1321441 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱模組，特別係一種用於對發熱電 子元件散熱之散熱模組。 【先前技術】 隨著中央處理器（CPU)等電子元件功率之不斷提高， 散熱問題越來越受到人們重視，在電腦中更是如此。為了 在有限之空間内高效地帶走系統產生之熱量，一般將鰭片1321441 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for dissipating heat from a heat generating electronic component. [Prior Art] As the power of electronic components such as a central processing unit (CPU) continues to increase, the problem of heat dissipation has received more and more attention, especially in computers. In order to efficiently remove the heat generated by the system in a limited space, the fins are generally
式散熱器或熱管式散熱器置於電子元件上對電子元件散 熱。為將電子元件產生之熱量快速地傳遞至散熱器上，一 般於散熱器與電子元件間設一集熱塊，該集熱塊系由銅等 高導熱性材料製成，利用其高導熱性迅速均勻地將電子元 件產生之熱量傳遞至熱管。集熱塊與電子元件之間之接觸 好壞直接影響到電子元件熱量散發之快慢。由於電子元件 之體積較小，而集熱塊系一平板狀結構與電子元件之間形 成面接觸，因而集熱塊與電子元件之間之接觸面積大小基 本上由電子元件之表面積決定，因而接觸面積有限，進而 影響其散熱性能。因此如何改進集熱塊結構，增大其與電 子元件之接觸面積，進而提升散熱性能，成為設計人員急 需解決之問題。 【發明内容】 有鑒於此，實有必要提供一種提升與發熱電子元件接 觸面積之散熱模組。 本散熱模組用於對發熱電子元件散熱，包括集熱塊、 6 熱管以及鰭片組，該集熱塊具有上表面及與之相對之下表 面’該熱管一端與該鰭片組熱連接’另一端與該集熱塊下 表面熱連接’該集熱塊上表面上設有一凹槽，該發熱電子 元件收容在該凹槽内。 本散熱模組用於對發熱電子元件散熱，包括集熱塊、 底座、熱管及鰭片組，該集熱塊設置在底座上，該熱管連 接於集熱塊與鰭片组之間，該集熱塊之其中一表面内陷形 成凹槽’該凹槽具有底面及複數個側面，該凹槽收容發熱 電子元件於其内，該凹槽之底面及側面包覆該發熱電子元 件之外表面。 與習知技術相比’該集熱塊上之凹槽能與發熱電子元 件實現立體之接觸，增大其間之接觸面積，減小其間之熱 阻’從而提高整個散熱模組之熱傳導效率。 【實施方式】 凊同時參考圖1至圖3，該散熱模組包括底座10、熱 管30、鰭片組9〇及集熱塊50。 底座10之大致中央位置設一容置槽14,用以容置集熱 塊50。容置槽14之四周分別形成一安裝孔16，用以容置 彈簧螺絲40，以將底座1〇鎖固在主機板（未示出）上。在 底座10之底面彎曲設置一曲型槽12，用以容置熱管30。 底座10上之容置槽14與該曲型槽12相貫穿連通，從而使 放置在曲型槽12内之熱管30能直接與放置在容置槽14内 之集熱塊50熱連接。 鰭片組90由複數片狀鰭片92平行排列設置而成，相 1321441 郴鰭片92間形成供強制氣流（風向如圖3中箭頭所示）通 過之流道94。其中每一鰭片92之底邊形成一方形缺口 96, 各缺口 96連成一體形成一 u形容置空間。熱管30包括置 於曲型槽12内之蒸發端31及自蒸發端μ延伸之冷凝端 32 ’該蒸發端31亦形成為曲型狀以與曲型槽12對應設置， 該冷凝端32容置於各鰭片92之缺口 96所形成之容置空間A heat sink or heat pipe heat sink is placed on the electronic component to dissipate heat from the electronic component. In order to quickly transfer the heat generated by the electronic component to the heat sink, a heat collecting block is generally disposed between the heat sink and the electronic component, and the heat collecting block is made of a highly thermally conductive material such as copper, and the high thermal conductivity is utilized rapidly. The heat generated by the electronic components is evenly transferred to the heat pipes. The contact between the heat collecting block and the electronic component directly affects the speed of heat dissipation of the electronic component. Since the electronic component has a small volume, and the heat collecting block forms a surface contact between the flat structure and the electronic component, the contact area between the heat collecting block and the electronic component is basically determined by the surface area of the electronic component, and thus the contact The area is limited, which in turn affects its heat dissipation performance. Therefore, how to improve the structure of the heat collecting block and increase the contact area with the electronic component, thereby improving the heat dissipation performance, has become an urgent problem for designers. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipation module that improves the contact area with a heat-generating electronic component. The heat dissipation module is configured to dissipate heat from the heat-generating electronic component, including a heat collecting block, a heat pipe, and a fin set. The heat collecting block has an upper surface and a surface opposite thereto. The heat pipe end is thermally connected to the fin group. The other end is thermally connected to the lower surface of the heat collecting block. The upper surface of the heat collecting block is provided with a groove, and the heat-generating electronic component is received in the groove. The heat dissipation module is configured to dissipate heat from the heat-generating electronic component, and includes a heat collecting block, a base, a heat pipe and a fin set, wherein the heat collecting block is disposed on the base, and the heat pipe is connected between the heat collecting block and the fin set, the set One of the surfaces of the thermal block is recessed to form a recess. The recess has a bottom surface and