CN213755420U

CN213755420U - Heat radiation structure of electronic equipment and camera with heat radiation structure

Info

Publication number: CN213755420U
Application number: CN202022124064.6U
Authority: CN
Inventors: 何可辉; 苏文; 刘靖康
Original assignee: Insta360 Innovation Technology Co Ltd
Current assignee: Insta360 Innovation Technology Co Ltd
Priority date: 2020-09-24
Filing date: 2020-09-24
Publication date: 2021-07-20
Anticipated expiration: 2030-09-24

Abstract

The utility model is suitable for an electronic equipment field discloses an electronic equipment's heat radiation structure, including casing and mainboard subassembly, the casing has and holds the chamber, and the mainboard subassembly sets up in holding the intracavity, and the lateral wall that holds the chamber is provided with the heat-conducting layer, and the mainboard subassembly includes first circuit module and second circuit module, and first circuit module and second circuit module are close to respectively in the different lateral walls that hold the chamber and connect in the heat-conducting layer. The utility model also discloses a camera, including shooting subassembly and foretell heat radiation structure. The utility model provides a heat radiation structure of electronic equipment and camera that has this heat radiation structure, through being close to each circuit module respectively and holding the different lateral walls in chamber, make the heat of each circuit module conduct respectively to holding the different lateral walls in chamber, and then make the heat dissipation of camera more even; and a heat conduction layer for improving heat conduction efficiency is arranged, so that the heat radiation efficiency of the camera can be improved.

Description

Heat radiation structure of electronic equipment and camera with heat radiation structure

Technical Field

The utility model belongs to the electronic equipment field especially relates to a heat radiation structure of electronic equipment and have this heat radiation structure's camera

Background

When various electronic devices are in working states, heat dissipated by parts, especially electronic elements such as processors which need a large amount of calculation can dissipate a large amount of heat during operation, and if the electronic devices cannot conduct and dissipate the heat in time, the heat can be concentrated, so that the local temperature of the electronic devices is too high, and the normal operation work of the electronic devices is influenced.

The camera is as a common shooting equipment in life, and most of cameras all adopt handheld shooting, and the camera is after long-time use, and all kinds of components and parts in the camera can produce a large amount of heats, for example all kinds of treater, photosensitive element and communication module etc. if can not in time dispel the heat, the heat concentrates easily and leads to the inside temperature of camera to rise, influences the normal work of each components and parts. Especially, the integration level of the existing camera is higher and higher, the structure is more compact, the heat dissipation effect of the camera is easily affected, and if the heat dissipation of the camera is not uniform, heat is easily concentrated at a certain part of the camera housing, the temperature of the part is too high, and the use experience of a user is affected.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of above-mentioned technical problem at least, provide an electronic equipment's heat radiation structure and have this heat radiation structure's camera, it will be divided and establish each circuit module and be close to respectively in the different lateral walls that hold the chamber to utilize the heat-conducting layer to improve mainboard assembly's radiating efficiency, have the good and even characteristics of heat dissipation of radiating effect.

The technical scheme of the utility model is that: a camera comprises a shell and a mainboard assembly, wherein the shell is provided with a containing cavity, the mainboard assembly is arranged in the containing cavity, the side wall of the containing cavity is provided with a heat conduction layer, the mainboard assembly comprises a plurality of circuit modules, and each circuit module is close to the different side walls of the containing cavity respectively and is connected to the heat conduction layer.

Optionally, the casing includes a center, a front casing and a rear casing, the front casing is connected to the front side of the center, the rear casing is connected to the rear side of the center and forms the accommodating cavity, the first circuit module is close to the front casing, the second circuit module is close to the rear casing, the heat conduction layer includes a first heat conduction area and a second heat conduction area, the first heat conduction area is set up in the first circuit module with between the front side of the accommodating cavity, the second heat conduction area is set up in the second circuit module with between the rear casing.

Optionally, the heat conduction layer further includes a third heat conduction area, the third heat conduction area is located beside the middle frame, and the third heat conduction area is adjacently connected to the first heat conduction area and the second heat conduction area.

Optionally, a heat conducting pad is disposed between the first heat conducting area and the first circuit module and between the second heat conducting area and the second circuit module.

Optionally, the first circuit module is provided with a communication module, the second circuit module is provided with a processor module, and the communication module and the processor module are connected to the heat-conducting pad.

Optionally, the heat conducting layer is a graphite layer or/and a copper sheet layer attached to the side wall of the accommodating cavity, and the heat conducting pad is a silicone grease layer.

