JP2016184706A - Cooling structure and cooling component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling structure having a high impact resistance while ensuring high heat dissipation effect, and to provide a cooling component.SOLUTION: In a cooling structure having a heat dissipation structure, a cooling body disposed on one side of the heat dissipation structure in contact therewith, and a cooled body disposed on the other side of the heat dissipation structure in contact therewith, the heat dissipation structure has a flat base, and a plurality of fins formed to project from one surface of the base at predetermined intervals. The plurality of fins have flexibility, and the cooling body or cooled body is in contact with the top of the plurality of fins of the heat dissipation structure.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cooling structure and a cooling component that can obtain a high heat dissipation effect and have impact resistance.

CPUs, image processing chips, memories, etc., semiconductor elements used in power devices such as large-scale integrated circuits (LSIs), liquid crystals, plasma displays (PDP), light emitting diodes (LEDs), organic electroluminescence (organic EL) elements, etc. In electronic components having light emitting elements, solar cell elements, and the like, and electronic devices equipped with such electronic elements, the amount of heat generated from the elements has increased due to downsizing and higher integration of electronic circuits. In addition, the occurrence of functional failure of electronic devices is a problem.
Therefore, in an electronic device, a heat dissipation structure is used in order to dissipate heat generated in the element and the electronic circuit and suppress thermal deterioration of the element and the temperature rise of the electronic device.

  Examples of the heat radiating structure include a heat radiating sheet, a heat sink, a heat pipe, and the like, and among them, a heat sink is widely used. A heat sink generally has a structure having a plurality of plate-like or rod-like fin portions on one surface of a base portion serving as a base in order to increase a heat transfer area for transferring heat to the air. As such a heat sink, for example, a cast product of aluminum or aluminum alloy having a plurality of fin portions on the surface, a heat sink having comb-shaped fin portions formed by bending a metal plate (see Patent Document 1), thermal conductivity A heat sink (see Patent Document 2) or the like is known in which a powder sheet is added to bend a paper sheet into a fin portion and bonded to a heat conductive portion such as paper, a metal plate, or a heat conductive plastic.

  As disclosed in Patent Document 1 or the like, the heat sink may be a surface (hereinafter, referred to as a non-fin portion side surface) opposed to a surface having a fin portion (hereinafter, sometimes referred to as a fin portion side surface). .) Is brought into contact with a heating element such as an element substrate, and the heat received from the heating element is dissipated on the surface of the fin portion, so that a heat radiation function can be exhibited, and as a result, the temperature of the heating element is lowered. Can do. Therefore, the higher the heat dissipation efficiency by the heat sink, the more efficiently the temperature of the heating element can be reduced.

JP 2001-057406 A International Publication No. 2011/025020

By the way, in the arrangement | positioning aspect of the conventional heat sink as disclosed by patent document 1-2 etc., the fin part is placed in the state exposed to the air, and the heat transfer from a heat sink is with the air which contacts a heat sink. Will be done only between. However, since the heat transfer efficiency performed between the heat sink and air is governed by the thermal conductivity of air, it is sufficient even if the heat transfer area of the heat sink is increased by increasing the number of fins, etc. There is a problem that a sufficient heat dissipation effect cannot be obtained.
Further, in the above arrangement mode, heat is transferred from the fin surface to the surrounding atmosphere by the heat sink (heat transfer) and heat radiation is generated to generate heat, but heat transfer by heat transfer, heat radiation, etc. is heat. The conductance is small, and in order to dissipate sufficient heat, it is necessary to increase the temperature difference between the fin part of the heat dissipation structure and the surrounding atmosphere, so it is difficult to lower the temperature of the heating element itself, There is a problem that a large amount of heat cannot be radiated.

  As a result of intensive studies by the present inventors on the above-mentioned problems, one surface side of the heat dissipation structure having the fin portion is brought into contact with a cooled body that requires heat dissipation, and the other surface side is dissipated. By adopting a sandwich type cooling structure in which the heat dissipation structure is brought into contact with the cooling body, i.e., the cooling target body and the cooling body, in addition to heat dissipation by the fins, It has been found that heat from a cooled body can be dissipated with high efficiency by conducting heat from the cooling body to the cooling body.

However, when adopting such a cooling structure, the present inventors have conducted further studies, and the following new problems arise due to the rigidity of the fin structure, in particular, the fin section, particularly the fin section. I found. That is, in the sandwich type cooling structure, the arrangement interval between the cooled object and the cooling body may be changed by receiving an external force such as vibration, or the relative position may change due to a lateral shift. At this time, in the heat sink disclosed in the cast product and Patent Document 1, the fin portion of the heat dissipation structure exhibits high rigidity and cannot be bent or tilted with respect to the base portion, and therefore cannot follow the shape change that occurs in the cooling structure. Damage to the cooling structure, such as damage to the fins, the object to be cooled, or the cooling body due to the stress generated inside the cooling structure, or peeling of the adhesive surface between the heat dissipation structure, the object to be cooled, and the cooling body There is a problem that arises.
In addition, when a sandwich type cooling structure is formed by retrofitting a fixed heat sink and a gap between the cooling bodies to form a sandwich type cooling structure, the rigidity of the fins is increased when the heat dissipation structure is inserted into the gap. In some cases, an element or the like of the cooling body is damaged and cannot be driven as an electronic device.

  As a result of further intensive studies by the present inventors in order to solve the above problems, it is possible to improve the heat dissipation effect by the above cooling structure by making the fin portion of the heat dissipation structure flexible. In addition, the present inventors have found that it is possible to improve the impact resistance of the above-described cooling structure against vibration and the like, and have completed the present invention.

  It is an object of the present invention to provide a cooling structure and a cooling component that have a high heat dissipation effect and have impact resistance by adopting a structure in which a heat dissipation structure is disposed between a cooling body and a body to be cooled. Main purpose.

  The present invention includes a heat dissipation structure, a cooling body disposed on one surface side of the heat dissipation structure so as to be in contact with the heat dissipation structure, and the heat dissipation structure on the other surface side of the heat dissipation structure. A cooling structure having a body to be cooled disposed in contact with the body, wherein the heat dissipation structure is formed to protrude from the surface of the flat base and one surface of the base at a predetermined interval A plurality of fin portions, and the plurality of fin portions have flexibility, and the cooling body or the object to be cooled includes top portions of the plurality of fin portions of the heat dissipation structure. Provided is a cooling structure characterized by being in contact with each other.

According to the present invention, by having the sandwich type structure described above, the heat received from the cooled body is conducted to the cooling body through the heat dissipation structure, and in addition to the heat dissipation by the fin portion of the heat dissipation structure. The heat from the body to be cooled can be dissipated with high efficiency by heat conduction to the cooling body. Thereby, the cooling structure of the present invention can obtain a high heat dissipation effect.
In the heat dissipation structure, since the fin portion has flexibility, the fin portion can be bent or inclined according to the interval between the cooling body and the cooled object. Furthermore, even if the interval between the cooling body and the cooled object changes due to vibration or the case where lateral displacement occurs, the fin portion bends following the change in the interval or the lateral displacement direction, or the fin portion is inclined. By changing the angle, it is possible to prevent the cooling structure from being damaged, and to have impact resistance.

  In the said invention, it is preferable that the said several fin part and the said base are integral. This is because even when the fin portion and the base portion are repeatedly bent at the connection portion, fatigue breakage at the connection portion can be prevented, and the heat dissipation structure can have high durability.

  In the case of the above invention, the heat dissipation structure includes a resin portion made of a resin material and a heat conductive layer formed on one surface of the resin portion. The resin portion includes a flat portion and the flat portion. A plurality of convex portions formed at predetermined intervals so as to protrude to the side on which the heat conductive layer is formed, and the flat portion and the plurality of convex portions are integrated. preferable. Since the heat dissipation structure has a laminated structure of a resin part and a heat conductive layer, and the fin part has a convex part of the resin part and a heat conductive layer formed on the convex part, in addition to the fin part, This is because the base portion can also have flexibility. In addition, the high heat conductivity of the heat conductive layer improves the heat dissipation function by the fins, and also enables heat conduction to the cooling body with high efficiency, and also improves the heat dissipation function from the cooling body. This is because the overall heat dissipation function can be further improved. Furthermore, it is because the heat dissipation structure can be reduced in weight by being made of resin.

In the case of the above invention, it is preferable that the plurality of convex portions are formed so that the surface of the resin portion on the side opposite to the side on which the heat conductive layer is formed is opposed. The convex part is formed so that the surface of the resin part opposite to the side on which the heat conductive layer is formed (hereinafter may be abbreviated as the non-convex part side surface), that is, the resin part This is because the heat dissipation structure can inevitably have an integrated structure in which the base portion and the fin portion are continuous because the flat portion is partially bent.
Moreover, since the convex part has the above-described structure, an interface part is formed on the non-convex part side surface of the resin part, and the flexibility of the entire heat dissipation structure is further improved by the presence of the interface part. Thereby, even if the to-be-cooled body or the cooling body disposed on the non-fin portion side surface is deformed, the heat dissipation structure can be brought into close contact with the deformation, so that heat from the placement surface can be obtained. This is because leakage can be suppressed.

  In the said invention, it is preferable that the said cooling body is in contact with the top part of the said several fin part. This is because the heat receiving area can be increased by allowing the non-fin portion side surface of the heat dissipation structure to contact the object to be cooled, and more heat can be conducted and dissipated. In addition, since the top of the fin portion and the cooling body are in contact with each other, in addition to heat dissipation by the fin portion, heat conduction to the cooling body through the fin portion enables heat dissipation from the cooling body, and a higher heat dissipation effect is achieved. Because it can be obtained.

  Further, the present invention includes a flat base portion and a plurality of fin portions formed to protrude from one surface of the base portion at a predetermined interval, and the plurality of fin portions have flexibility. There is provided a cooling component having a heat dissipating structure and a cooling body disposed so as to be in contact with the tops of the plurality of fin portions of the heat dissipating structure.

According to the present invention, since the cooling component has such a structure, it can be disposed on the body to be cooled to form a sandwich type cooling structure. As a result, heat from the radiator is conducted to the cooling body through the heat radiating structure, and in addition to heat dissipation by the fins of the heat radiating structure, heat from the cooled body is increased by heat conduction to the cooling body. Heat can be dissipated efficiently.
Further, in the heat dissipation structure, since the fin portion has flexibility, the cooling component of the present invention is retrofitted into a desired space in which the object to be cooled is disposed to form a sandwich type cooling structure. However, the fin portions can be bent or inclined according to the space interval, and the degree of freedom in designing the cooling structure can be improved. Further, after the cooling component of the present invention is arranged on the cooled body, even when the interval between the cooled body and the cooled body changes due to vibrations or when a lateral shift occurs, the change in the spacing or the lateral shift direction occurs. By following the bending of the fin portion or changing the inclination angle of the fin portion, it is possible to prevent the cooling structure from being damaged and the like and to have impact resistance.

Since the cooling structure of the present invention has a structure in which the heat dissipation structure is in contact with the cooling body and the object to be cooled, a high heat dissipation effect is obtained by heat conduction to the cooling body in addition to heat dissipation by the fin portion of the heat dissipation structure. There is an effect that can be.
In addition, the cooling structure of the present invention has an effect that it can have impact resistance against vibration or the like because the fin portion has flexibility.

