invention> Substrate 10 First trench 110 First trench segment 111 Second trench segment 113 Third trench segment 115 Second trench 120 Fin 30 channel 310 11 1309149 and (. 4th day repair (potential replacement page second heat pipe 50 first heat transfer segment 510 second pass The third section 520 the heat transfer section 530 of the first heat pipe portion 70 the evaporation portion 710 is condensed insulating portion 720 73012