CN105873417A - Chip, circuit board and mobile terminal - Google Patents
Chip, circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105873417A CN105873417A CN201610287175.4A CN201610287175A CN105873417A CN 105873417 A CN105873417 A CN 105873417A CN 201610287175 A CN201610287175 A CN 201610287175A CN 105873417 A CN105873417 A CN 105873417A
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- China
- Prior art keywords
- heat
- chip
- heat absorption
- foam
- absorption heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
Abstract
The invention discloses a chip. The chip comprises a chip body and a heat absorbing and storing piece. The heat absorbing and storing piece is arranged on the body and comprises foam and a heat absorbing and storing material with the material properties of absorbing and storing heat, and the heat absorbing and storing material is arranged on the foam. The heat absorbing and storing material can absorb heat on the chip and store the heat, when the temperature of the chip body is decreased, the stored heat is dissipated into air, and thus the heat of the chip body is reduced. Thus, a circuit board and a mobile terminal with the chip have good heat dissipating performance, the reliability of use of equipment is improved, and the influence of heat emitting to the chip, the circuit board and the mobile terminal is relieved. The heat absorbing and storing piece and the chip body are made to be in tight contact with the elasticity of the foam, the heat of the chip body is effectively absorbed, and a damping effect is achieved on the chip body. The invention further provides the circuit board and the mobile terminal with the chip.
Description
Technical field
The present invention relates to a kind of electronic device field, particularly relate to a kind of chip, circuit board and mobile terminal.
Background technology
The configuration of the mobile terminals such as existing smart mobile phone, panel computer is more and more higher, its internal chip dominant frequency
More and more higher, power consumption is increasing, and its caloric value strains greatly mutually, if these heats do not reach control or
Transfer, it will bring the impact of two aspects: 1. chip temperature is too high, cause terminal computing slack-off, even block
?；2. chip temperature is transferred to terminal enclosure, causes skin temperature higher, there will be ear hot, boiling hot during use
Piece etc. problem.
For solving the heating problem of mobile terminal, add the most in the industry the handles such as graphite flake generally by heat conductive silica gel
Heat distributes, because heat conductive silica gel heat conductivity is little, and weak effect, the emission efficiency of chip heat is the highest,
Inventor has found that when stating technical scheme on the implementation that the setting of heat radiation graphite flake is relatively big by the limitation of position,
Cannot be carried out directly dispelling the heat to the position that caloric value is bigger, thus cause its heat dispersion poor.
Summary of the invention
The technical problem to be solved is, it is provided that a kind of chip of heat accumulation, circuit board of can absorbing heat
And mobile terminal.
In order to solve above-mentioned technical problem, on the one hand, The embodiment provides a kind of chip, it is special
Levy and be, including chip body and heat absorption heat accumulation part；Described heat absorption heat accumulation part is arranged on described chip body,
Described heat absorption heat accumulation part includes foam and has the heat absorption heat accumulating of heat absorption and the material properties of heat storage function,
Described heat absorption heat accumulating is used for absorbing the heat on described chip body and storing described heat, described heat absorption
Heat accumulating is arranged at described foam.
Wherein, described heat absorption heat accumulating includes silicon dioxide and Polyethylene Glycol, described silicon dioxide and poly-second
Glycol mass ratio be 1:1～1:9 wherein, described heat absorption heat accumulating by with described silicon dioxide as cyst wall,
Microcapsule with described Polyethylene Glycol as capsule-core is constituted.
Wherein, described heat absorption heat accumulation part also include retarder thinner and bonding solution, described heat absorption heat accumulating,
Described retarder thinner and described bonding solution mix and coat on described foam.
Wherein, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and
Described titanate coupling agent is mixed and made into flaky material, described glue-line stacking be connected to described foam with described
Between shape material；On described flaky material, the one side away from described foam is connected to described chip body.
Wherein, the side face of described foam is provided with described heat absorption heat accumulating.
Wherein, the overall outer surface of described foam is provided with described heat absorption heat accumulating.
Wherein, described foam is provided with through hole, described through hole is provided with described heat absorption heat accumulating, institute
The one end stating heat absorption heat accumulating is connected to described chip body.
