201126325 六、發明說明： 【發明所屬之技術領域】 [0001]本發明涉及一種散熱裝置，尤其涉及一種電子元件散熱 裝置。 【先前技術】 * [0002]隨著電子產業之迅速發展，電子元件如中央處理器（cpu )等之運算速度大幅度提高，其產生之熱量亦隨之劇增 ，如何將電子元件之熱量散發出去，以保證其正常運行 ，一直係業界重視之問題。為有效散發中央處理器在運 ο 行過程中產生之熱量，業界適常在電子元件表面加裝一 散熱器，從而使電子元件自身溫度維持在正常運行範圍 内。 [0003]在一些電子系統如計算機内，不僅中央處理器需要裝設 散熱器進行散熱’同時中央處理器周圍之一些電子芯片 如英特爾（INTEL )主板上之北橋（MCH )、南橋（ICH )同樣亦需要進行冷却處理，否則將影響整個系統之正 a Q 常運行。以往’通常係在每個周邊電子芯片上均加設一 散熱器進行散熱或者利用一較大之散熱器同時覆蓋中央 處理器和周邊電子芯片進行散熱，該散熱器一般具有一 較大之基座覆蓋在電子芯片上面以及周圍，再通過安裝 件穿過基座與電路板配合而固定。然而’隨著電子產品 之緊凑度和集成度之不斷提高，中央處理器周圍之電子 芯片可用空間亦不斷减小，難於再通過固定件穿過基座 與電路板配合固定之方式將散熱器安裝在周邊電子芯片 上進行散熱’因為，上述基座通常具有較大之體積幷占 099101997 表單編號A0101 第3頁/共23頁 0992003885-0 201126325 據較大之空間，且固定件之安裝一般還需借助相關工具 等，此類條件往往都不係周圍空間狹小之電子芯片所能 具有之條件。 【發明内容】 [0004] 有鑒於此，實有必要提供一種適用狹小安裝空間之散熱 裝置。 [0005] 一種散熱裝置，用於對電路板上之電子元件進行散熱， 包括用於與電子元件導熱連接之一導熱板、一熱管和一 扣具組合，所述扣具組合包括貼固於導熱板頂面之一固 定板和一扣綫，所述固定板凸設有套住熱管一端之壓環 和分別位於熱管兩側之二扣環，所述扣綫中部穿置於扣 環内且跨壓過所述熱管，所述扣綫之兩端部與電路板扣 合而將導熱板固定在電子元件上。 [0006] 上述散熱裝置之導熱板通過結構簡單之固定板及扣綫配 合而固定，且通過導熱板與:熱管導熱連接而對所述電子 元件進行散熱，該導熱板與固定板之尺寸可小到僅僅覆 蓋在電子元件之表面上而占據極小安裝空間，且通過扣 綫卡扣安裝又無須借助任何工具，從而使散熱裝置適用 於具有狹小安裝空間之電子元件上。 【實施方式】 [0007] 如圖1至3所示，本發明一些實施例中之散熱裝置可用於 對安裝在如計算機主板等電路板70上，以對電路板70之 發熱最大之主要元件72如中央處理器（CPU)進行散熱之 同時對發熱量較大之如英特爾（INTEL)主板上之北橋（ MCH)、南橋（ICH)等周邊元件74進行散熱。上述散熱 099101997 表單編號A0101 第4頁/共23頁 0992003885-0 201126325201126325 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat sink, and more particularly to an electronic component heat sink. [Prior Art] * [0002] With the rapid development of the electronics industry, the computing speed of electronic components such as the central processing unit (CPU) has been greatly improved, and the heat generated by it has also increased dramatically. How to dissipate the heat of electronic components Going out to ensure its normal operation has always been a matter of concern to the industry. In order to effectively dissipate the heat generated by the CPU during operation, the industry often installs a heat sink on the surface of the electronic component to maintain the electronic component's own temperature within the normal operating range. [0003] In some electronic systems, such as computers, not only the central processor needs to be equipped with a heat sink for heat dissipation, while some electronic chips around the central processing unit, such as the North Bridge (MCH) and the South Bridge (ICH) on the Intel (INTEL) motherboard, are also the same. Cooling is also required, otherwise it will affect the normal operation of the entire system. In the past, it was common to add a heat sink to each peripheral electronic chip to dissipate heat or to use a large heat sink to cover the central processing unit and peripheral electronic chips for heat dissipation. The heat sink generally has a large base. Covered on and around the electronic chip, and then fixed by the mounting member through the base and the circuit board. However, as the compactness and integration of electronic products continue to increase, the available space of electronic chips around the central processing unit is also decreasing. It is difficult to fix the heat sink through the fixing member through the base and the circuit board. Installed on the peripheral electronic chip for heat dissipation 'Because the above base usually has a large volume 幷 099101997 Form No. A0101 Page 3 / Total 23 Page 0992003885-0 201126325 According to the larger space, the installation of the fixed parts is generally With the help of related tools, etc., such conditions are often not the conditions of the electronic chip with a small space around it. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat dissipating device suitable for a narrow installation space. [0005] A heat dissipating device for dissipating heat from electronic components on a circuit board, comprising a heat conducting plate for thermally conductively connecting with an electronic component, a heat pipe and a buckle assembly, the buckle assembly comprising being adhered to heat conduction a fixing plate and a buckle line on the top surface of the plate, wherein the fixing plate protrudes from a pressure ring that is disposed at one end of the heat pipe and two buckles respectively located on two sides of the heat pipe, and the middle portion of the buckle wire is inserted into the buckle ring and spans Pressing the heat pipe, the two ends of the buckle are fastened to the circuit board to fix the heat conducting plate to the electronic component. [0006] The heat conducting plate of the heat dissipating device is fixed