201127269 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，尤其涉及一種電子元件散熱 裝置。 【先前技術·】 [0002] 隨著電子產業之迅速發展，電子元件如中央處理器（CPU )等之運算速度大幅度提高，其產生之熱量亦隨之劇增 ，如何將電子元件之熱量散發出去，以保證其正常運行 ，一直係業界重視之問題。為有效散發中央處理器在運 ^ 行過程中產生之熱量，業界通常在電子元件表面加裝一 散熱器，從而使電子元件自身溫度維持在正常運行範圍 内。 [0003] 在一些電子系統如計算機内，不僅中央處理器需要裝設 散熱器進行散熱，同時中央處理器周圍之一些電子芯片 如英特爾（INTEL)主板上之北橋（MCH)、南橋（ICH )同樣亦需要進行冷却處理，否則將影響整個系統之正 Q 常運行。以往，通常係在利用一較大之散熱器同時覆蓋 中央處理器和周邊電子芯片進行散熱。該散熱器具有一 同時與多個電子元件如中央處理器和其他電子芯片接觸 之導熱基板，然而，由於產品自身存在之公差以及電子 元件之間之高度不等原因，難於將預先設計好之導熱基 板緊密安裝到電子元件上，而使導熱基板與電子元件之 間之接觸存在間隙，嚴重影響到散熱器對多個電子元件 之散熱效果。 【發明内容】 099101996 表單編號A0101 第3頁/共23頁 0992003884-0 201127269 [0004] 有鑒於此，實有必要提供— 幷安裝靈活之散熱裝薏。 種對多個電子元件進行散熱 [0005] -種散熱裝置’用於對電路板上之第— 電子元件進行散熱，包括安裝在第— 電子元件和第二 基座和安裝在第二電子元件上之— 基座與第一基座活動連接。 電子元件上之一第 第二基座，所述第 剛i述散熱裝置之第-基座和第二基座可分別安裝在多個 電子元件上進行散熱，且由於所述第二基座與第-基座 活動連接’即使電子元件之間之高度不等或者存在—定 之a差之晴况了亦可將基座分別靈活安裝到各個電子 元件上幷保證基座與電子元件之間緊密接觸。 【實施方式】 _]如圖1至3所示’本發明―些實施财之散熱1置可用於 對安裝在如計算機主板等電路板7〇上，以對電路板之 發熱最大之第一電子元件72如中:央處理器（CPU)進行散 熱之同時，對發熱量較大之如英特爾（INTEL)主板上之 北橋（MCH)、南橋（ICH)等第二電子元件⑽行散熱 。上述散熱裝置包括安襞在第一電子元件72上之—第— 基座10、安裝在第-基㈣上—風扇2Q、位於第一基座 10—側正對風扇20之一散熱片組3〇、安裝在第二電子元 件74之第二基座和分別將第一基座1〇及第二基座與散熱 片組30導熱連接之-熱管組5〇。所述第二基座包括與第 二電子元件74導熱接觸之一導熱板4〇和將導熱板4〇緊固 到第二電子元件74上之—扣具組合。 099101996 上述電路板70在第一電子元件72周圍之 表單編號A0101 第4頁/共23頁 四對稱位置分別 0992003884-0 [0008] 201127269 開設有一安裝孔76，電路板70在第二電子元件74周圍幷 對應第二電子元件74之二對角處設置二與扣具組合60配 合之安裝環78。 [0009] 上述第一基座10包括一安裝架12和結合於安装架12底部 之一導熱底板14。該底板14呈矩形，可由導熱性能優越 之金屬如銅製成，底板14之頂面形成有複數容置槽140 ° 所述容置槽140相互幷排且與底板14之兩相對邊緣平行。 所述容置槽140可以直接由底板14頂面向下四陷而成’亦 0 可以如本實施例中之底板14一樣，由底板14頂面向下凹 陷之同時還有複數S條沿容置槽14 0兩側向上凸起而形成 截面呈半圓狀之容置槽140。 [0010] 上述安裝架12跨設在第一電子元件72之上，以將底板14 壓設在第一電子元件72頂面上。該安裝架12包括一基部 122和由基部122四角向外延伸之四安裝脚丨24。該基部 122大致呈矩形，其底部開設亦與底板14容置槽140對應 之容置槽1220 °所堞容置槽122〇相互幷排幷與基部122 〇 之兩相對邊緣平行。錢基部122對應容置槽1 220之中間部 分向上棋起’使容置槽1220正好形成於基部122拱起之部 分内’而基部122之兩侧部分可供中間拱起部分之厚度小 ，以節約材料之同時减輕第一基座1〇之重量。上述四安 裝脚124分別自基部122四角沿對角綫向外延伸，每一安 裝脚124之末端連接—安裝筒124(^每一安裝筒124〇内 穿置有將散熱裝置固定到電路板7〇上安裝件丨〇〇 ^上述四 安裝脚124中有三安裝件1〇〇分別向外延伸有三固定臂 126，所述固定臂126分別由安裝脚丨24 一侧緣之中部向 099101996 表單編號A0101 第5頁/共23頁 0992003884-0 201127269 外延伸，而且所述固定臂126延伸之方向與容置槽122〇平 行。每一固定臂126之末端形成一固定筒1260，所述固定 筒1 260用於承接風扇20，且每一固定筒1 260内開彀用於 固定風扇20之一固定孔1262。 [0011] 上述安裝架12向一侧延伸出有z承托散熱片組3〇之托架 127 ’該托架127包括從相鄰 > 安裝筒1240之周緣向外延 伸之二延伸部1272和連接二延伸部1 272之一承接部12了4 。所述二延伸部1272相互平行間隔幷垂直於安裝架12底 部之容置槽1220向外延伸。所述承接部1274平行於所过^ 容置槽1220。所述二延伸部1272之外側緣分別垂直向上 凸起形成有限位凸部1270，以阻止承放於承接部1274上 之散熱片組30侧向滑動。上述安裝架12向與托架127相反 之一側延伸有一定位板128，該定位板128垂直於容置槽 1220以及固定臂126向外延伸，該定位板128位於基部 12 2與托架12 7相反之一側，且由基部1 2 2該側與安裝脚 124之連接處向外延伸。該定位板128頂面靠近末端處向 上凸起形成一環形凸台1280，所述凸台1280内以及定位 板128對應凸台1280處開設一定位孔1282，以與扣具組 合6 0配合。 [0012] 請一幷參閱圖5，上述第一基座10處於組裝狀態時，該底 板14結合於安裝架12基部122底部，底板14頂部之容置 槽140與基部122底部之容置槽1220配合形成複數圓形容 置通孔，所述容置通孔由基部122與托架127之承接部 1 2 7 4垂直之相對兩侧向外開口，以容置熱管組5 0之一部 分。該第一基座10通過安裝脚124上之安裝件1〇〇與電路 099101996 表單編號Α0101 第6頁/共23頁 0992003884-0 201127269 板70上之女裝孔76配合而將第—基座固定在第一電子 70件72上，且使第一基座底板14與第一電子元件72之 頂面緊密接觸。 [0013] Ο 上述風扇20為離心式風扇，風扇2〇固定於第一基座1〇上 為散熱片組30提供強制氣流。該風扇2〇包括一矩形殼體 22，该殼體22底部之周緣形成有與第—基座1〇固定筒 1260對應之三凸板24。所述殼體22對應凸板以處向内凹 陷。所述凸板24中有二凸板24位於殼體22相鄰之角落處 ，剩下—凸板24形成於與殼體22另一角落靠近之位置。 母凸板24上開設一通孔240。上述風扇2〇安裝於第一基 座10上時，每一凸板24分別承接於第一基座1〇上一對應 之固定筒1260上，該風扇20通過三固定螺釘2〇〇分別向 下穿過風扇20凸板24之通孔240與對應固定筒1260内之 固定孔1262配合而固定在第一基座1〇上。 [0014] 上述散熱片組30承放於第一基座10之托架127上，且散熱 片組30鄰接風扇2〇之出風口。該散熱片組3〇包括複數相 互平行間隔之散熱片32，所述散熱片32相互平行間隔且 由風扇20之出風口向外延伸，相鄰散熱片32之間開設有 與風扇20出風口連通之氣流通道。所述散熱片32底部之 中間部分承接於托架127之承接部1274上，所述散熱片 32之靠外之一端同時向一側呈-定角度彎折，以使散熱 片32内之空氣通道同時彎折延伸’從而改變氣流方向產 生紊流幷减少散熱片32表面之空氣滯留，進而有效提高 風扇20產生之強制氣流與散熱片32之間之熱交換效率β 該散熱片組30開設有複數收容孔34，所述收容孔34相互 099101996 表單煸號Α0101 0992003884-0 201127269 間隔幷垂直於散熱片3 2由散熱片組3 0之—側延伸之另一 相對側。上述托架127兩側之限位凸部127〇分別抵在散熱 片組30之兩相對側面，而起到阻止散熱片組3〇向托架127 兩侧滑動之限位作用。 [0015] 上述導熱板40由導熱性能良好之銅材料製成，所述導熱 板40本實施例中呈矩形，用於貼在第二電子元件74頂面 上，以直接吸收第二電子元件74之熱量再通過熱管組5〇 傳遞給散熱片組3 0。 [0016] 上述熱管組50包括將弟一基座10與散熱片組3〇導熱連接 (、 複數第一熱管52和將散熱片組30與導熱板4〇導熱連接之 至少一第二熱管54。所述第一熱管52之數量與第一基座 10安裝架12之容置槽1220或者底板丨4之容置槽140之數 量對應相等。在本實施例中所述第一熱管52之數量為二 ，每一第一熱管52大致呈U形，每一第一熱管52包括一第 一蒸發段522、與第一蒸發_5科平行之一第一冷凝段 524和垂直連接第一蒸發段522與第一冷凝段524之一第 一連接段526。所述至少一第二熱管54在本實施例中之數 i : 量為一，所述第二熱管54包括一第二蒸發段542、一第二 冷凝段544和連接第二蒸發段542和第二冷凝段544之一 第二連接段546。該第二熱管54之第二蒸發段542和第二 冷凝段544均呈平直狀’而該第二連接段546可根據具體 需要選擇各種彎曲形狀’該第二連接段546由第二蒸發段 542之一端彎折延伸而出幷連接第二冷凝段544之一端。 [0017] 上述熱管組50在使用時’所述第一熱管52之第一冷凝段 524以及第二熱管54之第二冷凝段544分別穿設於散熱片 0992003884-0 099101996 表單編號A0101 第8頁/共23頁 201127269 組30收容孔34内；所述第一熱管52之第一連接段526以 及第二熱管54之第二連接段546均位於散熱片組30以及第 一基座10之同一側；所述第一熱管52之第一蒸發段522穿 置於第一基座10基部122底部之容置槽1220與底板14頂 部之容置槽140配合形成圓形容置通孔内；所述第二熱管 54之第二蒸發段542由第一基座10及散熱片組30之同一 侧向外延伸至導熱板40之頂面》 [0018] Ο ο 特別如圖4所示，上述扣具組合60用於將第二熱管54之第 二蒸發段542貼固於導熱板4G頂面之同時將導熱板40固定 到第二電子元件7 4上。