TWI302434B - Thermal module - Google Patents

Description

1302434 IX. Description of invention:

Repairing Zheng, Ben.1

[Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for 70 pieces of heat dissipation. [Prior Art] • With the rapid development of electronic technology, the more powerful electronic devices are, the more highly integrated electronic components are, and the more heat they generate. To this end, the industry often uses a module to dissipate the heat generated by electronic components, while computers and components are becoming more and more miniaturized, and thus smaller thermal modules are increasingly used. Generally, the heat dissipation module includes a base and a heat dissipation heat pipe. FIG. 1 shows a heat dissipation module in the prior art. The air package includes a base 10, a heat sink 20, and a heat pipe 30 connected to the base heat sink 20. The susceptor 10 is made of a good thermal conductivity and includes a mating face 12 for contact with a % electronic component (not shown). The four corners of the base 10 integrally extend with four lugs 14, and each of the lugs 14 is provided with a through hole 14 (not shown) passing through the through hole 140 to fix the base 10 to the hair element. In the heat dissipation module, since the base 10 and the protrusion are integrally formed by stamping, a whole piece of copper material is required, and the molding needs to cut off a certain material, thereby causing a large amount of material waste, and increasing the number of the present invention. The heat dissipating electron obtaining sheet and the hot mold 10 and the copper heat generating screw hot electric ear 14 are processed into 6 1302434 ° Ι % 3 η j The present invention provides a material saving, low cost heat dissipating module fish... The heat dissipating module of the present invention includes a a heat conducting plate, which is connected to a heat-generating electronic component on the circuit board, and a heat pipe connecting the V hot plate and the heat sink, the heat 瞢 ': ... plate connection The heat absorbing portion and the political heat module housed in the heat sink further comprise a mounting frame for connecting, and connecting the heat conducting plate and the circuit board, the mounting frame covering the Qilian

Hot department. ",, & sucking the heat-dissipating module of the present invention by adding a mounting frame, a solid board and a hairpin electronic technology> U ^ . iL ΑΛ. f humiliation,,,,,,, The connection effectively saves the material and reduces the cost. The present invention will be further described below with reference to the accompanying drawings.

Referring to FIG. 2 and FIG. 3 , the heat dissipation module 100 of the first embodiment of the present invention includes a heat conducting plate 50 , a heat sink 60 , two parallel heat pipes 70 connecting the heat conducting plate 5 and the heat sink 60 , and a heat conducting plate 5 . A mounting bracket 80 is attached to a heat-generating electronic component (not shown). The heat conducting plate 50 is made of a metal material having good thermal conductivity, such as copper. The heat conducting plate 5 is square, and the top portion is provided with two parallel grooves 5 2 ' respectively, and a threaded hole is respectively arranged at four corners of the heat conducting plate 5 5 4. The heat sink 60 includes a plurality of parallel and interconnected fins 62'. The fins 62 are perpendicular to the heat conducting plate 50 and are provided with two through holes 1302434.

620 〇 The heat pipe 70 is L-shaped, and includes a heat absorbing portion 72 received in the heat transfer plate 5, and a heat radiating portion 74 in the through hole 620 of the heat absorbing portion 72. The mounting bracket 80 may be made of a metal or plastic material for mounting the heat conducting plate 50 on the heat-generating electronic component.

Board (not shown). The two mounting brackets 80 are mounted on opposite sides of the heat conducting plate 50. Each of the mounting brackets 80 includes a body 82, and two legs are vertically bent at the ends of the body edge. The legs are W + 士(四) 0 The outer Han I is a fixed portion 86 that is bent vertically from the end of the leg ^4. The body 82 and the fixed 4 86 knife are located on both sides of the leg portion 84. The body end is provided with two mounting holes 820 for penetrating the screw 90. An arc Z protrusion 824 is disposed in the middle of the body 82 for covering the heat absorbing portion 72 received in the groove 52 during installation. Each of the fixing portions is provided with a through hole 86〇 for use

The heat-absorbing portion 72 of the heat pipe 7 is welded to the heat-dissipating portion 7 of the heat-dissipating plate 7 by the fastener (not shown) which is fixed to the heat-conducting plate 5A on the circuit board. The heat-dissipating portion 82 is welded to the heat-dissipating portion. In the through hole 620 of the device 60. ???, 丁 9〇 passes through the mounting hole 820 and is screwed into the threaded hole 54 of the heat conducting plate 50 r|"">, * 乂 The female dressing frame 80 is fixed on the opposite side of the heat conducting plate 50. The four fasteners pass through the through holes 860 of the mounting bracket 80 to connect the heat conducting plates 50 to the heat generating electronic components. Referring to FIG. 4 and FIG. 5, the heat dissipation module of the second embodiment of the present invention is the first month of repairing (more), the original 1302434 hot plate 5G', the heat sink 4g, the plural first and the first political heat film 60, , 30, a lychee, all + music - and the u is connected to the heat conducting plate 50, and the first whistle one ... 6 〇, 3 〇 'the first heat pipe 70, a connection 兮 5 〇, and heat dissipation The plate 40, the second of the *hot plates 5, and the upper cracker 80. ..., 620 and one fixed on the heat conducting plate