by a simple fixing plate and a fastening line, and the electronic component is dissipated by a heat conducting plate and a heat pipe. The size of the heat conducting plate and the fixing plate can be small. It covers only the surface of the electronic component and occupies a very small installation space, and is installed by the buckle and without any tools, so that the heat sink is suitable for electronic components having a narrow installation space. [Embodiment] As shown in FIGS. 1 to 3, the heat sink device in some embodiments of the present invention can be used for a main component 72 mounted on a circuit board 70 such as a computer motherboard to maximize heat generation to the circuit board 70. For example, the central processing unit (CPU) performs heat dissipation while dissipating heat to the peripheral components 74 such as the North Bridge (MCH) and the South Bridge (ICH) on the Intel (INTEL) motherboard. The above heat dissipation 099101997 Form No. A0101 Page 4 of 23 0992003885-0 201126325
II
[0008]Ο [0009] 〇 [0010] 099101997 裝置包括安裝在主要元件72上之一第一基座1〇、安裝在 第基座10上一風扇20、位於第一基座1〇一侧正對風扇 20之一散熱片組30、安裝在周邊元件74之第二基座和分 別將第一基座10及第二基座與散熱片組3〇導熱連接之一 熱官組50。所述第二基座包括與周邊元件74導熱接觸之 一導熱板40和將導熱板40緊固到周邊元件74上之一扣具 組合60。 上述電路板70在主要元件72周圍之四對稱位置分別開設 有一安裝孔76，電路板70在周邊元件74周圍幷對應周邊 元件74之二對角處設置二與扣具組合6〇配合之安裝環 上述第一基座10包括一安裝架12和結合於安裝架12底部 之一導熱底板14。該底板14呈矩形，可由導熱性能優越 之金屬如銅製成，底板14之頂面形成有若干容置槽14〇。 所述容置槽140相互幷排且與底板14之兩相對邊緣平行。 所述容置槽140可以直接由.底板14頂面向下凹陷而成，亦 可以如本實施例中之底板14一樣’由底板14頂面向下凹 陷之同時還有若干凸條沿容置槽140兩側向上凸起而形成 截面呈半圓狀之容置槽140。 上述安設在主要元件72之上’以將底糾壓設 在主要元件m貝面上。安裝架12包括—基部122和由基部 122四角向外延伸之四安裝脚124。該基部122大致呈矩 形，其底部開設有與底板14容置槽14〇對應之容置槽 1220。所述容置槽1 220相互幷排幷與基部122之兩相對 邊緣平行。該基部122對應容置槽122〇之中間部分向上棋 表單編號A0101 第5頁/共23頁 0992003885-0 201126325 起，使容置槽1 220正好形成於基部122拱起之部分内，而 基部122之兩側部分可供中間拱起部分之厚度小，以節約 材料之同時减輕第一基座10之重量。上述四安裝脚124分 別自基部122四角沿對角綫向外延伸，每一安裝脚124之 末端連接一安裝筒1 240。每一安裝筒1240内穿置有將散 熱裝置固定到電路板70上安裝件100。上述四安裝脚124 中有三安裝件100分別向外延伸有三固定臂126，所述固 定臂126分別由安裝脚124 —側緣之中部向外延伸，而且 所述固定臂126延伸之方向與容置槽1 220平行。每一固定 臂126之末端形成一固定筒1 260，所述固定筒1 260用於 承接風扇20，且每一固定筒1260内開設用於固定風扇20 之一固定孔1262。 [0011] 上述安裝架12向一侧延伸出有一承托散熱片組30之托架 127，該托架127包括從相鄰二安裝筒1240之周緣向外延 伸之二延伸部1272和連接二延伸部1 272之一承接部12 74 。所述二延伸部1272相互平行間隔幷垂直於安裝架12底 部之容置槽1220向外延伸。所述承接部1 274平行於所述 容置槽1220。所述二延伸部1 272之外側緣分別垂直向上 凸起形成有限位凸部1 270，以阻止承放於承接部1274上 之散熱片組30側向滑動。上述安裝架12向與托架127相反 之一侧延伸有一定位板128，該定位板128垂直於容置槽 1 220以及固定臂126向外延伸，該定位板128位於基部 122與托架127相反之一侧，且由基部122該側與安裝脚 124之連接處向外延伸。該定位板128頂面靠近末端處向 上凸起形成一環形凸台1 280，所述凸台1 280内以及定位 099101997 表單編號A0101 第6頁/共23頁 0992003885-0 201126325 [0012] Ο [0013] ❹ [0014] 099101997 板128對應凸台1280處開設一定位孔1 282，以與扣具組 合60配合。 請一幷參閱圖5，上述第一基座10處於組裝狀態時，該底 板14結合於女裝架12基部122底部，底板14頂部之容置 槽140與基部122底部之容置槽1 220配合形成若干圓形容 置通孔，所述容置通孔由基部122與托架127之承接部 1274垂直之相對兩側向外開口，以容置熱管組5〇之一部 分。該第一基座10通過安裝脚124上之安農件1〇〇與電路 板70上之安裝孔76配合而將第一基座固定在主要元件 72上，且使第一基座10底板14與主要元件72之頂面緊密 接觸。 上述風扇20為離心式風扇，風扇20固定於第一基座1〇上 為散熱片組30提供強制氣流。該風扇2〇爸括一矩形殼體 22，該殼體22底部之周緣形成有與第一基座1〇固定筒 1260對應之三凸板24。所述殼體22對應凸板24處向内凹 陷。所述凸板24中有二凸板24位於殼薄22相鄰之角落處 ，剩下一凸板24形成於與殼體22另一角落靠近之位置。 每一凸板24上開設一通孔240。上述風扇20安裝於第一基 座10上時，每一凸板24分別承接於第一基座1 0上一對應 之固定筒1260上，該風扇20通過三固定螺釘200分別向 下穿過風扇20凸板24之通孔240與對應固定筒1 260内之 固定孔1262配合而固定在第一基座10上。 上述散熱片組30承放於第一基座10之托架127上，且散熱 片組30鄰接風扇20之出風口。該散熱片組30包括若干相 互平行間隔之散熱片32，所述散熱片32相互平行間隔且 表單編號Α0101 第7頁/共23頁 0992003885-0 201126325 由風扇20之出風口向外延伸’相鄰散熱片32之間開設有 與風扇2G出風π連通之氣㈣道。所職μ 32底部之 中間。Β承接於托架127之承接部1274上，所述散熱片 32之靠外之-端同時向—側呈—定角度彎折，以使散熱 片32内之空氣通道同時f折延伸，從而改變氣流方向產 生I流幷❹散熱片32表面之空氣滞留，進而有效提高 風扇20產生之強職流與散熱片32之間之熱交換效率。 该散熱片組3G5f1設有若干收容孔34，所述收容孔34相互 間隔幷垂直於散熱片32由散熱片組3〇之一侧延伸之另一 相對側。上述托架127兩侧之限位凸部127〇分別抵在散熱 片組30之兩相對側面，而起到阻止散熱片組3〇向托架127 兩側滑動之限位作用。 [0015] 上述導熱板40由導熱性能良好之銅材料製成，所述導熱 板40本實施例中呈矩形，用於貼在周邊元件以頂面上， 以直接吸收周邊元件74之熱量再埠過熱管組5〇傳遞給散 熱片組30 〇 .... . .... ;；：| . : , .·' 丨：卜 [0016] 上述熱管組50包括將第一基與散熱片組3〇導熱連接 若干第一熱管52和將散熱片組30與導熱板4〇導熱連接之 至少一第一熱管54。所述第一熱管52之數量與第一基座 10安裝架12之容置槽1 220或者底板14之容置槽140之數 量對應相等。在本實施例中所述第一熱管52之數量為二 ，每一第一熱管52大致呈ϋ形，每一第一熱管52包括一第 一蒸發段522、與第一蒸發段522平行之一第一冷凝段 524和垂直連接第—蒸發段522與第一冷凝段524之一第 一連接段526。所述至少一第二熱管54在本實施例中之數 099101997 表單編號Α0101 第8頁/共23頁 0992003885-0 201126325 量為一，在其他實施例中可以為多個β所述第二熱管54 包括一第二蒸發段542、一第二冷凝段544和連接第二蒸 發段542和第二冷凝段544之一第二連接段546。該第二 熱管54之第二蒸發段542和第二冷凝段544均呈平直狀， 而該第二連接段546可根據具體需要選擇各種彎曲形狀， 該第二連接段546由第二蒸發段542之一端彎折延伸而出 幷連接第二冷凝段544之一端。 [0017] Ο 上述熱管組50在使用時，所述第一熱管52之第一冷凝段 524以及第二熱管54之第二冷凝段544分別穿設於散熱片 級30收容孔34内；所述第一熱管52之第一連接段526以 及第二熱管54之第二連接段546均位於散熱片組3〇以及第 基座10之同一侧，所述第一熱管52之第一蒸發段522穿 置於第一基座10基部122底部之容置槽122〇與底板14頂 部之容置槽140配合形成圓形容置通孔内；所述第二熱管 54之第二蒸發段542由第一基座1〇及散熱片組3〇之同一 側向外延伸至導熱板4 0之頂面。 〇 _] 特別如圖4所示，上述扣具組合6〇用於將第二熱管“之第 -蒸發段542貼固於導熱板4〇頂面之同時將導熱板4〇固定 到周邊it㈣上。