CN110662410A - Integrated heat dissipation shielding cover and manufacturing method thereof - Google Patents
Integrated heat dissipation shielding cover and manufacturing method thereof Download PDFInfo
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- CN110662410A CN110662410A CN201910900240.XA CN201910900240A CN110662410A CN 110662410 A CN110662410 A CN 110662410A CN 201910900240 A CN201910900240 A CN 201910900240A CN 110662410 A CN110662410 A CN 110662410A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 title claims description 89
- 239000002184 metal Substances 0.000 claims abstract description 103
- 229910052751 metal Inorganic materials 0.000 claims abstract description 103
- 239000000110 cooling liquid Substances 0.000 claims abstract description 18
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 claims description 31
- 239000007924 injection Substances 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 6
- 239000002826 coolant Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 230000006835 compression Effects 0.000 abstract description 2
- 238000007906 compression Methods 0.000 abstract description 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Abstract
The invention discloses an integrated radiating shielding case and a manufacturing method thereof, wherein the shielding case comprises two radiating metal sheets, the peripheral edge of one radiating metal sheet is bent downwards to form a cavity cover, the other radiating metal sheet is stacked on one radiating metal sheet to form a closed cavity, cooling liquid is filled in the closed cavity, and a capillary layer for absorbing the cooling liquid is arranged on the upper surface of the lower radiating metal sheet in the closed cavity. Adopt a slice sheetmetal both as the cover top of shield cover and the chamber wall of conduct radiator again, make shield cover and radiator can integrated into one piece in, can guarantee holistic structural stability, can also take up the whole thickness of enterprising further compression in the space, on the other hand the chamber diapire of radiator can with the device that generates heat with less medium material contact or direct contact heat absorption and directly by the coolant liquid conduction in the chamber give off, the influence of current different medium contact gap to radiating has been avoided, holistic radiating efficiency has been promoted by a wide margin.
Description
Technical Field
The invention relates to the technical field of electronic product heat dissipation devices, in particular to an integrated heat dissipation shielding case and a manufacturing method thereof.
Background
Along with the commercial popularization of 5G technique, more and more intelligent electronic product, if smart mobile phone or panel computer all updated the 5G chip on its mainboard, because the power increase of 5G chip, its heat energy that produces also increases suddenly, simultaneously the 5G chip is also higher and higher to the requirement that prevents signal interference, if adopt current metallic shield cover to cover 5G chip, although can guarantee shielding effect, powerful heat gives off and can not solve, can make the unable normal operation of 5G chip, if adopt current heat pipe or samming board heat dissipation, then heat pipe and samming board all need occupy certain space, originally pursue the intelligent electronic equipment that integrates, miniaturize can't accept great space occupation. For example, chinese patent application No. CN201810179774.3 discloses a heat dissipation device with an EMI shielding structure, in which a shielding frame is provided as a support, a large temperature-uniforming plate is provided on the shielding frame, and the temperature-uniforming plate covers a heat dissipation element, but the structure of the temperature-uniforming plate in the structure necessarily occupies a large space, and the temperature-uniforming plate and the shielding frame need to be welded to form a shielding cover, which has poor structural stability, complicated manufacturing process, and inevitably increased cost, and most importantly, the space occupation cannot be solved. In addition, chinese patent application No. CN201510616652.2 discloses an electromagnetic shielding case and an electronic device, in which a through hole is formed at the top of the shielding case, and a temperature equalizing plate is installed in the through hole, so that the structure can be reduced in space occupation, but the temperature equalizing plate is embedded in the through hole, so that a heat conducting gap exists, the heat dissipation effect is not good in practice, and the stability of the embedded structure is not high.
Therefore, there is a great need in the art for a product that can not only solve the problem of efficient heat dissipation, but also effectively solve the problem of space occupation in small-sized intelligent electronic products.
Disclosure of Invention
The invention provides an integrated heat dissipation shielding cover and a manufacturing method thereof, which aim to solve the problems.
The invention provides an integrated heat-dissipation shielding cover which comprises two heat-dissipation metal sheets, wherein the peripheral edge of one heat-dissipation metal sheet is bent downwards to form a cavity cover used for covering components to realize a shielding function, the other heat-dissipation metal sheet is stacked on one heat-dissipation metal sheet to form a closed cavity, cooling liquid is filled in the closed cavity, and a capillary layer used for adsorbing the cooling liquid is arranged on the upper surface of the lower heat-dissipation metal sheet in the closed cavity.