It is the schematic perspective view and sectional drawing which show an example of the cooling structure of this invention. It is a schematic perspective view which shows the example of the thermal radiation structure in this invention. It is explanatory drawing which shows the example of the aspect of the fin part in this invention. It is explanatory drawing explaining the example of the specific aspect of the thermal radiation structure in this invention. It is a schematic sectional drawing which shows an example of the resin part in a thermal radiation structure. It is a schematic sectional drawing which shows the other example of the thermal radiation structure in this invention. It is a schematic sectional drawing which shows the other example of the cooling structure of this invention. It is explanatory drawing which shows an example of the fixation specification of a fin part and a cooling body. It is a schematic sectional drawing which shows the other example of the cooling structure of this invention. It is explanatory drawing explaining the other example of the cooling structure of this invention, and its formation method. It is a schematic sectional drawing which shows an example of the other aspect of the cooling structure of this invention. It is a schematic sectional drawing which shows an example of the cooling component of this invention. It is the schematic plan view and sectional drawing which show an example of the heat sink used by the comparative example 6. It is a schematic diagram which shows an example of a simple evaluation apparatus.

  Hereinafter, the cooling structure and cooling component of the present invention will be described in detail.

I. Cooling structure The cooling structure of the present invention includes a heat dissipation structure, a cooling body disposed on one surface side of the heat dissipation structure so as to contact the heat dissipation structure, and the other surface side of the heat dissipation structure. And a to-be-cooled body disposed so as to be in contact with the heat dissipation structure, wherein the heat dissipation structure has a flat base and a predetermined distance from one surface of the base. And a plurality of fin portions formed so as to protrude, and the plurality of fin portions have flexibility, and the cooling body or the object to be cooled is the plurality of fins of the heat dissipation structure. It is in contact with the top of the part.

The cooling structure of the present invention will be described with reference to the drawings. FIG. 1A is a schematic perspective view showing an example of the cooling structure of the present invention, and FIG. 1B corresponds to a cross-sectional view as seen from the width direction of the fin portion in the heat dissipation structure of FIG. . The cooling structure 10 of the present invention is disposed so as to be in contact with the heat dissipating structure 1, the cooling body 2 disposed so as to be in contact with one surface side of the heat dissipating structure 1, and the other surface side of the heat dissipating structure 1. The to-be-cooled body 3 is provided.
The heat dissipating structure 1 includes a flat base 11 and a plurality of fin portions 12 formed to protrude from one surface of the base 11 at a predetermined interval. Has flexibility.
In the cooling structure 10 illustrated in FIG. 1, the cooling body 2 is disposed in contact with the tops of the plurality of fin portions 12 of the heat dissipation structure 1, and the object to be cooled 3 is connected to the fin portions 12 of the heat dissipation structure 3. It is disposed in contact with the surface (non-fin portion side surface) 1a opposite to the formed surface.

According to the present invention, the heat dissipation structure has a sandwich structure that contacts the cooling body and the object to be cooled, so that the heat received from the object to be cooled can be conducted to the cooling body via the heat dissipation structure, and the heat dissipation structure. In addition to heat dissipation by the fins of the body, heat from the body to be cooled can be dissipated with high efficiency by heat conduction to the cooling body. Thereby, the cooling structure of the present invention can obtain a high heat dissipation effect.
Further, in the heat dissipation structure, since the fin portion has flexibility, it is possible to incline the fin portion at a desired angle with respect to the surface of the base portion or to bend the fin portion. Furthermore, even if the interval between the cooling body and the cooled object changes due to vibration or the case where lateral displacement occurs, the fin portion bends following the change in the interval or the lateral displacement direction, or the fin portion is inclined. By changing the angle, damage to the cooling structure, such as damage to the fins, the object to be cooled, or the cooling body due to stress applied during deformation, or peeling at the bonding interface between the heat dissipation structure, the cooling body, and the object to be cooled, etc. Can be prevented. For this reason, the cooling structure of the present invention can have impact resistance.

  In addition, since the fin portions can be bent or inclined according to the interval between the cooling body and the body to be cooled, the degree of freedom in designing the cooling structure can be improved.

The reason why a high heat dissipation effect can be obtained by having the above-described sandwich type structure in the cooling structure of the present invention is as follows.
In a cooling structure in which the non-fin portion side surface of the heat dissipation structure is in contact with the object to be cooled and the fin portion is not in contact with other members (hereinafter sometimes referred to as a non-sandwich type structure), the heat dissipation structure includes the fin portion Heat is transferred by transferring heat from the surface to the surrounding atmosphere and generating heat radiation. That is, in the non-sandwich structure, there are two heat transfer paths, namely, a heat transfer path by heat transfer and a heat transfer path by heat radiation, and among these, heat transfer having a large thermal conductance occurs predominantly.
Here, in a heat transfer path with low thermal conductance such as heat transfer or heat radiation, in order to dissipate sufficient heat, the temperature difference between the heat dissipation structure and the surrounding atmosphere is increased to transfer heat by heat transfer or heat radiation. The amount of heat needs to be increased. For this reason, it may be difficult to lower the temperature of the object to be cooled due to the temperature difference, or a large amount of heat may not be dissipated.
On the other hand, the cooling structure of the present invention employs a sandwich type structure in which the fin portion of the heat dissipation structure is in contact with the cooling body or the object to be cooled, so that the heat transfer path is in addition to the above-described two paths, Therefore, a heat conduction path through which heat is conducted from the heat dissipation structure to the cooling body (heat conduction) is provided, and among the three heat transfer paths, heat conduction having a large thermal conductance occurs predominantly. Thereby, the heat dissipated from the fin part surface in the heat dissipation structure can be conducted to the cooling body, and can be dissipated from the cooling body.
In a sandwich type structure, even if the temperature difference between the heat dissipation structure and the ambient atmosphere is small, a sufficient amount of heat can be transferred from the object to be cooled to the surroundings due to an increase in thermal conductance. Thus, the environment of the cooled object can be kept at a low temperature. Thereby, the cooling structure of this invention can acquire the high heat dissipation effect.

In this specification, including the top of the fin portion and the surface on the non-fin portion side, the heat dissipation structure “contacts (contacts with) the cooling body or the object to be cooled” means that the surface of the heat dissipation structure and the cooling body or object A mode in which the surface of the cooling body is in direct contact, a mode in which the heat dissipation structure and the cooling body or the body to be cooled are in indirect contact with each other via a fixing part such as an adhesive layer, a heat dissipation structure and the cooling body Or the other structural member other than a fixing | fixed part exists between to-be-cooled bodies, and the aspect which is contacting indirectly through the said structural member shall be included. The fixing unit will be described later.
In addition, the cooling body or the body to be cooled is in contact with (in contact with) the tops of the plurality of fin portions of the heat dissipation structure. In addition to the aspect in which the top end of the fin portion is in contact with the cooling body or the body to be cooled, the fin portion In the case where is bent, a mode of contacting at a bent portion including the top portion is also included.

  Hereinafter, each structure of the cooling structure of this invention is demonstrated.

A. Heat Dissipation Structure The heat dissipation structure in the present invention has a flat base portion and a plurality of fin portions formed to protrude from one surface of the base portion with a predetermined interval. Further, the plurality of fin portions have flexibility.

1. Fin part The fin part in this invention has flexibility. Here, the fin part has “flexibility” means that the fin part can be bent by applying a desired external force, or that the fin part can be inclined with respect to the base surface, or Say both.
In particular, it is preferable that the fin portion is elastically deformed as the flexibility of the fin portion. When the distance between the object to be cooled and the cooling body changes, or when the relative position of the object to be cooled and the cooling body changes due to lateral displacement, the fin part elastically deforms, so that the object to be cooled or the top of the cooling body and the fin part This is because no stress is applied to the contact area with the cooling structure, and the impact resistance of the entire cooling structure can be improved.

Here, the original shape of a fin part means the shape when a fin part stands upright with respect to the base surface. The fin portion being upright means that the central axis (for example, Y in FIG. 1B) passing through the top of the fin portion is orthogonal to the base surface.
The magnitude of the external force when the fin portion is bent or tilted with respect to the base surface is particularly limited as long as the fin portion can be bent at a desired angle or tilted with respect to the base surface. It is not a thing and can be set suitably.

The flexibility of the fin portion is defined by the following mechanical characteristics. That is, as the mechanical characteristics of the fin portion, the yield elongation of the fin portion is preferably 1% or more, and more preferably 2% or more. The yield elongation is preferably 1500% or less.
By setting the yield elongation of the fin part within the above range, the fin part can be bent at a desired angle or inclined at a desired angle with respect to the base surface, and the fin part is bent or inclined. This is because it can have a function of naturally restoring the original state upright with respect to the base from the state. In addition, in this specification, a yield elongation means the value of the tensile yield elongation measured by the tension test based on JISK7160-7164.
In the present invention, when the fin portion has a laminated structure composed of a plurality of members, at least the member that becomes the core portion of the fin portion has the mechanical characteristics.

The shape of the fin portion can be appropriately designed according to the configuration of the heat dissipation structure to be described later, for example, a plate shape as shown in FIG. 2A or a column shape as shown in FIG. It can be in a shape such as (pin shape). Especially, it is preferable that a fin part is plate shape. This is because, as will be described later, the plate-like fin portion can be easily formed by bending the laminated body, and the heat dissipation structure in which the fin portion and the base portion are integrated can be easily formed.
Although it can be set as the shape similar to a general plate-shaped fin part as a plate-shaped fin part, it is preferable that it is flat plate shape, especially rectangular flat plate shape as shown to Fig.2 (a). Examples of the cross-sectional shape in the height direction viewed from the arrangement direction of the plate-like fin portions include a triangle, a trapezoid, and the like in addition to a rectangle. Moreover, the fin part side surface may curve toward the root part from the top part of the fin part.
In addition, when the fin part is flat, from the viewpoint of securing strength and heat dissipation area, the height of the fin part is larger than the width of the fin part, and the length of the fin part is larger than the height of the fin part, That is, it is preferable that the flat surface of the fin portion is the side surface of the fin portion.
On the other hand, examples of the columnar (pin-shaped) fin portion include a cylinder as shown in FIG. 2B, a columnar body such as a polygonal column, a cone, a triangular pyramid, a polygonal pyramid.
FIG. 2 is a schematic perspective view showing an example of the heat dissipation structure in the present invention.

  The top part of the fin part may be a flat surface, may have a curvature, a part thereof is a flat surface, and a continuous part (corner part) with the side surface may be a curved surface. Further, the tip of the top may be sharp depending on the shape of the fin portion.

The height of a fin part should just be a magnitude | size which a heat dissipation structure can exhibit a desired heat dissipation function, for example, the inside of the range of 5 mm-500 mm is preferable, and the inside of the range of 10 mm-100 mm is especially preferable. If the height of the fin portion is lower than the above range, it may not be possible to make contact with the cooling body or the object to be cooled or the heat dissipation function by the fin portion may not be exhibited. On the other hand, if the height of the fin portion is higher than the above range, the construction becomes difficult and the material cost is increased. On the other hand, the heat dissipation effect is not improved and the cost performance may be deteriorated.
Here, the height of the fin portion is a length from the base surface to the top of the fin portion when the fin portion stands upright with respect to the base surface (for example, H1 in FIG. 2A). Part).

  As for the height of the fin portion, all the fin portions may have a uniform height, may have different heights for each fin portion, the interval between the cooling body and the cooled body, and the cooled body. It can design suitably according to the heat distribution. Especially, it is preferable that all the fin parts have a uniform height. This is because all the fin portions have a uniform height, thereby enabling uniform heat dissipation.

  The width of the fin portion may be any size as long as the heat dissipation structure can exhibit a desired heat dissipation function, and can be appropriately set depending on the shape of the fin portion. Note that the width of the fin portion refers to the interval between the base portions of the fin portion in the connecting portion between the fin portion and the base surface as viewed from the arrangement direction of the fin portion, and is represented by, for example, W1 in FIG. Say part.

  About the length of a fin part, what is necessary is just the magnitude | size which a heat dissipation structure can exhibit a desired heat dissipation function, and can be suitably set according to the shape of a cooling body, a to-be-cooled body, etc. In addition, the length of a fin part means the length of the longitudinal direction in planar view if it is plate shape.

