CN202998641U - Heat dissipation circuit structure and terminal adopting same - Google Patents
Heat dissipation circuit structure and terminal adopting same Download PDFInfo
- Publication number
- CN202998641U CN202998641U CN 201220611000 CN201220611000U CN202998641U CN 202998641 U CN202998641 U CN 202998641U CN 201220611000 CN201220611000 CN 201220611000 CN 201220611000 U CN201220611000 U CN 201220611000U CN 202998641 U CN202998641 U CN 202998641U
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- CN
- China
- Prior art keywords
- circuit structure
- pcb
- heat radiation
- graphite film
- circuit board
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Abstract
A heat dissipation circuit structure comprises a PCB (Printed Circuit Board) and a graphite film arranged on the PCB. In addition, a terminal adopting the above heat dissipation circuit structure is also provided. The heat dissipation circuit structure and the terminal conduct the heat of a high-temperature region to a low-temperature region through the graphite film with a high heat conductivity coefficient, so that the heat dissipated by an electronic device can uniformly arrive to a surface of the PCB as quickly as possible, thereby realizing temperature uniformity of the PCB, and achieving a better heat dissipation effect.
Description
Technical field
The utility model relates to electronic circuit, particularly relates to heat radiation circuit structure and adopts the terminal of this heat radiation circuit structure.
Background technology
PCB(Print Circuit Board, printed circuit board (PCB)) be important electronic unit, be the supporter of various electronic devices and components, be widely used in various terminal equipments.The heater members that is arranged on pcb board produces a large amount of heat, if untimely shedding can affect the service behaviour of heater members, even may break down because heat radiation makes excess Temperature.
For this reason, need heater members is dispelled the heat, traditional radiating mode is that heat sink material is fixed on the heater members of shell inner surface or circuit board, yet heat sink material is fixed on heater members, and area of dissipation is little, and radiating effect is relatively poor, heat sink material is placed on the inner surface of housing, by heat radiations such as the device space on circuit board, radomes, because air is little at the conductive coefficient under sealing condition, thereby cause radiating effect poor during heat radiation.
The utility model content
Based on this, being necessary provides a kind of heat radiation heat radiation circuit structure preferably for the relatively poor problem of heat radiation in prior art.
In addition, also be necessary to provide a kind of heat radiation terminal preferably.
A kind of heat radiation circuit structure comprises printed circuit board (PCB), it is characterized in that, also comprises the graphite film that is arranged on printed circuit board (PCB).
In embodiment, described heat radiation circuit structure also comprises electronic device therein, and described electronic device is arranged on described printed circuit board (PCB) by pad, and described graphite film covers the remainder except pad.
In embodiment, the thickness of described graphite film is between 12 microns to 100 microns therein.
In embodiment, described graphite film is pasted and/or is pressed together on described printed circuit board (PCB) therein.
In embodiment, described graphite film is arranged on two faces of described printed circuit board (PCB) therein.
A kind of terminal comprises above-mentioned heat radiation circuit structure.
Above-mentioned heat radiation circuit structure and terminal, graphite film by high thermal conductivity coefficient is transmitted to low-temperature space with the heat of high-temperature region, the even arrival printed circuit board surface that the heat that electronic device is distributed is fast as far as possible realizes that the temperature of printed circuit board (PCB) is even, reaches radiating effect preferably.
Description of drawings
Fig. 1 is the side schematic view of heat radiation circuit structure in an embodiment;
Fig. 2 is the side schematic view of heat radiation circuit structure in another embodiment;
Fig. 3 is the side schematic view of heat radiation circuit structure in another embodiment.
Embodiment
Below in conjunction with specific embodiment and accompanying drawing to heat radiation circuit structure and adopt the technical scheme of the terminal of this heat radiation circuit structure to be described in detail.
As shown in Figure 1, in one embodiment, a kind of heat radiation circuit structure 100 comprises printed circuit board (PCB) 110 and graphite film 120.Wherein, graphite film 120 is arranged on printed circuit board (PCB) 110.