Preferably, raised pillars are integrally formed on the lower surface of the heat dissipation metal sheet located on the upper layer in the closed cavity.
Preferably, the heat dissipation metal sheet is made of copper foil or stainless steel, and the raised pillars are etched on the copper foil or the stainless steel.
Preferably, an opening for injecting cooling liquid is reserved at the joint position of the two heat dissipation metal sheets, and the opening is welded and sealed.
Preferably, the heat dissipation metal sheet is a copper foil, and the capillary layer is copper powder sintered on the copper foil or a copper wire mesh welded on the copper foil or formed by etching a plurality of fine grooves on the copper foil.
Preferably, the other heat dissipation metal sheet is arranged on the lower surface of one heat dissipation metal sheet, so that the closed cavity is located in the cavity cover, grooves are arranged at the positions, opposite to the two heat dissipation metal sheets, of the two heat dissipation metal sheets, and the peripheries of the grooves are welded and sealed to form the closed cavity.
Preferably, the other heat dissipation metal sheet is arranged on the upper surface of one heat dissipation metal sheet, so that the closed cavity is located on the upper side of the cavity cover, grooves are arranged at the opposite positions of the two heat dissipation metal sheets, and the peripheries of the grooves are welded and sealed to form the closed cavity.
The invention also provides a manufacturing method of the integrated heat dissipation shielding cover, which is used for manufacturing the integrated heat dissipation shielding cover and comprises the following steps:
and (3) forming a closed cavity: preparing two radiating metal sheets with one large area and one small area, selecting one of the radiating metal sheets with a relatively large area to punch a groove on the radiating metal sheet, punching a matched groove on the other radiating metal sheet, arranging a capillary layer in the groove of any one of the two radiating metal sheets, oppositely arranging the grooves of the two radiating metal sheets, enabling the radiating metal sheet with the capillary layer to be positioned at the lower layer, welding the two radiating metal sheets along the periphery of the groove, reserving an opening to form a primary cavity, injecting cooling liquid into the primary cavity through the opening, vacuumizing, removing residual gas in the primary cavity, and welding and sealing the opening to form a closed cavity;
a cavity cover forming step: and bending the periphery of the heat dissipation metal sheet with larger area downwards to form a cavity cover.
Preferably, in the step of forming the closed cavity, when the grooves are punched in the two heat dissipation metal sheets, pipe slots for accommodating the water injection pipes are punched in the edges of the two heat dissipation metal sheets, the water injection pipes for injecting the cooling liquid are installed, the water injection pipes are cut off before the closed openings are welded, and the primary cavity is placed in a device filled with reducing gas to heat and reduce the capillary layer before the cooling liquid is injected into the primary cavity.
Preferably, seal the water injection pipe in the upper portion of water injection pipe after to preliminary cavity evacuation, then heat preliminary cavity and make the residual gas in preliminary cavity rise to in the water injection pipe, press from both sides tight or buckle the water injection pipe at the water injection pipe root after the tight department of clamp or the department of buckling of this water injection pipe excision water injection pipe and welding seal the opening and form and seal the cavity.
Preferably, in the cavity cover forming step, notches are cut at four corners of the heat dissipation metal sheet with the larger area, the metal sheet between the four notches is bent to form the cavity cover in flat butt joint, or an upper convex die with the same area and contour as the closed cavity and an inner concave die matched with the upper convex die are prepared, the closed cavity is placed on the upper convex die, so that the peripheral metal sheets of the heat dissipation metal sheet with the larger area extend out of the upper convex die, and then the peripheral metal sheets are stamped by the inner groove die to form the cavity cover.
Preferably, in the closed cavity forming step, after the groove is punched on the metal sheet without the capillary layer, a plurality of columns are arranged in the groove at the position corresponding to the capillary layer.
According to the technical scheme, the metal sheet is used as the top of the shielding cover and the chamber wall of the radiator, so that the shielding cover and the radiator can be integrated into a whole in an integrated mode, on one hand, the structural stability of the whole can be guaranteed, the whole thickness can be further compressed on the occupied space, on the other hand, the bottom wall of the chamber of the radiator can be contacted with a heating device through less medium materials or directly contacted with the heating device to absorb heat and directly conducted and dissipated in the chamber through cooling liquid, the influence of the existing different medium contact gaps on heat dissipation is avoided, and the whole heat dissipation efficiency is greatly improved.