該扣具組合6 0包括將第二蒸發段 542固定至導熱板40頂面之一肩定架62和將筹熱板40固 定到第二電子元件7 4上之一扣綫6 4該·固定:架6 2具有一 固定板620 ’該固定板620之形狀大小與導熱板4〇對應。 該固定板620上開設一第一長開口 622和第二長開口 624 ’其中第一長開口 622沿固定板620之一對角綫將固 定板620分成兩三角部分；該第二長開口 624沿垂直於固 定板620兩相對邊緣之一中綫將固定板620分開；第一長 開口 622與第一長開口 622相交；第一長開口622之寬度 略大於第二熱管54之第二蒸發段542之截面寬度，以收容 第二蒸發段542 ’該第二長開口 624之寬度略大於扣殘64 之截面直徑，以收容扣錢64之中間部分。 [0019] 上述固定板620在第一長開口 622之兩端處對應設置有二 壓環626，所述壓環626由固定板620向上拱起，壓環626 橫跨第一長開口 622將固定板620被第一長開口 622分開 之兩部分連接起來。該固定板620在第二長開口 624之兩 099101996 表單編號Α0101 第9頁/共23頁 0992003884-0 201127269 端處對應設置有二扣環628，所述扣環628由固定板620 向上拱起’扣環628橫跨第二長開口 624將固定板620被 第二長開口 624分開之部分連接起來。該固定板620上開 設有複數鉚接孔627，用於將固定板620鉚接到導熱板40 頂面。 [0020] 上述固定架62還具有由固定板620 —側緣延伸而出之連接 部’該連接部與第一基座1〇之定位板128活動連接，該活 動連接係指連接部以及整個固定架62可相對連接部與定 位板12 8連接處在一較小範圍内來回移動，例如連接部可 相對連接部與定位板128帶動固定架62上、下及左右之小 範圍内移動。可以理解，所述連接部可以作為固定架62 之一獨立部分，通過焊接'鉚接或者黏貼等方式直接設 置於導熱板40上。在本實施例中，所述連接部為由固定 板620—側緣延伸而出一連接片629，該連接片包括由固 定板6 2 〇 一側緣傾斜向上向外延伸之一傾斜部6 2 9 2和有傾 斜部6292上端緣水平延伸而出之一水平部6294。該水平 部6294靠近末端處開設一連接孔6290。 [0021] 上述扣綫64由彈性金屬綫彎折而成，該扣綫64包括一中 間部642和由中間部642相對兩端反方向傾斜延伸而出之 二扣合臂644。該中間部642包括二抵壓部6422和連接二 抵壓部6422之—壓扣部6424，該壓扣部6424位於二抵壓 部6422之間幷由二抵壓部6422相向端部向上拱起。所述 扣合之末端形成有扣鈎6440，該扣鈎6440由知合 臂644之末端先向下再向上彎折而成。 [0022] 099101996 同時參閱圖1至3 表單編號A0101 ’在使用時，上述固定架62可通過固定 第10頁/共23頁 0992003884-0 201127269 板620與導熱板40頂面焊接或黏貼等方式固定，在本實施 例中’固定架62通過固定板620上之鉚接孔627與導熱板 40鉚接固定。該第二熱管54之第二蒸發段542穿置在固定 架62之二壓環626内與導熱板40頂面接觸幷位於固定板 620之第一長開口 622内。該扣綫64中間部642之二抵麗 部6422分別穿置與固定板620之二扣環628内幷位於第二 長開口 624之内’扣錢64中間部642之壓扣部6424位於二 扣環628之間幷跨過第二熱管54之第二蒸發段542。該扣 幾64扣合臂644末端之扣鈎6440分別鈎住第二電子元件 〇 74對角上之安裝環78而將導熱板40固定到第二電子元件 74上’且此時扣綫64處於彈性變形狀態，在形變力之作 用下’扣綫64中間部642之二抵壓部6422下壓導熱板4〇 使導熱板40與第二電子元件74緊密接觸，同時扣綫64中 間部642之壓扣部6424下壓第二熱管54之第二蒸發段542 頂面，使第二蒸發段542底面與導熱板40頂面緊密接觸， 從而有效保證從第二電子元件74熱量通過第二熱管54快 速傳遞給散熱片組30» ^ 〇 [0023] 上述固定架62連接片629之水平部6294承接於第一基座 10定位板128上面，且定位板128上之圓環形凸台1280穿 置於連接片629之連接孔6290内，再用一栂接螺釘3〇〇結 合於定位板128之定位孔1282内，從而將第二基座之固定 架62與第一基座1〇樞接在一起。該枢接螺釘3〇〇具有一頭 部而使定連接片629夾置在樞接螺釘30 0之頭部與定位板 128之間。在本實施例中，所述連接片629之連接孔6290 之孔徑大於定位板128之圓環形凸台1280之外徑幷小於樞 099101996 表單編號A0101 第11頁/共23頁 0992003884-0 201127269 接螺釘300頭部之外徑’使連接片629可帶動固定架62以 及與固定架62鉚接之導熱板40關於圓環形凸台128〇水平 轉動，此外，所述樞接螺釘300之頭部與定位板128之間 距離大於連接片629之厚度’使連接片629可帶動固定架 62以及與固定架62鉚接之導熱板4〇在樞接螺釘3〇〇之頭 部與定位板128之間之範圍内在竪直方向上上下移動。 [0024] 上述固定架62與第一基座1〇通過連接部（連接片629 )連 接’可防止連接第一基座10與導熱板4〇之第二熱管54在 運輸或安裝之過程中過度變形而產生損壞。然而，如果 將導熱板40通過固定架62與第一基座10完全固死，就會 因為沒有活動空間，產品公差稍有問題，就會因為扣合 力不平衡，導致接觸間隙。 [0025] 上述散熱裝置之第一基座1〇、風扇2〇以及散熱片組3〇等 主體部分安裝在電路板70上之第一電子元件γ2上，再通 過由第二熱管54及導熱板4:0.將..第..一電子》件72周圍之第 . . . ..：. μ !；'. 1 ' 二電子元件74與主體部導蠢連接如★散熱裝置便可以 同時對第一電子元件72以美第二電子元件74進行散熱， 且占據第二電子元件74之極小空間，從而達到節省空間 之目的。 [〇〇26] 可以理解，在其他實施例中，上述散熱裝置可以包括多 個第一熱管54及多個對應之導熱板40，以對電路板上 第一電子元件72周圍之多個第二電子元件74進行散熱。 [0027] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 099101996 表單編號Α0101 第12頁/共23頁 0992003884-0 201127269 [0028] 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係帶有本發明一實施例中散熱裝置安裝於電路板上之 立體組合圖。 [0029] 圖2係圖1中散熱裝置之分解圖。 [0030] 圖3係圖1中散熱裝置之部分分解圖。 [0031] 圖4係圖2中扣具組合之放大圖。 〇 [0032] 圖5係圖1中散熱裝置之部分分解倒置圖。 [0033] 【主要元件符號說明】 第一基座：10 [0034] 安裝架：12 [0035] 基部：122 [0036] 容置槽：1220、140 〇 [0037] 安裝脚：124 [0038] 安裝筒：1240 [0039] 固定臂：126 [0040] 固定筒：1260 [0041] 固定孔：1262 [0042] 托架：127 [0043] 限位凸部：1270 099101996 表單編號A0101 第13頁/共23頁 0992003884-0 201127269 [0044] 延伸部：1272 [0045] 承接部：1274 [0046] 定位板：128 [0047] 凸台：1280 [0048] 定位孔：1282 [0049] 底板：14 [0050] 風扇：2 0 [0051] 殼體：22 [0052] 凸板：24 [0053] 通孔：240 [0054] 散熱片組：30 [0055] 散熱片：32 · [0056] 收容孔：34 [0057] 導熱板：40 [0058] 熱管組：5 0 [0059] 第一熱管：52 [0060] 第一蒸發段：522 [0061] 第一冷凝段：524 [0062] 第一連接段：526 099101996 表單編號A0101 第14頁/共23頁 0992003884-0 201127269 [0063]第二熱管：54 [0064] 第二蒸發段：542 [0065] 第二冷凝段：544 [0066] 第二連接段：546 [0067] 扣具組合：60 [0068] 固定架：62 [0069] 固定板：620 〇 [0070] 第一長開口 ： 622 [0071] 第二長開口 ： 624 [0072] 壓環：6 2 6 [0073] 鉚接孔：627 [0074] 扣環：628 「ΛΛπΓΊ Ll/UIOJ 連接片：629 [0076] 連接孔：6290 [0077] 傾斜部：6292 [0078] 水平部：6294 [0079] 扣綫：64 [0080] 中間部：642 [0081] 抵壓部：6422 099101996 表單編號A0101 第15頁/共23頁 0992003884-0 201127269 [0082] 壓扣部：6424 [0083] 扣合臂：644 [0084] 扣鈎：6 4 4 0 [0085] 電路板：70 [0086] 第一電子元件： 72 [0087] 第二電子元件： 74 [0088] 安裝孔：76 [0089] 安裝環：78 [0090] 安裝件：100 [0091] 固定螺釘：200 [0092] 樞接螺釘：300 099101996 表單編號A0101 第16頁/共23頁 0992003884-0201127269 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat sink device, and more particularly to an electronic component heat sink device. [Prior Art·] [0002] With the rapid development of the electronics industry, the computing speed of electronic components such as the central