The conductive coefficient of graphite film 120 is 600 ~ 1900 watts/Mi Du, and thickness is between 12 microns to 100 microns.In the present embodiment, graphite film 110 is pasted and/or is pressed together on printed circuit board (PCB) 120.In addition, graphite film 110 can be arranged on two faces of printed circuit board (PCB) 120.
This graphite film 120 is set directly on printed circuit board (PCB) 110, utilize the high thermal conductivity of graphite film, the heat that the high temperature components and parts are produced is delivered to around the low temperature components and parts, thereby reduce the localized hyperthermia of high temperature components and parts, make the temperature of whole pcb board reach balance, play radiating effect preferably.
Heat radiation circuit structure 200 shown in Figure 2 is from the different of heat radiation circuit structure 100 shown in Figure 1, and heat radiation circuit structure 200 also comprises electronic device 230 except comprising printed circuit board (PCB) 210 and graphite film 220.Electronic device 230 is arranged on printed circuit board (PCB) 210 by pad, the remainder that graphite film 220 covers except pad.Electronic device 230 comprises high temperature components and parts and low temperature components and parts, and the high temperature components and parts can be processor, power management chip or radio frequency chip etc., and the low temperature components and parts can be electric capacity or resistance etc.By graphite 220, the heat of high temperature components and parts is delivered to around the low temperature components and parts localized hyperthermia that reduces the high temperature components and parts.
Heat radiation circuit structure shown in Figure 3 comprises a plurality of electronic devices.
In addition, the utility model also provides a kind of terminal.This terminal comprises heat radiation circuit structure as described above.This terminal can be mobile terminal, as mobile phone, palmtop PC, personal digital assistant etc.
Above-mentioned heat radiation circuit structure and terminal, the heat that the graphite film by high thermal conductivity coefficient distributes electronic device, fast as far as possible even arrival pcb board surface makes pcb board in the situation that do not rely on external heat sink and dispel the heat preferably, keeps stablizing of work.Help simultaneously to make the mobile terminal surface temperature distribution more even, avoid electronic device localized hyperthermia and terminal enclosure localized hyperthermia, thereby avoid skin to be burnt by high temperature, improved the life-span of battery life and electronic device.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.Should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (6)
1. a heat radiation circuit structure, comprise printed circuit board (PCB), it is characterized in that, also comprises the graphite film that is arranged on printed circuit board (PCB).
2. heat radiation circuit structure according to claim 1, is characterized in that, described heat radiation circuit structure also comprises electronic device, and described electronic device is arranged on described printed circuit board (PCB) by pad, and described graphite film covers the remainder except pad.
3. heat radiation circuit structure according to claim 1 and 2, is characterized in that, the thickness of described graphite film is between 12 microns to 100 microns.
4. heat radiation circuit structure according to claim 1 and 2, is characterized in that, described graphite film is pasted and/or is pressed together on described printed circuit board (PCB).
5. heat radiation circuit structure according to claim 1 and 2, is characterized in that, described graphite film is arranged on two faces of described printed circuit board (PCB).
6. a terminal, is characterized in that, comprises heat radiation circuit structure as described in any one in claim 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220611000 CN202998641U (en) | 2012-11-16 | 2012-11-16 | Heat dissipation circuit structure and terminal adopting same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220611000 CN202998641U (en) | 2012-11-16 | 2012-11-16 | Heat dissipation circuit structure and terminal adopting same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202998641U true CN202998641U (en) | 2013-06-12 |
Family
ID=48569762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220611000 Expired - Lifetime CN202998641U (en) | 2012-11-16 | 2012-11-16 | Heat dissipation circuit structure and terminal adopting same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202998641U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050361A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Heat radiation structure assembly of electronic device and electronic device |
-
2012
- 2012-11-16 CN CN 201220611000 patent/CN202998641U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050361A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Heat radiation structure assembly of electronic device and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130612 |