CN203858576U

CN203858576U - Dust-proof heat-conducting foam cotton for flat computer

Info

Publication number: CN203858576U
Application number: CN201420168524.7U
Authority: CN
Inventors: 吴凤其
Original assignee: TAICANG QISHENG CHEMICAL FIBER FACTORY
Current assignee: TAICANG QISHENG CHEMICAL FIBER FACTORY
Priority date: 2014-04-09
Filing date: 2014-04-09
Publication date: 2014-10-01
Anticipated expiration: 2024-04-09

Abstract

The utility model provides a dust-proof heat-conducting foam cotton for a flat computer. The dust-proof heat-conducting foam cotton comprises a foam cotton layer, a gluing layer and a radiating layer, wherein the gluing layer is arranged between the foam cotton layer and the radiating layer and connects the foam cotton layer and the radiating layer into a whole. The heat-conducting foam cotton effectively radiates heat through the radiating layer, so that heat energy is quickly transferred in three ways, i.e. a conduction way, a convection way and a radiant heat transferring way; heat-conducting powder is contained in the radiating layer and is a nanometer material, so that the surface area is doubled, the contact area between a synthetic material and air or other liquid is also increased, a heat-conducting dope more easily forms convection, and radiation of a product is facilitated; the foam cotton is simple in structure, and stable and reliable in work and can easily realize industrial production.

Description

The panel computer heat conduction foam that prevents dust

Technical field

The utility model relates to heat-transfer device, specifically the dustproof heat conduction foam of a kind of panel computer.

Background technology

In recent years, development along with electronic technology, electronic product is constantly updated and is regenerated, and the size of its work package is more and more less, especially computer, day different development of the star moon especially, and speed and the efficiency of work are more and more higher, and its thermal value is also increasing, therefore not only require it to be equipped with corresponding heat abstractor, also to guarantee that heat abstractor has stronger heat-sinking capability, to guarantee reliability and the serviceable life of properties of product.Prior art is to adopt graphite heat radiation fin, but facts have proved, the graphite number of plies is more, and graphite heat radiation fin is thicker, and its heat conduction and heat radiation performance is poorer; Thereby the thickness that causes graphite heat radiation fin has had very large restriction, and the space between cannot filling machine member, to enterprise, bring very large inconvenience.

Utility model content

Utility model object: in order to solve the deficiencies in the prior art, the utility model provides a kind of panel computer heat conduction foam that prevents dust, and this heat conduction foam good heat conduction effect is simple in structure, easily realizes for commercial production.

Technical scheme: in order to realize above object, the panel computer described in the utility model heat conduction foam that prevents dust, comprise foamed cotton layer, adhesive layer and heat dissipating layer, between described foamed cotton layer and heat dissipating layer, be provided with adhesive layer, described adhesive layer is in aggregates by foamed cotton layer and heat dissipating layer adhesion.

Described adhesive layer is adhesive sticker or bond plies.

Described heat dissipating layer is comprised of PTE base material film and the heat-radiation coating bed of material being coated on PTE base material film.

The layer thickness of described foam is 200 μ m ~ 1000 μ m, and the thickness of adhesive layer is 50 μ m ~ 100 μ m, and the thickness of heat dissipating layer is 200 μ m ~ 500 μ m.

Beneficial effect: the dustproof heat conduction foam of a kind of panel computer that the utility model provides, by heat dissipating layer high efficiency and heat radiation, make heat energy with conduction, convection current and transmit photothermal three kinds of modes and transmit fast, heat dissipating layer contains heat conduction and divides, and heat conduction powder is nano material, this material doubles its surface area, synthetic material strengthens equally with the area that air or other liquid contact, allow heat-conductive coating more easily form convection current, the heat radiation of help product, this foam structure is simple, and working stability is reliable, and easily realizes for commercial production.

Accompanying drawing explanation

Fig. 1 is structural representation of the present utility model;

Wherein: 1. foamed cotton layer; 2. adhesive layer; 3. heat dissipating layer.

Embodiment

Below in conjunction with the drawings and specific embodiments, further illustrate the utility model.

As shown in Figure 1, a kind of panel computer described in the utility model heat conduction foam that prevents dust, comprise that thickness is the foamed cotton layer 1 of 200 μ m ~ 1000 μ m, thickness is that adhesive layer 2 and the thickness of 50 μ m ~ 100 μ m is the heat dissipating layer 3 of 200 μ m ~ 500 μ m, this heat dissipating layer 3 is comprised of PTE base material film and the heat-radiation coating bed of material being coated on PTE base material film, between described foamed cotton layer 1 and heat dissipating layer 3, be provided with adhesive layer 2, described adhesive layer 2 is in aggregates by foamed cotton layer 1 and heat dissipating layer 3 adhesions, and this adhesive layer 2 is adhesive sticker or bond plies.

When mechanism's part of heat conduction and heat radiation pushes mutually, because having elasticity, foamed cotton layer 1 can play certain buffer action.Can not affect heat dissipating layer 3 heat conduction and heat radiation performance in use.

Described heat radiation coating is by heat conduction powder, and particle diameter is the silicon dioxide of 10 nm ~ 20 μ m, and its percentage by weight accounts for 1%～20% of heat radiation coating; Particle diameter is the titania of 10 nm ~ 20 μ m, and its percentage by weight accounts for 1%～10% of heat radiation coating; Particle diameter is the zirconium silicate of 10 nm ~ 20 μ m, and its percentage by weight accounts for 1%～20% of heat radiation coating; Particle diameter is the boron nitride of 10 nm ~ 10 μ m, and its percentage by weight accounts for 1%～10% of heat radiation coating; Macromolecule alkyl alcoholamine acid amides, its percentage by weight accounts for 0.5%～5% of heat radiation coating; Polymethyl siloxane, its percentage by weight accounts for 0.5%～5% of heat radiation coating; Polysiloxane, its percentage by weight accounts for 0.5%～5% of heat radiation coating; Epoxy resin, described epoxy resin coordinates the percentage by weight of mentioned component to be mixed into 100%, stirs and fully mixes, then adding therein the organic dyestuff of required color, after fully mixing, coats on PTE base material film, just forms heat dissipating layer 3.

Above-described embodiment is only explanation technical conceive of the present utility model and feature, its objective is to allow to be familiar with these those skilled in the art and can to understand content of the present utility model enforcement according to this, can not limit protection domain of the present utility model with this.All equivalents of making according to the utility model Spirit Essence or modification, within all should being encompassed in protection domain of the present utility model.

Claims

1. the dustproof heat conduction foam of a panel computer, it is characterized in that: it comprises foamed cotton layer (1), adhesive layer (2) and heat dissipating layer (3), between described foamed cotton layer (1) and heat dissipating layer (3), be provided with adhesive layer (2), described adhesive layer (2) is in aggregates by foamed cotton layer (1) and heat dissipating layer (3) adhesion.

2. the dustproof heat conduction foam of a kind of panel computer according to claim 1, is characterized in that: described adhesive layer (2) is adhesive sticker or bond plies.

3. the dustproof heat conduction foam of a kind of panel computer according to claim 1, is characterized in that: described heat dissipating layer (3) is comprised of PTE base material film and the heat-radiation coating bed of material being coated on PTE base material film.

4. the dustproof heat conduction foam of a kind of panel computer according to claim 1, it is characterized in that: described foamed cotton layer (1) thickness is 200 μ m ~ 1000 μ m, the thickness of adhesive layer (2) is 50 μ m ~ 100 μ m, and the thickness of heat dissipating layer (3) is 200 μ m ~ 500 μ m.