CN109104841A - Thermal conduction plate with electro-magnetic screen function - Google Patents
Thermal conduction plate with electro-magnetic screen function Download PDFInfo
- Publication number
- CN109104841A CN109104841A CN201710472695.7A CN201710472695A CN109104841A CN 109104841 A CN109104841 A CN 109104841A CN 201710472695 A CN201710472695 A CN 201710472695A CN 109104841 A CN109104841 A CN 109104841A
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- China
- Prior art keywords
- thermal conduction
- conduction plate
- integrated structure
- plate body
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
Abstract
Thermal conduction plate with electro-magnetic screen function, the heat for runaway electron element.Thermal conduction plate has capillary structure, support construction and working fluid, and thermal conduction plate also includes extension and shielding frame, and extension extends from thermal conduction plate and has the first integrated structure.Shielding frame has side wall to surround electronic component in the plane, and the second integrated structure is configured at side wall, and the first integrated structure is sticked in the second integrated structure so that thermal conduction plate removably overlay electronic element, to execute electro-magnetic screen function.Using the thermal conduction plate with electro-magnetic screen function of the invention in addition to its excellent in heat dissipation effect, the function that can prevent Electromagnetic Interference is had both.It is loaded onto group, the structure of thermal conduction plate is easy to combine, and making, upper process is simple, significantly reduces manufacturing cost.Increase the value of thermal conduction plate or electromagnetic interference shield shell.
Description
[technical field]
A kind of thermal conduction plate, espespecially a kind of thermal conduction plate with electro-magnetic screen function.
[background technique]
General-purpose computer, intelligent running gear or other electronic devices on the market, inside installing there are many electronic component, because
This can generate a large amount of heat when electronic device operates, these accumulate in the heat inside electronic device can not easily outward
Dissipation, so that electronic component rapid wear, reduction operational effectiveness.The existing way for improving above-mentioned phenomenon is inside electronic device
It is additionally configured with thermal conduction plate (temperature-uniforming plate), wherein to require up to sealing and heat biography etc., so that manufacturing cost is high.
On the other hand, electronic component can also generate electromagnetic field in running, and each electronic component electromagnetic field can interfere with each other,
And then influence the normal operation of electronic equipment, as EMI (Electro Magnetic Interference, Electromagnetic Interference).
Prevent the existing way of Electromagnetic Interference just like directly the outside of electronic component plus appropriate electromagnetism mask to shield electromagnetic wave,
Electromagnetism mask is usually metal material, and sheet metal component can be used and largely manufacture and assemble automatically, low in cost because of technology maturation, because
Widely industry is adopted for this.
Therefore problem of the present invention is that, how in original processing procedure, increase thermal conduction plate or electromagnetic interference shield shell
Value to reach heat dissipation and effectiveness simultaneously, and simplifies manufacture and assembling procedure, and reduces manufacture and warranty costs.
[summary of the invention]
In view of the above problem, one embodiment of the invention provides a kind of thermal conduction plate with electro-magnetic screen function, for dissipating
Escape electronic component heat and have capillary structure, support construction and working fluid.Thermal conduction plate also includes extension and screen
Frame is covered, extension extends from thermal conduction plate and has the first integrated structure.Shielding frame has side wall in the plane around upper
Electronic component is stated, the second integrated structure is configured at side wall, and the first integrated structure is sticked in the second integrated structure so that thermal conduction plate can
Removably overlay electronic element, to execute electro-magnetic screen function.
Such as above-mentioned thermal conduction plate, in one embodiment, thermal conduction plate also includes covering plate body structure plate body together.Cover plate body tool
There is extension.Structure plate body and covering plate body define chamber jointly to accommodate capillary structure, support construction and working fluid altogether.
Such as above-mentioned thermal conduction plate, in one embodiment, thermal conduction plate also includes covering plate body structure plate body together.Structure plate body tool altogether
There is extension and defines chamber jointly with covering plate body to accommodate capillary structure, support construction and working fluid.
Such as above-mentioned thermal conduction plate, in one embodiment, covering plate body covers total structure plate body in a manner of accommodating, altogether structure plate body
It is situated between shielding frame and covering plate body.