On the other hand, the invention provides a kind of circuit board, including plate body and chip as the aforementioned, described core
Sheet is mounted on described plate body.
Wherein, described circuit board also includes that screening arrangement, described screening arrangement are arranged on described plate body, institute
Stating screening arrangement and cover at described chip body, described heat absorption heat accumulation part is pressed on described chip body with described
Between screening arrangement.
Another further aspect, the invention provides a kind of mobile terminal, including circuit board as the aforementioned.
Chip, circuit board and the mobile terminal that the present invention provides, by arranging heat absorption heat accumulation on chip body
Part, heat absorption heat accumulation part includes foam and has the heat absorption heat accumulating of heat absorption and heat storage function, and absorb heat heat accumulation material
Heat on chip can be absorbed by material, and by heat storage at self, when the temperature of chip body
After lowering, the heat of storage is dispersed in air, thus reduces the heat of chip body, and then make
Circuit board and the mobile terminal with this chip have preferably heat dispersion, improve the reliability that equipment uses,
Decrease the heating impact on chip, circuit board and mobile terminal；Foam can be with the housing etc. of mobile terminal
Structural member carries out contact and connects, and utilizes the elasticity of foam self, so that heat absorption heat accumulation part and chip body
It is in close contact, effectively absorbs the heat of chip body, and chip body is played cushioning effect, it is ensured that chip
Body reliability of operation.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to enforcement
In example or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below
In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying
On the premise of going out creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the circuit board that first embodiment of the invention provides；
Fig. 2 is the structural representation of the circuit board that second embodiment of the invention provides；
Fig. 3 is the structural representation of the circuit board that third embodiment of the invention provides；
Fig. 4 is the structural representation of the circuit board that fourth embodiment of the invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly
Chu, it is fully described by.
The mobile terminal that the present embodiments relate to can be any possess communication and the equipment of storage function, example
As: panel computer, mobile phone, electronic reader, remote controller, personal computer (Personal Computer,
PC), notebook computer, mobile unit, Web TV, wearable device etc. have the intelligence of network function and set
Standby.
Refer to Fig. 1, a kind of mobile terminal provided for the present invention, including circuit board 100, circuit board 100
Including plate body 1, chip 2 and radome 3.Chip 2 is mounted on plate body 1, and radome 3 is arranged at plate body
On 1 and cover at chip 2, so that chip 2 is played shielding action.
In the present embodiment, integrated various components and parts on the plate body 1 of circuit board 100, including being mounted on it
On chip 2.Chip 2 includes chip body 21 and heat absorption heat accumulation part 22；Heat absorption heat accumulation part 22 is arranged at core
On sheet body 21.Heat absorption heat accumulation part 22 includes foam 221 and has the heat absorption material properties with heat storage function
Heat absorption heat accumulating 222, described heat absorption heat accumulating 222 is for absorbing the heat on chip body 21 and storing up
Depositing described heat, heat absorption heat accumulating 222 is arranged at described foam 221.Chip body 21 is by several
Pin is connected on the plate body 1 of circuit board 100.It should be understood that chip body 21 can be centre reason
At least one in device chip, power management chip or charging management chip.The heating of said chip 2 is relatively
Greatly, it needs preferably heat dispersion, arranges heat absorption heat accumulating 222 in said chip 2, it is possible to by heat
Absorb and distribute to air after heat accumulation to certain temperature such that it is able to improving mobile terminal further
Reliability.Utilize foam 221 can carry out contacting connection with structural members such as the housings of mobile terminal, thus to core
Sheet body 21 plays cushioning effect, it is ensured that chip body 21 reliability of operation, in the present embodiment, and foam
221 are connected with radome 3.