The heat conducting plate 50 and the heat dissipating module 1〇〇1 are located in the opposite side of the heat conducting plate, and the two side holes 56 are respectively provided with two holes 54 and a heat conducting plate 50. , Top central machine right ji #: Threaded straight groove 52, next to the ":: groove has a groove, the first - heat pipe 70, is ! ^, which includes 5 hang. Straight Λ shape; 2 2, upper; wear: there is r-r-tan connected to the heat conduction plate 50, arc; groove 2;, 2: "heat pipe 2 〇, including and one = = heat sink 40, the middle (four) The middle arc-shaped heat absorbing portion 22 is mounted with Π::: the hot plate is 5°, the diagonal direction 824 is cut, and η is used, and an arc-shaped convex portion is provided in the middle to have two heat absorbing portions at both ends 72, the body 82, the vertical fold extension: the leg portion 84, from the body 82, a SI portion 84 at both ends, the end is bent vertically to extend out: solid: portion 86, 'the two fixed portion 86, the upper branch 860, used to cut through the fastener. 1302434 "-r- W, ^ . —.*. , ^wT. «4 If a screw 9 turns, pass through the mounting hole 820 and screw into the threaded hole 54, Φ V The hot plate 50 is fixed to the mounting bracket 80, and at the same time, for example, the hot plate 50, the leg 4 84, attached to the side edge 5 6, and softly passed through the fixing portion 8fi, u four fasteners 10, one through hole 860, and screwed into the + π 所在 所在 所在 Λ 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述) Τ. The hot plates 50, 50, and the mounting brackets 8, 80, and the cost of the heat. The knife opening s is set again, which can effectively reduce the waste of materials. In summary, the invention complies with the invention patent requirements, and patent application is filed according to law. However, the above is only a preferred embodiment of the present invention. Any equivalent modifications or variations made by those skilled in the art will be covered by the following claims. [Simple description of the map]

FIG. 1 is a schematic diagram of a combination of a heat dissipation module of the prior art. 2 is an exploded perspective view of a heat dissipation module according to an embodiment of the present invention. FIG. 3 is an assembled view of a heat dissipation module according to an embodiment of the present invention. 4 is an exploded perspective view of a heat dissipation module according to Embodiment 2 of the present invention. FIG. 5 is an assembled view of a heat dissipation module according to Embodiment 2 of the present invention. [Major component symbol description] 1302434 / 7 years J month 7 repair (more) original base base 10 mating surface 12 lug 14 through hole 140 heat sink 20 heat pipe 30 [Invention]

Heat Dissipation Module 100 Fasteners 10? Heat Dissipation Module 200 Second Heat Pipe 20? Heat absorbing part ΤΓ Heat release part 24? Second heat sink 30? Heat sink 40? Heat transfer plate 50, 5 (Γ Groove 52 Curved groove 53? Straight groove 52? Threaded hole 54?54? Side 56? Heat sink 60 First heat sink 60? Heat sink 62 Through hole 620 Heat pipe 70 First heat pipe 70? Heat absorbing part 72? 72? Heat release part 74?74? Mounting bracket 80, 80' body 82? 829 mounting holes 820, 82 (Γ projections 824, 8245 legs 84, 84' fixing portions 86, 86' through holes 860, 8605 screws 90, 9 (Γ (S > 11

Claims (1)

1302434 \ X. Patent application scope 'h A heat dissipation module, including · V hot plate' is used to contact a heat-generating electronic component mounted on the circuit board; a heat sink; The heat pipe is connected to the heat conducting plate and the heat sink, and the heat pipe comprises a heat absorbing portion connected to the heat conducting plate and a heat releasing portion received in the heat sink; a mounting frame fixed to the heat conducting plate for connecting The heat conducting plate and the circuit board 'the mounting frame cover the heat absorbing portion of the heat pipe. 2. The heat dissipation module of claim i, further comprising another mounting bracket identical to the mounting bracket, each mounting bracket comprising a body and two bent from one end of the body The extending leg portion and the fixing portion extending from the end of the leg portion are bent and extended. 3. The heat dissipation module of claim 2, wherein the leg portion is perpendicular to the body and the fixing portion. The heat dissipation module of claim 2, wherein the two mounting strip body cutters are fixed to opposite sides of the heat conducting plate, and the mounting bracket fixing portion is fixed to the circuit board. The heat dissipation module of claim 4, wherein the two fasteners pass through each of the mounting bracket fixing portions and the circuit board to fix the heat conducting plate to the circuit board. 6. The heat dissipation module according to claim 1, wherein the heat conduction plate 12 1302434 f/year j/day repair (more) is cut off at a pair of angles, the mounting frame includes a body, a second body The legs and the legs extending from the two ends are bent and extended from the ends of the legs, and the fixing portion is mounted on the heat conducting plate in a diagonal direction. The heat dissipation module of the sixth aspect of the invention, further comprising another heat pipe and a heat dissipation plate, wherein the heat conduction plate is provided with an arc groove, the heat includes a shape of the heat conduction plate a heat absorbing portion in the trench and a heat releasing portion in a heat sink. , ~ Declared the patent circumference! Item or the heat dissipation module of item 7, wherein a protrusion is provided in the middle of the mounting frame for covering the heat absorption portion of the heat pipe. The heat dissipation module of item 8, wherein the protrusion is 13 1302434 十一 XI. Schema: 14 1302434 ___ '第.__月七日修(更)本本 I VII. Designated representative map: (1) The representative representative of the case is: Figure (4). (2) A brief description of the components of the representative drawing: Fastener 10? Second heat pipe 209 Heat release portion 24? Heat sink 40? Curved groove 53? Threaded hole 54? First heat sink 60? Heat absorbing portion ΊΤ Mounting bracket 80 ? mounting hole 820, leg portion 84? through hole 860, heat sink module 200 heat absorbing portion 229 second heat sink 30? heat conducting plate 50? straight groove 52, side 56? first heat pipe 70? heat releasing portion 745 body 82 ? bulge 824, fixing part 869 screw 90? Please reveal the best indication of the characteristics of the invention. 8. If there is a chemical formula in this case =