CN105873416A - Chips, circuit board and mobile terminal - Google Patents
Chips, circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105873416A CN105873416A CN201610287099.7A CN201610287099A CN105873416A CN 105873416 A CN105873416 A CN 105873416A CN 201610287099 A CN201610287099 A CN 201610287099A CN 105873416 A CN105873416 A CN 105873416A
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- Prior art keywords
- heat
- heat absorption
- chip
- absorption heat
- accumulating
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses chips. Each chip comprises a body and a heat absorption and storage piece, each body is provided with a plurality of pins, the multiple pins are inserted on a circuit board, each heat absorption and storage piece is arranged on the corresponding body, and each heat absorption and storage piece comprises a heat absorption and storage material with the heat absorption and storage functions and material attributes. According to the chips, the bodies are provided with the heat absorption and storage pieces, the heat absorption and storage pieces comprise heat absorption and storage materials with the heat absorption and storage functions, heat on the chips can be absorbed, the heat is stored in the heat absorption and storage material, after the temperature of the chips is lowered, the stored heat is dissipated in air, therefore heat of the bodies is lowered, accordingly the circuit board and a mobile terminal provided with the chips can have good heat dissipation performance, and use reliability of equipment is improved. The invention further provides the circuit board and the mobile terminal.
Description
Technical field
The present invention relates to a kind of electronic device field, particularly relate to a kind of chip, circuit board and mobile terminal.
Background technology
Along with the development of mobile phone industry, mobile phone configuration is more and more higher, central processing unit (Central Processing
Unit/CPU) dominant frequency is more and more higher, and power consumption is increasing, causes cell-phone heating amount to strain mutually greatly, if
These heats do not reach control or transfer, it will bring the impact of two aspects: 1. chip for cell phone temperature is too high,
Causing mobile phone computing slack-off, even card, affects the use of mobile phone；2. chip for cell phone temperature transfer is to outside mobile phone
Shell, causes skin temperature higher, there will be the problems such as hot, boiling hot ear during use.
For solving the heating problem of mobile phone, be usually the most in the industry heat radiation graphite flake is arranged at inner walls or
On mobile phone shielding lid, chip is dispelled the heat indirectly, but send out when inventor states technical scheme on the implementation
Now relatively big by the limitation of position due to the setting of heat radiation graphite flake, the position that caloric value is bigger be cannot be carried out directly
Connect heat radiation, thus cause its heat dispersion poor.
Summary of the invention
It is an object of the invention to provide a kind of chip, circuit board and mobile terminal that can reduce heating impact.
In order to solve above-mentioned technical problem, the invention provides a kind of chip, described chip includes body and suction
Hot heat accumulation part, described body has several pins, and several pins described are used for being plugged in circuit board,
Described heat absorption heat accumulation part is arranged on described body, and described heat absorption heat accumulation part includes having heat absorption and heat storage function
The heat absorption heat accumulating of material properties, described heat absorption heat accumulating for absorbing the heat on described body,
And the heat of absorption is stored by described heat absorption heat accumulating.
Wherein, during described chip is central processor core, power management chip or charging management chip
At least one.
Wherein, described heat absorption heat accumulating includes silicon dioxide and Polyethylene Glycol, described silicon dioxide and poly-second
The mass ratio of glycol is 1:1～1:9.
Wherein, described heat absorption heat accumulating has some with described silicon dioxide as cyst wall, with described Polyethylene Glycol
Microcapsule for capsule-core is constituted.
Wherein, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and
Described titanate coupling agent is mixed and made into flaky material, and described glue-line stacking is covered on described flaky material,
Described flaky material is adhered on described body by described glue-line.
Wherein, described heat absorption heat accumulation part also include retarder thinner and bonding solution, described heat absorption heat accumulating,
Described retarder thinner and described bonding solution mix and coat on described body.
Wherein, described heat absorption heat accumulation part also includes that substrate and glue-line, described heat absorption heat accumulating are coated described
In substrate, described glue-line stacking is connected on described heat absorption heat accumulating, and is coated with described heat absorption heat accumulation material
The base of material is adhered on described body by described glue-line.
Wherein, described chip also includes that protecting film, described protecting film are arranged on described heat absorption heat accumulation part, and
Described protecting film is located remotely from the side of described body.
The embodiment of the present invention additionally provides a kind of circuit board, including plate body and chip, the body of described chip
Several pins are plugged on described plate body..