Such as above-mentioned thermal conduction plate, in one embodiment, covering plate body and altogether structure plate body are using same material.
Such as above-mentioned thermal conduction plate, in one embodiment, the first integrated structure is shaped in the inner surface of extension, and second
Integrated structure is shaped in the outer surface of side wall.
Such as above-mentioned thermal conduction plate, in one embodiment, shielding frame has region of taking, and region of taking vertically is prolonged from side wall
It stretches.
Such as above-mentioned thermal conduction plate, in one embodiment, the outer surface of the inner surface of plate body structure plate body together is covered to weld
Layer is fixed together.
Such as above-mentioned thermal conduction plate, in one embodiment, one of the first integrated structure and the second integrated structure are concave
Guide rail, and the other of the first integrated structure and second integrated structure are the bulge-structure for matching concave guide rail.
Such as above-mentioned thermal conduction plate, in one embodiment, one of the first integrated structure and the second integrated structure are hook,
And first the other of integrated structure and the second integrated structure be the catching groove or button hole for matching hook.
Thermal conduction plate provided by each embodiment according to the present invention, except the function of offer heat dissipation, and except its excellent in heat dissipation effect,
Have both the function that can prevent Electromagnetic Interference.In addition to this, it is loaded onto group, the structure of thermal conduction plate is to be easy to combine.In production
Process is simple, can significantly reduce manufacturing cost.Therefore, can be met with the above-mentioned prior art of effective solution the problem of.
Describe detailed features and advantage of the invention in detail in embodiments below, content is enough to make any to be familiar with
Relevant art understands technology contents of the invention and implements accordingly, and according to content disclosed by this specification, apply for a patent
Range and schema, it is any to be familiar with relevant art and be readily understood upon the relevant purpose of the present invention and advantage.
[Detailed description of the invention]
Fig. 1 is the decomposition cut-away view that the first embodiment of the present invention is painted thermal conduction plate.
Fig. 2 is the stereogram exploded view that the first embodiment of the present invention is painted thermal conduction plate.
Fig. 3 is the usage state diagram that the first embodiment of the present invention is painted thermal conduction plate.
Fig. 4 is the usage state diagram that the first embodiment of the present invention is painted thermal conduction plate.
Fig. 5 is the usage state diagram that the first embodiment of the present invention is painted thermal conduction plate.
Fig. 6 is the decomposition cut-away view that the second embodiment of the present invention is painted thermal conduction plate.
Fig. 7 is the decomposition cut-away view that the third embodiment of the present invention is painted thermal conduction plate.
Fig. 8 is the decomposition cut-away view that the fourth embodiment of the present invention is painted thermal conduction plate.
[specific embodiment]
Cooperation diagram and specific embodiments of the present invention below, the present invention is further explained to reach predetermined goal of the invention institute
The technological means taken.It will be appreciated by those skilled in the art that direction provided by specific embodiments of the present invention
Term, upper and lower, left and right, front or rear etc. are only used for the direction referring to alterations with benefit explanation, originally not for limitation
Invention.In addition to this, under without departing from the spirit and scope of the present invention, there is usual knowledge in the technical field of the invention
Person, practicable plurality of change and modification, the implementation example so derived are also fallen in scope.
Fig. 1 to Fig. 2 is please referred to, Fig. 1 is the decomposition cut-away view that thermal conduction plate 100 is painted according to the first embodiment of the present invention,
Using A-A in Fig. 2 as the cut-away view of face line.Fig. 2 is the stereo decomposing that thermal conduction plate 100 is painted according to the first embodiment of the present invention
Figure.Thermal conduction plate 100 is for dissipating the generated heat when electronic component operates, with capillary structure 5, support construction 6
And working fluid (not showing), thermal conduction plate 100 is also comprising extension 11 and shielding frame 4, and extension 11 is from thermal conduction plate 100
Outer wall extend, and on extension 11 have the first integrated structure 111.In one embodiment, extension 11 can also be from thermal conductivity
The internal stretch of plate 100 please be detailed in the explanation of aftermentioned 3rd embodiment.On the other hand, shielding frame 4 has side wall 41, shielding
Frame 4 can surround electronic component 71 (please referring to Fig. 3) in the plane (such as on circuit board 7).Shielding frame 4 includes the second knot
Structure 42 is closed, is configured on side wall 41, the second integrated structure 42 can engage with the first integrated structure 12, in this way, thermal conductivity
The mode that plate 100 can dismount is covered on electronic component 71, plays the function of electromagnetic shielding.