Optionally, the outer side surface of the rear shell is provided with an anti-scald layer.

Optionally, the scald-proof layer is plastic arranged on the surface of the rear shell, and the scald-proof layer is provided with a heat dissipation groove for exposing the rear shell.

Optionally, the rear shell is made of a metal material, and the anti-scald layer is connected to the rear shell through a nano injection molding process.

Optionally, the heat dissipation structure further includes a battery assembly, the battery assembly is disposed between the first circuit module and the second circuit module, and heat insulation layers are disposed on two sides of the battery assembly, which are close to the first circuit module and the second circuit module.

The utility model also provides a camera, including the heat radiation structure who shoots subassembly and foretell electronic equipment.

The utility model provides a heat radiation structure of electronic equipment and camera that has this heat radiation structure, through dividing the mainboard subassembly into a plurality of circuit modules, and be close to each circuit module respectively and hold the different lateral walls in chamber, make the heat of each circuit module conduct respectively to holding the different lateral walls in chamber, and then make the heat dissipation of camera more even; and the lateral wall that holds the chamber still is provided with the heat-conducting layer that is used for connecting each circuit module, and the heat-conducting layer can improve each circuit module's conduction efficiency to can improve the radiating efficiency of camera.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a cross-sectional view of a camera provided by an embodiment of the present invention;

fig. 2 is a cross-sectional view of another view angle of a camera provided by an embodiment of the present invention;

fig. 3 is a schematic perspective view of a camera according to an embodiment of the present invention.

In the figure:

1. a housing; 10. a middle frame; 101. a key hole; 102. a waterproof elastic member; 11. a front housing; 12. a rear housing; 121. a burn-proof layer; 122. a heat sink; 13. a first magnetic member; 14. a charging interface;

20. a shooting component; 30. a battery assembly; 31. a thermal insulation layer; 40. a heat conductive layer; 401. a first heat transfer area; 402. a second heat transfer area; 403. a third heat transfer area; 41. a first circuit module; 411. a key switch; 42. and a second circuit module.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It should be noted that the terms "disposed" and "connected" should be interpreted broadly, and may be, for example, directly disposed or connected, or indirectly disposed or connected through intervening elements or intervening structures.

In addition, in the embodiments of the present invention, if there are terms of orientation or positional relationship indicated by "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., it is based on the orientation or positional relationship shown in the drawings or the conventional placement state or use state, and it is only for convenience of description and simplification of the description, but does not indicate or imply that the structures, features, devices or elements referred to must have a specific orientation or positional relationship, nor must be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

The various features and embodiments described in the embodiments may be combined in any suitable manner, for example, different embodiments may be formed by combining different features/embodiments, and in order to avoid unnecessary repetition, various possible combinations of features/embodiments in the present invention will not be further described.

An embodiment of the utility model provides a pair of electronic equipment's heat radiation structure, please refer to fig. 1 and fig. 2, heat radiation structure includes casing 1 and mainboard subassembly, casing 1 has and holds the chamber, the mainboard subassembly sets up in holding the intracavity, wherein, the mainboard subassembly includes a plurality of circuit module, every circuit module is close to respectively in holding the different lateral walls in chamber for each circuit module's heat can be conducted respectively to the different lateral walls that hold the chamber, avoid the heat of mainboard subassembly to concentrate to a certain position of casing 1, realize electronic equipment's even heat dissipation. The lateral wall that holds the chamber is provided with heat-conducting layer 40, and each circuit module all connects in heat-conducting layer 40, and this heat-conducting layer 40 can accelerate the heat conduction of each circuit module, improves its heat conduction efficiency, and then improves electronic equipment's radiating effect. In the concrete application, when the heat radiation structure of this embodiment was applied to shooting equipment such as camera and was established, each circuit module generally can be connected with all kinds of electronic component, and electronic component can produce a large amount of heats at the during operation, and shooting equipment such as current camera generally adopts single mainboard design, and the heat concentrates on a certain position of casing 1 easily, influences the radiating effect on the one hand, and this position temperature of on the other hand is higher, and user experience is not good enough. And this embodiment divide into a plurality of circuit module with the mainboard subassembly, can rationally set up all kinds of electrons on different circuit module according to actual demand to realize even heat dissipation, avoid casing 1's local high temperature, improve user's use and experience. It should be noted that the heat dissipation structure of the present embodiment may be applied not only to a camera and other shooting devices, but also to other electronic devices, such as a mobile phone, a watch, a tablet computer, and the like.