Wherein, described plate body offers thermal hole near the position of described chip.
The embodiment of the present invention additionally provides a kind of mobile terminal, including circuit board.
The chip that the present invention provides is by arranging heat absorption heat accumulation part on body, and heat absorption heat accumulation part includes having suction
Heat on the body of chip can be absorbed by the heat absorption heat accumulating of heat and heat storage function, and by heat
Amount is stored in self, after the temperature of the body of chip lowers, is dispersed in air by the heat of storage,
Thus reduce the heat of body, so that there is the circuit board of this chip and mobile terminal has the most scattered
Hot property, improves the reliability that equipment uses, and decreases the heating shadow to chip, circuit board and mobile terminal
Ring.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, below by use required in embodiment
Accompanying drawing is briefly described, it should be apparent that, the accompanying drawing in describing below is only some enforcements of the present invention
Mode, for those of ordinary skill in the art, on the premise of not paying creative work, also may be used
To obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic diagram of a kind of circuit board that the embodiment of the present invention one provides；
Fig. 2 is the decomposing schematic representation of the chip shown in Fig. 1；
Fig. 3 is the profile of the chip shown in Fig. 2；
Fig. 4 is the schematic diagram of a kind of chip that the embodiment of the present invention two provides；
Fig. 5 is the schematic diagram of the heat absorption heat accumulation part in the chip in Fig. 5；
Fig. 6 is the schematic diagram of a kind of chip that the embodiment of the present invention three provides；
Fig. 7 is the schematic diagram of a kind of mobile terminal that the embodiment of the present invention four provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is entered
Row clearly and completely describes.
The mobile terminal that the present embodiments relate to can be any possess communication and the equipment of storage function, example
As: panel computer, mobile phone, electronic reader, remote controller, personal computer (Personal Computer,
PC), notebook computer, mobile unit, Web TV, wearable device etc. have the intelligence of network function and set
Standby.
Knot please also refer to a kind of circuit board 100 that Fig. 1 to Fig. 3, Fig. 1 provide for the embodiment of the present invention one
Structure schematic diagram, circuit board 100 includes plate body 1 and the chip 2 being mounted on plate body 1.As in figure 2 it is shown, core
Sheet 2 includes body 21 and heat absorption heat accumulation part 22, and body 21 has several pins (not shown), several
Pin is used for being plugged in circuit board 100, and heat absorption heat accumulation part 22 is arranged on body 21, and absorb heat heat accumulation part
22 include the heat absorption heat accumulating 221a with the material properties of heat absorption and heat storage function, and absorb heat heat accumulating
221a is used for the heat on absorbent body 21, and the heat of absorption is stored by the heat accumulating 221a that absorbs heat.
In the present embodiment, integrated various components and parts on the plate body 1 of circuit board 100, including being mounted on it
On chip 2.It should be understood that chip 2 can be central processor core, power management chip or fill
At least one in electricity managing chip.Body 21 has several pins, and several pins are for grafting and weld
It is connected on circuit board.The heating of said chip 2 is relatively big, and it needs preferably heat dispersion, at above-mentioned body
21 arrange heat absorption heat accumulation part 22, it is possible to distribute to air by heat absorption and after heat accumulation to certain temperature,
It is thus possible to improve the reliability of circuit board 100 further.The one side that body 21 deviates from circuit board 100 is permissible
For even surface, there are the face of concaveconvex structure, the face having LOGO etc..It should be understood that plate body 1 is near core
Thermal hole is offered at the position of sheet 2, i.e. thermal hole can be arranged around chip 2, further to the heat on chip 2
Amount carries out conducting heat and dispelling the heat, thus improves heat dispersion and the reliability of circuit board 100.
In the present embodiment, heat absorption heat accumulating 221a can be a kind of phase-change material, and it can be along with temperature
Changing and change physical property and can absorb substantial amounts of heat, along with the increase of the heat absorbed, absorb heat heat accumulation
Material 221a gradates as another kind of phase mutually from one, can stably maintain another after absorbing sufficient heat
Plant mutually and no longer absorb heat, and when body 21 does not has thermal source to produce or heat is relatively low, absorb heat heat accumulating 221a
Carry out dispelling the heat and gradually along with reducing of heat is gradually reverted to original phase mutually by another kind.Wherein, heat absorption
Heat accumulating 221a can change to liquid phase or liquid phase to solid phase from solid phase along with the change of temperature, or solid phase
Change to solid phase to gas phase or liquid phase, or liquid phase to gas phase or gas phase to liquid phase.