The arrangement interval of the fin portions (hereinafter referred to as pitch) may be a size that allows the heat dissipation structure to exhibit a desired heat dissipation function, depending on the size of the heat dissipation structure, the shape and number of fin portions, and the like. It can be set as appropriate. The pitch is preferably in the range of 3 mm to 100 mm, more preferably in the range of 5 mm to 50 mm, and particularly preferably 7 mm. If the pitch of the fin portions is smaller than the above range, the heat dissipation efficiency may be reduced due to the mutual heat dissipation action between adjacent fin portions, while if larger than the above range, the unit area of the heat dissipation structure may be reduced. Since the number of hit fin portions decreases, it is necessary to increase the number of fin portions in order to enhance the heat dissipation effect, and the heat dissipation structure and the cooling structure may be increased in size.
The pitch of the fin portions may be uniform or different, and can be appropriately designed according to the heat distribution of the object to be cooled.
In addition, the pitch of a fin part is the said one fin part side of said other fin part from the root part by the side of the other adjacent fin part of one fin part among two adjacent fin parts. Means the length to the base portion on the opposite side, for example, a portion indicated by P1 in FIG.

  The number of fin portions is not particularly limited, and can be appropriately set according to the size of the cooling structure, the required heat dissipation performance, and the like.

As shown in FIG. 3A, the fin portion may have a plurality of slits S in the height direction. It is because the surface area of a fin part increases by having a slit, and the heat dissipation function by a fin part can further be improved. There are no particular limitations on the dimensions, number, etc. of the slits, and they can be set as appropriate according to the desired heat dissipation function.
Moreover, the fin part may have the through-hole U which penetrates the width direction of a fin part, as shown in FIG.3 (b). This is because the heat dissipation function can be further enhanced by disturbing the airflow generated in the vicinity of the fin portion by the through hole. The shape, size, number, and the like of the through holes are not particularly limited, and can be appropriately set according to a desired heat dissipation function.
In addition, FIG. 3 is explanatory drawing which shows the example of the aspect of the fin part in this invention.

2. Base The above base may or may not have flexibility, but preferably has flexibility. When the fin portion and the base portion are integral, the base portion usually has flexibility. That the base portion has flexibility means that it can be bent by applying a desired force, and it is preferable that the base portion be elastically deformed.
The thickness of the said base part should just be a magnitude | size which can support a fin part, and can be suitably set according to the aspect of the thermal radiation structure mentioned later. The thickness of the base is a portion indicated by T1 in FIG.

  When the said base has flexibility, it is preferable that the said base has the mechanical characteristic mentioned above similarly to a fin part. The details of the mechanical characteristics of the base are the same as the details of the mechanical characteristics of the fin described in the section “1. Fin section”, and thus the description thereof is omitted here.

3. Embodiment of Heat Dissipation Structure The heat dissipation structure in the present invention is not particularly limited as long as the fin portion has flexibility.
The plurality of fin portions and the base portion may be separate or integrated, but the plurality of fin portions and the base portion are preferably integrated. By having an integrated structure in which the base and the fin are continuous, even when repeatedly bent at the connection between the fin and the base, fatigue damage at the connection can be prevented, and a heat dissipation structure This is because the body can have high durability.
2 (a) described above shows an example of a heat dissipation structure in which a plurality of fin portions and a base portion are integrated, and FIG. 2 (b) shows a plurality of fin portions and a base portion. An example of a separate heat dissipation structure is shown.

  When the fin part and the base part are separate bodies, the heat dissipation structure may have a plurality of flexible fin parts formed on the surface of the flexible base part, and on the surface of the rigid base part. A plurality of fin portions having flexibility may be formed. Especially, it is preferable that both a fin part and a base have flexibility. This is because the entire heat dissipation structure can have flexibility.

  In the present invention, it is preferable that both the fin portion and the base portion have flexibility, and the plurality of fin portions and the base portion are integrated. This is because the heat dissipation structure can have high flexibility and high durability.

A specific aspect of the heat dissipation structure in the present invention will be described with reference to the drawings. 4A to 4D are explanatory views for explaining examples of specific modes of the heat dissipation structure in the present invention.
FIG. 4A shows an example of a heat dissipation structure in which a plurality of fin portions and a base portion are integrated. The heat dissipation structure 1 illustrated in FIG. 4A includes a resin portion 21 made of a resin material and a heat conductive layer 22 formed on one surface of the resin portion 21, and the resin portion 21 is flat. Part 21B, and a plurality of convex parts 21A formed at predetermined intervals so as to protrude on the surface of the flat part 21B on the side where the heat conductive layer 22 is formed, and the flat part 21B and A plurality of convex portions 21A are integrated. Hereinafter, such an aspect is referred to as a “first aspect” of the heat dissipation structure.
The heat conductive layer 22 is formed along the surface of the resin part 21 on which the convex part 21A is formed (the convex part side surface), and the fin part 12 has the convex part 21A of the resin part 21 as a core part. The heat conductive layer 22 covering the surface of the convex portion 21A has a structure. The base 11 has a flat portion 21 </ b> B of the resin portion 21 and a heat conductive layer 22 that covers the surface of the flat portion 21.

  FIG.4 (b) shows the other example of the thermal radiation structure of the aspect with which a some fin part and a base are integral, and does not have a resin part in the above-mentioned 1st aspect. That is, the heat dissipation structure 1 illustrated in FIG. 4B includes a flat base portion 11 and a plurality of fin portions 12 formed to protrude from one surface of the base portion 11 at a predetermined interval. The heat dissipating structure 1 is composed of a laminated body having a heat conducting layer 22 and a flexibility providing layer 23 formed on one surface of the heat conducting layer 22, and the fin portion 12 is a laminated body. The surface of the heat conducting layer 22 opposite to the side on which the flexibility providing layer 23 is formed is opposed to the surface. Hereinafter, such an aspect is referred to as a “second aspect” of the heat dissipation structure.

4C and 4D illustrate an example of a heat dissipation structure in which a plurality of fin portions and a base portion are separate bodies and at least the plurality of fin portions have flexibility. Hereinafter, such an aspect is referred to as a “third aspect” of the heat dissipation structure.
In the heat dissipation structure 1 illustrated in FIG. 4C, the fin portion 12 includes a resin body 24 and a heat conductive layer 22 that covers the surface of the resin body 24. By having flexibility, the fin part 12 has desired flexibility.
In the heat dissipation structure 1 illustrated in FIG. 4D, the fin portion 12 is formed of a laminated body having the heat conductive layer 22 and the flexibility providing layer 23, and one end side of the laminated body is bent. It is fixed to the base portion 11 by a bent portion (sometimes referred to as “fixed white”) C. Since the laminate has flexibility, the fin portion 12 exhibits desired flexibility.
In the third aspect, the fin portion 12 is normally fixed to the base portion 11 via the fixing portion 13. The fixing unit will be described later.

Especially, it is preferable that the thermal radiation structure in this invention is the above-mentioned 1st aspect. This is because, in addition to the fin portion, the base portion can also have flexibility by having the configuration of the first aspect described above. In addition, the high heat conductivity of the heat conductive layer improves the heat dissipation function by the fins, and also enables heat conduction to the cooling body with high efficiency, and also improves the heat dissipation function from the cooling body. This is because the overall heat dissipation function can be further improved. Furthermore, it is because a heat radiating structure can be made lightweight.
Hereinafter, each aspect of the heat dissipation structure in the present invention will be described.

(1) 1st aspect The 1st aspect (henceforth a "this aspect" in this term) of the thermal radiation structure in this invention) is a resin part which consists of resin materials, and one surface of the said resin part A heat conductive layer formed thereon, and the resin portion is spaced apart from the flat portion and a surface of the flat portion on the side where the heat conductive layer is formed. A plurality of convex portions formed, and the flat portion and the plurality of convex portions are integrated.

  Hereinafter, each structure in the heat dissipation structure of this aspect will be described.

(A) Resin part The resin part has a flat part and a plurality of convex parts formed at predetermined intervals so as to protrude on one surface of the flat part. The resin portion is formed of a resin material and further has a structure in which the flat portion and the convex portion are integrated.

  A convex part is a part used as the core part of a fin part in the thermal radiation structure of this aspect, and is a site | part which a fin part can exhibit desired flexibility. Since the cross-sectional shape and the like of the convex portion are the same as the cross-sectional shape and the like of the fin portion described above, description thereof is omitted here. Further, the dimensions and pitches of the convex portions are appropriately designed according to the dimensions and pitches of the fin portions.

  The thickness of the flat portion may be any size as long as it can support the convex portion. For example, the thickness is preferably in the range of 100 μm to 550 μm, more preferably in the range of 150 μm to 350 μm, and particularly preferably in the range of 180 μm to 300 μm. When the thickness of the flat portion is larger than the above range, the workability of the heat dissipation structure may be deteriorated. On the other hand, when the thickness is smaller than the above range, the shape maintainability of the heat dissipation structure may be deteriorated. The thickness of the flat portion is a portion indicated by T2 in FIG.

  In this aspect, since the convex portion and the flat portion are integral, a resin material having flexibility is used as the resin material constituting the resin portion. The resin material preferably has high thermal conductivity. However, even a resin material with low thermal conductivity may contain an additive with high thermal conductivity so as to have high thermal conductivity.

  The resin material having flexibility may be any resin material in which the fin portion can exhibit desired mechanical properties. For example, a cured resin obtained by curing an ionizing ray curable resin, a thermosetting resin, or the like, a thermoplastic resin. Etc. Specific examples of these resin materials can be the same as those generally used for plastic films and resin molded products having flexibility, and examples thereof include polyimide resins, fluororesins, and silicone resins. Moreover, as a resin composition which forms curable resin, curable compounds, such as an isocyanate type curable compound, an epoxy-phenol type curable compound, an epoxy-acrylate type curable compound, and fluorene acrylate, and a photoinitiator are included. Examples thereof include a resin composition.

  Moreover, it is preferable that the said resin part is formed with the resin material which has heat-sealability. This is because the resin material constituting the resin portion has heat sealability, so that when the heat dissipation structure is disposed, the surface of the non-convex portion side of the resin portion can be easily attached as an adhesive surface. Moreover, it is because the convex part of a desired shape can be easily formed by bending a part of the flat part of a resin part, and thermobonding and making it adhere | attach firmly.

  Examples of the resin material having heat sealability include thermoplastic resins generally used for heat seal layers and the like. Specifically, polyolefin resins such as polyethylene, low density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, unstretched polypropylene, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyvinyl acetate, poly Vinyl resins such as vinyl chloride, vinyl chloride-vinyl acetate copolymer resins, poly (meth) acrylic resins, urethane resins, polyamide resins, epoxy resins, rubber resins, ionomer resins, chlorinated polypropylene resins And polycarbonate resin. (Meth) acrylic means at least one of acrylic and methacrylic.

Moreover, the said resin part may be formed with the cured resin which hardened the curable adhesive. By forming a resin part before curing with a curable adhesive and curing it in a state where a part of the flat part is bent, the contact surface can be bonded and a fin part of a desired shape can be easily formed. It is.
As the curable adhesive, for example, a moisture curing type of cyanoacrylate type or silicone rubber type, an epoxy resin type, an acrylic resin type heat curing type, an epoxy resin type, a urethane resin type, a curing type mixed type such as a silicone rubber type, Examples thereof include an adhesive that cures by a reaction such as an acrylate-based anaerobic curing type.

  The resin part may contain an additive having high thermal conductivity in order to improve thermal conductivity within a range in which flexibility and heat sealability can be maintained. Examples of such additives include metal particles, inorganic particles, carbon materials such as carbon particles and carbon fibers, and the like.