processing unit (CPU) has been greatly improved, and the heat generated by it has also increased dramatically. How to dissipate the heat of electronic components Going out to ensure its normal operation has always been a matter of concern to the industry. In order to effectively dissipate the heat generated by the CPU during operation, the industry usually installs a heat sink on the surface of the electronic component to maintain the electronic component's own temperature within normal operating range. [0003] In some electronic systems, such as computers, not only the central processing unit needs to be equipped with a heat sink for heat dissipation, but also some electronic chips around the central processing unit, such as the North Bridge (MCH) and the South Bridge (ICH) on the Intel (INTEL) main board. Cooling is also required, otherwise it will affect the positive Q operation of the entire system. In the past, it was common to use a large heat sink to cover both the central processing unit and the peripheral electronic chip for heat dissipation. The heat sink has a thermally conductive substrate that is in contact with a plurality of electronic components such as a central processing unit and other electronic chips. However, due to the tolerance of the product itself and the height difference between the electronic components, it is difficult to design a thermally conductive substrate in advance. Tightly mounted to the electronic component, there is a gap between the thermal substrate and the electronic component, which seriously affects the heat dissipation effect of the heat sink on the plurality of electronic components. SUMMARY OF THE INVENTION 099101996 Form No. A0101 Page 3 of 23 0992003884-0 201127269 [0004] In view of this, it is necessary to provide - 幷 flexible installation of heat dissipation. Dissipating heat to a plurality of electronic components [0005] - a heat sink for dissipating heat from a first electronic component on a circuit board, including mounting on the first electronic component and the second base and mounting on the second electronic component - the base is movably connected to the first base. a second pedestal on the electronic component, wherein the first base and the second pedestal of the heat sink are respectively mounted on the plurality of electronic components for heat dissipation, and because the second pedestal The pedestal active connection 'even if the height between the electronic components is different or exists - the difference between the abundance and the pedestal can be flexibly mounted on each electronic component, ensuring close contact between the pedestal and the electronic component . [Embodiment] _] As shown in Figures 1 to 3, the present invention - some of the implementation of the heat dissipation 1 can be used for mounting on a circuit board such as a computer motherboard, the first electron to maximize the heat of the circuit board The component 72 is such that the central processing unit (CPU) performs heat dissipation while dissipating heat to the second electronic component (10) such as the north bridge (MCH) and the south bridge (ICH) on the Intel (INTEL) main board. The heat dissipating device comprises a first base 10 mounted on the first electronic component 72, a first base 10 mounted on the first base (four), a fan 2Q, and a heat sink set 3 facing the fan 20 on the side of the first base 10 The second susceptor mounted on the second electronic component 74 and the heat pipe group 5 分别 respectively thermally connecting the first pedestal 1 〇 and the second pedestal to the heat sink group 30. The second base includes a heat conducting plate 4A in thermal contact with the second electronic component 74 and a clip assembly that secures the heat conducting plate 4A to the second electronic component 74. 099101996 The circuit board 70 has a mounting number 76 on the form number A0101 of the first electronic component 72, page 4 of the fourth electronic component 72, and a symmetrical position of 0992003884-0 [0008] 201127269, a circuit board 70 is disposed around the second electronic component 74. Two mounting holes 78 that cooperate with the clip assembly 60 are disposed at two opposite corners of the second electronic component 74. The first base 10 includes a mounting bracket 12 and a thermally conductive bottom plate 14 coupled to the bottom of the mounting bracket 12. The bottom plate 14 has a rectangular shape and can be made of a metal having excellent thermal conductivity, such as copper. The top surface of the bottom plate 14 is formed with a plurality of accommodating grooves 140. The accommodating grooves 140 are mutually arranged and parallel to the opposite edges of the bottom plate 14. The accommodating groove 140 can be directly recessed from the top surface of the bottom plate 14 to form a lower portion. The same can be used as the bottom plate 14 in the embodiment, and the bottom surface of the bottom plate 14 is recessed downwardly along with a plurality of S along the accommodating groove. 