In the present embodiment, heat absorption heat accumulating 222 can be a kind of phase-change material, and it can become along with temperature
Changing and change physical property and can absorb substantial amounts of heat, along with the increase of the heat absorbed, absorb heat heat accumulation material
Material 222 gradates as another kind of phase mutually from one, can stably maintain another kind of phase after absorbing sufficient heat
And no longer absorb heat, and when chip body 21 does not has thermal source to produce or heat is relatively low, absorb heat heat accumulating 222
Carry out dispelling the heat and gradually along with reducing of heat is gradually reverted to original phase mutually by another kind.Wherein, heat absorption
Heat accumulating 222 can change to liquid phase or liquid phase to solid phase from solid phase along with the change of temperature, or solid phase to
Gas phase or liquid phase change to solid phase, or liquid phase to gas phase or gas phase to liquid phase.
Heat absorption heat accumulating 222 can be arranged on the overall outer surface of foam 221 or on partial outer face.
In the present embodiment, the overall outer surface of foam 221 being provided with heat absorption heat accumulating 222, absorb heat heat accumulation material
The overall outer surface of foam 221 is covered by material 222, to increase heat absorption heat accumulating 222 and chip body 21
And the contact area between radome 3.When heat on chip body 21 reaches uniform temperature, absorb heat heat accumulation
Heat on chip body 21 is absorbed heat and heat accumulation by material 222, lowers the temperature chip body 21.
Herein, in other embodiments, heat absorption heat accumulating 222 can be provided only on the side face of foam 221,
Or it is arranged on foam 221 towards on the surface of chip body 21.
The mobile terminal that the present invention provides has the heat absorption heat accumulating 222 of heat absorption and heat storage function by setting,
Heat on chip body 21 can be absorbed by heat absorption heat accumulating 222, and by heat storage certainly
Body, after the temperature of chip 2 lowers, is dispersed into the heat of storage in air, thus reduces chip originally
The heat of body 21, thus mobile terminal has preferably heat dispersion, improves the reliability that mobile terminal uses.
In order to further improve, heat absorption heat accumulating 222 preferably comprises silicon dioxide and Polyethylene Glycol,
The mass ratio of silicon dioxide and Polyethylene Glycol is 1:1～1:9.Inventor is drawn by substantial amounts of experiment, will
Silicon dioxide and Polyethylene Glycol are with mass ratio as 1:1～1:9 mixes the organic phase change material that can prepare and has
Suitable phase transition temperature, it is possible to absorb the heat of chip body in time, improves chip 2 further and moves
The reliability of terminal.Concrete, the phase transition temperature that this heat absorption heat accumulating 222 is mixed to prepare is 40 degree, i.e.
After the heat of chip body generation reaches 40 degree, heat absorption heat accumulating 222 carries out decalescence, by chip
The heat of body is taken away, to lower the temperature chip body.Certainly, in other embodiments, heat absorption heat accumulation
Material 222 can also be inorganic phase-changing material, or composite phase-change material etc..
In order to further improve, heat absorption heat accumulating 222 is by with silicon dioxide as cyst wall, with Polyethylene Glycol
Microcapsule for capsule-core is constituted.The heat absorption heat accumulating 222 of this microcapsule structure can be preferably to chip body 21
Carry out the heat accumulation that absorbs heat, and then reach preferably heat dispersion.Concrete, Polyethylene Glycol is joined the denseest
In the Ludox of degree, after all dissolving, drip CaCl2Accelerator solution, under strong stirring so that poly-
There is sol gel reaction in ethylene glycol in Ludox, forms three-dimensional net structure gel after standing；By gel
In 80 DEG C of baking ovens, forced air drying 24～48h, are cooled to room temperature, can access with organic silica
The silica dioxide gel that compound produces in the basic conditions is cyst wall, with the Polyethylene Glycol after emulsifying as capsule-core
Microcapsule.I.e. silicon dioxide wraps the Polyethylene Glycol as capsule-core as cyst wall so that Polyethylene Glycol exists
Will not leak during solid-liquid, it is possible to well lived by Silica-coated.This formation microcapsule
The heat radiator material of structure, after the temperature of the heat of chip body 21 reaches 40 degree, starts to absorb chip originally
Heat on body 21, and capsule-core itself is gradually from solid-liquid, after capsule-core is converted to liquid phase, heat absorption
Heat accumulating 222 absorb heat the most saturated, its stop absorb heat, and body exterior temperature gradually
After being reduced to preset temperature, the heat of absorption is come out by capsule-core, is delivered in air, and capsule-core meeting
Along with gradually decreasing of its fever of the body amount gradually from liquid-solid, thus chip body 21 is directly dropped
Temperature, improves heat dispersion and the reliability of mobile terminal.Certainly, in other embodiments, heat absorption heat accumulation material
Material 222 can also be other structure so that heat absorption heat accumulating 222 can be from solid-vapor.
