CN102711416A - Heat dissipation processing device and mobile terminal - Google Patents
Heat dissipation processing device and mobile terminal Download PDFInfo
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- CN102711416A CN102711416A CN2012101635671A CN201210163567A CN102711416A CN 102711416 A CN102711416 A CN 102711416A CN 2012101635671 A CN2012101635671 A CN 2012101635671A CN 201210163567 A CN201210163567 A CN 201210163567A CN 102711416 A CN102711416 A CN 102711416A
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Abstract
The invention discloses a heat dissipation processing device and a mobile terminal. The device comprises a mobile terminal metal stand subjected to low-thermal-conductivity surface removal treatment, a first heat conducting material with rough surface, and a PCB (printed circuit board) with a multilayer structure, wherein the mobile terminal metal stand is located between a mobile terminal LCD (liquid crystal display) and the PCB; the space between the mobile terminal metal stand and the PCB is filled with the first heat conducting material; large-power devices on the PCB are arranged at a middle position of the device surface of the PCB, and are kept with gap between the devices; at least one layer of ground copper is arranged in the PCB; ground copper is arranged on the bottom or other positions of the large-power devices on the device surface of the PCB; and a ground hole is formed on the device surface of the PCB. Based on the technical scheme provided by the invention, the heat dissipation processing device provided by the invention can improve the overall electromagnetic compatibility index, radio frequency index and structural reliability index while the mobile terminal electronic system is subjected to the effective heat dissipation treatment.
Description
Technical field
The present invention relates to field of mobile communication, particularly relate to a kind of radiating treatment device and portable terminal.
Background technology
In the prior art, portable terminal is particularly based on 3G (Third Generation) Moblie technology (3rd-generation abbreviates 3G as) and Long Term Evolution (Long Term Evolution; Abbreviate LTE as) intelligent terminal of system; The dominant frequency of its inner master chip is increasingly high, and memory access rate is more and more faster, and RF power amplification and power management power consumption are also corresponding increasingly high; Therefore, just seeming is even more important to the radiating treatment (also can be called thermal design) of portable terminal.
The complicated of the lightening and function of moulding is the one integrity with both sides of intelligent mobile terminal; Be to dazzle cruel fuselage and colorful application on the one hand; Be power consumption and the portable terminal narrow space that grows with each passing day on the other hand, in the epoch of intelligent terminal develop rapidly at present, thermal design is extremely important.
At present, portable terminal thermal design heat radiation mainly relies on hardware arrangement, structure space designs and aspects such as heat fall in Heat Conduction Material.In the function machine terminal epoch, forward the two just can deal with problems; But in the intelligent terminal epoch, the Heat Conduction Material cooling application more and more widely.Particularly adopt the portable terminal of disconnected plate scheme, often leave the Heat Conduction Material heat dissipation problem and just can't effectively alleviate and solve.Above-mentioned disconnected plate scheme is meant: the area of the printed circuit board (PCB) (Printed Circuit Board abbreviates PCB as) that portable terminal is inner is that the complete machine longitudinal profile is about half.
In the prior art, common Heat Conduction Material is graphite, heat conduction Copper Foil, aluminium or copper base conducting strip etc.But these Heat Conduction Materials all can only be realized the purpose of dispelling the heat, and difficulty has other resultant effects, and when using owing to reason large tracts of land such as raw material, manufacture crafts, price is all somewhat expensive.
Summary of the invention
The present invention provides a kind of radiating treatment device and portable terminal, can carry out radiating treatment effectively to the portable terminal electronic system.
The present invention provides a kind of radiating treatment device; Comprise: the PCB of portable terminal metallic support, shaggy first Heat Conduction Material and the sandwich construction of handling through past low heat conductivity top layer; Wherein, The portable terminal metallic support is positioned between portable terminal LCDs (Liquid Crystal Display abbreviates LCD as) and the PCB; Be filled with first Heat Conduction Material between portable terminal metallic support and the PCB; The last high power device of PCB is arranged on the centre position of the device side of PCB, and leaves the space each other; Be provided with one deck ground copper at least among the PCB, high power device bottom or other positions of the device side of PCB are provided with ground copper, and the device side of PCB is provided with the hole, ground.