Referring to fig. 1, as an alternative embodiment of the present embodiment, the housing 1 includes a middle frame 10, a front shell 11 and a rear shell 12, the front shell 11 is connected to a front side of the middle frame 10, the rear shell 12 is connected to a rear side of the middle frame 10 and forms a receiving cavity, the motherboard assembly includes a first circuit module 41 and a second circuit module 42, the first circuit module 41 is close to the front shell 11, and the second circuit module 42 is close to the rear shell 12. The heat conduction layer 40 includes a first heat conduction area 401 and a second heat conduction area 402, the first heat conduction area 401 is disposed between the first circuit module 41 and the front side of the accommodating cavity, the second heat conduction area 402 is disposed between the second circuit module 42 and the rear shell 12, the first heat conduction area 401 of the heat conduction layer 40 conducts heat of the first circuit module 41 to the front shell 11, the second heat conduction area 402 conducts heat of the second circuit module 42 to the rear shell 12, and heat concentration of the first circuit module 41 and the second circuit module 42 at a certain position of the housing 1 is avoided, so that the housing 1 can keep a relatively comfortable temperature, and user experience during handheld use is improved. In a specific application, the number of the circuit modules of the motherboard assembly may be determined according to actual situations, and may be two or more, which is not limited in this embodiment.

Specifically, referring to fig. 1, in the present embodiment, the middle frame 10 may be a hollow shell, and the rear side of the middle frame 10 may be an opening, and the rear shell 12 is connected to the opening to form a relatively sealed accommodating cavity. Referring to fig. 2, one end of the front shell 11 is connected to the front side of the middle frame 10, a certain gap is formed between the opposite end of the front shell 11 and the front side, a key hole 101 is formed in the front side of the middle frame 10, the key hole 101 can be connected to a waterproof elastic member 102, the first circuit module 41 is connected to a key switch 411, the key switch 411 faces the key hole 101, and the opposite end of the front shell 11 can approach the waterproof elastic member 102 through the gap and trigger the key switch 411, so as to implement the operation of the electronic device. In this way, the middle frame 10, the front shell 11 and the rear shell 12 can provide waterproof performance for the electronic device without affecting the normal use of the keys. Of course, in other embodiments, the front side and the rear side of the middle frame 10 may be both openings, and the front shell 11 and the rear shell 12 are respectively connected to the openings of the front side and the rear side to form the receiving cavity, which is not limited in this embodiment.

With continued reference to fig. 1, as an alternative embodiment of the present embodiment, the heat conduction layer 40 further includes a third heat conduction area 403, the third heat conduction area 403 is located beside the middle frame 10 (i.e. the side connected adjacent to the front side of the middle frame 10 and the rear shell 12), and the third heat conduction area 403 is connected to the first heat conduction area 401 and the second heat conduction area 402. In a specific application, after absorbing the heat of the first circuit module 41 and the second circuit module 42, the first heat conduction area 401 and the second heat conduction area 402 can conduct part of the heat to the front shell 11 and the rear shell 12, and can conduct part of the heat to the third heat conduction area 403 connected to the front shell and the rear shell, and the third heat conduction area 403 can conduct the heat to the side of the middle frame 10, so as to further improve the heat dissipation effect.

Preferably, the heat conducting layer 40 in this embodiment may be a graphite layer or/and a copper sheet layer, and when a graphite layer and a copper sheet layer are used at the same time, the graphite layer may be attached to the side wall of the accommodating cavity, and the copper sheet layer may be attached to the graphite layer, or of course, the copper sheet layer may be attached to the side wall of the accommodating cavity, and the graphite layer may be attached to the copper sheet layer. Graphite and copper sheet have excellent thermal conductivity, and are comparatively frivolous, can laminate in the lateral wall that holds the chamber well, improve heat conduction efficiency, of course, in other embodiments, heat-conducting layer 40 also can be other heat conduction materials to can set up one deck, two-layerly or the multilayer.

Further, as an optional implementation manner of this embodiment, a heat conducting pad is disposed between the first heat conducting area 401 and the first circuit module 41, and a heat conducting pad is also disposed between the second heat conducting area 402 and the second circuit module 42. The thermally conductive pads may provide a tighter connection between the thermally conductive layer 40 and the first and

second circuit modules

41 and 42, further improving the thermal conductivity of the thermally conductive layer 40. In a specific application, the heat conducting pad may be formed by coating a heat conducting paste, or may be formed by other methods.

Preferably, the heat conducting pad in this embodiment may be a silicone layer. Of course, in other embodiments, other materials may be used.