In the aspect of the manufacturing process, after the two metal sheets form a closed cavity, the metal sheets with relatively large areas and extending around are directly bent downwards to form the shielding cavity cover, any welding operation is not needed, the manufacturing efficiency of the product is integrally improved, and the manufacturing process and time are reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an integrated heat dissipation shield according to embodiment 1 of the present invention;
fig. 2 is a schematic view of two structures of the integrated heat dissipation shield according to embodiment 1 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
the embodiment of the invention provides an integrated heat dissipation shielding cover, which is shown in fig. 1 to 2 and comprises two heat dissipation metal sheets, wherein the peripheral edge of one heat dissipation metal sheet 11 is bent downwards to form a cavity cover for covering a component 10 to realize a shielding function, the other heat dissipation metal sheet 12 is arranged on one heat dissipation metal sheet 11 in a laminated manner to form a closed cavity, cooling liquid 13 is filled in the closed cavity, and a capillary layer 14 for absorbing the cooling liquid is arranged on the upper surface of the lower heat dissipation metal sheet in the closed cavity.
Two sheetmetal form the mode of sealing the cavity and have two kinds, one of them, another heat dissipation sheetmetal set up in the lower surface of one of them heat dissipation sheetmetal make the closed cavity be located the chamber cover in, two heat dissipation sheetmetal relative position departments set up recess and weld all around and seal and form the closed cavity, structure shown in figure 2 for example, this kind of structure looks outward, and whole product is an integrated into one piece's complete chamber cover for radiating closed cavity is arranged in the chamber cover and can be protected by whole dustcoat, and the work security is better. Secondly, the other heat dissipation metal sheet is arranged on the upper surface of one of the heat dissipation metal sheets, so that the closed cavity is positioned on the upper side of the cavity cover, the opposite positions of the two heat dissipation metal sheets are provided with grooves, and the peripheries of the grooves are welded and closed to form the closed cavity, for example, in the structure shown in fig. 1, in the structure, the closed cavity for heat dissipation is positioned on the top outside the closed cavity, and the formation of the cavity cover is facilitated during processing.
In this embodiment, a specific structure and a working principle of the integrated heat dissipation shield are further described by taking an external structure of a chamber for heat dissipation in the structure of fig. 1 as an example.
In order to prevent the sealed cavity from sinking to affect the gas-liquid circulation, a raised pillar 15 is integrally formed on the lower surface of the upper heat dissipation metal sheet in the sealed cavity. In this embodiment, the pillars are arranged in a longitudinal and transverse arrangement manner, and can further form a flow guide channel while playing a supporting role, so that gas can be condensed at the top of the closed cavity to be liquid and then rapidly flow back to the capillary layer.
In this embodiment, the heat dissipation metal sheet is a copper foil, and the protruding pillars are etched on the copper foil. The etching mode is favorable for keeping the integrity of the copper foil, reducing damage and promoting the closed space. Of course, the heat dissipation metal plate in other embodiments may also be made of stainless steel.
The capillary layer is formed by sintering copper powder on a copper foil or welding a copper wire mesh on the copper foil or etching a plurality of fine grooves on the copper foil. In the embodiment, the capillary layer is formed by etching a plurality of grooves on the copper foil, so that the space of the closed cavity can be further expanded, and the capillary adsorption effect and the gas-liquid circulation efficiency are improved.
Adopt a slice sheetmetal both as the cover top of shield and the chamber wall of conduct radiator in this embodiment, make shield and radiator can integrated into one piece, on the one hand can guarantee holistic structural stability, can also take up whole thickness of further compression in the space, on the other hand the chamber diapire of radiator can with the device that generates heat with less medium material contact or direct contact endotherm and directly by the conduction of coolant liquid in the chamber give off, further reduce the thermal resistance, avoided current different medium contact gap to radiating influence, by a wide margin promotion holistic radiating efficiency.
Example 2:
the embodiment provides a manufacturing method of an integrated heat dissipation shielding case, which is used for manufacturing the integrated heat dissipation shielding case and comprises the following steps:
and (3) forming a closed cavity: preparing two radiating metal sheets with large area and small area, selecting one of the radiating metal sheets with relatively large area to punch a groove on the radiating metal sheet, punching a matched groove on the other radiating metal sheet, arranging a capillary layer in the groove of any one of the two radiating metal sheets, and forming a plurality of arranged pillars at the positions corresponding to the capillary layer in the groove after the groove is punched on the metal sheet without the capillary layer, so that the closed cavity can be ensured to be supported and not easy to deform, the space is effectively ensured, a liquid flow channel can be formed between the pillars, and the circulation is facilitated. After the grooves of the two radiating metal sheets are arranged oppositely and the radiating metal sheet provided with the capillary layer is positioned at the lower layer, the two radiating metal sheets are welded along the periphery of the grooves and an opening is reserved to form a preliminary cavity, cooling liquid is injected into the preliminary cavity through the opening, then the preliminary cavity is vacuumized and residual gas in the preliminary cavity is removed, and the opening is welded and sealed to form a closed cavity;
a cavity cover forming step: and bending the periphery of the heat dissipation metal sheet with larger area downwards to form a cavity cover.