It should be understood that heat absorption heat accumulation part 22 is arranged on the outer surface of body 21, and/or it is arranged at body
21 with on the joint face of plate body 1.When heat on the body 21 of chip 2 reaches uniform temperature, absorb heat heat accumulation
Heat on body 21 is absorbed heat and heat accumulation by the heat absorption heat accumulating 221a in part 22, comes chip 2
Body 21 lower the temperature.
The circuit board 100 that the present invention provides, by arranging heat absorption heat accumulation part 22 on the body 21 of chip 2, is inhaled
Heat on the body 21 of chip 2 can be absorbed by the heat absorption heat accumulating 221a in hot heat accumulation part 22,
And by heat storage at self, after the temperature of body 21 lowers, the heat of storage is dispersed into air
In, thus reduce the heat of the body 21 of chip 2, so that circuit board 100 has preferably heat dispersion,
Improve and there is the reliability that the mobile terminal of this circuit board 100 uses.
In order to further improve, it is 1:1～1:9 that heat absorption heat accumulating 221a preferably comprises mass ratio
Silicon dioxide and Polyethylene Glycol.Inventor is drawn by substantial amounts of experiment, by silicon dioxide and Polyethylene Glycol
With mass ratio as 1:1～the 1:9 organic-composite phase-change material that can prepare of mixing has suitable phase transition temperature,
Can the heat of absorbent body 21 in time, improve the reliability of chip 2 and mobile terminal further.Specifically
, the phase transition temperature that this heat absorption heat accumulating 221a is mixed to prepare is 40 degree, the heat i.e. produced at body 21
After amount reaches 40 degree, heat absorption heat accumulating 221a carries out decalescence, is taken away by the heat of body 21, with
Body 21 is lowered the temperature.Certainly, in other embodiments, heat absorption heat accumulating 221a can also be inorganic
Phase-change material, or composite phase-change material etc..
In order to further improve, heat absorption heat accumulating 221a by some with silicon dioxide as cyst wall, with poly-
Ethylene glycol is that the microcapsule of capsule-core is constituted.The heat absorption heat accumulating 221a of this microcapsule structure can be preferably to body 21
Carry out the heat accumulation that absorbs heat, and then reach preferably heat dispersion.Concrete, Polyethylene Glycol is joined the denseest
In the Ludox of degree, after all dissolving, drip CaCl2Accelerator solution, under strong stirring so that poly-
There is sol gel reaction in ethylene glycol in Ludox, forms three-dimensional net structure gel after standing；By gel
In 80 DEG C of baking ovens, forced air drying 24～48h, are cooled to room temperature, can access with organic silica
It is a large amount of with silica dioxide gel as cyst wall, with the Polyethylene Glycol after emulsifying that compound produces in the basic conditions
Microcapsule for capsule-core.I.e. in each microcapsule, silicon dioxide wraps the poly-second two as capsule-core as cyst wall
Alcohol so that Polyethylene Glycol will not leak during solid-liquid, it is possible to well by silicon dioxide bag
Wrap.The heat absorption heat accumulating of this formation microcapsule structure, after the heat of body 21 reaches 40 degree, starts to inhale
Receive the heat on body 21, and capsule-core itself is gradually increased gradually from solid-liquid along with heat, works as capsule
After core is converted to liquid phase, the heat that heat absorption heat accumulating 221a absorbs is the most saturated, and it stops absorbing heat,
And after the temperature outside body 21 is gradually decrease to preset temperature, the heat of absorption is slowly given out by capsule-core
Come, be delivered in air, and capsule-core gradually can be converted to from liquid phase along with gradually decreasing of its fever of the body amount
Solid phase, is changed by the circulation of above-mentioned solid phase to liquid phase, thus lowers the temperature body 21, improves mobile whole
The heat dispersion of end and reliability.Certainly, in other embodiments, heat absorption heat accumulating 221a can also be
Other structure so that heat absorption heat accumulating 221a can be by changing to body from the circulation being solid to gas phase
21 coolings.
As it is shown on figure 3, in order to further improve, heat absorption heat accumulation part 22 also includes titanate coupling agent 221b
With glue-line 222, heat absorption heat accumulating 221a and titanate coupling agent 221b is mixed and made into flaky material 221,
Glue-line 222 stacking is covered on flaky material 221, and flaky material 221 is adhered to body 21 by glue-line 222
On.