Further, as one optional implementation manner of this embodiment, the first circuit module 41 is provided with a communication module, and the second circuit module 42 is provided with a processor module, where the communication module is connected to the heat conducting pad, and the processor module is connected to the heat conducting pad. In the specific application, when the heat radiation structure of this embodiment is applied to the camera, processor module and communication module in the camera can produce a large amount of heats in work, connect communication module and processor module in the heat conduction pad, can directly pass through heat conduction pad conduction heat-conducting layer 40 with the heat that it produced to conduct to casing 1 via heat-conducting layer 40, avoid the heat to concentrate and influence the normal work of camera, thereby improve the radiating effect of camera. In this embodiment, the processor module may be a DSP module (Digital Signal Process, Digital model processing), and the communication module may be a WIFI module or a bluetooth module, etc. Of course, in other embodiments, each electronic component may be reasonably disposed on the first circuit module 41 and the second circuit module 42 according to the actual situation of the camera.

Referring to fig. 2 and the drawings together, further, as an optional implementation manner of the present embodiment, an anti-scald layer 121 is disposed on an outer side surface of the rear shell 12. In the concrete application, electronic equipment is after using for a long time, and the heat can be conducted to backshell 12 through heat-conducting layer 40 on, and the temperature of backshell 12 can improve to some extent, and the user is when touching backshell 12, because prevent scalding the existence of layer 121, the user can not direct contact the surface of backshell 12, avoids backshell 12 temperature higher and leads to user's experience to descend. Of course, if necessary, the anti-scald layer 121 may be disposed on the outer side surfaces of the middle frame 10 and the front shell 11.

Referring to fig. 3, as an optional implementation manner of the present embodiment, the anti-scald layer 121 may be plastic disposed on the surface of the rear housing 12, and the anti-scald layer 121 is disposed with a heat dissipation groove 122 for exposing the rear housing 12. The coefficient of heat conductivity of plastic is lower, even if after the long-time use of electronic equipment, prevent scalding layer 121 and also can keep a comfortable temperature relatively, and radiating groove 122 can make backshell 12 expose on the one hand and contact with the air to directly conduct the heat to the air in, improve the radiating effect, and on the other hand, radiating groove 122's size is generally less, and after layer 121 was prevented scalding in user's contact, user's skin can not directly with backshell 12 surface contact in the radiating groove 122, improve user's use and experience.

Preferably, with continued reference to fig. 3, in the present embodiment, the heat dissipation groove 122 may be a ring shape, and the heat dissipation groove 122 may correspond to the shape of the rear housing 12, in a specific application, the number of the heat dissipation grooves 122 may be set as appropriate according to the specific size of the electronic device, and of course, in other embodiments, the heat dissipation groove 122 may also be other shapes, such as a long strip shape or a circular shape.

Further, as an alternative embodiment of the present embodiment, the rear case 12 may be made of a metal material, and the metal material may accelerate the heat dissipation efficiency of the rear case 12 and also enhance the overall structural strength of the electronic device. Further, the anti-scald layer 121 may be connected to the rear case 12 through a Nano-injection Molding Technology (NMT), which is a Technology combining metal and plastic by a Nano-Technology, that is, after the metal surface is subjected to Nano-treatment, plastic is directly injection-molded on the metal surface, so that the metal and plastic may be integrally molded, thereby not only improving the adhesion between the anti-scald layer 121 and the rear case 12, but also reducing the weight and simultaneously giving consideration to the appearance texture.

Referring to fig. 1 again, as an optional implementation manner of the present embodiment, the heat dissipation structure further includes a battery assembly 30, the battery assembly 30 is disposed between the first circuit module 41 and the second circuit module 42, and heat insulation layers 31 are disposed on two sides of the battery assembly 30 close to the first circuit module 41 and the second circuit module 42. The thermal insulation layer 31 prevents heat of the first circuit module 41 and the second circuit module 42 from being conducted to the battery assembly 30, and ensures that the battery assembly 30 can be maintained at a relatively suitable temperature to prolong the service life of the battery assembly 30.

This embodiment still provides a camera, including shooting subassembly 20 and foretell heat radiation structure, camera can produce a large amount of heats after long-time use, and the camera generally needs handheld operation, and the user's use experience can be influenced to thermal too concentrated, and the heat radiation structure that the camera in this embodiment has can be effectively conduct the heat to the external world from the different positions of casing 1, avoids the heat to concentrate, improves user's use experience.