a plurality of side surfaces. The recess receives the heat-generating electronic component therein, and the bottom surface and the side surface of the recess cover the outer surface of the heat-generating electronic component. Compared with the prior art, the groove on the heat collecting block can realize the three-dimensional contact with the heat-generating electronic component, increase the contact area therebetween, and reduce the thermal resistance therebetween to improve the heat conduction efficiency of the entire heat-dissipating module. [Embodiment] Referring to FIG. 1 to FIG. 3 simultaneously, the heat dissipation module includes a base 10, a heat pipe 30, a fin set 9A, and a heat collecting block 50. A receiving groove 14 is disposed at a substantially central position of the base 10 for receiving the heat collecting block 50. A mounting hole 16 is formed around the accommodating groove 14 for accommodating the spring screw 40 to lock the base 1 to the main board (not shown). A curved groove 12 is formed on the bottom surface of the base 10 for accommodating the heat pipe 30. The accommodating groove 14 of the base 10 communicates with the curved groove 12 so that the heat pipe 30 placed in the curved groove 12 can be directly thermally connected to the heat collecting block 50 placed in the accommodating groove 14. The fin group 90 is formed by a plurality of fin fins 92 arranged in parallel, and a channel 94 is formed between the fins 1321441 and the fin fins 92 for the forced air flow (the wind direction is indicated by an arrow in Fig. 3). The bottom edge of each of the fins 92 forms a square cutout 96, and each of the notches 96 is integrally formed to form a u-shaped accommodation space. The heat pipe 30 includes an evaporation end 31 disposed in the curved groove 12 and a condensation end 32 extending from the evaporation end μ. The evaporation end 31 is also formed in a curved shape to correspond to the curved groove 12, and the condensation end 32 is accommodated. The accommodating space formed by the notch 96 of each fin 92
門，攸向興鰭片組9〇熱連接。該熱管3〇為扁平狀 加與集熱塊50及鰭片組90之接觸面積。 如圖4中所示為集熱塊50之結構示意圖。集熱塊5 呈方形塊狀，由導熱係數高之金屬如解製成^該集熱衫 50置於容置槽14内，其具有下表面52及與下表面52械 之上表面54,下表面52與熱管3〇相連結， 5〇之下表面52與熱管30之間還填充一層熱介=〇,The door, the 攸 兴 鳍 fin group, 9 〇 hot connection. The heat pipe 3 is flat and has a contact area with the heat collecting block 50 and the fin group 90. FIG. 4 is a schematic structural view of the heat collecting block 50. The heat collecting block 5 has a square block shape and is made of a metal having a high thermal conductivity. The heat collecting shirt 50 is placed in the accommodating groove 14 and has a lower surface 52 and a lower surface 52. The surface 52 is connected to the heat pipe 3〇, and a surface of the lower surface 52 and the heat pipe 30 is further filled with a heat medium.
使集熱塊50與熱管3G接觸更為緊密，減小其間之熱阻。 集熱塊50之上表面54上設有一凹槽％，該凹槽％用_ 置發熱電子7L件8G，如電腦之中央處理器（圖5)。該凹利 56具有四個側面57及—個底面58，相鄰兩側面 成圓弧倒角。該等側面57與底面58垂直，從_ 底面58 ffi成-大體成長方體之空間，心％之大小以石 側面57之高度大體由該發熱電子元件8〇 決定，使該凹槽56能足夠容置該發奴電 貝回』 χ热冤子兀件80於豆內 通常情況下’在該發熱電子元件8G與如槽 久、The heat collecting block 50 is brought into closer contact with the heat pipe 3G to reduce the thermal resistance therebetween. The upper surface 54 of the heat collecting block 50 is provided with a groove %, which is used to heat the electronic 7L piece 8G, such as a central processing unit of the computer (Fig. 5). The recess 56 has four side faces 57 and a bottom face 58 which are chamfered in a circular arc. The side faces 57 are perpendicular to the bottom surface 58 and form a space from the bottom surface 58 ffi into a substantially square body. The size of the core is substantially determined by the height of the stone side surface 57 by the heat generating electronic component 8 , so that the groove 56 can be sufficiently Set the slave to return to the 』 』 χ 冤 80 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于