該扣具組合6G包括將第：蒸發段⑷固 定至導熱板4G頂面之-固絲62和將導熱板4()固定到周 邊元件74上之-扣殘64。該固^架62具有—固定板62〇 ’該固定板620之形狀大小與導熱板4()對應^固定板 620上開設一第一開口 622和一第二開口 624，其中第一 開口 622沿固定板620之一對角綫將固定板62〇分成兩三 角部分；該第二開口 624沿垂直於固定板㈣兩相對邊緣 099101997 表單編號A0101 第9頁/共23頁 0992003885-0 201126325 之一中綫將固定板620分開；第一開口 622與第二開口 624相交；第一開口 622之寬度略大於第二熱管54之第二 条發^又5 4 2之截面寬度，以收容第二蒸發段5 4 2，該第-開口 6 2 4之寬度略大於扣綫6 4之截面直徑，以收容扣殘6 4 之中間部分。 [0019] [0020] 上述固定板620在第一開口 622之兩端處對應設置有二壓 環626 ’所述壓環626由固定板620向上拱起，壓環626橫 跨第一開口 622將固定板620被第一開口 622分開之兩部 分連接起來。該固定板620在第二開口 624之兩端處對應 設置有二扣環628，所述扣環628由固定板620向上拱起 ’扣環628橫跨第二開口 624將固定板620被第二開口 624 分開之部分連接起來。該固定板620上開設有若干鉚接孔 627 ’用於將固定板620鉚接到導熱板40頂面。 上述固定架62還具有由固定板620 —侧緣延伸而出之連接 部’該連接部與第一基座1¾之定位板128活動連接，該活 動連接係指連接部以及整個固定架62可相對連接部與定 位板128連接處在 I ~ 較小範〖圍内.來回移動，例如連接部可 相對連接部與定位板128帶動固定架62上、下及左右之小 範圍内移動。可以理解，所述連接部可以作為固定架62 之一獨立部分，通過焊接、鉚接或者黏貼等方式直接設 置於導熱板40上。在本實施例中，所述連接部為由固定 板620 —側緣延伸而出一連接片629，該連接片629包括 由固疋板6 2 0 —側緣傾斜向上向外延伸之一傾斜部6 2 9 2和 有傾斜部6 2 9 2上端緣水平延伸而出之一水平部6 2 9 4 ^該 水平部6294靠近末端處開設一連接孔629〇。 099101997 表單編號A0101 第10頁/共23頁 0992003885-0 201126325 [0021] 上述扣缦64由彈性金屬綫彎折而成，扣綫64包括一中間 部642和由中間部642相對兩端反方向傾斜延伸而出之二 扣合臂644。該中間部642包括二抵壓部6422和連接二抵 壓部6422之一壓扣部6424，該壓扣部6424位於二抵壓部 6422之間幷由二抵壓部6422相向端部向上拱起。所述扣 合臂644之末端形成有扣鈎6440，該扣鈎6440由扣合臂 644之末端先向下再向上彎折而成。 [0022] Ο 同時參閱圖1至3，在使用時，上述固定架62可通過固定 板620與導熱板40頂面焊接或黏貼等方式固定，在本實施 例中’固定架62通過固定板62〇上之鉚接孔627與導熱板 40鉚接固定。該第二熱管54之第二蒸發段542穿置在固定 架62之二壓環626内與導熱板40頂面接觸幷位於固定板 620之第一開口 622内。該扣殘64中間部642之二抵壓部 6422分別穿置與固定板62〇之二扣環628內幷位於第二開 口 624之内，扣綫64中間部642之壓扣部6424位於二扣環 628之間幷跨過第二熱管54之第二蒸發段542。該扣綫“ ο 扣合臂644末端之扣鈎6440分別鈎住周邊元件74對角外 之電路板70之安裝環78而將導熱板4〇固定到周邊元件以 上，且此時扣綫64處於彈性變形狀態，在形變力之作用 下，扣綫64中間部642之二抵壓部6422下壓導熱板40使 導熱板40與周邊元件74緊密接觸，同時扣綫64中間部 642之壓扣部6424下壓第二熱管54之第二蒸發段542頂面 ，使第二蒸發段542底面與導熱板4〇頂面緊密接觸，從而 有效保證從周邊元件74熱量通過第二熱管54快速傳遞給 散熱片組30。 099101997 表單編號Α0101 第11頁/共23頁 0992003885-0 201126325 [0023] 上述固定架62連接片629之水平部6294承接於第一基座 10定位板128上面，且定位板128上之圓環形凸台1280穿 置於連接片629之連接孔6290内，再用一樞接螺釘3〇〇結 合於定位板128之定位孔1 282内，從而將第二基座之固定 架62與第一基座1〇樞接在一起。該樞接螺釘3〇〇具有一頭 部而使定連接片629夾置在樞接螺釘300之頭部與定位板 128之間。在本實施例中，所述連接片629之連接孔629〇 之孔徑大於定位板128之圓環形凸台1280之外徑幷小於樞 接螺釘300頭部之外徑，使連接片629可帶動固定架62以 及與固定架62鉚接之導熱板4〇關於圓環形凸台1 280水平 轉動’此外，所述樞接螺釘3〇〇之頭部與定位板128之間 距離大於連接片629之厚度，使連接片629可帶動固定架 62以及與固定架62鉚接之導熱板4〇在樞接螺釘3〇〇之頭 部與定位板128之間之範圍内在竪直方向上上下移動。 [0024] 上述固定架62與第一基座1〇通過連接部（連接片629 )連 接’可防止連接第一基座1〇與導熱板4〇之第二熱管54在 運輸或安裝之過程中過度變形而產生損壞。然而，如果 將導熱板40通過固定架62與第一基座1〇完全固死，就會 因為沒有活動空間，產品公差稍有問題，就會因為扣合 力不平衡，導致接觸間隙。 [〇〇25]上述散熱裝置之第一基座10、風扇20以及散熱片組30等 主體部分安裝在電路板70上之主要元件72上，再通過由 第二熱管54及導熱板40將主要元件72周圍之周邊元件74 與主體部導熱連接，如此散熱裝置便可以同時對主要元 件72以及周邊元件74進行散熱’且占據周邊元件74之極 099101997 表單編號A0101 第頁/共23頁 0992003885-0 201126325 小空間，從而達到節省空間之目的。 [0026] [0027] ❹ [0028] [0029] [0030] [0031] [0032] 〇 [0033] [0034] [0035] [0036] [0037] [0038] 099101997 可以理解，在其他實施例中，上述散熱裝置可以包括多 個第二熱管54及多個對應之導熱板40，以對電路板70上 主要元件72周圍之多個周邊元件74進行散熱。 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係帶有本發明一實施例中散熱裝置安裝於電路板上之 立體組合圖。 圖2係圖1中散熱裝置之分解圖。 圖3係圖1中散熱裝置之部分分解圖。 圖4係圖2中扣具組合之放大圖。 圖5係圖1中散熱裝置之部分分解倒置圖。 【主要元件符號說明】 第一基座：10 安裝架：12 基部：122 容置槽：1 220、140 安裝脚：124 安裝筒：1240 表單編號Α0101 第13頁/共23頁 0992003885-0 201126325 [0039] 固定臂：1 2 6 [0040] 固定筒：1 2 6 0 [0041] 固定孔：1262 [0042] 托架：127 [0043] 限位凸部：127 0 [0044] 延伸部：1272 [0045] 承接部：1274 [0046] 定位板：128 [0047] 凸台：1 2 8 0 [0048] 定位孔：1282 [0049] 底板：14 [0050] 風扇：20 [0051] 殼體：22 [0052] 凸板：24 [0053] 通孔：240 [0054] 散熱片組：30 [0055] 散熱片：32 [0056] 收容孔：34 [0057] 導熱板：40 099101997 表單編號A0101 第14頁/共23頁 0992003885-0 201126325 [0058] 熱管組：5 0 [0059] 第一熱管：52 [0060] 第一蒸發段：522 [0061] 第一冷凝段：524 [0062] 第一連接段：526 [0063] 第二熱管：54 [0064] 第二蒸發段：542 〇 ^ [0065] 第二冷凝段：544 [0066] 第二連接段：546 [0067] 扣具組合：6 0 [0068] 固定架：62 [0069] 固定板：620 ΓλΛ»*7Γ\Ί LVAMU」 his βΒ — · /? ο ο 牙》— Γ幵J 口 · ϋ乙乙 〇 [0071] 第二開口 ： 624 [0072] 壓環：626 [0073] 鉚接孔：627 [0074] 扣環：628 [0075] 連接片：629 [0076] 連接孔：6290 099101997 表單編號Α0101 第15頁/共23頁 0992003885-0 201126325 [0077] 傾斜部：6292 [0078] 水平部：6294 [0079] 扣綫：6 4 [0080] 中間部：642 [0081] 抵壓部：6422 [0082] 壓扣部：6424 [0083] 扣合臂：644 [0084] 扣鈎：6 4 4 0 [0085] 電路板：70 [0086] 主要元件：72 [0087] 周邊元件：74 [0088] 安裝孔：76 [0089] 安裝環：78 [0090] 安裝件：100 [0091] 固定螺釘：200 [0092] 樞接螺釘：300 099101997 表單編號A0101 第16頁/共23頁 0992003885-0[0009] 〇 [0010] 099101997 The device includes a first base 1A mounted on the main component 72, a fan 20 mounted on the base 10, and located on the first side of the first base 1 A heat sink group 30 for one of the fans 20, a second base mounted to the peripheral member 74, and a heat supply group 50 for thermally connecting the first base 10 and the second base to the heat sink group 3, respectively. The second base includes a thermally conductive plate 40 in