Referring to fig. 2 again, specifically, the camera in this embodiment may be a wearable camera, and the inner side of the rear shell 12 is connected to the first magnetic member 13, and when in use, the wearable accessory provided with the second magnetic member may be worn on the body of the user, and the wearable accessory may be a magnetic hanging rope, a magnetic headband, or a magnetic rubber cushion. The user can be earlier through the adsorption of first magnetic part 13 and second magnetic part, adsorb the camera on wearing the annex, and the backshell 12 of camera can laminate in wearing the annex, and the user is wearing the annex when on one's body, the backshell 12 of camera can comparatively press close to the human body, after using the camera for a long time, the temperature of backshell 12 can rise, and prevent scalding the existence of layer 121, can avoid the direct conduction of heat of backshell 12 to user's skin, thereby improve user's use and experience. Referring to fig. 3, the rear case 12 may be connected to a charging interface 14, the charging interface 14 may be a pogo pin connector (pogo pin), the charging interface 14 may be used for charging and data transmission, and the camera may be attached to a charging stand or a charging box by using the first magnetic member 13 and charged through the charging interface 14.

The embodiment of the utility model provides a heat radiation structure of electronic equipment and camera that has this heat radiation structure, through dividing into first circuit module 41 and second circuit module 42 with the mainboard subassembly, and be close to the different lateral walls that hold the chamber respectively with first circuit module 41 and second circuit module 42, make the heat of first circuit module 41 and second circuit module 42 can conduct respectively to the different lateral walls that hold the chamber, and then make the heat dissipation of camera more even; and the side wall of the accommodating cavity is further provided with a heat conduction layer 40 for connecting the first circuit module 41 and the second circuit module 42, and the heat conduction layer 40 can improve the conduction efficiency of the first circuit module 41 and the second circuit module 42, so that the heat dissipation efficiency of the camera can be improved.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the present invention.

Claims

1. The utility model provides an electronic equipment's heat radiation structure, includes casing and mainboard subassembly, the casing has and holds the chamber, the mainboard subassembly set up in hold the intracavity, its characterized in that, the lateral wall that holds the chamber is provided with the heat-conducting layer, the mainboard subassembly includes a plurality of circuit module, every circuit module is close to respectively hold the different lateral walls in chamber and connect in the heat-conducting layer.

2. The heat dissipating structure of an electronic device according to claim 1, wherein the case includes a middle frame, a front case and a rear case, the front case is connected to a front side of the middle frame, the rear case is connected to a rear side of the middle frame and forms the receiving cavity, the main board assembly includes a first circuit module and a second circuit module, the first circuit module is adjacent to the front case, the second circuit module is adjacent to the rear case, the heat conductive layer includes a first heat conduction area and a second heat conduction area, the first heat conduction area is disposed between the first circuit module and the front side of the receiving cavity, and the second heat conduction area is disposed between the second circuit module and the rear case.

3. The heat dissipating structure of an electronic device of claim 2, wherein the thermally conductive layer further comprises a third thermally conductive area, the third thermally conductive area being located to a side of the bezel, the third thermally conductive area being connected adjacent to the first thermally conductive area and the second thermally conductive area.

4. The heat dissipation structure of an electronic device according to claim 2, wherein a heat conductive pad is disposed between the first heat conduction area and the first circuit module and between the second heat conduction area and the second circuit module.

5. The heat dissipation structure of electronic equipment according to claim 4, wherein the first circuit module is provided with a communication module, the second circuit module is provided with a processor module, and the communication module and the processor module are connected to the heat conductive pad.

6. The heat dissipation structure of an electronic device according to claim 4, wherein the heat conductive layer is a graphite layer and/or a copper sheet layer attached to the side wall of the receiving cavity, and the heat conductive pad is a silicone layer.

7. The heat dissipating structure of an electronic device as claimed in claim 2, wherein an anti-burn layer is disposed on an outer side of the rear housing.

8. The heat dissipation structure of claim 7, wherein the anti-burn layer is plastic disposed on the surface of the rear housing, and the anti-burn layer has a heat dissipation groove for exposing the rear housing.

9. The heat dissipation structure of electronic equipment as claimed in claim 8, wherein the rear housing is made of a metal material, and the burn-proof layer is connected to the rear housing by a nano-injection molding process.

10. The heat dissipation structure of an electronic device according to any one of claims 2 to 9, further comprising a battery assembly disposed between the first circuit module and the second circuit module, wherein the battery assembly is provided with heat insulating layers near both sides of the first circuit module and the second circuit module.

11. A camera comprising a camera assembly, further comprising a heat dissipation structure of the electronic device of any of claims 1-10.