CN205408382U - Electrographite / part separates heat recombination fin - Google Patents
Electrographite / part separates heat recombination fin Download PDFInfo
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- CN205408382U CN205408382U CN201620186942.8U CN201620186942U CN205408382U CN 205408382 U CN205408382 U CN 205408382U CN 201620186942 U CN201620186942 U CN 201620186942U CN 205408382 U CN205408382 U CN 205408382U
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Abstract
The utility model discloses an electrographite / part separates heat recombination fin, include: gum layer, local insulating layer and electrographite heat dissipation layer, the top of gum layer sets up electrographite heat dissipation layer, local insulating layer setting is in electrographite heat dissipation in situ portion or set up above electrographite heat dissipation layer, the whole thickness of composite radiating fin is 30 microns~2100 microns. In this way, the utility model discloses can spread local high heat rapidly, and the heat dissipation is fast.
Description
Technical field
This utility model relates to the technical field of heat dissipation of mobile communication, particularly relates to the heat insulation heat sink compound in a kind of electrographite/local.
Background technology
At present, the demand of notebook and TV and display screen make consumption increase, the demand of display screen high brightness makes light emitting diode make consumption increase, also strengthening the caloric value of equipment, battery power consumption increases simultaneously, and battery capacity also and then improves, display apparatus is made to generate heat more because power consumption strengthens, as can not be effectively controlled heating, not only high temperature makes the CPU operating of equipment go wrong or loss of function, also can make heat-producing device shortening in service life.And because needing importing heat sink material under the condition of high temperature, again because of the in-house limited space of mobile phone and tablet PC, so traditional thick and heavy radiating subassembly cannot be used, it is necessary to use thin fin material.
Separately because hand communication machine and tablet PC do not design radiator fan, so the heat that device interior produces need to be reached fin by heater, reached casing by fin again to dispel the heat, but because of handheld device inherent space constraints, use thin radiative material, the heat of equipment major part can concentrate on the place near from heater so that casing each portion temperature of handheld device is uneven, makes hand-held feel be deteriorated.So the CPUCPU of equipment generates heat because of high-speed cruising, for improving its speed of service, current radiating mode has not reached requirement.
Utility model content
This utility model is mainly solving the technical problems that provide a kind of electrographite/local heat insulation heat sink compound, it is possible to diffusion local high heat, and rapid heat dissipation rapidly.
For solving above-mentioned technical problem, the technical scheme that this utility model adopts is: provide a kind of electrographite/local heat insulation heat sink compound, including: gum layer, local thermal insulation layer and electrographite heat dissipating layer, described gum layer be provided above electrographite heat dissipating layer, described local thermal insulation layer is arranged on electrographite heat dissipating layer inside or is arranged on above electrographite heat dissipating layer, and described heat sink compound integral thickness is 30 microns～2100 microns.
In one preferred embodiment of this utility model, described local thermal insulation layer is built in electrographite heat dissipating layer with mosaic mode.
In one preferred embodiment of this utility model, described local thermal insulation layer sticks on electrographite heat dissipating layer upper surface by local back adhesive layer.
In one preferred embodiment of this utility model, the electrographite of described electrographite heat dissipating layer is spent sintering by polyimide thin slice through 2500 to 2800 and is formed, and the base material thickness of described electrographite heat dissipating layer is at 10 microns～80 microns.
In one preferred embodiment of this utility model, the material of described local thermal insulation layer is lamellar aeroge or nonconducting non-metallic sheet or low thermal conductivity flaky material, and the thickness of described local thermal insulation layer is at 10 microns～1000 microns.
In one preferred embodiment of this utility model, described gum heat dissipating layer thickness is at 3 microns～100 microns.
In one preferred embodiment of this utility model, described electrographite layer thickness is 5 microns～80 microns.
The beneficial effects of the utility model are: this utility model adopts local thermal insulation layer to be labelled to maximum temperature point, then allow local high heat spread to surrounding, alleviate high temperature concentration phenomenon, it is possible to spread rapidly heat.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model electrographite/local heat insulation heat sink compound one preferred embodiment；
Fig. 2 is the heat radiation schematic diagram of embodiment in Fig. 1；
Fig. 3 is the structural representation of heat insulation another preferred embodiment of heat sink compound in this utility model electrographite/local；
Fig. 4 is the heat radiation schematic diagram of embodiment in Fig. 3；
In accompanying drawing, the labelling of each parts is as follows: 1, gum layer；2, local thermal insulation layer；3, electrographite heat dissipating layer；4, heat generating component；5, shell.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, so that advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus protection domain of the present utility model being made apparent clear and definite defining.
Referring to Fig. 1 and Fig. 3, this utility model embodiment includes:
The heat insulation heat sink compound in a kind of electrographite/local, including: gum layer 1, local thermal insulation layer 2 and electrographite heat dissipating layer 3, described gum layer 1 be provided above electrographite heat dissipating layer 3, described local thermal insulation layer 2 is arranged on electrographite heat dissipating layer 3 inside or is arranged on above electrographite heat dissipating layer 3, and described heat sink compound integral thickness is 30 microns～2100 microns.
Furtherly, described local thermal insulation layer 2 is built in electrographite heat dissipating layer 3 with mosaic mode；Described local thermal insulation layer 2 sticks on electrographite heat dissipating layer 3 upper surface by local back glue-line 1；The electrographite of described electrographite heat dissipating layer 3 is spent sintering by polyimide thin slice through 2500 to 2800 and is formed, and the base material thickness of described electrographite heat dissipating layer 3 is at 10 microns～80 microns；The material of described local thermal insulation layer 2 is lamellar aeroge or nonconducting non-metallic sheet or low thermal conductivity flaky material, and the thickness of described local thermal insulation layer 2 is at 10 microns～1000 microns；Described gum layer 1 thickness is at 3 microns～100 microns；Described electrographite heat dissipating layer 3 thickness is 5 microns～80 microns.