Preferably, the distance between portable terminal metallic support and the PCB is more than or equal to 0.1 millimeter and smaller or equal to 0.2 millimeter.
Preferably, first Heat Conduction Material is: omnidirectional's conducting foam.
Preferably, go to the low heat conductivity top layer to be treated to: surperficial deoxidation layer is handled.
Preferably, high power device comprises: RF power amplification, power management chip and system's master chip.
Preferably, be provided with metal screen in the device side of PCB, high power device is between PCB surface and metal screen.
Preferably, be filled with first Heat Conduction Material between the metal screen of portable terminal metallic support and PCB.
Preferably, be filled with second Heat Conduction Material between metal screen and the high power device.
Preferably, second Heat Conduction Material is: heat conductive silica gel.
The present invention also provides a kind of portable terminal, comprises above-mentioned radiating treatment device.
Beneficial effect of the present invention is following:
Through passing by the Heat Conduction Material that portable terminal metallic support that the low heat conductivity top layer handles and the gap filling of PCB can conduct electricity; Make when the portable terminal electronic system is effectively carried out radiating treatment, can improve the performance of the reliability aspect such as anti-drop of electronic system ground connection performance and radiofrequency signal receptivity and complete machine structure system.
Description of drawings
Fig. 1 is the radiating treatment schematic representation of apparatus of the embodiment of the invention;
Fig. 2 is the flow chart that the employing omnidirectional conducting foam of the embodiment of the invention carries out the portable terminal radiating treatment.
Embodiment
In order to carry out radiating treatment effectively to the portable terminal electronic system; The invention provides a kind of radiating treatment device and portable terminal; In embodiments of the present invention; Do not adopt conventional Heat Conduction Material, choose the material that routine is used to conduct electricity, ground connection is handled, through series of processes treatment measures such as portable terminal metal support surface PROCESS FOR TREATMENT, the processing of PCB shielding process and metallic support and the gap fillings of pcb board shielding material; Reaching the main purpose while that portable terminal electronic system efficiently radiates heat is handled, electronic system ground connection performance and radiofrequency signal receptivity have been improved.Below in conjunction with accompanying drawing and embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, does not limit the present invention.
Device embodiment one
According to embodiments of the invention; A kind of radiating treatment device is provided; Fig. 1 is the radiating treatment schematic representation of apparatus of the embodiment of the invention; As shown in Figure 1, comprise according to the radiating treatment device of the embodiment of the invention: the PCB 14 of portable terminal metallic support 10, shaggy first Heat Conduction Material 12 and the sandwich construction of handling through low heat conductivity top layer in the past, below carry out detailed explanation to each module of the embodiment of the invention.
Particularly; Portable terminal metallic support 10 is between mobile terminal LCD and PCB 14; Need to keep certain gap between portable terminal metallic support 10 and the PCB 14; In embodiments of the present invention, the distance between portable terminal metallic support 10 and the PCB 14 is more than or equal to 0.1 millimeter and smaller or equal to 0.2 millimeter.Need to prove that the surface of portable terminal metallic support 10 need go to the low heat conductivity top layer to handle, and in embodiments of the present invention, goes to the low heat conductivity top layer to be treated to: surperficial deoxidation layer is handled.
Be filled with first Heat Conduction Material 12 between portable terminal metallic support 10 and the PCB 14; Wherein, first Heat Conduction Material 12 is: omnidirectional's conducting foam that routine is used to conduct electricity.
Above-mentioned omnidirectional conducting foam has excellent conducting performance at evenly doping copper powder, aluminium powder (under the not tight situation of early stage environmental requirement, nickel powder can partly mix) on the basis of common foam, and simultaneously, this material technology is simple, cheap.