14 0 is convex upwards on both sides to form a receiving groove 140 having a semicircular cross section. [0010] The mounting bracket 12 is disposed above the first electronic component 72 to press the bottom plate 14 on the top surface of the first electronic component 72. The mounting bracket 12 includes a base portion 122 and four mounting feet 24 extending outwardly from the four corners of the base portion 122. The base portion 122 has a substantially rectangular shape, and the bottom portion thereof has a receiving groove 1220 corresponding to the receiving groove 140 of the bottom plate 14. The receiving groove 122 is parallel to the opposite edges of the base portion 122. The money base 122 corresponds to the middle portion of the accommodating groove 1 220 and moves upwards so that the accommodating groove 1220 is formed in the portion where the base portion 122 is arched, and the two sides of the base portion 122 are available for the thickness of the intermediate bulging portion to be small. The material is saved while reducing the weight of the first base. The four mounting legs 124 extend diagonally from the corners of the base portion 122, and the end of each mounting leg 124 is connected to the mounting barrel 124. (Each mounting barrel 124 is inserted into the mounting plate to fix the heat sink to the circuit board 7 The upper mounting member 丨〇〇 ^ three of the four mounting legs 124 are respectively extended with three fixing arms 126 respectively, the fixing arms 126 are respectively from the side of the mounting flange 24 to the side of the 099101996 form number A0101 5th/23rd page 0992003884-0 201127269 is extended, and the fixing arm 126 extends in a direction parallel to the receiving groove 122. The end of each fixing arm 126 forms a fixing cylinder 1260, and the fixing cylinder 1260 It is used to receive the fan 20, and each of the fixed cylinders 1 260 is opened for fixing one fixing hole 1262 of the fan 20. [0011] The mounting bracket 12 extends to one side and has a z-supporting fin group 3 Rack 127 'The bracket 127 includes two extensions 1272 extending outwardly from the periphery of the adjacent mounting barrel 1240 and one of the receiving portions 12 272 connecting the two extensions 1 272. The two extensions 1272 are spaced apart from each other.幷 is perpendicular to the receiving groove 1220 at the bottom of the mounting frame 12 The receiving portion 1274 is parallel to the receiving groove 1220. The outer edges of the two extending portions 1272 are vertically upwardly convex to form a finite convex portion 1270 to prevent heat dissipation from the receiving portion 1274. The locating plate 12 extends laterally. A mounting plate 128 extends from a side opposite to the bracket 127. The positioning plate 128 extends perpendicularly to the receiving slot 1220 and the fixing arm 126. The positioning plate 128 is located at the base. 12 2 is opposite to the bracket 12 7 and extends outwardly from the joint of the base 1 2 2 and the mounting leg 124. The top surface of the positioning plate 128 is convex upwardly near the end to form an annular boss 1280. A positioning hole 1282 is defined in the boss 1280 and the positioning plate 128 corresponding to the boss 1280 to cooperate with the buckle assembly 60. [0012] Referring to FIG. 5, when the first base 10 is in an assembled state The bottom plate 14 is coupled to the bottom of the base portion 122 of the mounting frame 12. The receiving groove 140 at the top of the bottom plate 14 cooperates with the receiving groove 1220 at the bottom of the base portion 122 to form a plurality of circular receiving through holes. The receiving through holes are supported by the base portion 122 and the supporting portion. The receiving portion of the frame 127 is 1 2 7 4 opposite sides of the vertical The