  Since the convex part of the resin part corresponds to the core part of the fin part, the resin part preferably has the mechanical characteristics described in the section “1. Fin part”. Since the resin part has the above-mentioned mechanical properties, the fin part and the base part of the heat dissipation structure can have appropriate flexibility and elasticity, and the fin part can be bent by applying a desired external force, or the base part This is because even if it is inclined with respect to the surface, it can have a restoring property.

A groove portion may be provided on the non-convex portion side surface of the resin portion. By having the said groove part, the flexibility as the whole heat dissipation structure improves further. Thereby, even if the to-be-cooled body and the cooling body arranged on the non-fin part side surface of the heat dissipation structure are deformed, the heat dissipation structure can follow the deformation and adhere closely. This is because heat leakage from the surface can be suppressed.
The shape, number, position, and the like of the groove are not particularly limited and can be set as appropriate. Examples of the groove pattern include a lattice shape and a line shape. The size, depth, etc. of the groove are not particularly limited.
In addition, a groove part is a part shown by P in Fig.5 (a) mentioned later.

Since the resin part has a structure in which the flat part and the convex part are integrated, even when the stress is repeatedly applied to the base part of the convex part when the fin part is deformed, the fatigue failure of the fin part Can be made difficult to occur, and the strength can be improved.
Here, in the resin part, the flat part and the convex part are integrated, as shown in FIG. 5A, the resin part 21 projects a part of one surface to form the convex part 21A. By forming so that the flat portion 21B and the convex portion 21A are integrated with each other (as shown in FIG. 5B), the convex portion 21A has a resin portion. 21 (non-convex part side surface 21C) is formed so as to oppose, and the aspect (resin part of the 2nd aspect) with which flat part 21B and convex part 21A were united is mentioned. The resin part of the second aspect can be formed by bending a resin layer or the like.
FIG. 5 is a schematic cross-sectional view showing an example of a resin portion in the heat dissipation structure of this aspect.

  Especially, it is preferable that the said resin part is a 2nd aspect that the convex part is formed so that the non-convex part side surface of the said resin part may oppose. This is because, since the convex portion has a structure in which a part of the resin portion is bent, the heat dissipating structure of this aspect can inevitably have an integrated structure in which the base portion and the fin portion are continuous. . Further, since the convex portion has the above-described structure, the non-convex portion-side surface of the resin portion 21 is formed on the non-fin portion-side surface of the heat dissipation structure as shown in FIG. An interface portion Q is formed which suggests that 21C is in contact or bonded oppositely. This is because by having the interface part, the same effect as that obtained by having the groove part on the non-convex part side surface of the resin part can be exhibited.

Since the interface part is usually formed at a position facing the top of the convex part on the non-convex part side surface, it has a line-shaped pattern along the fin part, and the number is the number of fin parts Equivalent to.
Further, the interface part may be a linear shape in which the non-convex part side surfaces facing each other are in close contact with each other, or may be a groove shape.

When the resin material forming the resin part does not show heat sealability or adhesiveness, the resin part may have an adhesive layer, a pressure-sensitive adhesive layer, or the like on the non-convex part side surface of the resin part. . This is because the heat dissipation structure can be easily disposed on the cooling body or the body to be cooled. Moreover, when it is set as the resin part of a 2nd aspect, the non-convex part which opposes by forming an adhesive layer and a pressure-sensitive adhesive layer in one side of the resin layer which consists of the material of a resin part, and bending the surface as an inner surface This is because the side surfaces can be firmly bonded to each other. In this case, the convex part is formed so that the non-convex part side surface of the resin part faces through the adhesive layer, the pressure-sensitive adhesive layer, or the like.
The adhesive layer and the pressure-sensitive adhesive layer formed on the non-convex portion side surface of the resin portion can be the same as the conventionally known composition, but among them, the thermal conductivity is preferably high.

The method for forming the resin portion is not particularly limited as long as it is a method capable of forming a plurality of convex portions at predetermined intervals so as to protrude on one surface of the flat portion.
For example, in the case of the resin part of the second aspect, a resin layer is formed using the resin part forming composition, the resin layer is folded at a predetermined interval, and a flat part and a plurality of continuous flat parts are provided. A method of forming a convex portion or the like can be used. You may crimp the width direction of the said convex part as needed.
Moreover, if it is a resin part of a 1st aspect, it can form using the method etc. which carry out injection molding of the composition for resin part formation using the metal mold | die shapeable to a desired convex mold | type.
In addition, a heat conductive layer is previously laminated on one surface of the resin layer to form a laminated body, a part of the laminated body is bent to form a convex part, and the width direction of the convex part is changed as necessary. The resin part of a 2nd aspect can be formed by crimping | bonding. In this case, by bending the laminate, a resin part having a flat part and a plurality of convex parts is formed, and at the same time, the heat conduction layer follows the shape of the resin part. It can be formed in a lump.

(B) Thermal Conductive Layer The thermal conductive layer preferably has high thermal conductivity because it is necessary to quickly and efficiently conduct heat from the object to be cooled. This is because if the heat conductivity of the heat conduction layer is low, heat transfer is hindered, and heat stays in the object to be cooled and its vicinity and the temperature rises, so that a sufficient heat dissipation effect cannot be obtained. Because. The thermal conductivity of the heat conductive layer is preferably 10 W · m ⁻¹ · K ⁻¹ or more, and more preferably 80 W · m ⁻¹ · K ⁻¹ or more. The thermal conductivity is measured by an unsteady method using xenon flash light.

  The heat conductive layer should just show the above-mentioned heat conductivity, and can be made into paper shape, foil shape, film shape, sheet shape, etc. according to material. Examples of such a heat conductive layer include a metal foil, a carbon sheet, a heat conductive fiber sheet, a heat conductive thin film containing a heat conductive material and a binder resin.

  Examples of the metal of the metal foil include silver, copper, gold, aluminum, nickel, titanium, molybdenum, zinc, niobium, beryllium, tantalum, tin, lead, iron, platinum, zirconium and other metals, alloys of the above metals, specifically Includes stainless steel, iron-nickel alloy (permalloy, 42 alloy), copper-tin-phosphorus alloy (phosphor bronze), copper-zinc-nickel alloy (white), copper-zinc alloy (brass), nickel-chromium alloy (Dichrome), iron-nickel-cobalt alloy (Kovar), silver-copper-zinc alloy (silver brazing) and the like. Among them, copper, copper alloy, aluminum, and aluminum alloy are preferable because of high heat conductivity and low price, and aluminum or aluminum alloy is more preferable because of light weight.

  The metal foil may be a single phase, and the metal foil may contain metal particles or metal fibers of any material. In addition, the metal foil may contain particles such as oxides and nitrides, fibers, and the like.

  Examples of the carbon material constituting the carbon sheet include carbon black, graphene, graphite, carbon nanotube, diamond, and carbon fiber.

  Examples of the fiber material constituting the thermally conductive fiber sheet include resin fibers having high thermal conductivity such as ultra high molecular weight polyethylene fibers, inorganic fibers such as aluminum fibers, alumina fibers, and titanium fibers.

  The heat conductive thin film contains a heat conductive material and a binder resin. Examples of the heat conductive material include metals and metal alloys used in the above metal foil, metal oxides such as aluminum oxide, calcium oxide, and magnesium oxide, metal nitrides such as aluminum nitride and boron nitride, aluminum hydroxide, water Metal hydroxide such as magnesium oxide, carbonate metal salt such as calcium carbonate and magnesium carbonate, metal silicate salt such as calcium silicate, hydrated metal compound, crystalline silica, amorphous silica, silicon carbide or a composite thereof And carbon materials used for carbon sheets. These may be used individually by 1 type, and 2 or more types may be mixed and used for them.

  Examples of the shape of the thermally conductive material include particles and fillers. In addition, when the shape of a heat conductive material is a particulate form, as the average particle diameter of this particle | grain, the inside of the range of 0.1 micrometer-200 micrometers is preferable. The average particle diameter is measured by a dynamic light scattering method.

  The binder resin contained in the heat conductive thin film is not particularly limited as long as it can bind the heat conductive materials to each other, and includes a general binder resin. Binder resin may be used individually by 1 type, and 2 or more types may be mixed and used for it.

  Among these, the heat conductive layer is preferably a metal foil, and particularly preferably an aluminum foil or an aluminum alloy foil. This is because it has a high thermal conductivity, is lightweight, and has excellent workability such as bending and cutting.

Moreover, when a heat conductive layer is metal foil, it is preferable that the surface of the said metal foil is oxidized, ie, the oxide film is formed in the surface. This is because, since the surface of the metal foil is oxidized, the heat emissivity of the heat conductive layer alone is improved, so that a desired heat radiation effect can be obtained without separately providing a radiation layer described later. Even when the surface of the metal foil is roughened, the same effect can be obtained.
The method for oxidizing the surface of the metal foil is not particularly limited, and for example, there is an anodic oxidation method. The roughening method can be the same as the roughening method described in the section “(c) Radiation layer” described later.

  The thickness of the heat conductive layer may be a thickness that does not hinder heat conduction, and although it depends on the type of the heat conductive layer, it is preferably 6.0 μm or more and 200.0 μm or less, and more preferably 6.0 μm or more. It is preferable that it is 150.0 micrometers or less. If the thickness of the heat conductive layer is larger than the above range, the flexibility of the fin portion may be impaired. On the other hand, if the thickness is smaller than the above range, the heat transfer may be hindered or the strength of the fin portion may be reduced. It may be damaged.

  As a formation method of a heat conductive layer, it can select suitably according to the kind of heat conductive layer. For example, it can be formed by vapor deposition, sputtering, CVD, casting, or the like. Moreover, you may stick together and use the heat conductive layer formed beforehand, such as commercially available metal foil.

(C) Radiation layer It is preferable that the said heat dissipation structure has a radiation layer on the said heat conductive layer. This is because by having the radiation layer on the heat conductive layer, the heat dissipation function and mechanical strength of the heat dissipation structure can be further improved. In addition, since the heat conductive layer is covered with the radiation layer, deterioration of the heat conductive layer due to corrosion, oxidation, or the like can be prevented, and durability of the heat dissipation structure can be improved.
FIG. 6 is a schematic perspective view showing another example of the heat dissipation structure, and illustrates an example in which the radiation layer 25 is provided on the heat conductive layer 22. The radiation layer is formed following the shape of the convex portion side surface of the resin portion.

  The radiation layer preferably has a high emissivity (or called emissivity). This is because if the emissivity is low, the release of heat due to radiation is reduced, so that the heat received from the heat conducting layer cannot be sufficiently dissipated to the outside, and a desired heat dissipation effect cannot be obtained. The emissivity of the radiation layer is preferably 0.4 or more, more preferably 0.6 or more, and particularly preferably 0.8 or more. The emissivity is a value measured by a thermal emissivity measuring device.

(I) Material As long as the radiation layer can exhibit the above-described emissivity, for example, a resin layer, a metal layer composed of a metal material, an inorganic material layer composed of an inorganic material, and a heat dissipation property to a binder resin. A filler-containing layer containing a (thermally conductive) filler can be used. The radiation layer can be in the form of paper, foil, film, sheet or the like depending on the material.

  Examples of the resin constituting the resin layer include a polyvinyl chloride resin, a polyethylene resin, a polypropylene resin, a polystyrene resin, a polyester resin, an ABS resin, and an AS resin if the environmental temperature of the cooling structure of the present invention is relatively low. A general-purpose resin such as an acrylic resin such as polymethyl methacrylate is preferably used. Further, when the environmental temperature of the cooling structure of the present invention is slightly high, phenol resin, urea resin (urea resin), melamine resin, epoxy resin, unsaturated polyester resin, silicone resin, polyurethane resin and the like can be mentioned.