Need to prove; Above-mentioned first Heat Conduction Material, 12 conventional purposes just are used for conduction (the most frequently used conductive applications is a ground connection); In embodiments of the present invention, the material that this routine is used to conduct electricity is used for heat conduction, in practical application; The material that can not simply be used to routine to conduct electricity is used for heat conduction, so the embodiment of the invention need be handled as follows:
1, portable terminal metallic support 10 is carried out PROCESS FOR TREATMENT; Concrete, through the thermal conductance passband of PROCESS FOR TREATMENT lifting metal support surface;
2, the thermal conductive surface structure that can conduct electricity to PCB 14 carry out large tracts of landization, merges single small construction body;
3, the Heat Conduction Material that is used to routine to conduct electricity carries out the contact surface roughening, forms intensive multiple spot contact, guarantees maximum heat-conductive characteristic.
Particularly, the high power device on the PCB 14 is arranged on the centre position of the device side of PCB 14, and leaves the space each other; Wherein, above-mentioned high power device comprises but is not limited to: RF power amplification, power management chip and system's master chip.The RF power amplification of portable terminal, power management chip, system's master chip are main thermals source, and the radiating treatment device of the embodiment of the invention is primarily aimed at these thermals source and carries out efficiently radiates heat.
Be provided with one deck ground copper at least among the PCB 14, the high power device of the device side of PCB 14 bottom or other positions also are provided with ground copper in addition, and the device side of PCB 14 is provided with the hole, ground.
Preferably, in embodiments of the present invention, can also be provided with big radome in the device side of PCB 14, this big radome can be metal screen, and high power device is between PCB 14 surfaces and metal screen.Metal screen can be used to evade on the PCB 14 that the active device high frequency radiation is disturbed mutually and extraneous high-frequency signal disturbs.Be filled with first Heat Conduction Material 12 between the metal screen of portable terminal metallic support 10 and PCB 14.Be filled with second Heat Conduction Material between metal screen and the high power device, above-mentioned second Heat Conduction Material is: heat conductive silica gel.
Below in conjunction with accompanying drawing, the processing procedure of the above-mentioned radiating treatment device of the embodiment of the invention is carried out detailed explanation.
Fig. 2 is the flow chart that the employing omnidirectional conducting foam of the embodiment of the invention carries out the portable terminal radiating treatment, and is as shown in Figure 2, comprises following processing:
Step 1, to reserving the gap of enough height between portable terminal metallic support and the PCB shielding material, with 0.1mm to being good between the 0.2mm.
In practical application, this gap is too small, and omnidirectional's conducting foam compression stroke of technology production at present is not enough, and in addition, enough Heat Conduction Materials are filled in the gap could guarantee good heat storage capacity.Above-mentioned 0.1mm is to recommendation just between the 0.2mm, and actual in production technology new situation more, the gap can be adjusted.
Step 2 goes to the low heat conductivity top layer to handle to the surface of portable terminal metallic support.
In practical application, portable terminal metallic support commonly used is a magnadure, goes to the low heat conductivity top layer to handle promptly to the surface of portable terminal metallic support the processing of deoxidation layer carried out on the surface of magnadure.Therefore characteristics such as magnadure has that intensity height, modulus of elasticity are big, good heat dissipation, shock absorbing property is good, the load-carrying ability that withstands shocks is big, nonmagnetic, shielding is good, high-termal conductivity and conductivity are widely used in portable terminal at present.Magnadure increases oxide-film can significantly improve its erosion-resisting performance; The conventional oxidation film contains elements such as chromium, fluorine, phosphorus; The oxide-film main component that anodic oxidation forms is elements such as its surperficial equally distributed aluminium, silicon, and a large amount of nonmetalloid (thermal conductivity is low) in these elements effectively reduces the Corrosion Protection of magnadure.
The embodiment of the invention has been carried out detailed contrast test to this, the surface of magnesium aluminium alloy oxide layer reduces the test result show last can reach the scope of 2 ~ 4 degree to thermal conductivity to the control difference of temperature rise, that is, it is very big to the influence of thermal conductivity not remove oxide layer.Therefore, need go to the low heat conductivity top layer to handle to the surface of portable terminal metallic support.