opening is for accommodating a portion of the heat pipe group 50. The first base 10 passes through the mounting member 1 on the mounting foot 124 and the circuit 099101996 Form No. 101 0101 Page 6 / Total 23 Page 0992003884-0 201127269 Plate 70 The female hole 76 cooperates to fix the first base to the first electronic 70 member 72, and the first base bottom plate 14 is in close contact with the top surface of the first electronic component 72. [0013] The fan 20 is a centrifugal fan, and the fan 2 is fixed to the first base 1 to provide a forced air flow to the heat sink group 30. The fan 2 includes a rectangular casing 22, and a peripheral edge of the bottom of the casing 22 is formed with a three convex plate 24 corresponding to the first base 1 fixed cylinder 1260. The housing 22 is recessed inwardly corresponding to the convex plate. The convex plate 24 has two convex plates 24 located at adjacent corners of the casing 22, and the remaining convex plates 24 are formed at positions close to the other corner of the casing 22. A through hole 240 is defined in the female convex plate 24. When the fan 2 is mounted on the first base 10, each of the convex plates 24 is respectively received on a corresponding fixed cylinder 1260 on the first base 1 , and the fan 20 is respectively lowered by three fixing screws 2 The through hole 240 passing through the convex plate 24 of the fan 20 is fixed to the first base 1〇 in cooperation with the fixing hole 1262 in the corresponding fixed cylinder 1260. [0014] The heat sink group 30 is placed on the bracket 127 of the first base 10, and the heat sink group 30 is adjacent to the air outlet of the fan 2. The fin group 3 includes a plurality of fins 32 spaced apart from each other. The fins 32 are parallel to each other and extend outward from the air outlet of the fan 20. The adjacent fins 32 are connected to the air outlet of the fan 20. Air flow channel. The middle portion of the bottom of the heat sink 32 is received on the receiving portion 1274 of the bracket 127, and the outer end of the heat sink 32 is bent at a right angle to one side to make the air passage in the heat sink 32 At the same time, the bending extends to change the airflow direction to generate turbulence, and the air retention on the surface of the heat sink 32 is reduced, thereby effectively improving the heat exchange efficiency between the forced airflow generated by the fan 20 and the heat sink 32. The heat sink group 30 is provided with plural The receiving hole 34, the receiving hole 34 is mutually perpendicular to the other opposite side of the fins 3 2 extending from the side of the fin group 30 from the 099101996 form number Α0101 0992003884-0 201127269. The limiting protrusions 127 on both sides of the bracket 127 respectively abut against the opposite sides of the heat sink group 30, and function to prevent the heat sink group 3 from sliding toward both sides of the bracket 127. [0015] The heat conducting plate 40 is made of a copper material having good thermal conductivity. The heat conducting plate 40 is rectangular in the embodiment for attaching to the top surface of the second electronic component 74 to directly absorb the second electronic component 74. The heat is transferred to the heat sink group 30 through the heat pipe group 5〇. [0016] The heat pipe group 50 includes a heat conduction connection between the pedestal 10 and the heat sink group 3 (the plurality of first heat pipes 52 and at least one second heat pipe 54 that thermally connects the heat sink group 30 and the heat conductive plate 4 。). The number of the first heat pipes 52 is equal to the number of the receiving grooves 1220 of the mounting frame 12 of the first base 10 or the receiving grooves 140 of the bottom plate 4. In the embodiment, the number of the first heat pipes 52 is Second, each of the first heat pipes 52 is substantially U-shaped, and each of the first heat pipes 52 includes a first evaporation section 522, a first condensation section 524 parallel to the first evaporation_5 section, and a first evaporation section 522 connected vertically. And a first connecting section 526 of the first condensation section 524. The number i of the at least one second heat pipe 54 in the embodiment is one, and the second heat pipe 54 includes a second evaporation section 542, a a second condensation section 544 and a second connection section 546 connecting the second evaporation section 542 and the second condensation section 544. The second evaporation section 542 and the second condensation section 544 of the second heat pipe 54 are both flat. The second connecting section 546 can select various curved shapes according to specific needs. The second connecting section 546 is composed of the second evaporating section 54. 