CN206736159U - A kind of heat-conducting glue band - Google Patents
A kind of heat-conducting glue band Download PDFInfo
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- CN206736159U CN206736159U CN201720550347.2U CN201720550347U CN206736159U CN 206736159 U CN206736159 U CN 206736159U CN 201720550347 U CN201720550347 U CN 201720550347U CN 206736159 U CN206736159 U CN 206736159U
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- heat
- adhesion coating
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Abstract
The utility model discloses a kind of heat-conducting glue band, including：First graphene layer, the upper end of first graphene layer is provided with the second high-temperature plastic adhesion coating, the upper end of the second high-temperature plastic adhesion coating is provided with inorganic filler layer, the upper end of the inorganic filler layer is provided with the 3rd high-temperature plastic adhesion coating, and the upper end of the 3rd high-temperature plastic adhesion coating is provided with the second graphene layer；The lower end of first graphene layer is provided with the first high-temperature plastic adhesion coating, and the lower end of the first high-temperature plastic adhesion coating is provided with laminated polyester film.The utility model passes through the stronger capacity of heat transmission of graphene, heat transmission on electronic device is spread, inorganic filler layer primarily serves insulating effect, but there is the capacity of heat transmission, can be by the heat transmission on the first graphene layer to the second graphene layer, the second graphene layer is again by heat diffusion into air, heat transfer efficiency is high, conduction velocity is fast, and perfection solves the heat dissipation problem on electronic device, suitable for promoting the use of.
Description
Technical field
It the utility model is related to grapheme material technical field, more particularly to a kind of heat-conducting glue band.
Background technology
In recent years, in scientific domain and engineering field, people go to pay close attention to the material of good heat conductivity more and more, with
The acceleration of the continuous upgrading of electronic product, highly integrated and high performance electronics growing, work package body
Product size is less and less, and the speed and efficiency more and more higher of work, caloric value is increasing, and heat dissipation technology has become electronics work
One important topic of industry sustainable development, the material of low dimensional structures show excellent performance in terms of heat transfer, just led
For heat energy power, the isomer and its spin-off of carbon occupy very important status.
Graphene is a kind of cellular flat film formed by carbon atom with sp2 hybrid forms, is a kind of only one
The quasi- two-dimensional material of atomic layer level thickness, due to its very good intensity, flexible, conductive, heat conduction, optical characteristics, physics,
The fields such as materialogy, electronic information, computer, Aero-Space are obtained for significant progress, through retrieving, Chinese granted patent
Grant number is：CN 203393084 U；Denomination of invention：Graphite heat conducting Heat dissipation adhesive tape；Including the first polyester film, the second polyester
First, second high-temperature plastic adhesion coating, the second high temperature resistant has been respectively coated in film and graphite linings, this upper and lower surface of the first polyester film
The adhesive layer surface opposite with the first polyester film is covered with the graphite linings, passes through between this graphite linings and the second polyester film
3rd high-temperature plastic adhesion coating is bonded；The first high-temperature plastic adhesion coating surface opposite with the first polyester film is covered with release material
The bed of material.The diffusion that the utility model graphite heat conducting Heat dissipation adhesive tape not only improves heat also avoids adhesive tape hot-spot, can also be right
Graphite is played a supporting role, and is come off prevented also from entry material, avoids short circuit, so as to improve the performance of product and longevity
Life, but for thermal conductivity factor, the thermal conductivity factor of graphite is relatively low, so that heat-conducting glue band heat-conducting effect is not very perfect.
Utility model content
The utility model is intended to one of technical problem at least solving in correlation technique to a certain extent.Therefore, this reality
It is to propose a kind of heat-conducting glue band with a new purpose, the adhesive tape is by the stronger capacity of heat transmission of graphene, by electronics device
Heat transmission diffusion on part, inorganic filler layer primarily serves insulating effect, but has the capacity of heat transmission, can be by the first graphene layer
On heat transmission to the second graphene layer on, for the second graphene layer again by heat diffusion into air, heat transfer efficiency is high, conduction
Speed is fast, and perfection solves the heat dissipation problem on electronic device, suitable for promoting the use of.
According to a kind of heat-conducting glue band of the utility model embodiment, including：First graphene layer, first graphene layer
Upper end be provided with the second high-temperature plastic adhesion coating, the upper end of the second high-temperature plastic adhesion coating is provided with inorganic filler layer, described inorganic
The upper end of packing layer is provided with the 3rd high-temperature plastic adhesion coating, and the upper end of the 3rd high-temperature plastic adhesion coating is provided with the second graphene layer；
The lower end of first graphene layer is provided with the first high-temperature plastic adhesion coating, and the lower end of the first high-temperature plastic adhesion coating is provided with polyester
Film layer, the lower end of the laminated polyester film are provided with off-style paper layer.