By heat absorption heat accumulating 221a and titanate coupling agent 221b is mixed and made into flaky material 221, then
It is connected on flaky material 221 form heat absorption heat accumulation part 22 by glue-line 222 stacking, not only makes heat absorption storage
Warmware 22 can go to cut according to the shape of body 21, and then can have with the body 21 of chip 2
Preferably coordinate, it is possible to each position of chip 2 is carried out the heat accumulation that absorbs heat, further chip 2 is dropped
Temperature, improves heat dispersion and the reliability of circuit board 100, and the heat absorption heat accumulation part 22 of lamellar is applied more
Convenient, directly it is stained with, is cooled into coating without waiting for it.
In the present embodiment, heat absorption heat accumulating 221a is smashed to pieces and strong stirring obtains powder, due to powder body
Diameter be far longer than the diameter of each microcapsule, thus without the microcapsule knot destroyed in heat absorption heat accumulating 221a
Structure, does not i.e. interfere with the heat absorption heat storage function of heat absorption heat accumulating 221a, at the heat absorption heat accumulating of powder
221a adds titanate coupling agent 221b hydrophobically modified and obtains inorganic plan organic composite shaping phase-change material, then will
This inorganic plan organic composite shaping phase-change material prepares flake i.e. flaky material 221, lamellar through tabletting machine
Material 221 stacking again connects upper glue layer 222 and forms heat absorption heat accumulation part 22.It should be understood that glue-line 222 is permissible
For gum, double faced adhesive tape or mould release membrance etc..Heat absorption heat accumulation part 22 can be cut out according to the shape of the body 21 of chip 2
It is cut into definite shape, is fitted on body 21, it is achieved the function of heat absorption heat accumulation.
In order to further improve, chip 2 also includes that protecting film 23, protecting film 23 are arranged at heat absorption heat accumulation
On part 22, and protecting film 23 is located remotely from the side of body 21.
By arranging protecting film 23 on heat absorption heat accumulation part 22, so that heat absorption heat accumulation part 22 is protected further
Protect, improve chip 2, the reliability of circuit board 100 further.
In the present embodiment, protecting film 23 is polyethylene terephthalate (PET), and its stacking is connected to
On flaky material 221 and opposing with glue-line 222, flaky material 221 can be entered by protecting film 23 further
Row is shaped and has dust-proof effect.Certainly, in other embodiments, the material of protecting film 23 can also be
Other, such as silica gel.
Such as Fig. 4 to Fig. 5, a kind of chip 32 that the second embodiment of the present invention is provided, with the present invention the first reality
The basic structure executing the chip 2 that example provides is roughly the same, and its difference is, the chip in the present embodiment
The heat absorption heat accumulation part 322 of 32 includes absorb heat heat accumulating, retarder thinner and bonding solution, the heat accumulating that absorbs heat,
Retarder thinner and bonding solution mix and coat on body.
By retarder thinner, bonding solution are mixed to form heat absorption heat accumulation part 322 with heat absorption heat accumulating so that
Heat absorption heat accumulation part 322 directly has adhesive force, it is not necessary to still further increasing glue-line can coat on body, thus
Provide a kind of use advantageously heat absorption heat accumulation part 322.
In the present embodiment, heat absorption heat accumulating is smashed to pieces and strong stirring obtains powder, straight due to powder body
Footpath is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, the most not
Can affect the heat absorption heat storage function of heat absorption heat accumulating, the heat absorption heat accumulating in powder is added to dilute molten
Agent and interpolation special binder solution mixing (such as: methanol dimethylbenzene, acrylic resin etc.) so that heat absorption storage
Warmware 322 has adhesive force, directly uses the form of coating to be piled into certain thickness heat absorption heat accumulation part 322 attached
On the body 321 of chip 32, thus realize the function of heat absorption heat accumulation.
In order to further improve, chip 32 also includes that protecting film 323, protecting film 323 are arranged at heat absorption
On heat accumulation part 322, and protecting film 323 is located remotely from the side of body 321.
By arranging protecting film 323 on heat absorption heat accumulation part 322, so that heat absorption heat accumulation part 322 is carried out further
Protection, improves the reliability of chip 32 further.