面之間亦填充-層熱介面材料7〇,以利於執C 組裝時，將熱管30之蒸發端31;、'之傳遞。 丄取置在底座10之曲? 8 槽12内，冷凝細32與鰭片組30相連。集熱塊50放置於 底座10上之容置槽14内’並使發熱電子元件80收容於其 上表面54之四槽56内，熱管30之蒸發端31設于容置槽 14之部分與集熱塊50之下表面52通過熱介面材料2〇熱連 接，該熱介面讨料可減小接觸熱阻。在底座1〇之頂面 與熱管30之蒸發端&之末端對應之位置處還貼設一層熱 介面材料20a，用以與另一發熱電子元件（圖未示）如電腦 之南橋晶片組、北橋晶片組等接觸，從而對其進行散熱。 最後可用彈簧螺絲40通過裝配孔16將底座10鎖固在主機 板上。發熱電孑元件產生之熱量經集熱塊50傳遞到熱 管30，然後级過熱管傳遞到韓片組90 ’並借強制氣流 對鰭片組90進行吹拂，從而使發熱電子元件80產生之熱 量能及時地排出’保證該發熱電子元件80在正常之溫度下 工作。 由於集熱逸50上形成凹槽56結構，使發熱電子元件 8〇埋覆於集熱塊50内，不僅凹槽56之底面58與發熱電子 元件80接觸，其各個側面57也與發熱電子元件8〇接觸， 從而構成立體即三維之包覆接觸方式，增大了與發熱電子 疋件80之接觸面積，因而能更加快速地將發熱電子元件 產生之熱量傳遞出去，使整個散熱模組之散熱性能得到提 向0 綜上所述，本發明符合發明專利之要件，爰依法提出 】申明准以上所述者僅為本發明之較佳實施例，舉凡 熱悉本案技藝之人士，在爰依本發明精神所作之等效修錦 1321441 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1為本發明散熱模組一較佳實施方式及相關元件之 立體分解圖。 圖2為圖1另一角度之立體分解圖。 圖3為圖1之組裝圖。 圖4為集熱塊之結構示意圖。 圖5為集熱塊與相關元件結合之剖示圖。The surface is also filled with a layer of thermal interface material 7〇 to facilitate the transfer of the evaporation end 31 of the heat pipe 30; The condensing thin 32 is placed in the curved groove 8 of the base 10, and the condensing thin 32 is connected to the fin group 30. The heat collecting block 50 is placed in the receiving groove 14 of the base 10 and the heat-generating electronic component 80 is received in the four slots 56 of the upper surface 54 thereof. The evaporation end 31 of the heat pipe 30 is disposed in the receiving slot 14 and the set. The lower surface 52 of the thermal block 50 is thermally connected by a thermal interface material 2 which reduces the contact thermal resistance. A layer of thermal interface material 20a is attached to the top surface of the base 1 at a position corresponding to the end of the evaporation end of the heat pipe 30 for use with another heat-generating electronic component (not shown) such as a south bridge chipset of a computer. The North Bridge chipset is in contact with it to dissipate heat. Finally, the base 10 can be locked to the main board by the mounting holes 16 by spring screws 40. The heat generated by the heating element is transferred to the heat pipe 30 through the heat collecting block 50, and then the stage heat pipe is transferred to the Korean group 90' and the fin group 90 is blown by the forced air flow, so that the heat generated by the heat generating electronic component 80 can be generated. Discharge in time to ensure that the heat-generating electronic component 80 operates at normal temperatures. Since the structure of the recess 56 is formed on the collector 50, the heat-generating electronic component 8 is buried in the heat-collecting block 50, and not only the bottom surface 58 of the recess 56 is in contact with the heat-generating electronic component 80, but also the side surface 57 is also associated with the heat-generating electronic component. 8〇 contact, thereby forming a three-dimensional or three-dimensional coating contact mode, increasing the contact area with the heat-generating electronic component 80, thereby enabling the heat generated by the heat-generating electronic component to be transmitted more quickly, so that the heat dissipation of the entire heat-dissipating module The performance is improved to 0. In summary, the present invention meets the requirements of the invention patent, and is proposed according to the law. It is only the preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are Equivalent repairs 1321441 or variations made by the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a preferred embodiment of a heat dissipation module of the present invention and related components. Figure 2 is an exploded perspective view of another angle of Figure 1. Figure 3 is an assembled view of Figure 1. 4 is a schematic structural view of a heat collecting block. Figure 5 is a cross-sectional view showing the combination of the heat collecting block and the related elements.
【主要元件符號說明】[Main component symbol description]
底座 10 曲型槽 12 容置槽 14 安裝孔 16 熱界面材料 20 、 20a ' 70 執管 <、、、 30 蒸發端 31 冷凝端 32 彈簧螺絲 40 集熱塊 50 下表面 52 上表面 54 凹槽 56 侧面 57 底面 58 發熱電子元件 80 縛片組 90 藉片 92 流道 94 缺口 96Base 10 Curved groove 12 accommodating groove 14 Mounting hole 16 Thermal interface material 20, 20a '70 Tube <,,, 30 Evaporation end 31 Condensing end 32 Spring screw 40 Heat collecting block 50 Lower surface 52 Upper surface 54 Groove 56 Side 57 Bottom surface 58 Heated electronic components 80 Binder set 90 Borrowing film 92 Flow path 94 Notch 96