  Furthermore, examples of the resin include amide resins represented by 6 nylon (registered trademark) and 66 nylon (registered trademark), polyacetal, polycarbonate, polyethylene terephthalate, modified polyphenylene ether, modified polyphenylene oxide, polybutylene terephthalate, and ultrahigh molecular weight polyethylene. Engineering plastics such as: polyetheretherketone, polyphenylene sulfide, polysulfone, polyethersulfone, polyarylate, polyamideimide, polyetherimide, liquid crystal polymer, polytetrafluoroethylene (tetrafluoroethylene), polychlorotrifluoroethylene (3 Fluoride), polyvinylidene fluoride (difluoride), polyvinyl fluoride, super fluororesin such as tetrafluoroethylene-ethylene copolymer Engineering plastics, and the like.

The radiation layer, which is a resin layer, contains, in addition to the above-described resin, fillers of inorganic pigments such as SiZrO ₄ , Cr ₂ O ₃ , and iron oxide for the purpose of increasing heat resistance, thermal conductivity, and emissivity. May be.

  When the radiation layer is a metal layer, examples of the metal material constituting the metal layer include metals such as copper, gold, silver, nickel, titanium, stainless steel, and aluminum, and alloys of these metals.

  When the metal layer is a radiant layer, the emissivity is low when it is a mirror surface. Therefore, in order to show a desired emissivity, the surface of the metal layer is rough or the surface of the metal layer is oxidized. It is preferable that an oxide film is formed. The specific surface roughness of the metal layer is not particularly limited, and can be appropriately set according to the emissivity. Examples of the roughening method include UV ozone treatment, plasma treatment, and sandblast treatment. Further, the surface oxidation method of the metal layer can be the same as the method described in the above-mentioned section “(b) Thermal conductive layer”.

  When the radiation layer is an inorganic material layer, the inorganic material constituting the inorganic material layer includes carbon materials such as soda glass, graphite, carbon nanotubes, fullerenes, diamonds, and carbon nanomaterials, aluminum oxide, magnesium oxide, and oxidation. Examples thereof include oxides such as silicon, beryllium oxide, molybdenum oxide, and titanium oxide, and nitrides such as boron nitride, silicon nitride, and aluminum nitride.

  When the radiation layer is a filler-containing layer, examples of the heat dissipating (thermally conductive) filler and binder resin constituting the filler-containing layer are disclosed in JP 2011-228647 A, JP 2011-222334 A, and the like. Examples of the heat-dissipating (thermally conductive) filler and binder resin described are mentioned. Moreover, as the material for the heat dissipating (thermally conductive) filler, the metal material forming the metal layer described above, the carbon material forming the inorganic material layer, or the like can be used.

  The radiation layer contains a surfactant, a heat stabilizer, a dispersant, a flame retardant such as a metal hydrate, a silane coupling agent, a curing agent such as isocyanate, and an additive such as microsilica depending on the type. May be.

  The radiation layer preferably has a function other than the radiation function by selecting a material constituting the radiation layer or adding a material capable of exhibiting a desired function to the material constituting the radiation layer. This is because the radiation layer can further improve the heat radiation function of the heat radiation structure and can have an additional function. Examples of the function include an antistatic function, a self-cleaning function, a water absorption function, a protection function, a reflection and a heat shielding function, and the like.

(Antistatic function)
Since the radiation layer has an antistatic function, it can prevent adhesion of dust and dirt due to generation of static electricity, and can maintain a heat dissipation function.
This function can be imparted, for example, by adding an antistatic agent to the material of the radiation layer. Examples of the antistatic agent include metals such as aluminum, gold, silver, copper, and nickel, metal oxides such as tin oxide, indium oxide, and tin oxide-doped indium oxide (ITO), graphite, and the like.
Moreover, this function can be provided by adding a conductive polymer to the material of the radiation layer. Examples of the conductive polymer include conventionally known materials. For example, a conductive polymer described in JP 2014-197210 A can be used.

(Protection function)
The radiation layer can further improve surface properties such as weather resistance and durability by having a protective function. This function is given by using, for example, a fluororesin, a urethane resin, a melamine resin, an acrylic resin, or a silicone resin as a resin material included in the radiation layer, or adding these resins to a resin material constituting the radiation layer. It is possible.

(Self-cleaning function)
Since the radiation layer has a self-cleaning function, self-cleaning can be developed, and deterioration of the heat dissipation function due to adhesion of dirt can be suppressed. This function can be imparted by, for example, a method of using titanium oxide as a material constituting the radiation layer or adding titanium oxide to a resin material included in the radiation layer.

(Water absorption function)
The radiation layer has a water absorption function.For example, when the ambient temperature around the cooling structure changes, it absorbs condensed moisture at a low temperature and evaporates the absorbed moisture at a high temperature, thereby reducing its heat of vaporization. By utilizing this, the temperature rise of the cooled object can be suppressed.
This function uses, for example, various water-absorbing resins such as polymers obtained by polymerizing water-soluble monomers such as polyvinyl alcohol and polyethylene glycol as the resin material constituting the radiation layer, or these resin materials contained in the radiation layer. It can be applied by a method such as adding a water-absorbing resin.

(Reflection and heat shielding function)
Since the radiation layer has a reflection and heat shielding function, the temperature increase of the heat dissipation structure can be suppressed and heat can be radiated with high heat dissipation efficiency even in a high temperature environment. This function can be imparted by, for example, a method of adding white inorganic particles or the like to a resin constituting the radiation layer such as a fluororesin or polyethylene terephthalate using the radiation layer as a metal layer. Examples of white inorganic particles include aluminum hydroxide and titanium oxide.

(Ii) Others The thickness of the radiation layer may be any thickness that does not hinder heat conduction from the heat conduction layer, and can be appropriately set according to the type of the radiation layer. The thickness is preferably 1 μm or more and 150 μm or less, and particularly preferably 20 μm or more and 100 μm or less. If the thickness of the radiation layer is larger than the above range, heat conduction may be hindered and heat dissipation efficiency may be reduced, or the flexibility of the radiation layer and heat dissipation structure may be reduced and shape followability may be reduced. is there.

  The radiation layer preferably has high heat conductivity in addition to heat dissipation. This is because heat reception and heat dissipation from the heat conductive layer can be performed with higher efficiency.

The method for forming the radiation layer can be appropriately selected according to the material constituting the radiation layer.
For example, if the radiation layer is a resin layer or a filler-containing layer, a film is formed using a radiation layer composition containing a resin or a heat-dissipating (heat-conducting) filler, and the film is applied to the heat-conducting layer via an interlayer adhesive layer. If the resin is heat-meltable, such as a method of combining, a method of forming by dry laminating, a method of forming by extrusion laminating, and applying and drying on the heat conductive layer using a coating solution of the radiation layer composition containing the resin And a method of curing the coating layer of the radiation layer composition by irradiating electromagnetic waves such as ultraviolet rays and electron beams.
Further, when the radiation layer is a metal layer or the like, it can be formed using a radiation layer composition containing a metal material by various methods such as a coating method, a spraying method, a printing method, a vacuum deposition method, and a sputtering method. .

Further, as a method for forming the radiation layer, it may be formed by using a commercially available heat radiation coating material containing at least a binder resin and a heat dissipating filler, or a commercially available heat dissipating sheet in which a heat dissipating filler is dispersed in a binder resin. May be used as the radiation layer.
Examples of commercially available heat radiation coating materials include thermal radiation paint PELCOOL (registered trademark) manufactured by Pernox Corporation. Moreover, as a commercially available heat dissipation sheet, Cool Staff (registered trademark) manufactured by Oki Electric Cable Co., Ltd., Thermal radiation sheet manufactured by Pernox Co., Ltd. Black body tape HB-250 manufactured by Percool (registered trademark) Sheet Optex Co., Ltd. Black body manufactured by Lec Co., Ltd. Tape THI-2B-5 and the like are suitable.

(D) Arbitrary layer When the resin part has heat sealability and adhesiveness, the heat dissipation structure is separated from the non-convex part side surface of the resin part and easily peeled from the viewpoint of storage stability and ease of handling. You may have peeling layers, such as a processed film.

  The heat dissipation structure has a reinforcing layer between the heat conduction layer and the radiation layer and between the heat conduction layer and the resin portion in consideration of protection of the heat conduction layer and the strength of the heat dissipation structure. May be. Examples of the reinforcing layer include a polyimide film and a polyethylene terephthalate film.

  Furthermore, the heat dissipation structure may have an interlayer adhesive layer for adhering the layers to each other when the layers are laminated. Although it does not specifically limit as an adhesive agent used for an interlayer adhesive bond layer, In order to suppress inhibition of heat conduction especially, an adhesive agent with high heat conductivity is preferable. About a heat conductive adhesive, a conventionally well-known thing can be used.

(E) Others In the heat dissipation structure, the fin side surface may be an uneven surface. By making the fin part side surface of the heat dissipation structure an uneven surface, the heat transfer area can be further increased by the unevenness of the surface in addition to the heat transfer area by the fin part, so it can exhibit a higher heat dissipation function Because it can.
When the fin part side surface is an uneven surface, if the outermost layer on the fin part side of the heat dissipation structure is a heat conduction layer, it means that the heat conduction layer surface is uneven, and the radiation layer is the outermost layer. In some cases, the surface of the radiation layer is uneven. The shape of the unevenness is not particularly limited, and is provided with a pitch width of about several mm to several tens mm.
Examples of a method for providing unevenness on the fin-side surface of the heat dissipation structure include embossing.

(2) Second Aspect The second aspect of the heat dissipation structure according to the present invention (hereinafter sometimes referred to as “this aspect” in this section) is an aspect that does not have the resin portion of the first aspect described above. . That is, this aspect includes a flat base portion and a plurality of fin portions formed to protrude from one surface of the base portion at a predetermined interval. The heat dissipation structure includes a heat conductive layer. And a flexibility-imparting layer formed on one surface of the heat conduction layer, and the fin portion is formed on the side of the heat conduction layer on which the flexibility-giving layer is formed. Opposite surfaces are formed facing each other.

The heat conductive layer in this aspect can be the same as that described in the section “(1) First aspect”.
Further, in this aspect, the heat conductive layer alone has flexibility, but the resilience due to the yield elongation is not exhibited, and it is difficult for the fin portion to exhibit the desired flexibility. Since deformation may not occur easily, a laminate having a heat conductive layer and a flexibility-imparting layer is used.
The flexibility imparting layer may be any layer that can impart desired flexibility to the fin portion in combination with the heat conductive layer and can improve the heat dissipation function and the mechanical strength of the fin portion. And the radiation layer and the reinforcing layer described in the section of “(1) First aspect”.

  The heat dissipation structure of this aspect can be formed by bending a laminated body having a heat conductive layer and a flexibility-imparting layer formed on one surface of the heat conductive layer at a desired interval. At this time, the base portion and the fin portion are integrated.

(3) Third Aspect In a third aspect of the heat dissipation structure according to the present invention (hereinafter sometimes referred to as “this aspect” in this section), a plurality of fin portions and a base portion are separate bodies, and at least a plurality of fin portions and base portions are separate bodies. The fin portion has flexibility.

(A) Fin part The fin part in this aspect will not be specifically limited if it has flexibility, For example, the laminated body which has the resin body formed with resin, a resin layer, and a heat conductive layer, or its processed body, A laminate having a heat conductive layer and a flexibility-imparting layer or a processed body thereof can be used as a fin portion. When the fin portion is formed of a laminated body, as illustrated in FIG. 4D, the laminated body may be made upright with respect to the base portion to form the fin portion. Although not shown, one of the outermost layers of the laminated body It is good also considering the processed body formed by making it contact so that the surface may oppose, ie, the processed body formed by folding a laminated body in two, as a fin part.