thermally conductive contact with the peripheral member 74 and a fastener assembly 60 that secures the thermally conductive plate 40 to the peripheral member 74. The circuit board 70 defines a mounting hole 76 at four symmetrical positions around the main component 72. The circuit board 70 is disposed around the peripheral component 74 at two opposite corners of the corresponding peripheral component 74. The first base 10 includes a mounting bracket 12 and a thermally conductive bottom plate 14 coupled to the bottom of the mounting bracket 12. The bottom plate 14 has a rectangular shape and can be made of a metal having excellent thermal conductivity such as copper. The top surface of the bottom plate 14 is formed with a plurality of receiving grooves 14?. The accommodating grooves 140 are mutually arranged and parallel to opposite edges of the bottom plate 14. The accommodating groove 140 may be directly recessed from the top surface of the bottom plate 14 or may be recessed from the top surface of the bottom plate 14 as in the bottom plate 14 of the embodiment. The two sides are upwardly convex to form a receiving groove 140 having a semicircular cross section. The above is mounted on the main element 72' to set the bottom correction on the main element m. The mounting bracket 12 includes a base portion 122 and four mounting feet 124 extending outwardly from the four corners of the base portion 122. The base portion 122 has a substantially rectangular shape, and a receiving groove 1220 corresponding to the receiving groove 14 底板 of the bottom plate 14 is opened at the bottom. The accommodating grooves 1 220 are mutually parallel and parallel with the opposite edges of the base 122. The base portion 122 corresponds to the middle portion of the accommodating groove 122 向上 upwards to the form number A0101, page 5 / 23 pages 0992003885-0 201126325, so that the accommodating groove 1 220 is formed in the portion of the base portion 122, and the base portion 122 The two side portions are provided with a small thickness of the intermediate arched portion to save material while reducing the weight of the first base 10. The four mounting legs 124 extend diagonally from the corners of the base 122, and the end of each mounting leg 124 is coupled to a mounting barrel 1 240. A mounting member 100 for fixing the heat sink to the circuit board 70 is disposed in each of the mounting cylinders 1240. Three of the four mounting legs 124 are respectively extended with three fixing arms 126 respectively. The fixing arms 126 are respectively extended outward from the side of the side of the mounting leg 124, and the fixing arm 126 extends and is received. The slots 1 220 are parallel. A fixing cylinder 1 260 is formed at the end of each fixing arm 126. The fixing cylinder 1 260 is used for receiving the fan 20, and a fixing hole 1262 for fixing the fan 20 is opened in each fixing cylinder 1260. [0011] The mounting bracket 12 extends to one side with a bracket 127 for supporting the heat sink assembly 30. The bracket 127 includes two extensions 1272 and two extensions extending outward from the periphery of the adjacent two mounting cylinders 1240. One of the parts 1 272 receives the portion 12 74 . The two extending portions 1272 extend outwardly from each other and are perpendicular to the receiving groove 1220 at the bottom of the mounting frame 12. The receiving portion 1 274 is parallel to the receiving groove 1220. The outer side edges of the two extending portions 1 272 are vertically upwardly convex to form a finite-position convex portion 1 270 to prevent the fin group 30 placed on the receiving portion 1274 from sliding laterally. The mounting bracket 12 extends to a side opposite to the bracket 127 to extend a positioning plate 128. The positioning plate 128 extends perpendicularly to the receiving slot 1 220 and the fixing arm 126. The positioning plate 128 is located at the base 122 opposite to the bracket 127. One side, and extends outwardly from the junction of the side of the base 122 and the mounting foot 124. The top surface of the positioning plate 128 is convex upwardly near the end to form an annular boss 1 280, the inside of the boss 1 280 and the positioning 099101997 Form No. A0101 Page 6 / Total 23 Page 0992003885-0 201126325 [0012] Ο [0013 ❹ [0014] 099101997 The plate 128 defines a positioning hole 1 282 corresponding to the boss 1280 to cooperate with the buckle assembly 60. Referring to FIG. 