Step 3 is optimized the layout of PCB.RF power amplification, power management chip and system's master chip place plank to lean on mid portion, and relative position scatters, and stop copper and abundant hole, ground in large area; Simultaneously, to using the big electric conducting material such as the big thermal conductive surface of the big shielding part of bulk metal forms such as (more than the long 20mm of monolateral length) near device side.
The ground copper of enough areas and abundant hole, ground; It is the key factor of electronic system heat radiation itself; Because first path that the thermal power of electronic device dissipates is exactly Copper Foil and other adhesion metal things of pcb board, through the heat conduction of the higher material of these thermal conductivitys, heat is disseminated to the PCB surface.The big shielding part of big electric conducting material such as bulk metal helps the very first time and receives conduction or radiation and convection to the surperficial heat of PCB.Usually in order to strengthen direct heat conducting ratio, material compressions such as embodiment of the invention employing heat conductive silica gel are filled between thermal source electronic device surperficial and big the conductive shield material such as the big shielding part of bulk metal.
Take the importance of above-mentioned steps be to guarantee effective concentrated area PCB electronic device heat delivered on PCB surface big electric conducting material such as the big shielding part of bulk metal; Diffusing area of effective guaranteed heat consumption and volume; The total amount of heat that reduces the electronic system generation is directly to the radiation of air layer with to the flow accounting, and big electric conducting material such as the big shielding part of bulk metal transfers out from the PCB surface with heat thereby conveniently take further measure.
Step 4 is chosen omnidirectional's conducting foam of high thermal conductivity materials such as interior cupric, aluminium, and omnidirectional's conducting foam is typical case's representative of the high compressible electric conducting material of thermal conductivity, and its rough surface is realized complete filling in the gap of the whole big thermal conductive surface of corresponding PCB.
High thermal conductivity material in omnidirectional's conducting foam can effectively guarantee heat transfer property; Omnidirectional's conducting foam rough surface, integral compressible can guarantee effective contact area, lacks than common heat conduction Copper Foil though omnidirectional conducting foam inside contains copper material, and better heat-conducting effect can be arranged.The heat conduction copper foil surface it seems very flat, between PCB shielding material and magnadure, but can only put contact, and omnidirectional's conducting foam can the contact of realization face.Therefore, much bigger by the heat conducting absolute heat transfer area and the common heat conduction Copper Foil of volume ratio of omnidirectional's conducting foam.Simultaneously, there is small pore foamed cotton inside, thisly can be guaranteed enough heat storage capacities as common cotton by the same physical structure.
From the secluding air purpose, need realize complete filling in the gap of the whole big shield part position of corresponding PCB.Because after the surface of magnesium aluminium alloy oxide layer is removed, if the mode secluding air through the complete filling gap, surface of magnesium aluminium alloy will be oxidized falls, thereby influences the magnadure long term reliability.
Handle through above-mentioned steps; The heat-conducting effect of contrast graphite (artificial, natural), copper base conducting strip; Use the radiating treatment device of the embodiment of the invention; Under the situation of same area, can reach price is the radiating effect of the graphite of omnidirectional's conducting foam hundred times, more effective than heat conduction Copper Foil and copper base conducting strip.Through after the above-mentioned radiating treatment, can reduce by 4 ~ 6 deg.c than heat conduction Copper Foil and copper base conducting strip.
PROCESS FOR TREATMENT through above-mentioned four steps has guaranteed that omnidirectional's conducting foam all is fully utilized in the advantage of the capacity of heat transmission and heat storage capacity, and the user can not feel that portable terminal very significantly generates heat in hand-held use.
The embodiment of the invention is realizing also having obtained following effect outside the good heat-conducting effect:
On the one hand, complete machine electronic system ground connection effect is better, thereby significantly promotes Electro Magnetic Compatibility, and then makes and increase significantly on the radio-frequency performance index.According to experiment, the radio frequency receiving sensitivity of the portable terminal of the radiating treatment device of the use embodiment of the invention has the lifting of 2 ~ 3dBm.Particularly under the weak signal situation, the good results are evident in lifting to the radio frequency receptivity.