Further description, referring again to Fig. 1 and Fig. 2, thermal conduction plate 100 has covering plate body 1 structure plate body 2 together.It covers
The inner surface 111 of cover board body 1 has welding layer 8 between the outer surface 22 of structure plate body 2 together, welding layer 8 can will covering plate body 1 with
2 fixed engagement of structure plate body altogether, making covering plate body 1, structure plate body 2 is not easily to fall off together.2 section view of structure plate body is generally in down " ㄇ " font altogether,
Include opening 21.Covering 1 section view of plate body is generally in positive " ㄇ " font, and covering plate body 1 opening 13 is greater than structure plate body 2 altogether, therefore structure altogether
Plate body 2 can be placed in covering plate body 2, and between shielding frame 4 and covering plate body 1 (when assembling).Total structure plate body 2
Opening 21 covers plate body 1 and forms chamber 3 between structure plate body 2 together towards the bottom surface 14 of covering plate bodys 1.Capillary structure 5 is set
In 3 inner wall of chamber, tubular structure is formed.6 space set of support construction in the inside of capillary structure 5 and contact in covering plate body 1
Between total structure plate body 2, support construction 6 is, for example, column made of copper or granular structure.In this embodiment, support construction 6 is
Contact covering plate body 1 and altogether structure plate body 2 in an indirect way.And in some embodiments, support construction 6 can also regard capillary
Contact covers plate body 1 and altogether structure plate body 2 to the kenel that structure 5 configures in a straightforward manner.By the cross-sectional view of Fig. 1 as it can be seen that extending
Portion 11 is set on covering plate body 1, and each extension 11 is extended downwardly from chamber 3, and length exceeds the top of structure plate body 2 altogether
Face 23.First integrated structure 12 is set on extension 11, and in some embodiments, the first integrated structure 12 is adjacent to extension
11 elongated end, however the present invention has no this limitation.First integrated structure 12 is to implement with the structure of similar buckle first
In example, the first integrated structure 12 is the design of concave guide rail.Opposite, the second integrated structure 42 on shielding frame 4 is phase
The bulge-structure of cooperation can be accommodated since the extension 11 of covering plate body 1 is formed by 13 sizes of opening to cooperate shielding frame 4
Size so that the second integrated structure 42 can be combined or be engaged with the first above-mentioned integrated structure 12.Whereby, thermal conduction plate 100 can
To cover and be assembled to shielding frame 4, thermal conduction plate 100 can also be dismantled repeatedly and disengages it from shielding frame 4.
In some embodiments, the first integrated structure 12 can be integrally formed at the inner surface 111 of extension 11, likewise,
Second integrated structure 42 also can be integrally formed at the outer surface 411 of side wall 41, and in other words, the first integrated structure 12 is combined with second
Structure 42 can be independent element, be combined respectively with extension 11, side wall 41 in a manner of assembling, and the present invention is simultaneously unlimited
System.In some embodiments, the first integrated structure 12 can take shape in the inner surface 111 of extension 11 in an orbiting manner, can also
The inner surface 111 of extension 11 is taken shape in a manner of space segmentation.Opposite, the second integrated structure 42 also can correspond to first
Integrated structure 12, in an orbiting manner or the mode of space segmentation takes shape in the outer surface 411 of side wall 41, and its object is to energy
It is mutually matched, is combined together with the first integrated structure 12.
Fig. 3 to Fig. 5 is please referred to, first embodiment respectively according to the present invention is painted the usage state diagram of thermal conduction plate 100.