5, when the first base 10 is in the assembled state, the bottom plate 14 is coupled to the bottom of the base portion 122 of the dressing rack 12, and the receiving groove 140 at the top of the bottom plate 14 is matched with the receiving groove 1 220 at the bottom of the base portion 122. A plurality of circular receiving through holes are formed, and the receiving through holes are outwardly opened by the opposite sides of the base portion 122 and the receiving portion 1274 of the bracket 127 to accommodate a portion of the heat pipe group 5〇. The first base 10 is fixed to the main component 72 by the mating piece 1 on the mounting leg 124 and the mounting hole 76 on the circuit board 70, and the first base 10 is bottom plate 14 In close contact with the top surface of the main component 72. The fan 20 is a centrifugal fan, and the fan 20 is fixed to the first base 1 to provide a forced air flow to the heat sink group 30. The fan 2 includes a rectangular casing 22, and a peripheral edge of the bottom of the casing 22 is formed with a three convex plate 24 corresponding to the first base 1 〇 fixed cylinder 1260. The housing 22 is recessed inwardly corresponding to the projection 24. The convex plate 24 has two convex plates 24 at the corners adjacent to the thin shell 22, and a convex plate 24 is formed at a position close to the other corner of the casing 22. A through hole 240 is defined in each of the convex plates 24. When the fan 20 is mounted on the first base 10, each of the convex plates 24 is respectively received on a corresponding fixed cylinder 1260 on the first base 10, and the fan 20 passes through the fan through the three fixing screws 200 respectively. The through hole 240 of the 20 convex plate 24 is fixed to the first base 10 in cooperation with the fixing hole 1262 in the corresponding fixed cylinder 1 260. The heat sink group 30 is placed on the bracket 127 of the first base 10, and the heat sink group 30 is adjacent to the air outlet of the fan 20. The heat sink group 30 includes a plurality of fins 32 spaced apart from each other, the heat sinks 32 are spaced apart from each other and the form number is Α0101. Page 7/23 pages 0992003885-0 201126325 Extending outward from the air outlet of the fan 20 Between the fins 32, a gas (four) channel communicating with the fan 2G is provided. In the middle of the bottom of the μ 32. The yoke is received on the receiving portion 1274 of the bracket 127, and the outer end of the heat sink 32 is bent at an angle to the side at the same time, so that the air passage in the heat sink 32 is simultaneously folded and extended, thereby changing The airflow direction generates air retention on the surface of the fins 32, thereby effectively improving the heat exchange efficiency between the strong current generated by the fan 20 and the fins 32. The heat sink group 3G5f1 is provided with a plurality of receiving holes 34 spaced apart from each other perpendicularly to the other opposite side of the heat sink 32 extending from one side of the heat sink group 3''. The limiting protrusions 127 on both sides of the bracket 127 respectively abut against the opposite sides of the heat sink group 30, and function to prevent the heat sink group 3 from sliding toward both sides of the bracket 127. [0015] The heat conducting plate 40 is made of a copper material having good thermal conductivity. The heat conducting plate 40 is rectangular in the embodiment for attaching to the top surface of the peripheral component to directly absorb the heat of the peripheral component 74. The heat pipe group 5〇 is transferred to the heat sink group 30 〇.... . . . ;;:| . : , . . . 丨: [0016] The heat pipe group 50 includes the first base and the heat sink group 3〇 thermally connected to the first heat pipe 52 and the at least one first heat pipe 54 that thermally connects the heat sink group 30 and the heat conducting plate 4〇. The number of the first heat pipes 52 is equal to the number of the receiving grooves 1 220 of the first base 10 mounting frame 12 or the receiving grooves 140 of the bottom plate 14. In the embodiment, the number of the first heat pipes 52 is two, each of the first heat pipes 52 is substantially in the shape of a dome, and each of the first heat pipes 52 includes a first evaporation section 522 and one of the first evaporation sections 522. The first condensation section 524 and the first connection section 526 of the first condensation section 524 and