2 one end bends to extend and exits one end of the second condensation section 544. [0017] The heat pipe group 50 described above uses a first condensation section 524 of the first heat pipe 52 and a second condensation of the second heat pipe 54 in use. The segments 544 are respectively disposed in the heat sink 0992003884-0 099101996 Form No. A0101 Page 8 / 23 pages 201127269 Group 30 receiving holes 34; the first connecting portion 526 of the first heat pipe 52 and the second heat pipe 54 second The connecting section 546 is located on the same side of the heat sink group 30 and the first base 10; the first evaporation section 522 of the first heat pipe 52 passes through the receiving groove 1220 and the bottom plate 14 at the bottom of the base 122 of the first base 10 The top receiving groove 140 cooperates to form a circular receiving through hole; the second evaporation portion 542 of the second heat pipe 54 extends outward from the same side of the first base 10 and the heat sink group 30 to the top of the heat conducting plate 40 [0018] In particular, as shown in FIG. 4, the above-mentioned fastener assembly 60 is used to fix the second evaporation section 542 of the second heat pipe 54 to the top surface of the heat conducting plate 4G while fixing the heat conducting plate 40 to the second. The electronic component 74. The fastener assembly 60 includes fixing the second evaporation section 542 to the top surface of the heat conducting plate 40. a shoulder fixing frame 62 and a fixing wire 40 for fixing the heat collecting plate 40 to the second electronic component 74. The fixing: the frame 6 2 has a fixing plate 620. The shape and size of the fixing plate 620 and the heat conducting plate 4 Corresponding to. The fixing plate 620 defines a first long opening 622 and a second long opening 624 ′, wherein the first long opening 622 divides the fixing plate 620 into two triangular portions along a diagonal line of the fixing plate 620; the second length The opening 624 separates the fixing plate 620 along a line perpendicular to one of the opposite edges of the fixing plate 620; the first long opening 622 intersects the first long opening 622; the width of the first long opening 622 is slightly larger than the second evaporation of the second heat pipe 54 The section width of the section 542 is such as to accommodate the second evaporation section 542'. The width of the second long opening 624 is slightly larger than the cross-sectional diameter of the buckle 64 to accommodate the middle portion of the deduction 64. [0019] The fixing plate 620 is correspondingly provided with two pressing rings 626 at two ends of the first long opening 622. The pressing ring 626 is upwardly arched by the fixing plate 620, and the pressing ring 626 is fixed across the first long opening 622. The plate 620 is joined by two portions separated by a first long opening 622. The fixing plate 620 is provided with two buckles 628 at the ends of the second long opening 624, 099101996, Form No. 1010101, Page 9/23, 0992003884-0, 201127269, and the buckle 628 is arched upward by the fixing plate 620. The buckle 628 connects the portions of the fixed plate 620 separated by the second long opening 624 across the second long opening 624. The fixing plate 620 is provided with a plurality of rivet holes 627 for riveting the fixing plate 620 to the top surface of the heat conducting plate 40. [0020] The fixing frame 62 further has a connecting portion extending from a side edge of the fixing plate 620. The connecting portion is movably connected with the positioning plate 128 of the first base 1 , and the movable connection is a connecting portion and the entire fixing. The frame 62 can be moved back and forth in a relatively small range with respect to the connection between the connecting portion and the positioning plate 128. For example, the connecting portion can move relative to the connecting portion and the positioning plate 128 to drive the upper, lower and left and right sides of the fixing frame 62. It can be understood that the connecting portion can be used as a separate part of the fixing frame 62, and is directly disposed on the heat conducting plate 40 by welding riveting or pasting. In this embodiment, the connecting portion extends from the side edge of the fixing plate 620 to form a connecting piece 629. The connecting piece includes an inclined portion 6 2 which is inclined upward and outward by a side edge of the fixing plate 6 2 . 