In the present embodiment, protecting film 323 is polyethylene terephthalate (PET).Wherein, inhaling
After hot heat accumulation part 322 is directly coated on body 321, protecting film 323 is arranged on heat absorption heat accumulation part 322.
Heat absorption heat accumulation part 322 can be shaped and have dust-proof effect by protecting film 323 further.Certainly, exist
In other embodiments, the material of protecting film 323 can also be other, such as silica gel.
Such as Fig. 6, the third embodiment of the present invention is provided a kind of chip 42, is provided with first embodiment of the invention
The basic structure of chip 2 roughly the same, its difference is, the heat absorption of the chip 42 in the present embodiment
Heat accumulation part 422 includes absorb heat heat accumulating 4221, substrate 4222 and glue-line 4223, and absorb heat heat accumulating 4221
Coating in substrate 4222, glue-line 4223 stacking is connected to absorb heat on heat accumulating 4221, and glue-line 4223
It is adhered on body 421.
By directly heat absorption heat accumulating 4221 being coated molding in substrate 4222, then at heat absorption heat accumulating
4221 arrange glue-line 4223 to be pasted on body 421, it is not necessary to tablet machine carries out tabletting, makes relatively simple.
In the present embodiment, substrate 4222 is polyethylene terephthalate (PET), will heat absorption heat accumulation material
Material 4221 smashs to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of microcapsule, therefore
The microcapsule structure in heat absorption heat accumulating 4221 will not be destroyed, i.e. do not interfere with the suction of heat absorption heat accumulating 4221
Hot heat storage function, is directly coated at molding in substrate 4222 by the heat absorption heat accumulating 4221 of powder, will tool
The substrate 4222 having heat absorption heat accumulating 4221 is adhered on body 421 by glue-line 4223, it is achieved heat absorption
The heat absorption heat storage function of heat accumulation part 422.It should be understood that glue-line can be gum, double faced adhesive tape or other etc..
In order to further improve, chip 42 also includes that protecting film 423, protecting film 423 are arranged at heat absorption
On heat accumulation part 422, and away from body 421.
By arranging protecting film 423 on heat absorption heat accumulation part 422, so that heat absorption heat accumulation part 422 is carried out further
Protection, improves the reliability of chip 42 further.
In the present embodiment, protecting film 423 is polyethylene terephthalate (PET).By protecting film 423
It is arranged in substrate 4222.Heat absorption heat accumulation part 422 can be shaped and have by protecting film 423 further
Dust-proof effect.Certainly, in other embodiments, the material of protecting film 423 can also be other, such as
Silica gel.
Referring to Fig. 7, for the schematic diagram of the mobile terminal 200 that fourth embodiment of the invention provides, this moves
Terminal 200 includes that circuit board 100, circuit board 100 include the chip 2,32,42 in as above three embodiments
In any one.
When mobile terminal during fabrication, first body arrange heat absorption heat accumulation part, then by chip attachment in electricity
On the plate body of road plate, finally circuit board is assemblied in mobile terminal.Wherein, the heat absorption of microcapsule structure is formed
Heat accumulating, after the heat of body reaches 40 degree, starts the heat on absorbent body, and capsule-core itself by
Gradually from solid-liquid, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating absorbs is the most saturated,
It stops absorbing heat, and after the temperature of body exterior is gradually decrease to preset temperature, capsule-core is by absorption
Heat comes out, and is delivered in air, and capsule-core can along with gradually decreasing of its fever of the body amount gradually from
Liquid-solid, by the circulating phase-change of the heat accumulating that absorbs heat, thus lowers the temperature to body, improves mobile whole
The heat dispersion of end and reliability.
The mobile terminal that the present invention provides is by arranging heat absorption heat accumulation part on the body of chip, and absorb heat heat accumulation part
Can inhale by the heat on the body to chip including the heat absorption heat accumulating with heat absorption and heat storage function
Receive, and by heat storage at self, after the temperature of chip lowers, the heat of storage is dispersed into sky
In gas, thus reduce the heat of the body of chip, thus mobile terminal has preferably heat dispersion, improve
The reliability that mobile terminal uses.
The mobile terminal that the present invention provides also by by silicon dioxide and Polyethylene Glycol with mass ratio as 1:1～1:
The organic phase change material that 9 mixing can prepare has suitable phase transition temperature, it is possible to the heat of absorbent body in time
Amount, improves the reliability of chip and mobile terminal further.