the first condensation section 524 are vertically connected. The at least one second heat pipe 54 is in the present embodiment, the number 099101997, the form number Α0101, the eighth page, the total of the 23 pages, the number of the second heat pipes 54. In other embodiments, the plurality of the second heat pipes 54 may be a plurality of β. A second evaporation section 542, a second condensation section 544, and a second connection section 546 connecting the second evaporation section 542 and the second condensation section 544 are included. The second evaporation section 542 and the second condensation section 544 of the second heat pipe 54 are both flat, and the second connection section 546 can select various curved shapes according to specific needs, and the second connection section 546 is formed by the second evaporation section. One end of the 542 bends and extends out of the end of the second condensation section 544. [0017] Ο when the heat pipe group 50 is in use, the first condensation section 524 of the first heat pipe 52 and the second condensation section 544 of the second heat pipe 54 are respectively disposed in the heat sink stage 30 receiving holes 34; The first connecting section 526 of the first heat pipe 52 and the second connecting section 546 of the second heat pipe 54 are located on the same side of the heat sink group 3〇 and the base 10, and the first evaporation section 522 of the first heat pipe 52 is worn. The accommodating groove 122 置于 disposed at the bottom of the base portion 122 of the first base 10 cooperates with the accommodating groove 140 at the top of the bottom plate 14 to form a circular receiving through hole; the second evaporation portion 542 of the second heat pipe 54 is formed by the first base The same side of the seat 1 and the fin group 3 向外 extends outward to the top surface of the heat conducting plate 40. 〇_] In particular, as shown in FIG. 4, the above-mentioned fastener assembly 6〇 is used for fixing the first heat-dissipating section 542 of the second heat pipe to the top surface of the heat-conducting plate 4 while fixing the heat-conducting plate 4 to the peripheral it (four) The clip assembly 6G includes a fixing wire 62 for fixing the evaporation section (4) to the top surface of the heat conducting plate 4G and a buckle 64 for fixing the heat conducting plate 4 () to the peripheral member 74. The fixing frame 62 has The fixing plate 62 is configured to have a first opening 622 and a second opening 624 on the fixing plate 620. The first opening 622 is adjacent to the fixing plate 620. The corner line divides the fixing plate 62 into two triangular portions; the second opening 624 separates the fixing plate 620 along a center line which is perpendicular to the opposite edges of the fixing plate (four) 099101997 Form No. A0101 Page 9 / Total 23 page 0992003885-0 201126325; The first opening 622 intersects with the second opening 624; the width of the first opening 622 is slightly larger than the width of the second strip of the second heat pipe 54 to accommodate the second evaporation section 5 4 2, the first The width of the opening 6 2 4 is slightly larger than the cross-sectional diameter of the buckle line 64 to accommodate the middle portion of the buckle 6 4 [0020] The fixing plate 620 is correspondingly provided with two pressure rings 626 at the two ends of the first opening 622. The pressure ring 626 is upwardly arched by the fixing plate 620, and the pressure ring 626 is spanned across the first opening 622. The fixing plate 620 is connected by two parts separated by the first opening 622. The fixing plate 620 is correspondingly provided with two buckles 628 at two ends of the second opening 624, and the buckle 628 is arched upward by the fixing plate 620. The ring 628 connects the portions of the fixing plate 620 separated by the second opening 624 across the second opening 624. The fixing plate 620 is provided with a plurality of rivet holes 627' for riveting the fixing plate 620 to the top surface of the heat conducting plate 40. The fixing frame 62 further has a connecting portion extending from the side edge of the fixing plate 620. The connecting portion is movably connected with the positioning plate 128 of the first base 128. The movable connecting means that the connecting portion and the entire fixing frame 62 are relatively connected The connection between the portion and the positioning plate 128 is in the range of I ~ smaller