When the fin portion is a resin body, the resin that forms the resin body may be any resin that can exhibit the desired flexibility, and is described in the section “(1) First aspect (a) Resin portion”. Generally, it can be the same as a resin generally used for a plastic film or a resin molded product having flexibility, such as a cured resin obtained by curing an ionizing ray curable resin, a thermosetting resin, or a thermoplastic resin. The resin body may contain the additive described in the section “(1) First aspect (a) Resin part”.
The mechanical characteristics of the resin body are the same as those described in the section “(1) First aspect (a) Resin part”, and thus the description thereof is omitted here.
The surface of the resin body may be coated with a heat conductive layer, and the surface of the heat conductive layer may be further coated with the radiation layer or any layer described in the section “(1) First aspect”. It may be.

  When the fin portion is a laminated body having a resin layer and a heat conductive layer or a processed body thereof, for each layer of the laminated body, the resin of the second aspect in the section “(1) First aspect (a) Resin part” It can be the same as the resin layer used for forming the portion and the heat conductive layer described in the section “(1) First aspect”. The laminate may have the radiation layer or any layer described in the section “(1) First aspect” on the heat conductive layer.

  When the fin portion is a laminated body having a heat conductive layer and a flexibility-imparting layer or a processed body thereof, for each layer of the laminated body, the items of “(1) First aspect” and “(2) Second aspect” It can be the same as the heat conductive layer and the flexibility-imparting layer described in 1.

  In this aspect, the fin portion is usually formed on the base portion via the fixing portion. The presence or absence of flexibility of the fixing part is not particularly limited, and can be set as appropriate according to the material. Examples of the fixing portion include a fixing portion, a rubber member, solder, brazing, a mechanical holding member such as caulking, crimping fin, and the like described in the section “D. Form of cooling structure” described later.

(B) Base part The base part in this aspect does not ask | require the presence or absence of flexibility. Examples of the base include sheets and plates made of a resin material, a metal material, a carbon material, and the like, and various laminates used for forming the fin portion of this aspect.

As a resin material used for the base, for example, if the base has flexibility, a material similar to the resin material of the fin portion can be used. Moreover, if it is a rigid base part, a conventionally well-known engineering plastic etc. can be used. The base may contain the additive described in the section “(1) First aspect (a) Resin part”. Further, the surface of the base formed of the resin material may be covered with a heat conductive layer, and further, the surface of the heat conductive layer may be covered with a radiation layer or an arbitrary layer.
The thickness of the base portion made of the resin material is the same as the thickness of the flat portion of the resin portion in the section “(1) First aspect”.

As the metal material used for the base, a metal having excellent thermal conductivity can be used, and examples thereof include copper, copper alloy, aluminum, aluminum alloy, aluminum nitride, alumina, and stainless steel.
Examples of the carbon material used for the base include carbon black, graphene, graphite, carbon nanotube, diamond, and carbon fiber.

  For a base made of a metal material or a carbon material, even if the thickness of the base is large, an increase in heat conduction resistance can be suppressed due to the high thermal conductivity of the material. It is also possible to reduce the thickness and form a sheet. The thickness of the base made of a metal material or a carbon material is preferably, for example, 6.0 μm or more and 20.0 mm or less, and more preferably 50.0 μm or more and 10.0 mm or less.

B. Cooling body The cooling body in the present invention is disposed on one surface side of the heat dissipation structure so as to be in contact with the heat dissipation structure.
The cooling body is a member that normally exhibits a lower temperature than the cooled body when the cooled body and the cooled body are not in contact with the heat dissipation structure.

The cooling body is not particularly limited as long as it is a member that can receive heat from the heat dissipation structure and dissipate heat.
Examples of the cooling body include a member having a higher thermal conductivity than air and a member having a heat dissipation or cooling function. This is because heat conduction from the heat dissipation structure to the cooling body can be effectively performed by using a member having a higher thermal conductivity than air as the cooling body. Further, by using a member having a function of radiating or cooling as the cooling body, the heat radiating structure is cooled to absorb the heat, or the heat conducted from the heat radiating structure to the cooling body is further dissipated to the air. This is because heat can be effectively dissipated.

The member having a higher thermal conductivity than air may be any member other than vacuum or gas, and examples thereof include a plate, a sheet, a molded part, and a liquid made of a resin material or an inorganic material. Moreover, it is good also considering the housing | casing at the time of mounting a to-be-cooled body and a thermal radiation structure in various components as a cooling body.
As a material constituting a member having a higher thermal conductivity than air, among others, a thermally conductive resin in which an additive such as metal powder or graphite is dispersed in a resin, a carbon material such as a fiber reinforced plastic, graphite, or a carbon nanotube, A material exhibiting high thermal conductivity such as metal is preferred.

  On the other hand, the member having a heat dissipation or cooling function may be a member that cools the heat dissipation structure and absorbs heat, or a member that dissipates heat conducted from the heat dissipation structure into the air. Specific examples include conventionally known heat pipes, heat sinks, heat diffusion sheets, cooling fans, coolers, cooling pipes, heat exchangers, Peltier elements, heat pumps, cooling channels, and the like.

  The cooling body preferably has a high emissivity. The emissivity of the cooling body can be the same as that of the above-described radiation layer.

  As the cooling body, a single member may be used, or a plurality of members may be used in combination. For example, the heat dissipation structure and the heat diffusion sheet that is the first cooling body may be in contact with each other, and the heat diffusion sheet may be in contact with the housing that is the second cooling body.

  When the cooling body is disposed on the fin portion side surface of the heat dissipation structure, the cooling body may be individually disposed for each fin portion, and the single cooling body is disposed so as to contact each fin portion. May be.

C. Cooled object The cooled object in the present invention is disposed on the other surface side of the heat dissipation structure so as to be in contact with the heat dissipation structure.
The cooled body is a member that normally exhibits a higher temperature than the cooled body when the cooled body and the cooled body are not in contact with the heat dissipation structure.

The object to be cooled is not particularly limited as long as it retains heat and needs to be dissipated, and has a heat source that generates a large amount of heat when performing a desired function, or itself does not generate heat. Examples include those that retain heat by receiving heat from other members having a heat source.
When the object to be cooled has a heat source, examples of the heat source include an LED element, an organic EL element, a solar cell element, a solid-state imaging element, a semiconductor element, and the like, circuit components, and the like. Specific examples of each element can be the same as those of conventionally known elements.

Examples of the object to be cooled include a large-scale integrated circuit (LSI) such as a CPU, an image processing chip, and a memory, a power device, an element substrate such as a solar cell substrate, a liquid crystal, a plasma display (PDP), an LED, and an organic EL display device An element substrate, a power unit, a power semiconductor module, an intelligent power module, an inverter, a solar battery cell, a solar battery module, etc. used for a display device such as the above.
In addition, the to-be-cooled body may have arbitrary members according to the kind of to-be-cooled body.

  When the object to be cooled is arranged on the fin part side surface of the heat dissipation structure, the object to be cooled may be arranged individually for each fin part, and a single object to be cooled contacts the top of each fin part. It may be arranged as follows.

D. Form of cooling structure As a form of the cooling structure of the present invention, a cooling body is disposed on one surface side of the heat dissipation structure so as to be in contact with the heat dissipation structure, and on the other surface side of the heat dissipation structure, The object to be cooled is disposed so as to be in contact with the heat dissipation structure, and the cooling body or the object to be cooled may be in contact with the tops of the plurality of fin portions of the heat dissipation structure.
Especially in this invention, it is preferable that the said cooling body is in contact with the top part of several said fin part. This is because the heat receiving area can be increased by allowing the non-fin portion side surface of the heat dissipation structure to contact the object to be cooled, and more heat can be conducted and dissipated. In addition, since the top of the fin portion and the cooling body are in contact with each other, in addition to heat dissipation by the fin portion, heat conduction to the cooling body through the fin portion enables heat dissipation from the cooling body, and a higher heat dissipation effect is achieved. Because it can be obtained.

The top of the fin part and the cooling body or the object to be cooled are in direct contact with each other, for example, as shown in FIG. 1, the fin part 12 is in direct contact with the surface of the cooling body 2 or the body 3 to be cooled at the top. Alternatively, the top side of the fin portion may be bent, and the bent portion including the top portion may be in direct contact with the surface of the cooling body or the object to be cooled. Moreover, the top part of a fin part and the cooling body or to-be-cooled body may be directly contacting by fitting the top part of a fin part in the groove part formed in the surface of a cooling body or a to-be-cooled body. 7 is a schematic cross-sectional view showing an example of the form of the cooling structure of the present invention. FIG. 7A shows that the top side of the fin portion 12 is bent, and the bent portion C including the top portion is the surface of the cooling body 2. FIG. 7B illustrates an embodiment in which the top portion of the fin portion 12 is fitted into the groove-shaped groove portion R formed on the surface of the cooling body 2. FIG. 7 illustrates the form of the cooling structure when a lateral shift occurs in the cooled object and the cooling body due to vibration or the like.
The groove formed on the surface of the cooling body or the object to be cooled may be formed in a concave shape with respect to the surface, and a plurality of convex portions are formed on the surface, and the gap between the convex portions is formed. It may be a groove. Specifically, a shape capable of fitting and fixing the entire top portion of the fin portion 12 as shown in FIG. 7B, and a mountain in which a part of the top portion of the fin portion 12 shown in FIG. 8A can be fitted. There are mold shapes. Further, as shown in FIG. 8B, the surface of the cooling body or the body to be cooled is an uneven surface having an arc-shaped convex portion formed so as to protrude from the surface, and between the convex portions. It is also possible to make the recessed part located into a groove part. The groove portions shown in FIGS. 8A and 8B can improve the contact area with the fin portions.

Moreover, the top part of a fin part may be in contact with the surface of the cooling body 2 or the to-be-cooled body 3 through the fixing | fixed part 13, as shown in FIG. The contact area between the top of the fin part and the surface of the cooling body or the body to be cooled can be increased by passing through the fixing part, and heat receiving from the body to be cooled and heat conduction to the cooling body can be performed with high efficiency. Because you can.
Examples of the fixing part include an adhesive layer, an adhesive tape, an adhesive gel layer, and a grease layer.
Examples of the adhesive constituting the adhesive layer include silicone adhesives, rubber adhesives, epoxy adhesives, acrylic adhesives, acrylate adhesives, urethane adhesives, olefin adhesives, and the like. .
The adhesive tape usually has an adhesive layer formed on a substrate. Examples of the material of the base material include polyolefin resin, ethylene-vinyl acetate copolymer, polyester resin, polycarbonate resin, polyimide resin, polyether resin, polyamide resin, polyphenylene sulfide, ionomer resin, and fluorine resin. Resin materials such as vinyl chloride resin, cellulose resin, and silicone resin, paper, glass fiber, metal foil, and the like. Moreover, as an adhesive which comprises an adhesive layer, the adhesive which comprises said adhesive bond layer can be used.
Examples of the material for the adhesive gel layer include silicone gel, urethane gel, acrylic gel, polyamide gel, polyvinyl pyrrolidone gel, styrene gel, and vinyl chloride gel.
Examples of the material for the grease layer include silicone grease, fluoroether grease, chemically synthesized oil grease, petroleum hydrocarbon grease, and water-soluble grease typified by carboxymethyl cellulose.

  The fixing portion may include an arbitrary material such as a metal particle, an inorganic particle, a carbon material such as carbon particle or carbon fiber, etc., in order to improve thermal conductivity.

  As shown in FIG. 9A, the fixing portion 13 may be provided for each top portion of the fin portion 12, and as shown in FIG. One fixed portion 13 may be formed. In addition, FIG. 9 illustrates the form of the cooling structure when a lateral shift occurs in the cooled object and the cooling body due to vibration or the like.

