CN202998641U - Heat dissipation circuit structure and terminal adopting same - Google Patents

Abstract

A heat dissipation circuit structure includes a printed circuit board and a graphite film arranged on the printed circuit board. In addition, a terminal using the heat dissipation circuit structure is provided. The heat dissipation circuit structure and the terminal conduct heat from a high temperature area to a low temperature area through a graphite film with a high thermal conductivity, so that the heat emitted by the electronic device reaches the surface of the printed circuit board as quickly and evenly as possible, so as to achieve a uniform temperature of the printed circuit board and achieve a better heat dissipation effect.

Description

Heat dissipation circuit structure and terminal adopting the above heat dissipation circuit structure

technical field

The utility model relates to an electronic circuit, in particular to a heat dissipation circuit structure and a terminal adopting the heat dissipation circuit structure.

Background technique

PCB (Print Circuit Board, printed circuit board) is an important electronic component, a support for various electronic components, and is widely used in various terminal equipment. The heating device installed on the PCB generates a lot of heat. If it is not dissipated in time, it will affect the performance of the heating device, and may even cause failure due to excessive temperature caused by heat dissipation.

Therefore, it is necessary to dissipate heat from the heat-generating device. The traditional heat-dissipating method is to fix the heat-dissipating material on the inner surface of the housing or on the heat-generating device of the circuit board. , Place the heat dissipation material on the inner surface of the housing, and dissipate heat through the device gaps on the circuit board, shielding covers, etc. when dissipating heat, because the thermal conductivity of air under closed conditions is small, resulting in poor heat dissipation.

Utility model content

Based on this, it is necessary to provide a heat dissipation circuit structure with better heat dissipation to solve the problem of poor heat dissipation in the prior art.

In addition, it is also necessary to provide a terminal with better heat dissipation.

A heat dissipation circuit structure, including a printed circuit board, is characterized in that it also includes a graphite film arranged on the printed circuit board.

In one embodiment, the heat dissipation circuit structure further includes an electronic device, the electronic device is mounted on the printed circuit board through a pad, and the graphite film covers the rest except the pad.

In one embodiment, the thickness of the graphite film is between 12 microns and 100 microns.

In one of the embodiments, the graphite film is pasted and/or pressed on the printed circuit board.

In one of the embodiments, the graphite film is disposed on two surfaces of the printed circuit board.

A terminal includes the above heat dissipation circuit structure.

The above-mentioned heat dissipation circuit structure and terminal conduct the heat from the high-temperature area to the low-temperature area through the graphite film with high thermal conductivity, so that the heat emitted by the electronic device reaches the surface of the printed circuit board as quickly as possible and evenly, so that the temperature of the printed circuit board is uniform and reaches Better cooling effect.

Description of drawings

Fig. 1 is a side schematic diagram of the heat dissipation circuit structure in an embodiment;

Fig. 2 is a schematic side view of the heat dissipation circuit structure in another embodiment;

FIG. 3 is a schematic side view of the heat dissipation circuit structure in another embodiment.

Detailed ways

The heat dissipation circuit structure and the technical solution of the terminal adopting the heat dissipation circuit structure will be described in detail below in combination with specific embodiments and drawings.

As shown in FIG. 1 , in one embodiment, a heat dissipation circuit structure 100 includes a printed circuit board 110 and a graphite film 120 . Wherein, the graphite film 120 is disposed on the printed circuit board 110 .

The thermal conductivity of the graphite film 120 is 600-1900 W/m·degree, and the thickness is between 12 microns and 100 microns. In this embodiment, the graphite film 110 is pasted and/or pressed on the printed circuit board 120 . In addition, the graphite film 110 may be disposed on both sides of the printed circuit board 120 .

The graphite film 120 is directly arranged on the printed circuit board 110, and uses the high thermal conductivity of the graphite film to transfer the heat generated by the high-temperature components to the surroundings of the low-temperature components, thereby reducing the local high temperature of the high-temperature components and making the temperature of the entire PCB board To achieve a balance, play a better heat dissipation effect.

The difference between the heat dissipation circuit structure 200 shown in FIG. 2 and the heat dissipation circuit structure 100 shown in FIG. 1 is that the heat dissipation circuit structure 200 includes an electronic device 230 in addition to a printed circuit board 210 and a graphite film 220 . The electronic device 230 is mounted on the printed circuit board 210 through pads, and the graphite film 220 covers the rest except the pads. The electronic device 230 includes high temperature components and low temperature components. The high temperature components may be processors, power management chips or radio frequency chips, etc., and the low temperature components may be capacitors or resistors. The heat of the high-temperature components is transferred to the surroundings of the low-temperature components through the graphite 220, thereby reducing the local high temperature of the high-temperature components.

The heat dissipation circuit structure shown in FIG. 3 includes multiple electronic devices.

In addition, the utility model also provides a terminal. The terminal includes a heat dissipation circuit structure as described above. The terminal can be a mobile terminal, such as a mobile phone, a handheld computer, a personal digital assistant, and the like.

The above heat dissipation circuit structure and terminal, through the graphite film with high thermal conductivity, the heat dissipated by the electronic device can reach the surface of the PCB board as quickly as possible, so that the PCB board can dissipate heat better without relying on an external radiator, and keep working of stability. At the same time, it helps to make the temperature distribution on the surface of the mobile terminal more uniform, avoiding local high temperature of the electronic device and the terminal shell, thereby preventing the skin from being burned by high temperature, and improving the life of the battery and the life of the electronic device.

The above-mentioned embodiments only express several implementations of the utility model, and the description thereof is relatively specific and detailed, but it should not be construed as limiting the patent scope of the utility model. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (6)

1. A heat dissipation circuit structure, comprising a printed circuit board, characterized in that it also includes a graphite film arranged on the printed circuit board. 2. The heat dissipation circuit structure according to claim 1, characterized in that, the heat dissipation circuit structure also includes electronic devices, the electronic devices are mounted on the printed circuit board through pads, and the graphite film covers The rest of the board. 3. The heat dissipation circuit structure according to claim 1 or 2, characterized in that the thickness of the graphite film is between 12 microns and 100 microns. 4. The heat dissipation circuit structure according to claim 1 or 2, wherein the graphite film is pasted and/or pressed on the printed circuit board. 5. The heat dissipation circuit structure according to claim 1 or 2, wherein the graphite film is disposed on both surfaces of the printed circuit board. 6. A terminal, characterized by comprising the heat dissipation circuit structure according to any one of claims 1 to 5.

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