In the step of forming the closed cavity in this embodiment, when the grooves are punched in the two heat dissipation metal sheets, a pipe groove for accommodating the water injection pipe is punched in the edges of the two heat dissipation metal sheets, the water injection pipe for injecting the coolant is installed, the water injection pipe is cut off before the closed opening is welded, and the primary cavity is placed in a device filled with reducing gas to heat and reduce the capillary layer before the coolant is injected into the primary cavity.
In this embodiment, seal the water injection pipe on the upper portion of water injection pipe after to preliminary cavity evacuation, then heat preliminary cavity and make the interior residual gas of preliminary cavity rise to the water injection pipe in, press from both sides tight or buckle the water injection pipe at the water injection pipe root after the tight department of clamp or the department of buckling of this water injection pipe excision water injection pipe and welding seal the opening and form and seal the cavity. The warming is intended to raise the residual gas into the water injection tube, because once the residual gas is inside the chamber, and the residual gas contains oxygen, the reduced capillary layer can be oxidized after a long time, and the capillary is attenuated or fails.
In the cavity cover forming step in this embodiment, notches are cut at four corners of a heat dissipation metal sheet with a large area, the metal sheet between the four notches is bent to form a cavity cover in flat butt joint, or an upper convex mold with a closed cavity area and a contour consistent with those of the closed cavity and an inner concave mold matched with the upper convex mold are prepared, the closed cavity is placed on the upper convex mold, so that the peripheral metal sheets of the heat dissipation metal sheet with the large area extend out of the upper convex mold, and then the peripheral metal sheets are stamped by an inner groove mold to form the cavity cover.
In the embodiment, after the two metal sheets form the closed cavity, the metal sheets with relatively large area and extending around are directly bent downwards to form the shielding cavity cover, so that any welding operation is not needed, the manufacturing efficiency of the product is integrally improved, and the manufacturing process and time are reduced.
The above detailed description is provided for an integrated heat dissipation shield and a manufacturing method thereof according to an embodiment of the present invention, and a specific example is applied in the detailed description to explain the principle and the embodiment of the present invention, and the description of the above embodiment is only used to help understanding the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea and method of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (12)
1. The integrated heat dissipation shielding cover is characterized by comprising two heat dissipation metal sheets, wherein the peripheral edge of one heat dissipation metal sheet is bent downwards to form a cavity cover used for covering a component to realize a shielding function, the other heat dissipation metal sheet is stacked on the one heat dissipation metal sheet to form a closed cavity, cooling liquid is filled in the closed cavity, and a capillary layer used for adsorbing the cooling liquid is arranged on the upper surface of the lower heat dissipation metal sheet in the closed cavity.
2. The integrated heat sink shield of claim 1 wherein raised posts are integrally formed on the lower surface of the upper heat sink metal sheet within the enclosed cavity.
3. The integrated heat sink shield of claim 2 wherein the heat sink metal sheet is a copper foil or stainless steel, and the raised posts are etched on the copper foil or stainless steel.
4. The integrated heat dissipation shield cover of claim 1 or 2, wherein an opening for injecting cooling liquid is reserved at the joint position of the two heat dissipation metal sheets, and the opening is welded and closed.
5. The integrated heat dissipation shield of claim 1 or 2, wherein the heat dissipation metal sheet is a copper foil, and the capillary layer is copper powder sintered on the copper foil or a copper wire mesh welded on the copper foil or formed by etching a plurality of fine grooves on the copper foil.
6. The integrated heat dissipation shield cover of claim 1 or 2, wherein the other heat dissipation metal sheet is disposed on the lower surface of one of the heat dissipation metal sheets so that the closed cavity is located in the cavity cover, the two heat dissipation metal sheets are disposed with a groove at a position opposite to each other, and the periphery of the groove is welded and closed to form the closed cavity.