Shielding frame 4 is fixedly installed on circuit board 7, with the electronic component 71 being compassingly set on circuit board 7, in the first embodiment,
Shielding frame 4 has region 43 of taking, and positioned at the center of shielding frame 4,43 periphery of region of taking is connect with bracket 44, bracket 44
It is to extend vertically from side wall 41 and be connected with region 43 of taking.In this embodiment, region 43 is taken as round aspect, however this
Invention is not limited thereto system, in some embodiments, take region 43 or rectangular aspect.With mechanical arm front end
Suction nozzle absorption is taken region 43, be conducive to shielding frame 4 automatically precisely, contraposition on 71 periphery of electronic component, as shown in Figure 4.
After shielding frame 4 is fixed on 71 periphery of electronic component, then will the covering covering of plate body 1 to shielding frame 4 so that covering plate body 1 with
Shielding frame 4 is combined through the concave guide rail of the first integrated structure 12 as previously described and the bulge-structure of the second integrated structure 42
It is completed.Here, structure plate body 2 is to be situated between shielding frame 4 and covering plate body 1 altogether.Thermal conduction plate 100 has hair because of inside
The components such as fine texture 5, support construction 6 and working fluid, provide the function of heat dissipation, samming.On the other hand, plate body 1 is covered
Mask be can be used as to block Electromagnetic Interference, in this way, which thermal conduction plate 100 has both heat dissipation and shields the function of electromagnetic wave.
Referring to Fig. 6, to be painted the decomposition cut-away view of thermal conduction plate 100 according to the second embodiment of the present invention.Second implements
It is bulge-structure that example, which is different from the first embodiment in the first integrated structure 12,.Opposite, the second of shielding frame 4 combines
Structure 42 is the concave guide rail to match.Therefore, covering plate body 1 and shielding frame 4 equally can be dismantled arbitrarily, assembled with above-mentioned
The advantages of.
Referring to Fig. 7, to be painted the decomposition cut-away view of thermal conduction plate 200 according to the third embodiment of the present invention.Third is implemented
For example with the first, second embodiment the difference is that extension 24 is arranged on total structure plate body 2, extension 24 is total to structure plate body 2A certainly
Top surface 23 extend and have the first integrated structure 25.Covering plate body 1A accommodates total structure plate body 2A in cap structure, covers
The inner surface 111 of cover board body 1A has welding layer 8 between the outer surface 22 of structure plate body 2A equally together to prevent exempting to cover plate body 1A
Structure plate body 2A falls off together.In the third embodiment, the first integrated structure 25 is concave guide rail, and the second of shielding frame 4 combines
Structure 42 is the bulge-structure to match, and as above-mentioned, in some embodiments, the first integrated structure 25 can surround or be spaced
The mode of segmentation takes shape in the inner surface of extension 24.And the second integrated structure 42 of shielding frame 4 then corresponds to first and combines
The kenel of structure 25 is arranged, and causes it that can be combined with each other with the first integrated structure 25, reaches total structure plate body 2A and shielding frame 4 can
The purpose of arbitrary assembly and disassembly.
Then, referring to Fig. 8, to be painted the decomposition cut-away view of thermal conduction plate 200 according to the fourth embodiment of the present invention.4th
Embodiment is different from the third embodiment place and is that the first integrated structure 25 is bulge-structure, convex towards the inside of total structure plate body 2A
Out, the second integrated structure 42 of shielding frame 4 then corresponds to the concave guide rail to match.Altogether structure plate body 2A and shielding frame 4 it
Between combination, dismounting mode please refer to above-mentioned, no longer superfluous words herein.
The present invention is not intended to limit the kenel of the first, second integrated structure, in some embodiments, the first integrated structure 12
(25) it is also possible to hook, the second integrated structure 42 is then the catching groove or button hole of matching hook, and vice versa.
In some embodiments, same material can be used in covering plate body 1 and total structure plate body 2.Such as be all metal, further
It is so that made by the alloys such as copper or magnalium, there is no restriction by the present invention.
Thermal conduction plate provided by each embodiment according to the present invention, because inside has capillary structure, support construction and work
Fluid, the circulation actuation of working fluid heat evaporation, cooling condensation in capillary structure, can quickly conduct, spread heat, can
Achieve the purpose that samming, heat dissipation.