9 2 and the upper end edge of the inclined portion 6292 extend horizontally to form a horizontal portion 6294. The horizontal portion 6294 defines a connecting hole 6290 near the end. [0021] The buckle wire 64 is formed by bending an elastic metal wire, and the buckle wire 64 includes an intermediate portion 642 and two fastening arms 644 extending obliquely from opposite ends of the intermediate portion 642. The intermediate portion 642 includes two pressing portions 6422 and a pressing portion 6424 connecting the two pressing portions 6422. The pressing portion 6424 is located between the two pressing portions 6422 and is upwardly arched from opposite ends of the two pressing portions 6422. . The end of the fastening is formed with a hook 6440 which is formed by bending the end of the arm 644 downward and upward. [0022] 099101996 See also FIGS. 1 to 3 Form No. A0101 'When in use, the above-mentioned fixing frame 62 can be fixed by fixing the 10th page/total 23 page 0992003884-0 201127269 plate 620 and the top surface of the heat conducting plate 40 for welding or pasting. In the present embodiment, the fixing frame 62 is riveted and fixed to the heat conducting plate 40 through the rivet holes 627 on the fixing plate 620. The second evaporating section 542 of the second heat pipe 54 is disposed in the second pressing ring 626 of the fixing frame 62 and is in contact with the top surface of the heat conducting plate 40, and is located in the first long opening 622 of the fixing plate 620. The middle portion 642 of the buckle line 64 is inserted into the second buckle 628 of the fixing plate 620, and the inner portion of the buckle 628 is located in the second long opening 624. The buckle portion 6424 of the middle portion 642 of the buckle 64 is located at the second buckle. The second evaporating section 542 of the second heat pipe 54 is crossed between the rings 628. The buckles 6440 at the ends of the snap arms 644 are hooked to the mounting rings 78 on the diagonal of the second electronic component 〇 74 to fix the heat conducting plate 40 to the second electronic component 74. In the elastic deformation state, under the action of the deformation force, the two pressing portions 6422 of the middle portion 642 of the buckle 64 press down the heat conducting plate 4, so that the heat conducting plate 40 is in close contact with the second electronic component 74, and the intermediate portion 642 of the buckle 64 is The pressing portion 6424 presses the top surface of the second evaporation section 542 of the second heat pipe 54 so that the bottom surface of the second evaporation section 542 is in close contact with the top surface of the heat conducting plate 40, thereby effectively ensuring heat from the second electronic component 74 to pass through the second heat pipe 54. Fast transfer to the heat sink set 30» ^ 〇 [0023] The horizontal portion 6294 of the above-mentioned fixing frame 62 connecting piece 629 is received on the first base 10 positioning plate 128, and the annular boss 1280 on the positioning plate 128 is placed In the connecting hole 6290 of the connecting piece 629, a connecting screw 3 is coupled to the positioning hole 1282 of the positioning plate 128, thereby pivoting the fixing base 62 of the second base to the first base 1 together. The pivoting screw 3 has a head portion such that the fixed connecting piece 629 is interposed between the head of the pivoting screw 30 0 and the positioning plate 128. In this embodiment, the connecting hole 6290 of the connecting piece 629 has a larger diameter than the annular boss 1280 of the positioning plate 128, which is smaller than the pivot 099101996. Form No. A0101, page 11 / 23 pages, 0992003884-0 201127269 The outer diameter of the head of the screw 300 is such that the connecting piece 629 can drive the fixing frame 62 and the heat conducting plate 40 riveted with the fixing frame 62 to horizontally rotate about the annular boss 128, and further, the head of the pivoting screw 300 is The distance between the positioning