and smaller. For example, the connecting portion can move relative to the connecting portion and the positioning plate 128 to move the fixing frame 62 up, down and left and right. The connecting portion can be used as a fixing frame The connecting portion is directly connected to the heat conducting plate 40 by welding, riveting or pasting. In the embodiment, the connecting portion extends from the side edge of the fixing plate 620 to form a connecting piece 629. The sheet 629 includes an inclined portion 6 2 9 2 which is inclined upwardly and outwardly from the side edge of the fixing plate 620, and an upper edge of the inclined portion 6 2 9 2 extends horizontally to form a horizontal portion 6 2 9 4 ^ The horizontal portion 6294 opens a connection hole 629〇 near the end. 099101997 Form No. A0101 Page 10 of 23 0992003885-0 201126325 [0021] The buckle 64 is formed by bending an elastic metal wire, and the buckle wire 64 includes an intermediate portion 642 and is inclined in opposite directions from opposite ends of the intermediate portion 642. The two fastening arms 644 extend out. The intermediate portion 642 includes two pressing portions 6422 and a pressing portion 6424 connecting the two pressing portions 6422. The pressing portion 6424 is located between the two pressing portions 6422 and is upwardly arched from opposite ends of the two pressing portions 6422. . The end of the fastening arm 644 is formed with a hook 6440 which is formed by bending the end of the fastening arm 644 downward and upward. [0022] Ο Referring to FIGS. 1 to 3 simultaneously, in use, the fixing frame 62 can be fixed by welding or pasting the top surface of the heat conducting plate 40 by the fixing plate 620. In the embodiment, the fixing frame 62 passes through the fixing plate 62. The rivet hole 627 on the cymbal is riveted and fixed to the heat conducting plate 40. The second evaporation section 542 of the second heat pipe 54 is disposed in the second pressure ring 626 of the fixing frame 62 and is in contact with the top surface of the heat conducting plate 40, and is located in the first opening 622 of the fixing plate 620. The two crimping portions 6422 of the intermediate portion 642 of the buckle 64 are respectively disposed in the second opening 624 of the two buckles 628 of the fixing plate 62, and the pressing portion 6424 of the intermediate portion 642 of the buckle 64 is located at the second buckle. The second evaporating section 542 of the second heat pipe 54 is crossed between the rings 628. The buckle "64" at the end of the fastening arm 644 hooks the mounting ring 78 of the circuit board 70 outside the peripheral component 74 to fix the heat conducting plate 4 to the peripheral component, and the buckle 64 is at this time. In the elastic deformation state, under the action of the deformation force, the two pressing portions 6422 of the intermediate portion 642 of the buckle wire 64 press the heat conducting plate 40 to bring the heat conducting plate 40 into close contact with the peripheral member 74, and at the same time, the pressing portion of the intermediate portion 642 of the buckle 64 6424 presses the top surface of the second evaporation section 542 of the second heat pipe 54 so that the bottom surface of the second evaporation section 542 is in close contact with the top surface of the heat conducting plate 4, thereby effectively ensuring the heat transfer from the peripheral component 74 to the heat dissipation through the second heat pipe 54. The group of sheets 30. 099101997 Form No. 101 0101 Page 11 / Total 23 pages 0992003885-0 201126325 [0023] The horizontal portion 6294 of the above-mentioned fixing frame 62 connecting piece 629 is received on the positioning plate 128 of the first base 10, and on the positioning plate 128 The annular boss 1280 is inserted into the connecting hole 6290 of the connecting piece 629, and is then coupled into the positioning hole 1 282 of the positioning plate 128 by a pivoting screw 3, thereby fixing the fixing base 62 of the second base. Connected to the first base 1 。. The pivot snail 3〇〇 has a head and the fixed connecting piece 629 is sandwiched between the head of the pivoting screw 300 and the positioning plate 128. In this embodiment, the connecting hole 629 of the connecting piece 629 has a larger aperture than the positioning. The outer diameter 幷 of the annular boss 1280 of the plate 128 is smaller than the outer diameter of the head of the