The thermal conduction plate of various embodiments of the present invention also has shielding frame, covering plate body and structure plate body, extension view are practical altogether
Using selection is set on covering plate body or altogether structure plate body, has the first integrated structure, can be with the second knot of shielding frame
It closes structure to combine, stops external electromagnetic wave interference in a manner of mask internal electronic element.
The thermal conduction plate of various embodiments of the present invention is in addition to having the function of heat dissipation, samming, with the function of electromagnetic shielding.
Thermal conduction plate combination, using above can Simple assembled, and in manufacture, the process simplification of production can significantly reduce manufacture at
This.
Although technology contents of the invention have been disclosed above in the preferred embodiment, however, it is not to limit the invention,
It is any to be familiar with this those skilled in the art, do not depart from spirit of the invention make it is a little change and retouch, should all be covered by this hair
In bright scope, therefore protection scope of the present invention should be defined by the scope of the appended claims.
Claims (10)
1. a kind of thermal conduction plate with electro-magnetic screen function, for dissipate the heat of an electronic component and have a capillary structure,
One support construction and a working fluid, which is characterized in that the thermal conduction plate also includes:
One extension extends from the thermal conduction plate and has one first integrated structure；And
One shielding frame, has one side wall to surround the electronic component in a plane, and one second integrated structure is configured at institute
Side wall is stated, first integrated structure is sticked in second integrated structure so that the thermal conduction plate removably covers the electricity
Subcomponent, to execute electro-magnetic screen function.
2. thermal conduction plate as described in claim 1, which is characterized in that the thermal conduction plate also includes:
One covering plate body, has the extension；And
Structure plate body altogether, define a chamber jointly with the covering plate body with accommodate the capillary structure, the support construction with
And the working fluid.
3. thermal conduction plate as described in claim 1, which is characterized in that the thermal conduction plate also includes:
One covering plate body；And
Structure plate body altogether has the extension, and with the covering plate body define a chamber jointly with accommodate the capillary structure,
The support construction and the working fluid.
4. thermal conduction plate as claimed in claim 2 or claim 3, which is characterized in that the covering plate body uses phase with the structure plate body altogether
Same material.
5. thermal conduction plate as claimed in claim 2 or claim 3, which is characterized in that the covering plate body is covered described in a manner of accommodating
Structure plate body altogether, the structure plate body altogether are situated between the shielding frame and the covering plate body.
6. thermal conduction plate as described in claim 1, which is characterized in that first integrated structure is shaped in the extension
Inner surface, second integrated structure is shaped in the outer surface of the side wall.
7. thermal conduction plate as described in claim 1, which is characterized in that the shielding frame has one to take region, described to take
Region is extended vertically from the side wall.
8. thermal conduction plate as claimed in claim 2 or claim 3, which is characterized in that the inner surface of the covering plate body and the structure plate altogether
The outer surface of body is fixed together with a welding layer.
9. thermal conduction plate as described in claim 1, which is characterized in that in first integrated structure and second integrated structure
One of be a concave guide rail, and the other of first integrated structure and described second integrated structure be match it is described recessed
One bulge-structure of type guide rail.
10. thermal conduction plate as described in claim 1, which is characterized in that first integrated structure and second integrated structure
One of be a hook, and the other of first integrated structure and described second integrated structure are to match the hook
Catching groove or button hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710472695.7A CN109104841B (en) | 2017-06-21 | 2017-06-21 | Heat conductive plate with electromagnetic shielding function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710472695.7A CN109104841B (en) | 2017-06-21 | 2017-06-21 | Heat conductive plate with electromagnetic shielding function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109104841A true CN109104841A (en) | 2018-12-28 |
| CN109104841B CN109104841B (en) | 2020-11-10 |
Family
ID=64795844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710472695.7A Active CN109104841B (en) | 2017-06-21 | 2017-06-21 | Heat conductive plate with electromagnetic shielding function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109104841B (en) |
Cited By (2)
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| CN110366362A (en) * | 2019-08-07 | 2019-10-22 | 李居强 | It is electromagnetically shielded radiator |
| CN110662410A (en) * | 2019-09-23 | 2020-01-07 | 深圳市鸿富诚屏蔽材料有限公司 | Integrated heat dissipation shielding cover and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN109104841B (en) | 2020-11-10 |
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