Heat absorption heat accumulation part 22 also includes retarder thinner and bonding solution, and absorb heat heat accumulating 222, retarder thinner
Mix with bonding solution and coat on foam 221.By by retarder thinner, bonding solution and heat absorption heat accumulation material
Formation heat absorption heat accumulation part 22 it is coated on foam 221 so that heat absorption heat accumulation part 22 directly has after material 222 mixing
There is adhesive force, it is not necessary to still further increase glue-line and can coat on foam 221, simultaneously facilitate heat absorption heat accumulation part
22 integral adhesives are between chip body 21 and radome 3, it is also possible to utilize the deformation nature of foam 221 to rise
To cushioning effect, thus provide a kind of use advantageously heat absorption heat accumulation part 22.
In the present embodiment, heat absorption heat accumulating 222 is smashed to pieces and strong stirring obtains powder, due to powder body
Diameter is far longer than the diameter of microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating 222, the most not
Can affect the heat absorption heat storage function of heat absorption heat accumulating 222, the heat absorption heat accumulating 222 in powder is added to
Retarder thinner and interpolation special binder solution mixing (such as: methanol dimethylbenzene, acrylic resin etc.), then adopt
It is piled into certain thickness by the form of coating to be attached on foam 221 form heat absorption heat accumulation part 22 so that heat absorption storage
Warmware 22 has adhesive force, can be with integral adhesive on chip body 21.Herein, in other embodiments,
Directly heat absorption heat accumulating 222 can also be coated on foam 221 formation heat absorption heat accumulation part 22, then pass through
Bonding or direct laminating type makes heat absorption heat accumulation part 22 be connected with chip body 21, thus realizes the heat accumulation that absorbs heat
Function.
Heat absorption heat accumulation part 22 is pressed between described chip body 21 and described radome 3, to utilize heat absorption storage
The foam 221 of warmware 22 plays preferable cushioning effect, simultaneously so that absorb heat heat accumulation part 22 with chip originally
Body 21 compact siro spinning technology, is beneficial to heat absorption heat accumulating 222 and absorbs the heat of chip body 21.Herein, at other
In embodiment, as some chip body 21 need not radome 3, it is also possible to utilize other of mobile terminal
Structural member, such as housing etc., be pressed on heat absorption heat accumulation part 22 so that heat absorption heat accumulation part 22 is pressed in chip originally
On body 21, will absorb heat heat accumulation part 22 and chip body 21 compact siro spinning technology, and play preferable cushioning effect.
In the present embodiment, radome 3 includes shield bracket 31 and screening cover 32, and shield bracket 31 is fixed on
Described wiring board, and it is looped around the surrounding of described chip body 21, between shield bracket 31 and chip body 21
Gap is arranged, and screening cover 32 is fixed on shield bracket 31, and foam 221 is pressed on screening cover 32 and chip body
Between 21, utilize coordinating of shield bracket 31 and screening cover 32, radome 3 and chip body can be facilitated
Assembly connection between 21 and plate body 1, the gap formed between shield bracket 31 and chip body 21, can
To avoid shield bracket 31 that chip body 21 is caused interference.
When mobile terminal starts to assemble, first heat absorption heat accumulation part 22 is set at body, then chip 2 is pasted
It is loaded on the plate body 1 of circuit board 100, then radome 3 is installed, make heat absorption heat accumulation part 22 is pressed on shielding
Between cover 3 and chip body 21.Finally circuit board 100 is assemblied in mobile terminal.Wherein, formed micro-
The heat radiator material of capsule structure, after the thermal temperature of body reaches 40 degree, starts the heat on absorbent body
Amount, and capsule-core itself is gradually from solid-liquid, and after capsule-core is converted to liquid phase, absorb heat heat accumulating 222
The heat absorbed is the most saturated, and it stops absorbing heat, and is gradually decrease to preset in the temperature of body exterior
After temperature, the heat of absorption is come out by capsule-core, is delivered in air, and capsule-core can be along with its fever of the body
Gradually decreasing of amount and gradually from liquid-solid, thus body is directly lowered the temperature, improves mobile terminal
Heat dispersion and reliability.