plates 128 is greater than the thickness of the connecting piece 629. The connecting piece 629 can drive the fixing frame 62 and the heat conducting plate 4 riveted to the fixing frame 62 between the head of the pivoting screw 3〇〇 and the positioning plate 128. Move up and down in the vertical direction within the range. [0024] The fixing bracket 62 and the first base 1〇 are connected by a connecting portion (connecting piece 629) to prevent the second heat pipe 54 connecting the first base 10 and the heat conducting plate 4 from being excessive during transportation or installation. Deformed to cause damage. However, if the heat conducting plate 40 is completely solidified by the fixing frame 62 and the first base 10, there will be a problem in the product tolerance due to the lack of an active space, and the contact gap will be caused by the uncoupling force. [0025] The main body portion of the heat sink is first mounted on the first electronic component γ2 on the circuit board 70, and then passed through the second heat pipe 54 and the heat conductive plate. 4:0. will be the first part around the .. one electronic device 72. . . .:. μ !; '. 1 ' The two electronic components 74 and the main body guide stupid connection such as ★ heat sink can be simultaneously The first electronic component 72 dissipates heat by the second electronic component 74 and occupies a very small space of the second electronic component 74, thereby achieving space saving. [〇〇26] It can be understood that, in other embodiments, the heat dissipation device may include a plurality of first heat pipes 54 and a plurality of corresponding heat conducting plates 40 to face a plurality of second around the first electronic component 72 on the circuit board. The electronic component 74 performs heat dissipation. [0027] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, such as 099101996 Form No. 101 0101, Page 12 / Total 23 Pages 0992003884-0 201127269 [0028] Those skilled in the art, in accordance with the spirit of the present invention, etc. Modifications or changes shall be covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat dissipating device mounted on a circuit board in an embodiment of the present invention. 2 is an exploded view of the heat sink of FIG. 1. 3 is a partially exploded view of the heat sink of FIG. 1. [0031] FIG. 4 is an enlarged view of the buckle assembly of FIG. 2. [0032] FIG. 5 is a partially exploded inverted view of the heat sink of FIG. 1. [Main component symbol description] First pedestal: 10 [0034] Mounting bracket: 12 [0035] Base: 122 [0036] accommodating groove: 1220, 140 〇 [0037] Mounting feet: 124 [0038] Installation Cartridge: 1240 [0039] Fixed arm: 126 [0040] Fixed cylinder: 1260 [0041] Fixing hole: 1262 [0042] Bracket: 127 [0043] Limiting projection: 1270 099101996 Form number A0101 Page 13 of 23 Page 0992003884-0 201127269 [0044] Extension: 1272 [0045] Receiving part: 1274 [0046] Positioning plate: 128 [0047] Boss: 1280 [0048] Positioning hole: 1282 [0049] Base plate: 14 [0050] Fan : 2 0 [0051] Housing: 22 [0052] Convex plate: 24 [0053] Through hole: 240 [0054] Heat sink group: 30 [0055] Heat sink: 32 · [0056] Housing hole: 34 [0057] Thermal Conductive Plate: 40 [0058] Heat Pipe Set: 5 0 [0059] First Heat Pipe: 52 [0060] First Evaporation Section: 522 [0061] First Condensation Section: 524 [0062] First Connection Section: 526 099101996 Form Number A0101 Page 14 of 23 0992003884-0 201127269 [0063] Second heat pipe: 54 [0064] Second evaporation section: 542 [0065] Second condensation section: 544 [0066] Two connection segments: 546 [0067] Fastener combination: 60 [0068] Fixing bracket: 62 [0069] Fixing plate: 620 〇 [0070] First long opening: 622 [0071] Second long opening: 624 [0072] Pressure Ring: 6 2 6 [0073] Riveting hole: 627 [0074] Buckle: 628 "ΛΛπΓΊ Ll/UIOJ Connecting piece: 629 [0076] Connecting hole: 6290 [0077] Inclined part: 6292 [0078] Horizontal part: 6294 [ 0079] Buckle line: 64 [0080] Middle part: 642 [0081] Pressing part: 6422 099101996 Form number A0101 Page 15 / Total 23 page 0992003884-0 201127269 [0082] Pressing part: 6424 [0083] Buckle arm :644 [0084] Clasp: 6 4 4 0 [0085] Circuit board: 70 [0086] First electronic component: 72 [0087] Second electronic component: 74 [0088] Mounting hole: 76 [0089] Mounting ring: 78 [0090] Mounting: 100 [0091] Set screw: 200 [0092] Pivot screw: 300 099101996 Form number A0101 Page 16 / Total 23 page 0992003884-0