In some embodiments of the utility model, the first high-temperature plastic adhesion coating, the second high-temperature plastic adhesion coating, the 3rd
The thickness ratio of high-temperature plastic adhesion coating is 1: 2: 2.
In other embodiments of the present utility model, the thickness of the inorganic filler layer is 8~10 microns.
In other embodiments of the present utility model, the filler in the inorganic filler layer is alundum (Al2O3).
In other embodiments of the present utility model, the thickness of the laminated polyester film is 1.8~2.2 microns.
Beneficial effect in the utility model is：The first graphene layer and the second graphene layer are respectively equipped with adhesive tape,
Under normal temperature, the thermal conductivity factor of graphene is 5300W/mK, and graphite only has 129W/mK, so the heat transfer efficiency of graphene
It is far longer than the thermal conductivity of common graphite, the effect of off-style paper layer is to play protection laminated polyester film, prevents that it is contaminated and loses
Stickup property is gone, off-style paper layer can be torn off during use, recycle the stickup of laminated polyester film Nian Jie with electronic device, the first stone
Black alkene layer is Nian Jie by the first high-temperature plastic adhesion coating with laminated polyester film, and inorganic filler layer mainly plays a part of insulation, interior
The alundum (Al2O3) in portion has heat conductivility, and the heat of the first graphene layer can be sent to the second graphite linings, the second graphene
Layer is in the upper surface of adhesive tape, and the heat that can be will be transmitted to swaps with air, by heat diffusion into air, that is, completes heat
Amount is scattered and disappeared；The utility model is inorganic to fill out by the heat transmission diffusion on electronic device by the stronger capacity of heat transmission of graphene
The bed of material primarily serves insulating effect, but has the capacity of heat transmission, can be by the heat transmission on the first graphene layer to the second graphene
On layer, the second graphene layer is again by heat diffusion into air, and heat transfer efficiency is high, and conduction velocity is fast, and perfection solves electronics device
Heat dissipation problem on part, suitable for promoting the use of.
Brief description of the drawings
Accompanying drawing is used for providing further understanding to of the present utility model, and a part for constitution instruction, with this practicality
New embodiment is used to explain the utility model together, does not form to limitation of the present utility model.In the accompanying drawings：
Fig. 1 be the utility model proposes a kind of heat-conducting glue band structural representation.
In figure：1- off-style paper layers, 2- laminated polyester films, the first high-temperature plastics of 3- adhesion coating, the graphene layers of 4- first, 5- second
High-temperature plastic adhesion coating, 6- inorganic filler layers, the high-temperature plastic adhesion coatings of 7- the 3rd, the graphene layers of 8- second.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.
The example of the embodiment is shown in the drawings, wherein same or similar label represents identical or class from beginning to end
As element or with same or like function element.The embodiments described below with reference to the accompanying drawings are exemplary, purport
For explaining the utility model, and it is not intended that to limitation of the present utility model.
In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " suitable
The orientation or position relationship of the instruction such as hour hands ", " counterclockwise ", " axial direction ", " radial direction ", " circumference " are based on orientation shown in the drawings
Or position relationship, be for only for ease of description the utility model and simplify and describe, rather than instruction or imply signified device or
Element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limit of the present utility model
System.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In description of the present utility model, " multiple " are meant that two or two
More than, unless otherwise specifically defined.
In the utility model, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be
Mechanically connect or electrically connect；Can be joined directly together, can also be indirectly connected by intermediary, can be two
The connection of element internal or the interaction relationship of two elements.For the ordinary skill in the art, can basis
Concrete condition understands concrete meaning of the above-mentioned term in the utility model.
Reference picture 1, a kind of heat-conducting glue band, including：First graphene layer 4, the upper end of the first graphene layer 4 are resistance to provided with second
High temperature adhesive layer 5, the upper end of the second high-temperature plastic adhesion coating 5 are provided with inorganic filler layer 6, and the upper end of inorganic filler layer 6 is provided with the 3rd
High-temperature plastic adhesion coating 7, the upper end of the 3rd high-temperature plastic adhesion coating 7 are provided with the second graphene layer 8；The lower end of first graphene layer 4 is set
There is the first high-temperature plastic adhesion coating 3, the lower end of the first high-temperature plastic adhesion coating 3 is provided with laminated polyester film 2, the lower end of laminated polyester film 2
Provided with off-style paper layer 1；First high-temperature plastic adhesion coating 3, the second high-temperature plastic adhesion coating 5, the thickness ratio of the 3rd high-temperature plastic adhesion coating 7 are
1∶2∶2；The thickness of inorganic filler layer 6 is 8~10 microns；Filler in inorganic filler layer 6 is alundum (Al2O3)；Polyester film
The thickness of layer 2 is 1.8~2.2 microns.