  The non-fin part side surface of the heat dissipation structure may be in direct contact with the object to be cooled or the cooling body, or may be in contact with the above-described fixing part.

  Moreover, when the non-fin part side surface of a heat radiating structure and a cooling body contact directly, the base and cooling body of a heat radiating structure may be integrated. That is, the same structure in which the base functions as a cooling body may be used.

The cooling structure of the present invention may be an open system as shown in FIG. 1 and, as illustrated in FIG. 3 may be a closed system. According to the present invention, as shown in FIGS. 10A to 10C, even when the opening O of the casing that is the cooling body 2 is small, the fin portion of the heat dissipation structure 1 has flexibility. Therefore, the heat dissipating structure 1 is arranged on the body 3 to be cooled, and is inserted from the frontage O in a state where the fin portion is inclined toward the base side, and the inclination is caused by the restoring force of the fin portion itself inside the housing 2. By changing, it becomes possible to set it as the arrangement | positioning which the top part of the fin part and the cooling body 2 contacted.
FIG. 10 is an explanatory diagram for explaining another example of the cooling structure of the present invention and a method for forming the cooling structure. In FIG. 10, reference numerals of the fin portion and the base portion are omitted.

  The distance between the object to be cooled and the cooling body is not particularly limited as long as one of the object to be cooled or the cooling body is in contact with the top of the fin portion and the other is in contact with the surface on the non-fin portion side. It can be appropriately designed according to the size of the heat dissipation structure, the use of the cooling structure, and the like.

E. Applications The cooling structure of the present invention can be suitably used as an object in any field having a portion that becomes hot during operation or operation. For example, it can be used as a cooling structure for an arithmetic device, an image processing device, an image display device, illumination, a power unit, a solar power generation unit, a communication device, an air conditioning device, a manufacturing device, a transportation device, and the like.

F. Another aspect of the cooling structure of the present invention In the cooling structure of the present invention, in addition to the above-described aspect, the fin portion itself of the heat dissipation structure does not have flexibility defined by the above-described mechanical characteristics. The fin part may be flexible so that the fin part can be inclined with respect to the surface of the base part with the fixing part as a starting point by the fixing part that fixes the part to the base part.
That is, another aspect of the cooling structure of the present invention (hereinafter sometimes referred to as “this aspect” in this section) includes the heat dissipation structure and the heat dissipation structure on one surface side of the heat dissipation structure. A cooling body disposed so as to be in contact with the heat sink, and a cooled body disposed so as to be in contact with the heat dissipation structure on the other surface side of the heat dissipation structure. The body has a flat base, a plurality of fixing parts formed on one surface of the base part at a predetermined interval, and a plurality of fin parts arranged on the plurality of fixing parts. The plurality of fixing portions fix the fin portions such that the fin portions can be inclined with respect to the surface of the base portion with the fixing portion as a starting point. It is in contact with the tops of the plurality of fins of the heat dissipation structure. It is an.

11 (a) and 11 (b) are schematic cross-sectional views showing an example of another aspect of the cooling structure of the present invention. FIG. 11 (b) shows a lateral shift in the cooling structure shown in FIG. 11 (a). FIG.
The cooling structure 10 of this aspect is disposed so as to be in contact with the heat dissipating structure 1, the cooling body 2 disposed so as to be in contact with one surface side of the heat dissipating structure 1, and the other surface side of the heat dissipating structure 1. The to-be-cooled body 3 is provided.
The heat dissipating structure 3 includes a flat base 11, a plurality of fixing portions 14 formed on one surface of the base 11 at a predetermined interval, and a plurality of fins disposed on the plurality of fixing portions 14. Part 12. The plurality of fixing portions 14 fix the fin portions 12 so that the fin portions 12 can be inclined with respect to the surface of the base portion 11 with the fixing portion 14 as a starting point.
In the cooling structure 10 illustrated in FIGS. 11A and 11B, the cooling body 2 is disposed in contact with the tops of the plurality of fin portions 12 of the heat dissipation structure 1, and the object to be cooled 3 has the heat dissipation structure. It arrange | positions in contact with the surface facing the surface in which the fin part 12 of the body 1 was formed.

  In this aspect, “the fin portion has flexibility” means that the fin portion can be tilted with respect to the surface of the base portion from the fixed portion, thereby producing the effects of the present invention described above. Is possible.

  In this aspect, the details of the cooling structure other than the heat dissipation structure can be the same as those described above. Hereinafter, the structure of the heat dissipation structure of this aspect will be described.

1. Fixing part The fixing part fixes the fin part so that the fin part can be inclined with respect to the surface of the base part from the fixing part. Therefore, in this embodiment, the fixed portion has the mechanical characteristics of the fin portion described in the section “A. Heat Dissipation Structure”.

  The fixing part preferably has the above-described mechanical characteristics and exhibits high thermal conductivity. For example, the fixing part, rubber member, and urethane resin described in the above-mentioned section “D. Form of cooling structure” A member, an olefin resin member, a silicone resin member, a fluororesin member, or the like can be used.

  For the shape, width, thickness, etc. of the fixing part, the fin part is fixed so that it has a desired mechanical strength and the fin part can be inclined with respect to the surface of the base part from the fixing part. If possible, it is not particularly limited, and can be set as appropriate.

  The fixing part has the same mechanical characteristics as the fin part described in the section of “A. Heat dissipation structure” because the fin part can be inclined with respect to the surface of the base part starting from the fixing part. It is. If the yield elongation of the fixed part is smaller than the specified range, yielding occurs immediately upon bending and the flexibility of the fixed part is impaired, so the fin part can be inclined through the fixed part to a desired angle. In some cases, the fins cannot be installed at a predetermined interval, or the cooling structure may be damaged when an external impact or the like is applied.

2. Fin part The fin part in this aspect is arrange | positioned on the said several fixed part. In this embodiment, the fin portion does not have the mechanical characteristics described in the section “A. Heat dissipation structure”.
The shape, size, pitch, and other details of the fin portion can be the same as the shape, size, pitch, and other details of the fin portion described in the section “A. Heat Dissipation Structure”. .

As a fin part, what is necessary is just what does not have flexibility, for example, the fin made from resin, the fin made from a metal, the fin made from a ceramic, the fin made from a carbon sheet etc. are mentioned.
Examples of the resinous fin include a rigid molded body formed of a conventionally known engineering plastic or the like. The resinous fin may contain any additive having high thermal conductivity described in the section “A. Heat dissipation structure 3. Aspect of heat dissipation structure”.
Further, the surface of the resin fin may be covered with a heat conductive layer, and an arbitrary layer may be formed on the heat conductive layer. The heat conductive layer and the optional layer are the same as the contents described in the section “A. Heat Dissipation Structure 3. Aspect of Heat Dissipation Structure”, and thus the description thereof is omitted here.

  On the other hand, the metal fin may be formed of a metal material having excellent thermal conductivity, such as aluminum and stainless steel, used for a general cast product heat dissipation structure.

  As the ceramic and the carbon sheet used for the ceramic fin and the carbon sheet fin, those formed of a conventionally known material can be used. The surface of these fins may be covered with a heat conductive layer, and a radiation layer or an arbitrary layer may be formed on the heat conductive layer.

  When the fin portion has a heat conductive layer or the like formed on the surface or is a metal fin, the fin portion surface may be a rough surface, or a metal oxide film may be formed on the surface. The reason for this is the same as the reason described in the section “A. Heat Dissipation Structure 3. Aspect of Heat Dissipation Structure”, and the description here is omitted.

3. Base As the base, it is preferable to have thermal conductivity, and the presence or absence of flexibility does not matter. About a base, it can be made to be the same as that of the base demonstrated by the term of "A. Heat dissipation structure 3. Aspect of heat dissipation structure (3) 3rd aspect", for example.

II. Cooling component The cooling component of the present invention has a flat base portion and a plurality of fin portions formed to protrude from one surface of the base portion at a predetermined interval, and the plurality of fin portions are A heat dissipation structure having flexibility, and a cooling body arranged so as to be in contact with the tops of the plurality of fin portions of the heat dissipation structure.

  FIG. 12 is a schematic sectional view showing an example of the cooling component of the present invention. The cooling component 20 of the present invention includes the heat dissipating structure 1 and the cooling body 2 disposed in contact with the tops of the plurality of fin portions 12 of the heat dissipating structure 1. The heat dissipating structure 1 includes a flat base 11 and a plurality of fin portions 12 formed to protrude from one surface of the base 11 at a predetermined interval. It has flexibility.

According to the present invention, since the cooling component has such a structure, it can be disposed on the body to be cooled to form a sandwich type cooling structure. As a result, heat from the radiator is conducted to the cooling body through the heat radiating structure, and in addition to heat dissipation by the fins of the heat radiating structure, heat from the cooled body is increased by heat conduction to the cooling body. Heat can be dissipated efficiently.
Further, in the heat dissipation structure, since the fin portion has flexibility, the cooling component of the present invention is retrofitted into a desired space in which the object to be cooled is disposed to form a sandwich type cooling structure. However, the fin portions can be bent or inclined according to the space interval, and the degree of freedom in designing the cooling structure can be improved.
Further, after the cooling component of the present invention is arranged on the cooled body, even when the interval between the cooled body and the cooled body changes due to vibrations or when a lateral shift occurs, the change in the spacing or the lateral shift direction occurs. By following the bending of the fin portion or changing the inclination angle of the fin portion, it is possible to prevent the cooling structure from being damaged and the like and to have impact resistance.

  About the cooling component of this invention, except the point which does not have a to-be-cooled body, and the point limited to the aspect arrange | positioned so that a cooling body may contact | connect the top part of the fin part of a thermal radiation structure, it is "I. Since it can be the same as that described in the section of “Cooling structure”, the description is omitted here.

  Further, as another aspect of the cooling component of the present invention, the heat dissipation structure described in the section of “I. Cooling structure F. Other aspect of the cooling structure of the present invention” and the plurality of fin portions of the heat dissipation structure are provided. It can also be set as the aspect which has the cooling body arrange | positioned so that it may contact | connect a top part.

  The cooling component of the present invention becomes hot during operation and operation, and can be suitably used for objects in all fields that require heat dissipation. For example, a light emitting element such as a CPU, an image processing chip, a memory, a semiconductor element used in a large scale integrated circuit (LSI), a power device, a solar cell substrate, a liquid crystal, a plasma display (PDP), an LED, an organic EL element, etc. Since the electronic device has heat generated from the element during operation or operation, the heat radiation function according to the present invention is exhibited by arranging the cooling component of the present invention in the element.

  The cooling component of the present invention can be suitably used as a cooled object that can be taken in and out of the casing and a component that cools the cooled object disposed in the casing. Even if the front / outlet for cooling parts is small, the fin part is tilted to the base side during insertion, and the cooling part is brought into contact with the body to be cooled by using the restoring force of the fin part after insertion. This is because the cooling component can be fixed in contact with the inner wall of the casing.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

  Hereinafter, the present invention will be specifically described with reference to examples.

  A heat dissipating structure and a cooling structure including the heat dissipating structure were produced by the following method. Table 1 shows the details of the fins of the heat dissipation structure produced in each example. In addition, the yield elongation of the fin part in an Example and a comparative example was measured by the tension test method based on JISK7160-7164 using the tensilon RTC-1250A by A & D company.