The mobile terminal that the present invention provides passes through to arrange heat absorption heat accumulation part 22 on the chip body 21 of chip 2,
Heat absorption heat accumulation part 22 includes that the heat absorption heat accumulating 222 with heat absorption and heat storage function can be to chip body 21
On heat absorb, and by heat storage at self, after the temperature of chip 2 lowers, will storage
The heat deposited is dispersed in air, thus reduces the heat of chip body 21, thus mobile terminal has preferably
Heat dispersion, improve mobile terminal use reliability.
The mobile terminal that the present invention provides also by by silicon dioxide and Polyethylene Glycol with mass ratio as 1:1～1:
The organic phase change material that 9 mixing can prepare has suitable phase transition temperature, it is possible to the heat of absorbent body in time
Amount, improves the reliability of chip 2 and mobile terminal further.
The mobile terminal that the present invention provides makes microcapsule structure also by by heat absorption heat accumulating 222, it is possible to preferably
Chip body 21 is carried out the heat accumulation that absorbs heat, and then reaches preferably heat dispersion.
The mobile terminal that the present invention provides is also by by retarder thinner, bonding solution and heat absorption heat accumulating 222
Mixing is arranged on foam 221 formation heat absorption heat accumulation part 22 so that heat absorption heat accumulation part 22 directly has adhesive force,
Can coat on chip body 21 without still further increasing glue-line, thus it is the most convenient to provide a kind of use
Heat absorption heat accumulation part 22.
As in figure 2 it is shown, the second embodiment of the present invention provides a kind of mobile terminal, implement with the present invention first
The basic structure of the mobile terminal that example provides is roughly the same, and its difference is the knot of heat absorption heat accumulation part 22a
Structure.In the present embodiment, heat absorption heat accumulation part 22a includes foam 221a, is arranged on foam 221a and has suction
Heat and the heat absorption heat accumulating of material properties, titanate coupling agent and the glue-line 224a of heat storage function, heat absorption storage
Hot material and titanate coupling agent are mixed and made into flaky material 223a, and glue-line 224a stacking is connected to described foam
Between 221a and described flaky material 223a, on flaky material 223a, the one side away from described foam 221a connects
It is connected to described chip body 21.Utilize glue-line 224a, can will be bonded in foam 221a with heat absorption heat accumulating
On, in order to make the two be connected as an entirety.
By heat absorption heat accumulating and titanate coupling agent are mixed and made into flaky material 223a, then pass through glue-line
224a stacking is connected between foam 221a and described flaky material 223a be formed heat absorption heat accumulation part 22a, not only
Make heat absorption heat accumulation part 22a can go to cut according to the shape of chip body 21, and then can be with foam
221a has and preferably coordinates, and the heat absorption heat accumulation part 22a application of lamellar is more convenient, is directly stained with, no
With waiting that it is cooled into coating.
In the present embodiment, heat absorption heat accumulating is smashed to pieces and strong stirring obtains powder, straight due to powder body
Footpath is far longer than the diameter of microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, and i.e. will not shadow
Ringing the heat absorption heat storage function of heat absorption heat accumulating, the heat absorption heat accumulating in powder adds titanate coupling agent
Hydrophobically modified obtains inorganic plan organic composite shaping phase-change material, then by this inorganic plan organic composite fixed phase change
Material prepares flake i.e. flaky material 223a, flaky material 223a by glue-line 224a layer through tabletting machine
The folded above foam 221a that connects forms heat absorption heat accumulation part 22a.It should be understood that glue-line 224a can be gum,
Double faced adhesive tape or mould release membrance etc..Heat absorption heat accumulation part 22a can be cut into a setting according to the shape of chip body 21a
Shape, is fitted on chip body 21a, it is achieved the function of heat absorption heat accumulation.