Embodiment one:
Refer to Fig. 1 and Fig. 2, this utility model is the composite fin of artificial graphite radiating layer+local thermal insulation layer+gum layer, with electrographite as heat radiating material, it is attached on the heat generating component 4 of handheld communication machine or tablet PC with double faced adhesive tape gum layer, the Btu utilization electrographite heat dissipating layer 3 of heat generating component 4 is conducted to device housings 5, being transmitted in air by 5 heats of device housings, such mechanism constitutes the heater heat dissipation path of handheld communication machine or tablet PC.
On handheld communication machine or tablet PC, because of use in be hand-held, because of handheld communication machine or tablet PC inherent space constraints, the fin that thickness is too big cannot be used, so when handheld communication machine or the heating of tablet PC heater, by heat sink compound, heat is conducted, because heat sink compound thickness limits, fin surface temperature is more high the closer to heater temperature, more low further away from heater temperature, in the heat conduction path of equipment, fin is heat to be conducted again the shell 5 to equipment, and shell 5 contacts with hands.Because the thickness of equipment cooling sheet is limited, heat-sinking capability is limited, higher by heater spot temperature, from heater more away from temperature more low, thus take, have the phenomenon that each spot temperature of handheld device enclosure 5 is inconsistent, and affect the not good problem of the feel in use.
Embodiment two:
Refer to Fig. 3 and Fig. 4,
nullThis utility model is based on Traditional Man graphite heat radiation fin，A piece of with heater local of the same size thermal insulation layer 2 setting up on the electrographite heat dissipating layer 3 at heater position，Electrographite heat dissipating layer 3 is thermally isolated closest to the part of heater，So shell temperature nearest corresponding to heater can reduce，Again because of the relation of electrographite heat conduction，Originally the heat on the position electrographite heat dissipating layer 3 nearest from heat generating component 4 is toward heater center to four sides diffusion，The area that electrographite heat dissipating layer 3 is the warmmest is made to increase，Because the caloric value of heater is fixed value，When highest temperature position area increases，Then the temperature value of the highest temperature can reduce because area increases，Namely originally concentrate on the little area highest temperature at heater position，Affecting casing is also the little area highest temperature concentrated，And isolate with shell 5 because local thermal insulation layer 2 electrographite heat dissipating layer 3 originally collects the small areas highest temperature，The highest temperature value of shell 5 temperature made reduces，And reduce hand-held discomfort.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every equivalent structure utilizing this utility model description and accompanying drawing content to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, all in like manner include in scope of patent protection of the present utility model.
Claims (7)
1. the heat insulation heat sink compound in electrographite/local, it is characterized in that, including: gum layer, local thermal insulation layer and electrographite heat dissipating layer, described gum layer be provided above electrographite heat dissipating layer, described local thermal insulation layer is arranged on electrographite heat dissipating layer inside or is arranged on above electrographite heat dissipating layer, and described heat sink compound integral thickness is 30 microns～2100 microns.
2. the heat insulation heat sink compound in electrographite/local according to claim 1, it is characterised in that: described local thermal insulation layer is built in electrographite heat dissipating layer with mosaic mode.
3. the heat insulation heat sink compound in electrographite/local according to claim 1, it is characterised in that: described local thermal insulation layer sticks on electrographite heat dissipating layer upper surface by local back adhesive layer.
4. the heat insulation heat sink compound in electrographite/local according to claim 1, it is characterized in that: the electrographite of described electrographite heat dissipating layer is spent sintering by polyimide thin slice through 2500 to 2800 and formed, and the base material thickness of described electrographite heat dissipating layer is at 10 microns～80 microns.
5. the heat insulation heat sink compound in electrographite/local according to claim 1, it is characterized in that: the material of described local thermal insulation layer is lamellar aeroge or nonconducting non-metallic sheet or low thermal conductivity flaky material, and the thickness of described local thermal insulation layer is at 10 microns～1000 microns.
6. the heat insulation heat sink compound in electrographite/local according to claim 1, it is characterised in that: described gum heat dissipating layer thickness is at 3 microns～100 microns.
7. the heat insulation heat sink compound in electrographite/local according to claim 1, it is characterised in that: described electrographite layer thickness is 5 microns～80 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620186942.8U CN205408382U (en) | 2016-03-11 | 2016-03-11 | Electrographite / part separates heat recombination fin |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620186942.8U CN205408382U (en) | 2016-03-11 | 2016-03-11 | Electrographite / part separates heat recombination fin |
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| CN205408382U true CN205408382U (en) | 2016-07-27 |
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| CN201620186942.8U Active CN205408382U (en) | 2016-03-11 | 2016-03-11 | Electrographite / part separates heat recombination fin |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105644028A (en) * | 2016-03-11 | 2016-06-08 | 奇华光电（昆山）股份有限公司 | Natural graphite/locally heat-insulation combined radiating fin |
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2016
- 2016-03-11 CN CN201620186942.8U patent/CN205408382U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105644028A (en) * | 2016-03-11 | 2016-06-08 | 奇华光电（昆山）股份有限公司 | Natural graphite/locally heat-insulation combined radiating fin |
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