[Example 1]
(Production of heat dissipation structure)
A white polyethylene terephthalate film (emissivity 0.80, hereinafter referred to as “white PET film”) having a thickness of 50 μm as a radiation layer is used, and a urethane polyol system manufactured by Rock Paint is used on the surface of the white PET film. After the adhesive is applied to a dry film thickness of 7 μm, it is dry-laminated on a 40 μm aluminum foil, which is a heat conductive layer, to produce a laminate composed of white PET film (radiation layer) / aluminum foil (heat conductive layer). did. Next, the laminate is cut to 25 mm × 38 mm to produce a plurality of cut pieces, and a region 5 mm from one long side of each cut piece is bent so that the white PET film is a valley surface. Thus, a fixed white was formed to form a fin portion.
Next, with the laminated body separately prepared as a base, the white PET film surface of the laminated body and the fixing white of each fin part are passed through a heat conductive tape (SLION TAPE manufactured by Hitachi Maxell Co., Ltd.) while keeping a predetermined interval. And pasted. Thereby, the heat radiating structure of the 3rd aspect whose base and fin part are separate bodies was obtained. The fin portion of the heat dissipation structure was a plate having a height of 20 mm, a length of 38 mm, and a width of 97 μm, and a pitch of 10 mm. Further, the yield elongation of the fin portion was 4%. Then, the heat dissipation structure was cut so as to have a shape of 38 mm length × 38 mm width in plan view.

(Production of cooling structure)
A heat-dissipating structure is mounted on a 2.0 mm thick, 50 mm square aluminum plate (emissivity 0.09, manufactured by Toyo Aluminum Co., Ltd., A1050) as a body to be cooled via a heat conductive tape (Hitachi Maxell Co., Ltd. SLION TAPE) Attached. Next, a 50 mm × 100 mm square anodized aluminum plate (emissivity 0.75) is used as a cooling body through a heat conductive tape so as to be parallel to the object to be cooled at a position 10 mm away. The fin portion of the body was pressed and arranged, and the fin portion of the heat dissipation structure and the cooling body were fixed to obtain a heat dissipation structure.

(Preparation of evaluation sample S1)
The said cooling body of the obtained said heat radiating structure was moved to the position 19 mm away from the to-be-cooled body, and it was set as sample S1 for evaluation.

[Example 2]
A cooling structure and an evaluation sample S2 were obtained in the same manner as in Example 1 except that the heat dissipation structure was obtained by the following method.
(Production of heat dissipation structure)
The laminated body produced in Example 1 was subjected to mountain fold processing a plurality of times by hand folding with a white PET film as an outer surface, with a desired interval, and the mountain fold portion was used as a fin portion. Thereby, the heat dissipation structure of the 2nd mode with which a base and a fin part were united was obtained. The fin portion of the heat dissipation structure was a plate having a height of 20 mm, a length of 38 mm, and a width of 194 μm, and a pitch of 10 mm. Further, the yield elongation of the fin portion was 4%.

[Example 3]
A cooling structure and an evaluation sample S3 were obtained in the same manner as in Example 2 except that the heat dissipation structure was obtained by the following method.
(Production of heat dissipation structure)
On the aluminum foil surface of the laminate produced in Example 1, a urethane polyol adhesive manufactured by Rock Paint was applied in a dry film thickness of 7 μm, and then a 80 μm thick Mitsubishi resin polypropylene film was overlaid as a resin layer. In addition, a laminate composed of white PET film (radiation layer) / aluminum foil (heat conduction layer) / polypropylene film (resin layer) was produced.
The laminated body was subjected to mountain fold processing a plurality of times by hand folding with a desired interval so that the white PET film became the outer surface, and the mountain fold portion was used as a fin portion. Thereby, the heat dissipation structure of the 1st aspect with which a base and a fin part are united was obtained. The fin portion of the heat dissipation structure was a plate having a height of 20 mm, a length of 38 mm, and a width of 368 μm, and a pitch of 10 mm. Further, the yield elongation of the fin portion was 5%.

[Example 4]
A cooling structure and an evaluation sample S4 were obtained in the same manner as in Example 3 except that the heat dissipation structure was obtained by the following method.
(Production of heat dissipation structure)
After the mountain fold process of the laminate was performed several times in Example 3, the mountain fold part was crimped in the width direction by heat sealing, and the opposing surfaces of the resin layer located in the mountain fold part were integrated to form a fin part. did. Thereby, the heat dissipation structure of the 1st aspect with which a base and a fin part are united was obtained. The fin portion of the heat dissipation structure was a plate shape having a height of 20 mm, a length of 38 mm, and a width of 368 μm, and a pitch of 10 mm. Further, the yield elongation of the fin portion was 5%.

[Comparative Example 1]
A cooling structure in which the same cooling body as in Example 1 is disposed at a position 19 mm away from the cooled body without providing a heat conductive tape and a heat dissipation structure on the cooled body used in Example 1 (for both evaluation and evaluation) Sample S5) was obtained.

[Comparative Example 2]
The cooling structure is the same as in Example 1 except that the cooling body is arranged at a position 21 mm away from the body to be cooled and the top of the fin portion of the heat dissipation structure is not in contact with the cooling body. (Sample for evaluation S6) was obtained.

[Comparative Example 3]
The cooling structure is disposed in the same manner as in Example 2 except that the cooling body is arranged at a position 21 mm away from the body to be cooled and the top of the fin portion of the heat dissipation structure is not in contact with the cooling body. A sample S7) for cum evaluation was obtained.

[Comparative Example 4]
The cooling structure is arranged in the same manner as in Example 3 except that the cooling body is arranged at a position 21 mm away from the body to be cooled and the top of the fin portion of the heat dissipation structure is not in contact with the cooling body. A sample S8) for cum evaluation was obtained.

[Comparative Example 5]
The cooling structure is arranged in the same manner as in Example 4 except that the cooling body is arranged at a position 21 mm away from the body to be cooled and the top of the fin portion of the heat dissipation structure is not in contact with the cooling body. A sample for simultaneous evaluation S9) was obtained.

[Comparative Example 6]
The heat sink 40 of the aluminum cast product illustrated in FIG. 13 was used as the heat dissipation structure. 13A is a schematic plan view of the heat sink 40, and FIG. 13B is a cross-sectional view taken along line AA of FIG. 13A. The heat sink of the cast aluminum product is 38SQ38H20WA manufactured by Mitutoh Chemical Co., Ltd., length 38 mm × width 38 mm, base height Hb = 4 mm, fin portion 41 height Hr = 16 mm, pitch in the X-axis direction PPrx = 2 mm, Y The pitch Pry in the axial direction was 2 mm. The heat sink 40 was anodized and had an emissivity of 0.80. In addition, the yield elongation of the fin part was less than 1% (measurement impossible).

(Production of cooling structure)
In the same manner as in Example 1, a heat radiating structure was attached on the object to be cooled. Next, the cooling body used in Example 1 is arranged by being pressed against the fin portion of the heat dissipation structure via the heat conductive tape so as to be parallel to the object to be cooled at a position 10 mm away from the cooling target. The cooling structure (evaluation sample S10) was obtained by fixing the part and the cooling body. At this time, the fin portion of the heat sink was bent by a machine so that the cooling body could be arranged at a desired position.

[Evaluation 1]
(Cooling structure shape maintainability by changing distance between cooling body and heat dissipation structure)
About evaluation sample S1-S4 obtained in Examples 1-4, it was confirmed whether the shape of the cooling structure was maintained after the movement of the said cooling body.
For the cooling structure (evaluation sample S10) obtained in Comparative Example 6, the cooling body is moved to a position 19 mm away from the body to be cooled, and the shape of the cooling structure is maintained after the cooling body is moved. I checked.
○ in which the contact between the cooling body and the fin portion is maintained and the shape of the cooling structure is maintained; ○, the contact between the cooling body and the fin portion is eliminated, and the shape of the cooling structure is not maintained Was marked with x. The results are shown in Table 1.

[Evaluation 2]
(Heat dissipation efficiency)
For the samples S1 to S9 for evaluation of the cooling structure obtained in the examples and comparative examples, the heat dissipation efficiency is measured by the following method using the simple evaluation device illustrated in FIG. 14, and the temperature difference from the reference is calculated. did.
The simple evaluation device 30 was heated by applying a current 1.8 A and a voltage 2.1 V to the heat source 31 from the heating power source 35. An evaluation sample S (cooling structure 10) was attached to one surface of the heat source 31 via a heat conductive tape 32 (SLION TAPE manufactured by Hitachi Maxell). Further, a thermocouple 34 is attached to the other surface of the heat source 31 via a heat conductive tape 32, and an electromotive force generated by the thermocouple is recorded in a recording device 37 via a data recorder 36 and measured after being left for 60 minutes. The value was converted to temperature. The heat source generated 3.8 W of heat and the temperature alone reached 75 ° C.
FIG. 14 shows a measurement example of the heat radiation efficiency of the evaluation samples S1 to S4 of Examples 1 to 4. Moreover, although not shown in figure, in the comparative example 1, it measured in the state which has arrange | positioned the cooling body 2 and the to-be-cooled body 3 apart, without arrange | positioning the thermal radiation structure 1 in FIG. About Comparative Examples 2-5, it measured in the state which has arrange | positioned the fin part of the thermal radiation structure 1 in FIG. 14, and the cooling part 2 apart. The calculation of the temperature difference was based on the heat dissipation efficiency of the evaluation sample of Comparative Example 1. The results are shown in Table 1.

From the results shown in Table 1, it became clear that the cooling structures of Examples 1 to 4 exhibited an excellent heat dissipation function due to the effect of heat dissipation by heat conduction as compared with the cooling structures of Comparative Examples 2 to 5. It can be said that this is because the cooling structures of Examples 1 to 4 have a sandwich structure in which the fin portion of the heat dissipation structure and the cooling body are in contact with each other.
Moreover, in the cooling structure using the heat sink of the aluminum casting product in which a fin part does not have flexibility (comparative example 6), when the distance of a cooling body and a heat radiating structure changes, it contacts by plastic deformation of a heat radiating structure. It could not be maintained, and the heat dissipation effect due to heat conduction could not be obtained.

DESCRIPTION OF SYMBOLS 1 ... Radiation structure 2 ... Cooling body 3 ... Cooling body 10 ... Cooling structure 11 ... Base part 12 ... Fin part 13, 14 ... Fixed part 20 ... Cooling component 21 ... Resin part 21A ... Protruding part 21B ... Flat part 22 ... Heat Conductive layer

Claims (6)

A heat dissipating structure;
A cooling body disposed on one surface side of the heat dissipation structure so as to be in contact with the heat dissipation structure;
On the other surface side of the heat dissipation structure, a body to be cooled disposed so as to be in contact with the heat dissipation structure;
A cooling structure having
The heat dissipation structure has a flat base portion and a plurality of fin portions formed to protrude from one surface of the base portion at a predetermined interval.
The plurality of fin portions are flexible.
The cooling structure or the cooled object is in contact with the tops of the fin portions of the heat dissipation structure.   The cooling structure according to claim 1, wherein the plurality of fin portions and the base portion are integrated. The heat dissipation structure has a resin portion made of a resin material and a heat conductive layer formed on one surface of the resin portion,
The resin portion includes a flat portion, and a plurality of convex portions formed at a predetermined interval so as to protrude to the side of the flat portion where the heat conductive layer is formed,
The cooling structure according to claim 2, wherein the flat portion and the plurality of convex portions are integrated.   The cooling structure according to claim 3, wherein the plurality of convex portions are formed so that a surface of the resin portion on a side opposite to the side on which the heat conductive layer is formed is opposed.   The cooling structure according to any one of claims 1 to 4, wherein the cooling body is in contact with top portions of the plurality of fin portions. A flat base;
A plurality of fin portions formed to protrude from one surface of the base portion at a predetermined interval;
A plurality of the fin portions, a heat dissipation structure having flexibility, and a cooling body arranged so as to be in contact with the tops of the plurality of fin portions of the heat dissipation structure,
Having cooling parts.