7. The integrated heat dissipation shield cover of claim 1 or 2, wherein the other heat dissipation metal sheet is disposed on the upper surface of one of the heat dissipation metal sheets so that the closed cavity is located on the upper side of the cavity cover, the two heat dissipation metal sheets are disposed with grooves at opposite positions, and the peripheries of the grooves are welded to form the closed cavity.
8. A method for manufacturing an integrated heat dissipation shield, which is used for manufacturing the integrated heat dissipation shield of any one of claims 1 to 6, and which comprises the following steps:
and (3) forming a closed cavity: preparing two radiating metal sheets with one large area and one small area, selecting one of the radiating metal sheets with a relatively large area to punch a groove on the radiating metal sheet, punching a matched groove on the other radiating metal sheet, arranging a capillary layer in the groove of any one of the two radiating metal sheets, oppositely arranging the grooves of the two radiating metal sheets, enabling the radiating metal sheet with the capillary layer to be positioned at the lower layer, welding the two radiating metal sheets along the periphery of the groove, reserving an opening to form a primary cavity, injecting cooling liquid into the primary cavity through the opening, vacuumizing, removing residual gas in the primary cavity, and welding and sealing the opening to form a closed cavity;
a cavity cover forming step: and bending the periphery of the heat dissipation metal sheet with larger area downwards to form a cavity cover.
9. The method for manufacturing an integrated heat-dissipating shield according to claim 8, wherein in the step of forming the closed chamber, when the grooves are punched in the two heat-dissipating metal sheets, pipe slots for accommodating the water injection pipes are punched in the edges of the two heat-dissipating metal sheets, the water injection pipes for injecting the cooling liquid are installed, the water injection pipes are cut off before the closed openings are welded, and the primary chamber is placed in a device filled with reducing gas to heat and reduce the capillary layer before the cooling liquid is injected into the primary chamber.
10. The method of manufacturing an integrated heat dissipation shield as recited in claim 9, wherein the water injection pipe is closed at an upper portion of the water injection pipe after the preliminary cavity is vacuumized, then the preliminary cavity is heated to make residual gas in the preliminary cavity rise into the water injection pipe, the water injection pipe is cut at a clamped or bent portion of the water injection pipe after the water injection pipe is clamped or bent at a root portion of the water injection pipe, and the closed cavity is formed by welding a closed opening.
11. The method for manufacturing an integrated heat dissipation shield according to claim 8, wherein in the cavity cover forming step, notches are cut at four corners of the heat dissipation metal sheet with a larger area, the metal sheet between the four notches is bent to form the cavity cover in a flat butt joint manner, or an upper convex mold with an area and a contour consistent with those of the closed cavity and a concave mold matched with the upper convex mold are prepared, the closed cavity is placed on the upper convex mold, so that the peripheral metal sheet of the heat dissipation metal sheet with a larger area extends out of the upper convex mold, and then the peripheral metal sheet is stamped by the inner groove mold to form the cavity cover.
12. The method of claim 8, wherein the step of forming the closed cavity comprises punching a groove in the metal sheet without the capillary layer and forming a plurality of pillars in the groove at positions corresponding to the capillary layer.
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| CN201910900240.XA CN110662410A (en) | 2019-09-23 | 2019-09-23 | Integrated heat dissipation shielding cover and manufacturing method thereof |
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| CN201910900240.XA CN110662410A (en) | 2019-09-23 | 2019-09-23 | Integrated heat dissipation shielding cover and manufacturing method thereof |
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Cited By (2)
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| WO2021203825A1 (en) * | 2020-04-08 | 2021-10-14 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus |
| CN115023099A (en) * | 2021-11-10 | 2022-09-06 | 荣耀终端有限公司 | Electronic device |
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| CN210808103U (en) * | 2019-09-23 | 2020-06-19 | 深圳市鸿富诚屏蔽材料有限公司 | Integrated heat dissipation shielding cover |
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| WO2021203825A1 (en) * | 2020-04-08 | 2021-10-14 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus |
| CN115023099A (en) * | 2021-11-10 | 2022-09-06 | 荣耀终端有限公司 | Electronic device |
| WO2023082750A1 (en) * | 2021-11-10 | 2023-05-19 | 荣耀终端有限公司 | Electronic device |
| CN115023099B (en) * | 2021-11-10 | 2023-11-21 | 荣耀终端有限公司 | Electronic equipment |
| EP4203638A4 (en) * | 2021-11-10 | 2024-03-06 | Honor Device Co Ltd | Electronic device |
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