pivot screw 300, so that the connecting piece 629 can drive the fixing frame 62 and the heat conducting plate 4 riveted with the fixing frame 62 about the annular boss 1 280 horizontal rotation ' In addition, the distance between the head of the pivoting screw 3 与 and the positioning plate 128 is greater than the thickness of the connecting piece 629 , so that the connecting piece 629 can drive the fixing frame 62 and the heat conducting plate riveted with the fixing frame 62 4〇 moves up and down in the vertical direction within the range between the head of the pivoting screw 3〇〇 and the positioning plate 128. [0024] The fixing bracket 62 and the first base 1〇 are connected by a connecting portion (connecting piece 629) 'It can prevent the second heat pipe 54 connecting the first base 1 and the heat conducting plate 4 from being excessively deformed during transportation or installation to cause damage. However, if the heat conducting plate 40 is passed through the fixing frame 62 and the first base 1 〇 completely dead, because there is no space for activities, product tolerances If there is a problem, the contact force will be unbalanced, resulting in a contact gap. [〇〇25] The main component 72 of the heat sink having the first base 10, the fan 20, and the heat sink group 30 and the like is mounted on the circuit board 70. Then, by the second heat pipe 54 and the heat conducting plate 40, the peripheral component 74 around the main component 72 is thermally connected to the main body portion, so that the heat dissipating device can simultaneously dissipate the main component 72 and the peripheral component 74 and occupy the peripheral component 74. Extreme 099101997 Form No. A0101 Page / Total 23 Pages 0992003885-0 201126325 Small space to save space. [0027] [0029] [0029] [0030] [0032] [0032] [0033] [0034] [0036] [0038] [0038] 099101997 It will be understood that in other embodiments The heat sink may include a plurality of second heat pipes 54 and a plurality of corresponding heat conducting plates 40 for dissipating heat from the plurality of peripheral elements 74 around the main component 72 of the circuit board 70. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat dissipating device mounted on a circuit board in an embodiment of the present invention. Figure 2 is an exploded view of the heat sink of Figure 1. Figure 3 is a partially exploded view of the heat sink of Figure 1. Figure 4 is an enlarged view of the buckle assembly of Figure 2. Figure 5 is a partially exploded inverted view of the heat sink of Figure 1. [Main component symbol description] First base: 10 Mounting bracket: 12 Base: 122 Socket: 1 220, 140 Mounting feet: 124 Mounting cylinder: 1240 Form number Α 0101 Page 13 / Total 23 0992003885-0 201126325 [ 0039] Fixed arm: 1 2 6 [0040] Fixed cylinder: 1 2 6 0 [0041] Fixing hole: 1262 [0042] Bracket: 127 [0043] Limiting projection: 127 0 [0044] Extension: 1272 [ 0045] Receiving part: 1274 [0046] Positioning plate: 128 [0047] Boss: 1 2 8 0 [0048] Positioning hole: 1282 [0049] Base plate: 14 [0050] Fan: 20 [0051] Housing: 22 [ 0052] Convex plate: 24 [0053] Through hole: 240 [0054] Heat sink group: 30 [0055] Heat sink: 32 [0056] Housing hole: 34 [0057] Thermal plate: 40 099101997 Form number A0101 Page 14 / 23 pages 0992003885-0 201126325 [0058] Heat pipe group: 5 0 [0059] First heat pipe: 52 [0060] First evaporation section: 522 [0061] First condensation section: 524 [0062] First connection section: 526 [0063] Second heat pipe: 54 [0064] Second evaporation section: 542 〇 ^ [0065] Second condensation section: 544 [0066] Second connection section: 546 [0067] Buckle combination: 6 0 [0068] Fixed frame: 62 [0069] Fixing plate: 620 ΓλΛ»*7Γ\Ί LVAMU” his βΒ — · /? ο ο 牙 —— Γ幵 J 口 · ϋ 乙 〇 [0071] Second opening: 624 [0072] Pressure ring: 626 [0073] Riveting hole: 627 [0074] Buckle: 628 [0075] Connecting piece: 629 [0076] Connecting hole: 6290 099101997 Form number Α 0101 Page 15 / Total 23 page 0992003885-0 201126325 [0077] Inclined section: 6292 [0078] Horizontal portion: 6294 [0079] Buckle: 6 4 [0080] Intermediate portion: 642 [0081] Pressing portion: 6422 [0082] Pressing portion: 6424 [0083] Buckle arm: 644 [0084] Clasp: 6 4 4 0 [0085] Circuit board: 70 [0086] Main components: 72 [0087] Peripheral components: 74 [0088] Mounting holes: 76 [0089] Mounting ring: 78 [0090] Mounting: 100 [ 0091] Set screw: 200 [0092] Pivot screw: 300 099101997 Form number A0101 Page 16 / Total 23 page 0992003885-0