In the present embodiment, on flaky material 223a, the one side away from foam 221a is connected to chip body 21a,
Flaky material 223a can be mounted directly on the end face of described chip body 21a, it is also possible to by gum, double
Face glue, mould release membrance, heat-conducting glue etc. are bonded in the end face of described chip body 21a, in order to heat absorption heat accumulating is inhaled
Receive the heat of described chip body 21a.
The mobile terminal that the present invention provides is mixed and made into sheet also by by heat absorption heat accumulating and titanate coupling agent
Shape material 223a, then be connected on flaky material 223a form heat absorption heat accumulation part 22a by glue-line 224a stacking,
Not only make heat absorption heat accumulation part 22a can go to cut according to the shape of body, and the heat absorption heat accumulation of lamellar
Part 22a application is more convenient, is directly stained with, is cooled into coating without waiting for it.
In the above-described embodiment, heat absorption heat accumulating is arranged on the overall outer surface of foam, or heat absorption
Heat accumulating is arranged on foam towards on the surface of chip body, the combination of heat absorption heat accumulating and foam
And without cease it is limited to above-described embodiment.
In third embodiment of the invention, shown in Fig. 3, heat absorption heat accumulating 222b can be provided only on
On the side face of foam 221b, specifically, heat absorption heat accumulating 222b can be coated on the surrounding of foam 221b
On side face, it is also possible to be, heat absorption heat accumulating 222b is processed into annular, and foam 221b is embedded in heat absorption heat accumulation
In the annular region that material 222b is formed.
For another example the 4th embodiment that the present invention provides, shown in Fig. 4, foam 221c can offer through hole,
Through hole is provided with heat absorption heat accumulating 222c so that heat absorption heat accumulating 222c is embedded in foam 221c,
One end of heat absorption heat accumulating 222c can be connected to chip body 21a, and the other end can be connected to radome 3
Or other structural members, in order to heat absorption heat accumulating 222c absorbs the heat of chip body 21a, and through hole can set
Put multiple, the position of through hole is set according to the main heating position of chip 2.
Or, heat absorption heat accumulating can use the combination of above several ways to be arranged on foam, such as,
Heat absorption heat accumulating is set on the surface of foam chip body upward, and on foam, offers through hole, through hole
In be injected with heat absorption heat accumulating.Or, it is provided with on the side face of foam and on the surface of chip body
Heat absorption heat accumulating.
The mobile terminal that the present invention provides is by arranging heat absorption heat accumulation part on chip body, and absorb heat heat accumulation part bag
Include have heat absorption and heat storage function heat absorption heat accumulating the heat on chip body can be absorbed, and
And by heat storage at self, after the temperature of chip body lowers, the heat of storage is dispersed into air
In, thus reduce the heat of chip body, thus mobile terminal has preferably heat dispersion, improves mobile
The reliability that terminal uses.Foam can carry out contacting connection with the structural member such as the housing of mobile terminal, utilizes
The elasticity of foam self, so that the heat accumulation part that absorbs heat is in close contact with chip body, effectively absorbs chip originally
The heat of body, and chip body is played cushioning effect, it is ensured that chip body reliability of operation.
Above embodiment, is not intended that the restriction to this technical scheme protection domain.Any in above-mentioned reality
Amendment, equivalent and the improvement etc. made within executing the spirit of mode and principle, should be included in this technology
Within the protection domain of scheme.
Claims (11)
1. a chip, it is characterised in that include chip body and heat absorption heat accumulation part；Described heat absorption heat accumulation part
Being arranged on described chip body, described heat absorption heat accumulation part includes foam and has the material of heat absorption and heat storage function
The heat absorption heat accumulating of material attribute, described heat absorption heat accumulating is for absorbing the heat on described chip body also
Storing described heat, described heat absorption heat accumulating is arranged at described foam.
Chip the most according to claim 1, it is characterised in that described heat absorption heat accumulating includes dioxy
SiClx and Polyethylene Glycol, described silicon dioxide and Polyethylene Glycol mass ratio are 1:1～1:9.