The first graphene layer 4 and the second graphene layer 8, at normal temperatures, the thermal conductivity factor of graphene are respectively equipped with adhesive tape
For 5300W/mK, and graphite only has 129W/mK, so the heat transfer efficiency of graphene is far longer than the heat conduction of common graphite
Rate, the effect of off-style paper layer 1 are to play protection laminated polyester film 2, prevent that it is contaminated and loses stickup, can be torn during use
Off-style paper layer 1 is removed, recycles the stickup of laminated polyester film 2 Nian Jie with electronic device, the first graphene layer 4 and laminated polyester film
2 are bonded by the first high-temperature plastic adhesion coating 3, and inorganic filler layer 6 mainly plays a part of insulation, internal alundum (Al2O3) tool
There is heat conductivility, the heat of the first graphene layer 4 can be sent to the second graphite linings 8, the second graphene layer 8 is in the upper of adhesive tape
Surface, the heat that can be will be transmitted to swaps with air, by heat diffusion into air, that is, completes scattering and disappearing for heat；This reality
With the new capacity of heat transmission stronger by graphene, the heat transmission on electronic device is spread, inorganic filler layer 6 primarily serves
Insulating effect, but have the capacity of heat transmission, can be by the heat transmission on the first graphene layer 4 to the second graphene layer 8, the second stone
Black alkene layer 8 is again by heat diffusion into air, and heat transfer efficiency is high, and conduction velocity is fast, and perfection solves the radiating on electronic device
Problem, suitable for promoting the use of.
In the utility model, unless otherwise clearly defined and limited, fisrt feature is "above" or "below" second feature
Can be that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, first is special
Sign second feature " on ", " top " and " above " can be fisrt feature directly over second feature or oblique upper, or only
Represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be with
Be fisrt feature immediately below second feature or obliquely downward, or be merely representative of fisrt feature level height and be less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the present utility model.In this manual, to the schematic table of above-mentioned term
State and be not necessarily referring to identical embodiment or example.Moreover, specific features, structure, material or the feature of description can be
Combined in an appropriate manner in any one or more embodiments or example.
It is described above, the only preferable embodiment of the utility model, but the scope of protection of the utility model is not
This is confined to, any one skilled in the art is in the technical scope that the utility model discloses, according to this practicality
New technical scheme and its utility model design are subject to equivalent substitution or change, should all cover in protection model of the present utility model
Within enclosing.
Claims (5)
- A kind of 1. heat-conducting glue band, it is characterised in that including：First graphene layer, the upper end of first graphene layer are provided with the second high-temperature plastic adhesion coating, second high-temperature plastic The upper end of adhesion coating is provided with inorganic filler layer, and the upper end of the inorganic filler layer is provided with the 3rd high-temperature plastic adhesion coating, and the described 3rd is resistance to The upper end of high temperature adhesive layer is provided with the second graphene layer；The lower end of first graphene layer is provided with the first high-temperature plastic adhesion coating, and the lower end of the first high-temperature plastic adhesion coating is provided with Laminated polyester film, the lower end of the laminated polyester film are provided with off-style paper layer.
- A kind of 2. heat-conducting glue band according to claim 1, it is characterised in that：It is the first high-temperature plastic adhesion coating, second resistance to High temperature adhesive layer, the thickness ratio of the 3rd high-temperature plastic adhesion coating are 1: 2: 2.
- A kind of 3. heat-conducting glue band according to claim 1, it is characterised in that：The thickness of the inorganic filler layer is 8~10 Micron.
- A kind of 4. heat-conducting glue band according to claim 3, it is characterised in that：Filler in the inorganic filler layer is three Al 2 O.
- A kind of 5. heat-conducting glue band according to claim 1, it is characterised in that：The thickness of the laminated polyester film be 1.8~ 2.2 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720550347.2U CN206736159U (en) | 2017-05-16 | 2017-05-16 | A kind of heat-conducting glue band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720550347.2U CN206736159U (en) | 2017-05-16 | 2017-05-16 | A kind of heat-conducting glue band |
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| Publication Number | Publication Date |
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| CN206736159U true CN206736159U (en) | 2017-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201720550347.2U Active CN206736159U (en) | 2017-05-16 | 2017-05-16 | A kind of heat-conducting glue band |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115092920A (en) * | 2022-06-27 | 2022-09-23 | 常州富烯科技股份有限公司 | Graphene heat-conducting gasket and preparation method thereof |
-
2017
- 2017-05-16 CN CN201720550347.2U patent/CN206736159U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115092920A (en) * | 2022-06-27 | 2022-09-23 | 常州富烯科技股份有限公司 | Graphene heat-conducting gasket and preparation method thereof |
| CN115092920B (en) * | 2022-06-27 | 2023-09-26 | 常州富烯科技股份有限公司 | Graphene heat conduction gasket and preparation method thereof |
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