The mobile terminal that the present invention provides makes microcapsule structure also by by heat absorption heat accumulating, it is possible to the most right
Body carries out the heat accumulation that absorbs heat, and then reaches preferably heat dispersion.
The mobile terminal that the present invention provides is mixed and made into sheet also by by heat absorption heat accumulating and titanate coupling agent
Shape material, then be connected on flaky material form heat absorption heat accumulation part by glue-line stacking, not only make heat absorption storage
Warmware can go to cut according to the shape of body, and the application of the heat absorption heat accumulation part of lamellar is more convenient,
Directly it is stained with, is cooled into coating without waiting for it.
The mobile terminal that the present invention provides mixes with heat absorption heat accumulating also by by retarder thinner, bonding solution
Form heat absorption heat accumulation part so that heat absorption heat accumulation part directly has adhesive force, it is not necessary to still further increase glue-line
Coat on body, thus provide a kind of use advantageously heat absorption heat accumulation part.
The mobile terminal that the present invention provides mixes with heat absorption heat accumulating also by by retarder thinner, bonding solution
Form heat absorption heat accumulation part so that heat absorption heat accumulation part directly has adhesive force, it is not necessary to still further increase glue-line
Coat on body, thus provide a kind of use advantageously heat absorption heat accumulation part.
The mobile terminal that the present invention provides arranges protecting film also by heat absorption heat accumulation part, with to heat absorption heat accumulation
Part is protected further, improves the reliability of chip, mobile terminal further.
It is above the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For Yuan, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these change
Enter and retouching is also considered as protection scope of the present invention.
Claims (11)
1. a chip, it is characterised in that including body and heat absorption heat accumulation part, described body has several
Pin, several pins described are used for being plugged in circuit board, and described heat absorption heat accumulation part is arranged at described body
On, described heat absorption heat accumulation part includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, institute
State heat absorption heat accumulating for absorbing the heat on described body, and described heat absorption heat accumulating by absorb
Heat stores.
Chip the most according to claim 1, it is characterised in that described chip be central processor core,
At least one in power management chip or charging management chip.
Chip the most according to claim 2, it is characterised in that described heat absorption heat accumulating includes dioxy
SiClx and Polyethylene Glycol, the mass ratio of described silicon dioxide and Polyethylene Glycol is 1:1～1:9.
Chip the most according to claim 3, it is characterised in that described heat absorption heat accumulating by some with
Described silicon dioxide is cyst wall, microcapsule with described Polyethylene Glycol as capsule-core is constituted.
Chip the most according to claim 4, it is characterised in that described heat absorption heat accumulation part also includes metatitanic acid
Ester coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent be mixed and made into flaky material,
Described glue-line stacking is covered on described flaky material, and described flaky material is adhered to described by described glue-line
On body.
Chip the most according to claim 4, it is characterised in that described heat absorption heat accumulation part also includes dilution
Solvent and bonding solution, described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and are coated with
It is distributed on described body.
Chip the most according to claim 4, it is characterised in that described heat absorption heat accumulation part also includes substrate
And glue-line, described heat absorption heat accumulating is coated in described substrate, and described glue-line stacking is covered on described heat absorption
On heat accumulating, and the substrate being coated with described heat absorption heat accumulating is adhered to described body by described glue-line
On.
8. according to the chip described in claim 5～7 any one, it is characterised in that described chip also includes
Protecting film, described protecting film is arranged on described heat absorption heat accumulation part, and described protecting film is located remotely from described
The side of body.
9. a circuit board, it is characterised in that include plate body and as described in claim 1～8 any one
Chip, several pins of the body of described chip are plugged on described plate body.
Circuit board the most according to claim 9, it is characterised in that described plate body is near described chip
Thermal hole is offered at position.
11. 1 kinds of mobile terminals, it is characterised in that include the electricity as described in claim 9～10 any one
Road plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287099.7A CN105873416A (en) | 2016-04-29 | 2016-04-29 | Chips, circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287099.7A CN105873416A (en) | 2016-04-29 | 2016-04-29 | Chips, circuit board and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105873416A true CN105873416A (en) | 2016-08-17 |
Family
ID=56629041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610287099.7A Pending CN105873416A (en) | 2016-04-29 | 2016-04-29 | Chips, circuit board and mobile terminal |
Country Status (1)
| Country | Link |
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Application publication date: 20160817 |