Chip the most according to claim 2, it is characterised in that described heat absorption heat accumulating is by with described
Silicon dioxide is cyst wall, microcapsule with described Polyethylene Glycol as capsule-core is constituted.
Chip the most according to claim 3, it is characterised in that described heat absorption heat accumulation part also includes dilution
Solvent and bonding solution, described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and are coated with
It is distributed on described foam.
Chip the most according to claim 3, it is characterised in that described heat absorption heat accumulation part also includes metatitanic acid
Ester coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent be mixed and made into flaky material,
Described glue-line stacking is connected between described foam and described flaky material；Away from described on described flaky material
The one side of foam is connected to described chip body.
6. according to the chip described in any one of Claims 1-4, it is characterised in that the side face of described foam
On be provided with described heat absorption heat accumulating.
7. according to the chip described in any one of Claims 1-4, it is characterised in that the entirety of described foam
Described heat absorption heat accumulating it is provided with on outer surface.
8. according to the chip described in any one of claims 1 to 3, it is characterised in that arrange on described foam
Having through hole, be provided with described heat absorption heat accumulating in described through hole, one end of described heat absorption heat accumulating connects
To described chip body.
9. a circuit board, it is characterised in that include plate body and as described in claim 1～8 any one
Chip, described chip attachment is on described plate body.
Circuit board the most according to claim 9, it is characterised in that described circuit board also includes shielding dress
Putting, described screening arrangement is arranged on described plate body, and described screening arrangement covers at described chip body, institute
State heat absorption heat accumulation part to be pressed between described chip body and described screening arrangement.
11. 1 kinds of mobile terminals, it is characterised in that include the circuit board as described in claim 9 or 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287175.4A CN105873417B (en) | 2016-04-29 | 2016-04-29 | A kind of chip, circuit board and mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287175.4A CN105873417B (en) | 2016-04-29 | 2016-04-29 | A kind of chip, circuit board and mobile terminal |
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| CN105873417B CN105873417B (en) | 2019-02-01 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108093604A (en) * | 2016-11-23 | 2018-05-29 | 三星电子株式会社 | Steam including being used to absorb heat（Two-phase）The electronic device of chamber |
| CN109104841A (en) * | 2017-06-21 | 2018-12-28 | 神讯电脑(昆山)有限公司 | Thermal conduction plate with electro-magnetic screen function |
| CN110505797A (en) * | 2019-09-19 | 2019-11-26 | Oppo广东移动通信有限公司 | Heat-radiating substrate, the manufacturing method of heat-radiating substrate and electronic equipment |
| CN111653532A (en) * | 2020-06-15 | 2020-09-11 | 深圳市上欧新材料有限公司 | High heat flux density chip heat dissipation device and manufacturing method thereof |
| WO2021045409A1 (en) * | 2019-09-03 | 2021-03-11 | Samsung Electronics Co., Ltd. | Electronic device including heat dissipation structure |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN101472452A (en) * | 2007-12-12 | 2009-07-01 | 英特尔公司 | Thermal energy storage for mobile computing thermal management |
| CN101942290A (en) * | 2010-08-09 | 2011-01-12 | 西南交通大学 | Method for preparing polyethylene glycol/silicon dioxide composite shape-stabilized phase change energy storage material and product thereof |
| CN102711416A (en) * | 2012-05-24 | 2012-10-03 | 中兴通讯股份有限公司 | Heat dissipation processing device and mobile terminal |