On the other hand, the complete machine structure system reliability is better, falls at complete machine to be able to aspect the index promote.Because the cushioning effect of omnidirectional's conducting foam, make complete machine structure body and critical component especially the falling height that in free fall test, tolerates of LCD screen improve about 0.2 meter, the drop number that in the cylinder fall-down test, tolerates raising at least 20 times.
In the portable terminal of some attenuate designs; There is not metallic support between LCD and the PCB; Said method also can be suitable for; Promptly can shield the block large-area omnidirectional of packing conducting foam between metal chase and the PCB metal screen of body, realize that heat conduction also takes into account radio frequency optimization and the function of structural reliability lifting at LCD.
Device embodiment two
According to embodiments of the invention; A kind of portable terminal is provided; Portable terminal according to the embodiment of the invention comprises device embodiment one described radiating treatment device, and the embodiment of the invention can be understood according to the description of said apparatus embodiment one, repeats no more at this.
In sum; Technical scheme by means of the embodiment of the invention; Through passing by the Heat Conduction Material that portable terminal metallic support that the low heat conductivity top layer handles and the gap filling of PCB can conduct electricity; Make when the portable terminal electronic system is effectively carried out radiating treatment, can improve electronic system ground connection performance and radiofrequency signal receptivity.
Although be the example purpose, the preferred embodiments of the present invention are disclosed, it also is possible those skilled in the art will recognize various improvement, increase and replacement, therefore, scope of the present invention should be not limited to the foregoing description.
Claims (10)
1. radiating treatment device; It is characterized in that; Comprise: the printing board PCB of portable terminal metallic support, shaggy first Heat Conduction Material and the sandwich construction of handling through past low heat conductivity top layer; Wherein, said portable terminal metallic support is between portable terminal LCDs LCD and said PCB; Be filled with said first Heat Conduction Material between said portable terminal metallic support and the said PCB; High power device on the said PCB is arranged on the centre position of the device side of said PCB, and leaves the space each other; Be provided with one deck ground copper at least among the said PCB, said high power device bottom or other positions of the device side of said PCB are provided with ground copper, and the device side of said PCB is provided with the hole, ground.
2. device as claimed in claim 1 is characterized in that, the distance between said portable terminal metallic support and the said PCB is more than or equal to 0.1 millimeter and smaller or equal to 0.2 millimeter.
3. device as claimed in claim 1 is characterized in that, said first Heat Conduction Material is: omnidirectional's conducting foam.
4. device as claimed in claim 1 is characterized in that, the said low heat conductivity top layer of going is treated to: surperficial deoxidation layer is handled.
5. device as claimed in claim 1 is characterized in that, said high power device comprises: RF power amplification, power management chip and system's master chip.
6. like each described device in the claim 1 to 5, it is characterized in that, be provided with metal screen in the device side of said PCB, said high power device is between said PCB surface and said metal screen.
7. device as claimed in claim 6 is characterized in that, is filled with said first Heat Conduction Material between the metal screen of said portable terminal metallic support and said PCB.
8. device as claimed in claim 7 is characterized in that, is filled with second Heat Conduction Material between said metal screen and the said high power device.
9. device as claimed in claim 8 is characterized in that, said second Heat Conduction Material is: heat conductive silica gel.