| CN202871774U (en) * | 2012-11-13 | 2013-04-10 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Storage, conduction and dissipation integrated high-power electronic device |
| CN103629286A (en) * | 2012-08-27 | 2014-03-12 | 深圳富泰宏精密工业有限公司 | Foam assembly, manufacturing method thereof, and electronic device using same |
| CN203858576U (en) * | 2014-04-09 | 2014-10-01 | 太仓市其盛化纤厂 | Dust-proof heat-conducting foam cotton for flat computer |
| CN104140786A (en) * | 2013-05-09 | 2014-11-12 | 中国科学院理化技术研究所 | Composite phase-change thermal storage material |
| CN105050359A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Mobile terminal and method for dissipating heat of mobile terminal |
| CN205071566U (en) * | 2015-07-28 | 2016-03-02 | 东莞钱锋特殊胶粘制品有限公司 | Heat dissipation buffering shielding composite structure of mobile electronic device |
| CN105472950A (en) * | 2015-12-28 | 2016-04-06 | 联想(北京)有限公司 | Cooling device and electronic device |
| CN105472940A (en) * | 2014-08-20 | 2016-04-06 | 中兴通讯股份有限公司 | Terminal cooling device and mobile terminal |
-
2016
- 2016-04-29 CN CN201610287175.4A patent/CN105873417B/en not_active Expired - Fee Related
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| CN101472452A (en) * | 2007-12-12 | 2009-07-01 | 英特尔公司 | Thermal energy storage for mobile computing thermal management |
| CN101942290A (en) * | 2010-08-09 | 2011-01-12 | 西南交通大学 | Method for preparing polyethylene glycol/silicon dioxide composite shape-stabilized phase change energy storage material and product thereof |
| CN102711416A (en) * | 2012-05-24 | 2012-10-03 | 中兴通讯股份有限公司 | Heat dissipation processing device and mobile terminal |
| CN103629286A (en) * | 2012-08-27 | 2014-03-12 | 深圳富泰宏精密工业有限公司 | Foam assembly, manufacturing method thereof, and electronic device using same |
| CN202871774U (en) * | 2012-11-13 | 2013-04-10 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Storage, conduction and dissipation integrated high-power electronic device |
| CN104140786A (en) * | 2013-05-09 | 2014-11-12 | 中国科学院理化技术研究所 | Composite phase-change thermal storage material |
| CN203858576U (en) * | 2014-04-09 | 2014-10-01 | 太仓市其盛化纤厂 | Dust-proof heat-conducting foam cotton for flat computer |
| CN105472940A (en) * | 2014-08-20 | 2016-04-06 | 中兴通讯股份有限公司 | Terminal cooling device and mobile terminal |
| CN105050359A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Mobile terminal and method for dissipating heat of mobile terminal |
| CN205071566U (en) * | 2015-07-28 | 2016-03-02 | 东莞钱锋特殊胶粘制品有限公司 | Heat dissipation buffering shielding composite structure of mobile electronic device |
| CN105472950A (en) * | 2015-12-28 | 2016-04-06 | 联想(北京)有限公司 | Cooling device and electronic device |
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| CN108093604A (en) * | 2016-11-23 | 2018-05-29 | 三星电子株式会社 | Steam including being used to absorb heat（Two-phase）The electronic device of chamber |
| US10739830B2 (en) | 2016-11-23 | 2020-08-11 | Samsung Electronics Co., Ltd. | Electronic device including vapor (two phase) chamber for absorbing heat |
| CN108093604B (en) * | 2016-11-23 | 2021-09-21 | 三星电子株式会社 | Electronic device |
| CN109104841A (en) * | 2017-06-21 | 2018-12-28 | 神讯电脑(昆山)有限公司 | Thermal conduction plate with electro-magnetic screen function |
| WO2021045409A1 (en) * | 2019-09-03 | 2021-03-11 | Samsung Electronics Co., Ltd. | Electronic device including heat dissipation structure |
| US11627654B2 (en) | 2019-09-03 | 2023-04-11 | Samsung Electronics Co., Ltd. | Electronic device including heat dissipation structure |
| CN110505797A (en) * | 2019-09-19 | 2019-11-26 | Oppo广东移动通信有限公司 | Heat-radiating substrate, the manufacturing method of heat-radiating substrate and electronic equipment |
| CN111653532A (en) * | 2020-06-15 | 2020-09-11 | 深圳市上欧新材料有限公司 | High heat flux density chip heat dissipation device and manufacturing method thereof |
| CN111653532B (en) * | 2020-06-15 | 2021-12-21 | 深圳市数聚天源人工智能有限公司 | High heat flux density chip heat dissipation device and manufacturing method thereof |
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