10. a portable terminal is characterized in that, is provided with each described radiating treatment device in the claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210163567.1A CN102711416B (en) | 2012-05-24 | 2012-05-24 | Radiating treatment device and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210163567.1A CN102711416B (en) | 2012-05-24 | 2012-05-24 | Radiating treatment device and mobile terminal |
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| CN102711416A true CN102711416A (en) | 2012-10-03 |
| CN102711416B CN102711416B (en) | 2015-10-21 |
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| CN201210163567.1A Active CN102711416B (en) | 2012-05-24 | 2012-05-24 | Radiating treatment device and mobile terminal |
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Cited By (7)
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| CN103747608A (en) * | 2013-12-13 | 2014-04-23 | 深圳市同为数码科技股份有限公司 | Anti-off movable heat conduction structure |
| CN104159391A (en) * | 2013-05-15 | 2014-11-19 | 中兴通讯股份有限公司 | Heat dissipation device for terminal, and terminal |
| WO2015139285A1 (en) * | 2014-03-21 | 2015-09-24 | 华为终端有限公司 | Frame and mobile terminal |
| CN105338783A (en) * | 2014-07-01 | 2016-02-17 | 联想(北京)有限公司 | Heat dissipation device for electronic equipment |
| CN105873417A (en) * | 2016-04-29 | 2016-08-17 | 广东欧珀移动通信有限公司 | Chip, circuit board and mobile terminal |
| CN107396604A (en) * | 2017-08-04 | 2017-11-24 | 歌尔科技有限公司 | A kind of method, smart machine and system for improving smart machine receiving sensitivity |
| CN108601299A (en) * | 2018-04-26 | 2018-09-28 | 上海移远通信技术股份有限公司 | Shielding case and shield assemblies comprising it |
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| CN101770563A (en) * | 2009-12-30 | 2010-07-07 | 华为终端有限公司 | Intelligent card heat dissipating device and manufacturing method thereof |
| US20100309634A1 (en) * | 2007-12-26 | 2010-12-09 | Radesh Jewram | Thermal Interface with Non-Tacky Surface |
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| CN1625327A (en) * | 2003-11-21 | 2005-06-08 | Lg电子株式会社 | Heat radiating system and method for a mobile communication terminal |
| US20100309634A1 (en) * | 2007-12-26 | 2010-12-09 | Radesh Jewram | Thermal Interface with Non-Tacky Surface |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159391A (en) * | 2013-05-15 | 2014-11-19 | 中兴通讯股份有限公司 | Heat dissipation device for terminal, and terminal |
| CN103747608B (en) * | 2013-12-13 | 2017-03-15 | 深圳市同为数码科技股份有限公司 | A kind of Anti-off movable heat conduction structure |
| CN103747608A (en) * | 2013-12-13 | 2014-04-23 | 深圳市同为数码科技股份有限公司 | Anti-off movable heat conduction structure |
| US9910468B2 (en) | 2014-03-21 | 2018-03-06 | Huawei Device (Dongguan) Co., Ltd. | Holder and mobile terminal |
| CN105611984A (en) * | 2014-03-21 | 2016-05-25 | 华为终端有限公司 | Frame and mobile terminal |
| CN105611984B (en) * | 2014-03-21 | 2018-01-16 | 华为终端（东莞）有限公司 | Support and mobile terminal |
| WO2015139285A1 (en) * | 2014-03-21 | 2015-09-24 | 华为终端有限公司 | Frame and mobile terminal |
| US10481654B2 (en) | 2014-03-21 | 2019-11-19 | Huawei Device Co., Ltd. | Holder and mobile terminal |
| CN105338783A (en) * | 2014-07-01 | 2016-02-17 | 联想(北京)有限公司 | Heat dissipation device for electronic equipment |
| CN105873417A (en) * | 2016-04-29 | 2016-08-17 | 广东欧珀移动通信有限公司 | Chip, circuit board and mobile terminal |
| CN105873417B (en) * | 2016-04-29 | 2019-02-01 | Oppo广东移动通信有限公司 | A kind of chip, circuit board and mobile terminal |
| CN107396604A (en) * | 2017-08-04 | 2017-11-24 | 歌尔科技有限公司 | A kind of method, smart machine and system for improving smart machine receiving sensitivity |
| CN107396604B (en) * | 2017-08-04 | 2023-07-14 | 歌尔科技有限公司 | Method for improving receiving sensitivity of intelligent equipment, intelligent equipment and system |
| CN108601299A (en) * | 2018-04-26 | 2018-09-28 | 上海移远通信技术股份有限公司 | Shielding case and shield assemblies comprising it |
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|---|---|
| CN102711416B (en) | 2015-10-21 |
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